Susceptor of semiconductor manufacturing apparatus
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Description
Claims
The ornamental design for a susceptor of semiconductor manufacturing apparatus, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
| 5169684 | December 8, 1992 | Takagi |
| D515675 | February 21, 2006 | Tremoulet, Jr. |
| D599827 | September 8, 2009 | Yabe |
| D638522 | May 24, 2011 | Yoshida |
| D728757 | May 5, 2015 | Graham |
| D783922 | April 11, 2017 | Kirkland |
| D810705 | February 20, 2018 | Krishnan |
| D864361 | October 22, 2019 | Kim |
| D871561 | December 31, 2019 | Kang |
| D871608 | December 31, 2019 | Okuda |
| D888903 | June 30, 2020 | Gunther |
| D895075 | September 1, 2020 | Kang |
| D917825 | April 27, 2021 | Kirkland |
| D933619 | October 19, 2021 | Yoshida |
| D933726 | October 19, 2021 | Savandaiah |
| D974910 | January 10, 2023 | Collins |
| 12087598 | September 10, 2024 | Tateno |
| D1055006 | December 24, 2024 | Nallagonda |
| 20090081887 | March 26, 2009 | Inoue |
| 20140090554 | April 3, 2014 | Chalk |
| 20140262193 | September 18, 2014 | Im |
| 304326143 | May 2017 | CN |
| 305875373 | January 2020 | CN |
| 2014-063820 | April 2014 | JP |
| 1740585 | March 2023 | JP |
- Silicon Ring, posting date unavailable [online], [retrieved Mar. 24, 2025]. Retrieved from internet, https://www.dstcsemi.com/products/silicon-ring/ (Year: 2025).
- Heat Resistant Plastic Wafer Hoop Ring for Expand Wafer, posting date unavailable [online], [retrieved Mar. 24, 2025]. Retrieved from internet, https://www.jedecictrays.com/quality-13789604-heat-resistant-plastic-wafer-hoop-ring-for-expand-wafer (Year: 2025).
Patent History
Patent number: D1079661
Type: Grant
Filed: Feb 5, 2024
Date of Patent: Jun 17, 2025
Assignee: KOKUSAI ELECTRIC CORPORATION (Tokyo)
Inventor: Daiki Taniguchi (Toyama)
Primary Examiner: Mary Shannon Malley
Assistant Examiner: Bria' l Simmons-Holloway
Application Number: 29/927,474
Type: Grant
Filed: Feb 5, 2024
Date of Patent: Jun 17, 2025
Assignee: KOKUSAI ELECTRIC CORPORATION (Tokyo)
Inventor: Daiki Taniguchi (Toyama)
Primary Examiner: Mary Shannon Malley
Assistant Examiner: Bria' l Simmons-Holloway
Application Number: 29/927,474
Classifications