Support ring for an interlocking process kit for a substrate processing chamber

- Applied Materials, Inc.
Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a top, front, right isometric view of a support ring for an interlocking process kit for a substrate processing chamber, showing our new design.

FIG. 2 is a bottom, left, back isometric view thereof.

FIG. 3 is a top plan view thereof.

FIG. 4 is a bottom plan view thereof.

FIG. 5 is a front elevation view thereof.

FIG. 6 is a back elevation view thereof.

FIG. 7 is a right side elevation view thereof.

FIG. 8 is a left side elevation view thereof; and,

FIG. 9 is an enlarged cross-sectional view taken along line 9-9 in FIG. 3 with the enlargements taken from the dashed-dot encircled portions labeled, “FIG. 9,” in FIG. 3.

The even dashed broken lines in FIG. 9 represent unclaimed environment and form no part of the claimed design. The dash-dot lines represent the boundary lines of the enlarged portion view of FIG. 9 shown in FIGS. 3 and 9 and form no part of the claimed design.

Claims

The ornamental design for a support ring for an interlocking process kit for a substrate processing chamber, as shown and described.

Referenced Cited
U.S. Patent Documents
D404372 January 19, 1999 Ishii
6068548 May 30, 2000 Vote
D491963 June 22, 2004 Doba
7186171 March 6, 2007 Oh
D556704 December 4, 2007 Nakamura
D557226 December 11, 2007 Uchino
D559993 January 15, 2008 Nagakubo
D559994 January 15, 2008 Nagakubo
7459057 December 2, 2008 Zuniga
D588078 March 10, 2009 Okada
D599827 September 8, 2009 Yabe
D633991 March 8, 2011 Nakagawa
D638522 May 24, 2011 Yoshida
D655401 March 6, 2012 Muramatsu
D655797 March 13, 2012 Muramatsu
8491267 July 23, 2013 Glasspoole
8617672 December 31, 2013 Bhatnagar
D703160 April 22, 2014 Tanimura
D717746 November 18, 2014 Lau
D722966 February 24, 2015 Smith
D767234 September 20, 2016 Kirkland
D770992 November 8, 2016 Tauchi
D783922 April 11, 2017 Kirkland
D799690 October 10, 2017 Kawamura
D802545 November 14, 2017 Tauchi
D803917 November 28, 2017 Harada
D804436 December 5, 2017 Tauchi
D804556 December 5, 2017 Harada
D812578 March 13, 2018 Uemura
D821552 June 26, 2018 Nakagawa
D822181 July 3, 2018 Nakagawa
D862404 October 8, 2019 Murata
D871561 December 31, 2019 Kang
D871608 December 31, 2019 Okuda
D885443 May 26, 2020 Tsuji
D885444 May 26, 2020 Tsuji
D888804 June 30, 2020 Clark
D888903 June 30, 2020 Gunther
D891382 July 28, 2020 Koppa
D895075 September 1, 2020 Kang
D895076 September 1, 2020 Kuroda
D895777 September 8, 2020 Chase
D909323 February 2, 2021 Yoshida
D916038 April 13, 2021 Watanabe
D917825 April 27, 2021 Kirkland
D928591 August 24, 2021 Morgan, Sr.
D931241 September 21, 2021 Babu et al.
D933033 October 12, 2021 Yoshida
D933619 October 19, 2021 Yoshida
D933725 October 19, 2021 Koppa
D933726 October 19, 2021 Savandaiah
D934315 October 26, 2021 Lavitsky
D939459 December 28, 2021 Shimada
D941371 January 18, 2022 Lavitsky
D941372 January 18, 2022 Lavitsky
D942516 February 1, 2022 Koppa
D949116 April 19, 2022 Diana
D954986 June 14, 2022 Nakatani
D992614 July 18, 2023 Sasaki
D992615 July 18, 2023 Sasaki
20040077167 April 22, 2004 Willis
20050277375 December 15, 2005 Young
20060057826 March 16, 2006 De Boer
20070113783 May 24, 2007 Lee
20080041820 February 21, 2008 Tong
20090050272 February 26, 2009 Rosenberg
20110092142 April 21, 2011 Frank, Jr
20120263569 October 18, 2012 Priddy
20140262193 September 18, 2014 Im
20150190835 July 9, 2015 Hawrylchak
20190362948 November 28, 2019 Sarode Vishwanath
20190362949 November 28, 2019 Sarode Vishwanath
20190363003 November 28, 2019 Sarode Vishwanath
20200090915 March 19, 2020 Kerschbaumer
20200395195 December 17, 2020 Sanchez et al.
20210005502 January 7, 2021 Wagatsuma et al.
20210013014 January 14, 2021 Sarode Vishwanath
Foreign Patent Documents
304826214 September 2018 CN
305889712 June 2020 CN
D1644757 November 2019 JP
DM/101920-002 October 2019 KR
30-1140868 December 2021 KR
D210892 April 2021 TW
D215401 November 2021 TW
WO2021108178 June 2021 WO
WO2021194468 September 2021 WO
Other references
  • Support Ring Kit,https://www.amazon.com/Support-Ring-Kit/dp/B00CSBVCJ2, Feb. 6, 2017. (Year: 2017).
  • MI-T-M Support Ring Kit: Support Ring Kit, Fits MI-T-M Brand,https://www.grainger.com/product/MI-T-M-Support-Ring-Kit-Support-Ring-33PL56,2024. (Year: 2024).
  • Meiko 0403014 Sliding Ring Ceramics, https://www.restaurantsupply.com/meiko-0403014-sliding-ring-ceramics?srsltid= AfmBOooBtUg7QrCooQa28u5SfAkZX49d1xQ-0ba7--NsSAm5xjEXxnYFTvg, 2024. (Year: 2024).
  • Zhuhai Cersol Technology Co., Ltd's Post,https://www.linkedin.com/posts/ceramic-solutions.com_in-semiconductor-etching-the-electrostatic-activity-185829631504125952-ii10, 2024. (Year: 2024).
Patent History
Patent number: D1055006
Type: Grant
Filed: Mar 18, 2022
Date of Patent: Dec 24, 2024
Assignee: Applied Materials, Inc. (Santa Clara, CA)
Inventors: Sahiti Nallagonda (San Jose, CA), Jonathan Simmons (San Jose, CA), Xinwei Huang (San Jose, CA), Peter Muraoka (San Mateo, CA), Andreas Schmid (Sunnyvale, CA)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/831,297