Semiconductor device package

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Description

FIG. 1 is a perspective view from the front left side and below the semiconductor device package showing our new design.

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof; and,

FIG. 4 is an elevational view from the front side thereof.

Claims

We claim the ornamental design for a semiconductor device package, as shown and described.

Referenced Cited
U.S. Patent Documents
D396847 August 11, 1998 Nakayama et al.
D416236 November 9, 1999 Kobayashi et al.
D444132 June 26, 2001 Iwanishi et al.
D466873 December 10, 2002 Kasem et al.
D472528 April 1, 2003 Kasem et al.
D476962 July 8, 2003 Yoshihira et al.
D489338 May 4, 2004 Seddon et al.
Patent History
Patent number: D504874
Type: Grant
Filed: Aug 11, 2004
Date of Patent: May 10, 2005
Assignee: Semiconductor Components Industries, LLC (Phoenix, AZ)
Inventors: Phillip Celaya (Gilbert, AZ), Darrell D. Truhitte (Phoenix, AZ), Michael J. Seddon (Gilbert, AZ)
Primary Examiner: Stella Reid
Assistant Examiner: Selina Sikder
Application Number: 29/211,046