Power semiconductor module

- Infineon Technologies AG
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Description

FIG. 1 is a front elevation view of a power semiconductor module, showing our new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a top, side perspective view thereof;

FIG. 4 is another top, side perspective view thereof;

FIG. 5 is a side elevational view thereof;

FIG. 6 is a bottom plan view thereof; and,

FIG. 7 is a rear elevation view thereof.

Broken lines form no part of the claimed design and surface shading represents contour and not surface ornamentation.

Claims

The ornamental design for a power semiconductor module, as shown and described.

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Patent History
Patent number: D762597
Type: Grant
Filed: Feb 3, 2015
Date of Patent: Aug 2, 2016
Assignee: Infineon Technologies AG (Neubiberg)
Inventors: Andras Bertalan (Warstein-Allagen), Georg Borghoff (Warstein), Alexander Hoehn (Soest)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/516,507