Abstract: A memory device includes a first memory cell array, a second memory cell array disposed in a first direction with respect to the first memory cell array, a first contact plug extending in the first direction through the first memory cell array, and a second contact plug extending in the first direction through the second memory cell array. The first memory cell array includes first electrode layers stacked in a first direction, and a first semiconductor pillar extending through the first electrode layers in the first direction. The second memory cell array including second electrode layers stacked in the first direction, and a second semiconductor pillar extending in the first direction through the second electrode layers. The first contact plug is electrically connected to the first semiconductor pillar, and the second contact plug is electrically connected to the second semiconductor pillar and the first contact plug.

Abstract: A neuromorphic weight cell (NWC) including a resistor ladder including a plurality of resistors connected in series, and a plurality of shunting nonvolatile memory (NVM) elements, each of the shunting NVM elements being coupled in parallel to a corresponding one of the resistors.

Abstract: Provided is a semiconductor power device. The device includes: at least one p-type body region located on the top of an n-type drift region, a first n-type source region and a second n-type source region located within the p-type body region, a first gate structure configured to control a first current channel between the first n-type source region and the n-type drift region to be turned on or off; and a second gate structure configured to control a second current channel between the second n-type source region and the n-type drift region to be turned on or off. The second gate structure is recessed in the n-type drift region.

Abstract: A structure of memory device includes an active region in a substrate, a dielectric layer on the active region, and a floating gate disposed on the dielectric layer. The active region extends along a first direction in a top-view. The floating gate includes a first protruding structure extending along the first direction from a sidewall of the floating gate protruding from a top surface of the substrate. The whole of the first protruding structure is located in the active region.

Abstract: In a method of manufacturing a semiconductor device, a memory cell structure covered by a protective layer is formed in a memory cell area of a substrate. A mask pattern is formed. The mask pattern has an opening over a first circuit area, while the memory cell area and a second circuit area are covered by the mask pattern. The substrate in the first circuit area is recessed, while the memory cell area and the second circuit area are protected. A first field effect transistor (FET) having a first gate dielectric layer is formed in the first circuit area over the recessed substrate and a second FET having a second gate dielectric layer is formed in the second circuit area over the substrate as viewed in cross section.

Abstract: A method of forming a microelectronic device comprises forming a stack structure over a source structure, forming pillar structures vertically extending through the stack structure, and forming at least one trench vertically extending through the stack structure. The at least one trench defines at least one stadium structure comprising opposing stair step structures having steps comprising horizontal ends of tiers. Additional trenches may be formed to vertically extend through the stack structure, and at least one further trench may be formed to vertically extend through the stack structure. The at least one further trench defines at least one additional stadium structure comprising additional opposing stair step structures having additional steps comprising additional horizontal ends of the tiers. A dielectric material may be formed within the at least one trench, the additional trenches, and the at least one further trench. Microelectronic devices, memory devices, and electronic systems are also described.

Abstract: A semiconductor device includes a memory macro having a middle strap area between edges of the memory macro and memory bit areas on both sides of the middle strap area. The memory macro includes n-type wells and p-type wells arranged alternately along a first direction with well boundaries between the adjacent n-type and p-type wells. The n-type and the p-type wells extend lengthwise along a second direction and extend continuously through the middle strap area and the memory bit areas. The memory macro includes a first dielectric layer disposed at the well boundaries in the middle strap area and the memory bit areas. From a top view, the first dielectric layer extends along the second direction and fully separates the n-type wells from the p-type wells in the middle strap area. From a cross-sectional view, the first dielectric layer vertically extends into the n-type or the p-type wells.

Abstract: Provided is a semiconductor device. The semiconductor device includes a floating gate disposed on a substrate; a memory gate disposed on the floating gate; a first spacer disposed sidewalls of the floating gate and the memory gate, and an upper surface of the substrate; a second spacer disposed on the first spacer; a select high-k film disposed on a first portion of a sidewall of the first spacer between the substrate and the second spacer; and a select gate disposed on a second portion of the sidewall of the first spacer between the substrate and the second spacer. A width of a portion of the first spacer is reduced as a distance to the substrate decreases, and the portion of the first spacer is disposed between the substrate and the second spacer.

Abstract: A semiconductor memory device, and a manufacturing method of the semiconductor memory device, includes: a bit line overlapping with a peripheral circuit layer; interlayer insulating layers and conductive patterns alternately stacked in a first direction on the bit line; vertical channels connected to the bit line, the vertical channels penetrating the interlayer insulating layers and the conductive patterns, the vertical channels protruding farther in the first direction than the stacked interlayer insulating layers and the conductive patterns; a connection pattern in contact with a portion of each of the vertical channels that protrudes farther in the first direction than the stacked interlayer insulating layers and the conductive patterns, the connection pattern connecting the vertical channels; a source channel in contact with the connection pattern, the source channel extending in the first direction; and a source select line surrounding the source channel.

Abstract: A floating body SRAM cell that is readily scalable for selection by a memory compiler for making memory arrays is provided. A method of selecting a floating body SRAM cell by a memory compiler for use in array design is provided.

Abstract: Some implementations described herein provide a semiconductor structure. The semiconductor structure includes a first terminal coupled to a substrate of the semiconductor structure, with the first terminal including a first portion of a tunneling layer formed on the substrate, and a first gate formed on the first portion of the tunneling layer. The semiconductor structure includes a second terminal coupled to the substrate and adjacent to the first terminal, with the second terminal including a second portion of the tunneling layer formed on the substrate, a second gate formed on the second portion of the tunneling layer, and a dielectric structure formed on a top surface and side surfaces of the second gate. The semiconductor structure includes a third terminal coupled to an insulating structure and adjacent to the second terminal, with the third terminal including, a third gate formed on the insulating structure.

Abstract: A semiconductor memory cell comprising an electrically floating body having two stable states is disclosed. A method of operating the memory cell is disclosed.

Abstract: A vertical type non-volatile memory device includes a substrate having a cell array area of a block unit and an extension area, a vertical contact disposed in the extension area, a plurality of vertical channel structures provided on the substrate in the cell array area, a plurality of dummy channel structures provided on the substrate in the extension area, and a plurality of gate electrode layers and a plurality of interlayer insulation layers stacked alternately on the substrate. In an electrode pad connected to the vertical contact, dummy channel structures are disposed at both sides of the vertical contact and a horizontal cross-sectional surface of each of the plurality of dummy channel structures has a shape which is longer in one direction.

Abstract: A method for forming a 3D memory device is disclosed. The method includes: forming an alternating dielectric stack on a substrate; forming a plurality of channel holes penetrating the alternating dielectric stack; forming a channel structure in each channel hole; forming a channel column structure on the channel structure in each channel hole; trimming an upper portion of each channel column structure to form a channel plug; and forming a top selective gate cut between neighboring channel plugs.

Abstract: A novel semiconductor device is provided. A memory string, which extends in the Z direction and includes a conductor and an oxide semiconductor, intersects with a plurality of wirings CG extending in the Y direction. The conductor is placed along a center axis of the memory string, and the oxide semiconductor is concentrically placed outside the conductor. The conductor is electrically connected to the oxide semiconductor. An intersection portion of the memory string and the wiring CG functions as a transistor. In addition, the intersection portion functions as a memory cell.

Abstract: A first gate electrode is formed on a semiconductor substrate via a first insulating film containing a metal element. A sidewall insulating film is formed on a side surface of the first gate electrode. A second gate electrode is formed on the semiconductor substrate via a second insulating film. The second gate electrode is formed so as to adjacent to the first gate electrode via the second insulating film. The second insulating film is made of a stacked film having a third insulating film, a fourth insulating film having a charge accumulating function, and a fifth insulating film. The third insulating film is formed on the semiconductor substrate as a result of an oxidation of a portion of the semiconductor substrate, and formed on the side surface of the first gate electrode as a result of an oxidation of the sidewall insulating film, by the thermal oxidation treatment.

Abstract: A three-dimensional memory device includes a lower stack and an upper stack stacked one on the other, and each including a plurality of word lines which are stacked alternately with a plurality of interlayer dielectric layers, wherein each of the lower stack and the upper stack includes a first cell part, a second cell part, a coupling part which couples the first cell part and the second cell part, and a staircase part which extends parallel to the coupling part from the first cell part and in which pad areas of the word lines are disposed in a stepwise manner, and wherein the coupling part of the upper stack is disposed to overlap with the staircase part of the lower stack, and the staircase part of the upper stack is disposed to overlap with the coupling part of the lower stack.

Abstract: Drivers for sense amplifiers are disclosed. A driver may include two or more drain areas extending in a first direction and two or more source areas extending in the first direction. The driver may also include a drain interconnection including two or more first drain-interconnection portions which extend in the first direction above the two of more drain areas and one or more second drain-interconnection portions extending in a second direction between the two or more first drain-interconnection portions. The driver may also include a source interconnection including two or more first source-interconnection portions extending in the first direction above the two or more source areas and one or more second source-interconnection portions extending in the second direction between the two or more first source-interconnection portions. Associated systems are also disclosed.

Abstract: A semiconductor memory includes a plurality of stripe-like active areas formed by stacking, in a direction perpendicular to a substrate, a plurality of layers extending parallel to the substrate, a first gate electrode formed on first side surfaces of the active areas, the first side surfaces being perpendicular to the substrate, a second gate electrode formed on second side surfaces of the active areas, the second side surfaces being perpendicular to the substrate. The layers are patterned in self-alignment with each other, intersections of the active areas and the first gate electrode form a plurality of memory cells, and the plurality of memory cells in an intersecting plane share the first gate electrode.

Abstract: A non-volatile memory device is provided. The non-volatile memory device includes a substrate having an active region, a source region, a drain region, and a floating gate. The source region and the drain region may be arranged in the active region, the drain region may be arranged adjacent to the source region. The source region and the drain region may define a channel region therebetween. The floating gate may be arranged over the active region, and may include a first section over the channel region, a plurality of second sections over the drain region, and a connecting section arranged between the first section and the plurality of second sections.

Abstract: An artificial neural network device that utilizes one or more non-volatile memory arrays as the synapses. The synapses are configured to receive inputs and to generate therefrom outputs. Neurons are configured to receive the outputs. The synapses include a plurality of memory cells, wherein each of the memory cells includes spaced apart source and drain regions formed in a semiconductor substrate with a channel region extending there between, a floating gate disposed over and insulated from a first portion of the channel region and a non-floating gate disposed over and insulated from a second portion of the channel region. Each of the plurality of memory cells is configured to store a weight value corresponding to a number of electrons on the floating gate. The plurality of memory cells are configured to multiply the inputs by the stored weight values to generate the outputs. Various algorithms for tuning the memory cells to contain the correct weight values are disclosed.

Abstract: A semiconductor device includes a single poly non-volatile memory device including a sensing and selection gate structure, an erase gate structure, and a control gate structure. The sensing and selection gate structure includes a sensing gate and a selection gate, a bit line, a word line disposed on the selection gate, and a tunneling gate line. The erase gate structure includes an erase gate, and an erase gate line disposed near the erase gate. The control gate structure includes a control gate disposed on the substrate, and a control gate line disposed near the control gate. The sensing gate, the selection gate, the erase gate and the control gate are connected by one conductive layer. The erase gate structure implements a PMOS capacitor, an NMOS transistor, or a PMOS transistor. The semiconductor device includes a single poly non-volatile memory device including a separate program area and erase area.

Abstract: A semiconductor device includes a non-volatile memory. The non-volatile memory includes a first dielectric layer disposed on a substrate, a floating gate disposed on the dielectric layer, a control gate and a second dielectric layer disposed between the floating gate and the control gate. The second dielectric layer includes one of a silicon oxide layer, a silicon nitride layer and a multi-layer thereof. The first dielectric layer includes a first-first dielectric layer formed on the substrate and a second-first dielectric layer formed on the first-first dielectric layer. The second-first dielectric layer includes a dielectric material having a dielectric constant higher than silicon nitride.

Abstract: Methods, systems and apparatus for memory devices with discharging circuits are provided. In one aspect, a semiconductor device includes a semiconductor substrate, one or more discharging circuits arranged on the semiconductor substrate, one or more common source line (CSL) layers conductively coupled to the one or more discharging circuits, and a memory array having a three-dimensional (3D) array of memory cells arranged in a plurality of vertical channels on the one or more CSL layers. Each of the plurality of vertical channels includes a respective string of memory cells, and each of the one or more CSL layers is conductively coupled to corresponding strings of memory cells. Each of the one or more discharging circuits includes one or more transistors that are disabled by one or more corresponding conductive lines through the memory array.

Abstract: A semiconductor memory cell comprising an electrically floating body having two stable states is disclosed. A method of operating the memory cell is disclosed.

Abstract: A structure of memory device includes trench isolation lines in a substrate, extending along a first direction. An active region in the substrate is between adjacent two of the trench isolation lines. A dielectric layer is disposed on the active region of the substrate. A floating gate corresponding to a memory cell is disposed on the dielectric layer between adjacent two of the trench isolation lines. The floating gate has a first protruding structure at a sidewall extending along the first direction. A first insulating layer crosses over the floating gate and the trench isolation lines. A control gate line is disposed on the first insulating layer over the floating gate, extending along a second direction intersecting with the first direction. The control gate line has a second protruding structure correspondingly stacked over the first protruding structure of the floating gate, and crosses over the trench isolation lines.

Abstract: Various embodiments, disclosed herein, include methods and apparatus having charge trap structures, where each charge trap structure includes a dielectric barrier between a gate and a blocking dielectric on a charge trap region of the charge trap structure. In various embodiments, material of the dielectric barrier of each of the charge trap structures may have a dielectric constant greater than that of aluminum oxide. Additional apparatus, systems, and methods are disclosed.

Abstract: A cache memory circuit that evicts cache lines based on which cache lines are storing background data patterns is disclosed. The cache memory circuit can store multiple cache lines and, in response to receiving a request to store a new cache line, can select a particular one of previously stored cache lines. The selection may be performed based on data patterns included in the previously stored cache lines. The cache memory circuit can also perform accesses where the internal storage arrays are not activated in response to determining data in the location specified by the requested address is background data. In systems employing virtual addresses, a translation lookaside buffer can track the location of background data in the cache memory circuit.

Abstract: There are provided a semiconductor memory device and a manufacturing method thereof. The semiconductor memory device includes: a first etch stop layer; a source layer on the first etch stop layer; a second etch stop layer on the source layer; a stack structure on the second etch stop layer; and a channel structure penetrating the first and second etch stop layers, the source layer, and the stack structure, the channel structure being electrically connected to the source layer. A material of each of the first and second etch stop layers has an etch selectivity with respect to a material of the source layer.

Abstract: The present invention provides a semiconductor structure for a split gate flash memory cell and a method of manufacturing the same. The split gate flash memory cell provided by the present invention at least includes a select gate and a floating gate formed on the substrate, one side of the select gate is formed with an isolation wall, and the floating gate is on the other side of the isolation wall. An ion implantation region is formed in an upper portion of the substrate below the isolation wall, wherein the ion implantation type of the ion implantation region is different from the ion implantation type of the substrate. The manufactured split gate flash memory cell can reduce the influence of the channel inversion region on the channel current, thereby improving the characteristics of the channel current of the flash cell and optimizing the device performance.

Abstract: A memory device includes a silicon-germanium source contact layer, an alternating stack of insulating layers and electrically conductive layers located over the silicon-germanium source contact layer, and a memory stack structure vertically extending through the alternating stack. The memory stack structure comprises a memory film and a vertical semiconductor channel that contacts the memory film. The silicon-germanium source contact layer contacts a cylindrical portion of an outer sidewall of the vertical semiconductor channel. Logic circuits for operating the memory elements may be provided on a substrate within a same semiconductor die, or may be provided in another semiconductor die that is bonded to the semiconductor die containing the memory device.

Abstract: There are provided a semiconductor memory device and a manufacturing method thereof. The semiconductor memory device includes: a source layer; a channel structure extending in a first direction from within the source layer; a source-channel contact layer surrounding the channel structure on the source layer; a first select gate layer overlapping with the source-channel contact layer and surrounding the channel structure; a stack including interlayer insulating layers and conductive patterns that are alternately stacked in the first direction and surrounding the channel structure, the stack overlapping with the first select gate layer; and a first insulating pattern that is formed thicker between the first select gate layer and the channel structure than between the stack and the channel structure.

Abstract: A floating body SRAM cell that is readily scalable for selection by a memory compiler for making memory arrays is provided. A method of selecting a floating body SRAM cell by a memory compiler for use in array design is provided.

Abstract: In an embodiment, a plasma processing system includes a vacuum chamber, a substrate holder configured to hold a substrate to be processed where the substrate holder is disposed in the vacuum chamber. The system further includes an electron source disposed above a peripheral region of the substrate holder, the electron source being configured to generate an electron beam towards the peripheral region of the substrate holder.

Abstract: A memory, comprising: a plurality of storage groups, first signal lines and second signal lines. The plurality of storage groups is arranged along a first direction, each one of the storage groups includes multiple banks, which are arranged along a second direction, and the first direction is perpendicular to the second direction; the first signal lines extend along the first direction, each first signal line is arranged correspondingly to more than one of the multiple banks, and configured to transmit storage data of the more than one of the multiple banks; and the second signal lines extend along the first direction, each one of the second signal lines is arranged correspondingly to a respective bank, and configured to transmit the storage data of the respective bank; wherein the first signal lines exchange the storage data with the second signal lines through respective data exchange circuits.

Abstract: A semiconductor storage device includes a substrate, a plurality of conductive layers arranged in a first direction intersecting a surface of the substrate, and a semiconductor layer extending in the first direction and penetrating the plurality of conductive layers. The plurality of conductive layers includes a first conductive layer and a second conductive layer that are adjacent to each other, a third conductive layer and a fourth conductive layer that are adjacent to each other, and a fifth conductive layer and a sixth conductive layer that are adjacent to each other.

Abstract: A method for manufacturing a semiconductor feature includes: alternatingly forming first and second dielectric layers on a semiconductor substrate along a vertical direction; forming multiple spaced-apart trenches penetrating the first and second dielectric layers; forming multiple support segments filling the trenches; removing the second dielectric layers to form multiple spaces; forming multiple conductive layers filling the spaces; removing the support segments to expose the conductive layers and the first dielectric layers; selectively forming a blocking layer covering the first dielectric layers outside of the conductive layers; forming multiple selectively-deposited sub-layers on the exposed conductive layers outside of the blocking layer and each connected to one of the conductive layers; forming multiple channel sub-layers on the selectively-deposited sub-layers outside of the blocking layer; removing the blocking layer; forming multiple isolation sub-layers filling the trenches; and forming multiple

Abstract: A neural network device with synapses having memory cells each having a floating gate and a first gate over first and second portions of a channel region disposed between source and drain regions, and a second gate over the floating gate or the source region. First lines each electrically connect the first gates in one of the memory cell rows, second lines each electrically connect the second gates in one of the memory cell rows, third lines each electrically connect the source regions in one of the memory cell columns, and fourth lines each electrically connect the drain regions in one of the memory cell columns. The synapses receive a first plurality of inputs as electrical voltages on the first or second lines, and provide a first plurality of outputs as electrical currents on the third or fourth lines.

Abstract: Provided herein is a memory device and a method of operating the same. The memory device may include a memory block including a plurality of memory cells, and a peripheral circuit configured to apply a plurality of operating voltages to a plurality of word lines of the memory block during a program operation, wherein, during a verify operation included in the program operation, the peripheral circuit may be configured to allow a selected word line, among the plurality of word lines, to float, and may decrease a potential of the selected word line to a pre-level by decreasing potentials of adjacent word lines to the selected word line.

Abstract: A microelectronic device comprises a stack structure comprising alternating conductive structures and insulative structures arranged in tiers, each of the tiers individually comprising a conductive structure and an insulative structure, strings of memory cells vertically extending through the stack structure, the strings of memory cells comprising a channel material vertically extending through the stack structure, another stack structure vertically overlying the stack structure and comprising alternating levels of other conductive structures and other insulative structures, the other stack structure comprising pillars vertically overlying the strings of memory cells, each pillar comprising an other channel material in electrical communication with the channel material of the strings of memory cells, and conductive contact structures vertically overlying the other stack structure, each conductive contact structure comprising an electrically conductive contact at least partially extending into the pillars and

Abstract: Disclosed are semiconductor memory devices and methods of fabricating the same. A semiconductor memory device includes a stack structure that includes a plurality of electrodes and a plurality of dielectric layers that are alternately stacked on a substrate, a vertical channel structure that penetrates the stack structure, and a conductive pad on the vertical channel structure. The vertical channel structure includes a semiconductor pattern and a vertical dielectric layer between the semiconductor pattern and the electrodes. An upper portion of the semiconductor pattern includes an impurity region that includes a halogen element. The upper portion of the semiconductor pattern is adjacent to the conductive pad.

Abstract: A neuromorphic device for the analog computation of a linear combination of input signals, for use, for example, in an artificial neuron. The neuromorphic device provides non-volatile programming of the weights, and fast evaluation and programming, and is suitable for fabrication at high density as part of a plurality of neuromorphic devices. The neuromorphic device is implemented as a vertical stack of flash-like cells with a common control gate contact and individually contacted source-drain (SD) regions. The vertical stacking of the cells enables efficient use of layout resources.

Abstract: A semiconductor memory device comprises a semiconductor, a first insulator, a second insulator, a first conductor, a third insulator, a fourth insulator, and a fifth insulator. The first insulator is on the semiconductor. The second insulator is on the first insulator. The third insulator is on the first conductor. The fourth insulator is between the second insulator and the first conductor. The fifth insulator is provided between the second insulator and the third insulator. The fifth insulator is having an oxygen concentration different from an oxygen concentration of the fourth insulator.

Abstract: A semiconductor memory structure includes a semiconductor layer, a conductive layer disposed over the semiconductor layer, a gate penetrating through the conductive layer and the semiconductor layer, and an interposing layer disposed between the gate and the conductive layer and between the gate and the semiconductor layer, wherein a pair of channel regions is formed in the semiconductor layer at two sides of the gate.

Abstract: Some embodiments include an integrated structure having vertically-stacked conductive levels. Upper conductive levels are memory cell levels, and a lower conductive level is a select device level. Conductively-doped semiconductor material is under the select device level. Channel material extends along the memory cell levels and the select device level, and extends into the conductively-doped semiconductor material. A region of the channel material that extends into the conductively-doped semiconductor material is a lower region of the channel material and has a vertical sidewall. Tunneling material, charge-storage material and charge-blocking material extend along the channel material and are between the channel material and the conductive levels. The tunneling material, charge-storage material and charge-blocking material are not along at least a portion of the vertical sidewall of the lower region of the channel material, and the conductively-doped semiconductor material is directly against such portion.

Abstract: A nonvolatile memory device includes; a memory cell area including a cell structure and a common source plate. The memory cell area is mounted on a peripheral circuit area including a buried area covered by the memory cell area and an exposed area uncovered by the memory cell area. A first peripheral circuit (PC) via extending from the exposed area, and a common source (CS) via extending from the common source plate, wherein the first PC via and the CS via are connected by a CS wire disposed outside the cell structure and providing a bias voltage to the common source plate.

Abstract: Methods for forming channel structures in 3D memory devices are disclosed. In one example, a memory film and a sacrificial layer are subsequently formed along a sidewall and a bottom of a channel hole. A protective structure covering a portion of the sacrificial layer along the sidewall of the channel hole is formed. A portion of the sacrificial layer at the bottom of the channel hole that is not covered by the protective structure is selectively removed. A portion of the memory film at the bottom of the channel hole that is not covered by a remainder of the sacrificial layer is selectively removed.

Abstract: A non-volatile memory device includes a substrate. A plurality of shallow trench isolation (STI) lines are disposed on the substrate and extend along a first direction. A memory gate structure is disposed on the substrate between adjacent two of the plurality of STI lines. A trench line is disposed in the substrate and extends along a second direction intersecting the first direction, wherein the trench line also crosses top portions of the plurality of STI lines. A conductive line is disposed in the trench line and used as a selection line to be coupled to the memory gate structure.

Abstract: The present disclosure provides a method for preparing a semiconductor device structure. The method includes forming a first metal plug, a second metal plug, a third metal plug, and a fourth metal plug over a semiconductor substrate; forming an energy removable liner covering the first metal plug, the second metal plug, the third metal plug, and the fourth metal plug; performing an etching process to remove a portion of the energy removable layer from the substrate, while remaining an energy removable block between the first metal plug and the second metal plug in the cell region; forming a dielectric layer covering the energy removable block and the first metal plug, the second metal plug, the third metal plug, and the fourth metal plug; performing a thermal treating process to transform the energy removable layer into a first air gap structure including a first air gap enclosed by liner layer.

Abstract: A method for manufacturing a semiconductor device according to an, exemplary embodiment of the present disclosure includes: forming a semiconductor layer on a substrate in a chamber; and forming a semiconductor layer on a substrate in a chamber. Forming the insulation layer includes: (a) injecting precursors that include a metal into a surface of the semiconductor layer; (b) removing precursors that are not adsorbed; (c) injecting reactants onto the surface of the semiconductor layer; and (d) removing residual reactants. The semiconductor layer includes a semiconductor material that has a layered structure.