Cover of seal cap for reaction chamber for semiconductor manufacturing

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Description

FIG. 1 is a front, bottom and right side perspective view of a cover of seal cap for reaction chamber for semiconductor manufacturing showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a top plan view thereof; and

FIG. 7 is a bottom plan view thereof.

FIG. 8 is a cross-sectional view take along line 8-8 in FIG. 6; and,

FIG. 9 is a cross-sectional view take along line 9-9 in FIG. 7.

Claims

We claim the ornamental design for a cover of seal cap for reaction chamber for semiconductor manufacturing, as shown (and described).

Referenced Cited
U.S. Patent Documents
D404370 January 19, 1999 Kimura
D560284 January 22, 2008 Nagakubo
D616390 May 25, 2010 Sato
D717746 November 18, 2014 Lau
D732480 June 23, 2015 Makinen
D813181 March 20, 2018 Okajima
20140302700 October 9, 2014 Makinen
Foreign Patent Documents
1579504 June 2017 JP
Other references
  • U.S. Appl. No. 29/591,907, filed Jan. 25, 2017 by Applicant Hitachi Kokusai Electric Inc., Inventors: Yusaku Okajima, Shuhei Saido and Mika Urushihara.
Patent History
Patent number: D872037
Type: Grant
Filed: Jan 30, 2018
Date of Patent: Jan 7, 2020
Assignee: KOKUSAI ELECTRIC CORPORATION (Tokyo)
Inventors: Yusaku Okajima (Toyama), Hidenari Yoshida (Toyama), Shuhei Saido (Toyama), Takafumi Sasaki (Toyama)
Primary Examiner: Derrick E Holland
Application Number: 29/635,319