Semiconductor module

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Description

FIG. 1 is a front view of a semiconductor module showing my new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a left side view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a perspective view thereof; and,

FIG. 8 is a cross-sectional view thereof taken along line 8-8 of FIG. 5.

The ornamental design of the present disclosure is a semiconductor module on which power semiconductor elements and the like may be mounted. A plurality of pin-shaped terminals protrudes from the top surface. Each end in a longitudinal direction includes a mounting hole.

Claims

The ornamental design for a semiconductor module, as shown and described.

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Patent History
Patent number: D721340
Type: Grant
Filed: Jun 21, 2013
Date of Patent: Jan 20, 2015
Assignee: Fuji Electric Co., Ltd. (Kawasaki-shi, Kanagawa)
Inventor: Hideyo Nakamura (Kawasaki)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/458,667