Pattern wafer
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Description
Claims
The ornamental design for a pattern wafer, as shown and described.
Referenced Cited
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Patent History
Patent number: D791091
Type: Grant
Filed: Jun 24, 2016
Date of Patent: Jul 4, 2017
Assignee: HITACHI KOKUSAI ELECTRIC INC. (Tokyo)
Inventors: Hiromi Okada (Toyama), Shinya Morita (Toyama), Satoshi Aizawa (Toyama), Masayoshi Minami (Toyama), Kazuyuki Okuda (Toyama), Masayuki Yamada (Toyama)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/569,263
Type: Grant
Filed: Jun 24, 2016
Date of Patent: Jul 4, 2017
Assignee: HITACHI KOKUSAI ELECTRIC INC. (Tokyo)
Inventors: Hiromi Okada (Toyama), Shinya Morita (Toyama), Satoshi Aizawa (Toyama), Masayoshi Minami (Toyama), Kazuyuki Okuda (Toyama), Masayuki Yamada (Toyama)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/569,263
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)