Pattern wafer

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Description

FIG. 1 is a front elevational view of a pattern wafer, showing our new design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is an enlarged front portion view taken along line 7-7 in FIG. 1;

FIG. 8 is an enlarged bottom portion view taken along line 8-8 in FIG. 6; and,

FIG. 9 is a top perspective view of FIG. 7.

Claims

The ornamental design for a pattern wafer, as shown and described.

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Patent History
Patent number: D791091
Type: Grant
Filed: Jun 24, 2016
Date of Patent: Jul 4, 2017
Assignee: HITACHI KOKUSAI ELECTRIC INC. (Tokyo)
Inventors: Hiromi Okada (Toyama), Shinya Morita (Toyama), Satoshi Aizawa (Toyama), Masayoshi Minami (Toyama), Kazuyuki Okuda (Toyama), Masayuki Yamada (Toyama)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/569,263