High-performance semiconductor module
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Description
The broken line portions of the figure drawings are included to show portions of the article that form no part of the claimed design.
All surfaces not shown form no part of the claimed design.
Claims
The ornamental design for a high-performance semiconductor module, as shown and described.
Referenced Cited
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Patent History
Patent number: D853342
Type: Grant
Filed: Aug 25, 2017
Date of Patent: Jul 9, 2019
Assignee: Infineon Technologies AG (Neubiberg)
Inventors: Thomas Auer (Warstein), Andras Bertalan (Warstein-Allagen), Jens Krugmann (Paderborn), Christoph Messelke (Arnsberg)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/615,042
Type: Grant
Filed: Aug 25, 2017
Date of Patent: Jul 9, 2019
Assignee: Infineon Technologies AG (Neubiberg)
Inventors: Thomas Auer (Warstein), Andras Bertalan (Warstein-Allagen), Jens Krugmann (Paderborn), Christoph Messelke (Arnsberg)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/615,042
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)