Cover of seal cap for reaction chamber for semiconductor manufacturing
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Description
Claims
We claim the ornamental design for a cover of seal cap for reaction chamber for semiconductor manufacturing, as shown (and described).
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
D404370 | January 19, 1999 | Kimura |
D560284 | January 22, 2008 | Nagakubo |
D616390 | May 25, 2010 | Sato |
D717746 | November 18, 2014 | Lau |
D732480 | June 23, 2015 | Makinen |
D813181 | March 20, 2018 | Okajima |
20140302700 | October 9, 2014 | Makinen |
1579504 | June 2017 | JP |
- U.S. Appl. No. 29/591,907, filed Jan. 25, 2017 by Applicant Hitachi Kokusai Electric Inc., Inventors: Yusaku Okajima, Shuhei Saido and Mika Urushihara.
Patent History
Patent number: D872037
Type: Grant
Filed: Jan 30, 2018
Date of Patent: Jan 7, 2020
Assignee: KOKUSAI ELECTRIC CORPORATION (Tokyo)
Inventors: Yusaku Okajima (Toyama), Hidenari Yoshida (Toyama), Shuhei Saido (Toyama), Takafumi Sasaki (Toyama)
Primary Examiner: Derrick E Holland
Application Number: 29/635,319
Type: Grant
Filed: Jan 30, 2018
Date of Patent: Jan 7, 2020
Assignee: KOKUSAI ELECTRIC CORPORATION (Tokyo)
Inventors: Yusaku Okajima (Toyama), Hidenari Yoshida (Toyama), Shuhei Saido (Toyama), Takafumi Sasaki (Toyama)
Primary Examiner: Derrick E Holland
Application Number: 29/635,319
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)