Plug-based floating gate memory
A device and a method of forming a floating gate memory transistor of very small area, thereby allowing a high-density integrated circuit chip, more specifically for Erasable Programmable Read-Only Memory (EPROM) or similar non-volatile devices.In a first embodiment, a method is disclosed that fabricates a programmable memory cell described as a "diffusion cut" cell where a plug-type floating gate contact hole cuts through a diffusion region and partially into a substrate region. In a second embodiment, a method is disclosed that fabricates a programmable memory cell described as an "oxide cut" cell, where the plug-type floating gate contact hole only penetrates a silicon oxide layer. This "oxide cut" cell is formed in a similar fashion except penetration does not go into the diffusion region or substrate.
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Claims
4964143 | October 16, 1990 | Haskell |
4975384 | December 4, 1990 | Baglee |
5045490 | September 3, 1991 | Esquivel et al. |
5049515 | September 17, 1991 | Tzeng |
5063172 | November 5, 1991 | Manley |
5071782 | December 10, 1991 | Mori |
5135879 | August 4, 1992 | Richardson |
5141886 | August 25, 1992 | Mori |
5399516 | March 21, 1995 | Bergendahl et al. |
5460989 | October 24, 1995 | Wake |
Type: Grant
Filed: Jan 25, 1996
Date of Patent: May 26, 1998
Assignee: Micron Technology, Inc. (Boise, ID)
Inventor: Kirk D. Prall (Boise, ID)
Primary Examiner: John Niebling
Assistant Examiner: Richard A. Booth
Law Firm: Fletcher & Associates
Application Number: 8/591,702
International Classification: H01L 218247;