Abstract: Printable metal formulations, methods of making the formulations, and methods of coating or printing thin films from metal ink precursors are disclosed. The metal formulation generally includes one or more Group 4, 5, 6, 7, 8, 9, 10, 11, or 12 metal salts or metal complexes, one or more solvents adapted to facilitate coating and/or printing of the formulation, and one or more optional additives that form (only) gaseous or volatile byproducts upon reduction of the metal salt or metal complex to an elemental metal and/or alloy thereof. The formulation may be made by combining the metal salt(s) or metal complex(es) and the solvent(s), and dissolving the metal salt(s) or metal complex(es) in the solvent(s) to form the formulation. Thin films may be made by coating or printing the metal formulation on a substrate; removing the solvents to form a metal-containing precursor film; and reducing the metal-containing precursor film.

Abstract: A method of producing a coating for a medical device having high surface area and low porosity. The coating is formed by a PVD process in which a primary metallic component is deposited in the presence of a secondary reactive component in a high energy environment such that surface diffusion and intermixing can occur prior to the solidification of the condensate. The resulting coating consists of a zone 2 microstructure having a [1,1,1] crystal orientation, which provides a surface having well-defined pyramidal-shaped structures formed thereon.

Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.

Abstract: Metal source containing precursor liquid solutions for chemical vapor deposition processes, including atomic layer deposition, for fabricating conformal metal-containing films on substrates are described. More specifically, the metal source precursor liquid solutions are comprised of (i) at least one metal complex selected from ?-diketonates, ?-ketoiminates, ?-diiminates, alkyl metal, metal carbonyl, alkyl metal carbonyl, aryl metal, aryl metal carbonyl, cyclopentadienyl metal, cyclopentadienyl metal isonitrile, cyclopentadienyl metal nitrile, cyclopentadienyl metal carbonyl, metal alkoxide, metal ether alkoxide, and metal amides wherein the ligand can be monodentate, bidentate and multidentate coordinating to the metal atom and the metal is selected from group 2 to 14 elements, and (ii) a solvent selected from organic amides including linear amides and cyclic amides for such metal source containing precursors.

Abstract: An acidic chromium-free solution for treating a metal surface containing: a vanadium cation source and/or a vanadyl cation source; an organic acid as an anion source; and at least one oxoacid as another anion source is provided. The oxoacid is selected from oxoacids of nitrogen, sulfur, phosphorus, boron, and chlorine. A metal component composed of, for example, aluminum or magnesium is brought into contact with the chromium-free solution to form a vanadium coating film of a surface of the metal component. A surface treating process using this chromium-free solution is useful for formation of a coating film having low corrosion resistance and low electric resistance.

Abstract: Disclosed are methods and compositions for aqueous electrodeposition of rare earth-transitiona metal alloys (e.g., samarium-cobalt alloys). Also disclosed are nanostructured magnetic coatings comprising a magnetic alloy of a rare earth metal (e.g., samarium) and a transition metal (e.g., cobalt). This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.

Abstract: A film formation method for forming a metal oxide film includes loading a target object into a process container configured to maintain a vacuum therein; supplying a film formation source material into the process container; supplying an oxidizing agent into the process container; and causing the film formation source material and the oxidizing agent to react with each other, thereby forming a metal oxide film on the target object. The film formation source material is an organic metal compound containing a metal of the metal oxide film and prepared by mixing a first organic metal compound that is solid at room temperature and has a higher vapor pressure with a second organic metal compound that is liquid at room temperature such that the organic metal compound is liquid at room temperature.

Abstract: A composition for deposition as a coating includes a matrix material having a molten fraction of between about 33% and about 90% by volume and a filler material interspersed within the matrix.

Abstract: Compositions and methods for forming metal films on semiconductor substrates are disclosed. One of the disclosed methods comprises: heating the semiconductor substrate to obtain a heated semiconductor substrate; exposing the heated semiconductor substrate to a composition containing at least one metal precursor comprising at least one ligand, an excess amount of neutral labile ligands, a supercritical solvent, and optionally at least one source of B, C, N, Si, P, and mixtures thereof; exposing the composition to a reducing agent and/or thermal energy at or near the heated semiconductor substrate; disassociating the at least one ligand from the metal precursor; and forming the metal film while minimizing formation of metal oxides.

Abstract: A release film for soft composite materials is provided. The release film contains a film with a closely packed self-assembled monolayer. A method of applying soft composite materials to a substrate without loss of the soft composite material to the release film is also provided. The method is useful in applications such as applying thermal pastes to semiconductor packaging.

Abstract: Devices and methods for the controlled release or exposure of reservoir contents, and methods of manufacture thereof, are provided. The device includes a reservoir cap formed of an electrically conductive material, which prevents the reservoir contents from passing out from the device and prevents exposure of the reservoir contents to molecules outside of the device; an electrical input lead connected to said reservoir cap; and an electrical output lead connected to said reservoir cap, such that upon application of an electrical current through the reservoir cap, via the input lead and output lead, the reservoir cap ruptures to release or expose the reservoir contents. The reservoir contents can comprise a release system containing drug molecules for release or can comprise a secondary device, such as a sensor. The controlled release system may be incorporated into an implantable drug delivery or biosensing device.

Abstract: The various embodiments of the present invention generally relate to the deposition of a seedlayer for a magnetic recording medium used for perpendicular magnetic recording (PMR) applications, where the seedlayer provides for grain size refinement and reduced lattice mis-fit for a subsequently deposited underlayer or granular magnetic layer, and where the seedlayer is deposited using a nickel (Ni) alloy based sputter target. The nickel (Ni) alloy can be binary (Ni—X; Ni—Y) or ternary (Ni—X—Y). In addition, the binary (Ni—X; Ni—Y) or ternary (Ni—X—Y) nickel (Ni) based alloys can be further alloyed with metal oxides, thus forming seedlayer thin films with a granular microstructure containing metallic grains, surrounded by an oxygen rich grain boundary. The nickel-based alloys (with or without metal oxides) of the various exemplary embodiments can be made by powder metallurgical technique or by melt-casting techniques, with or without thermo-mechanical working.

Abstract: An aluminizing composition includes an aluminum-based powder, an inert organic pyrolysable thickener, and a binder selected from the group consisting of colloidal silica, at least one organic resin, and combinations thereof. A method for aluminizing an internal passage of a metal substrate comprises injecting the organic- based aluminizing composition into the internal passage, heat treating the composition under conditions sufficient to remove volatile components from the composition, to cause diffusion of aluminum into surface regions of the internal passage, and to cause decomposition of at least some pyrolysable thickener particles, and burnishing excess material from the internal passage.

Abstract: Tantalum precursors suitable for chemical vapor deposition of tantalum-containing material, e.g., tantalum, TaN, TaSiN, etc., on substrates. The tantalum precursors are substituted cyclopentadienyl tantalum compounds. In one aspect of the invention, such compounds are silylated to constitute tantalum/silicon source reagents. The precursors of the invention are advantageously employed in semiconductor manufacturing applications to form diffusion barriers in connection with copper metallization of the semiconductor device structure.

Abstract: A method is provided for manufacturing a high-precision mold whereby a feature matching a desired feature design is carved into a hard mold material (41) using, for example, a diamond grinding wheel and/or a diamond turning point. Inherent imprecision and errors (49) introduced by the use of the grinding wheel/turning point are measured to determine deviations from the desired feature design. An ultrafast shortpulse laser is then activated to desirably ablate the deviations, thereby correcting the errors and conforming the feature to the desired shape. Furthermore, a thin film (1602) may be formed over the feature either prior to or after the laser ablation process, where the error measurement and laser ablation processes detects and ablates errors on the surface of the thin film, respectively. Additionally, the laser ablation process may be applied directly to, for example, an optical lens (1400) formed from an imprecise mold to remove any errors and imperfections thereon.

Abstract: Disclosed are coating compositions, such as primer compositions, suitable for providing corrosion protection to metal substrates, as well as related coated articles and methods.

Abstract: It is an object of the present invention to provide an electroless plating pre-treatment solution and an electroless plating method capable of shortening the incubation time and achieving cost reduction. As the pre-treatment solution 7 to be supplied onto the wafer W before the electroless plating, an aqueous solution is supplied in which an activation accelerator to accelrate the oxidative decomposition reaction of a reducing agent and an oxide layer remover to remove an oxide layer formed on the wiring portions 4a are dissolved. The activation accelerator includes at least one selected from the group consisting of sulfonic acid having two or more characteristic groups, derivatives of the sulfonic, and salts of the sulfonic acid.

Abstract: Additionally, a coating composition comprising gelatine, water and a metal and/or ceramic powder is used to form coating layers on selected materials.

Abstract: The present invention provides a method for metal plating which makes it possible to perform electroless plating in a favorable manner even on materials difficult to apply electroless plating, and a pretreatment agent for this method. An article to be plated is treated with a pretreatment agent which has been prepared by mixing a solution of a silane coupling agent having a metal-capturing functional group in its molecule and a solution containing a metal that shows catalytic activity in the deposition of a plating metal such as copper, nickel or the like from an electroless plating solution onto the surface of an article to be plated so that the above-mentioned metal is captured by the above-mentioned silane coupling agent, and then adding a reducing agent. Afterward, electroless plating is performed so that a metal thin film is formed on the surface of the article pretreated above. Then, desired metal plating can be performed.

Abstract: An aqueous nickel slurry of the present invention comprises water, nickel fine powder provided thereon with an insoluble inorganic oxide adhered to the surface of the individual nickel fine particles constituting the fine powder, polyacrylic acid or an ester or salt thereof and at least one member selected from the group consisting of ammonium hydroxides substituted with organic substituents and hydroxyl group-containing amine compounds. The aqueous nickel slurry comprises nickel fine powder stably dispersed in the slurry in a high concentration without causing any re-agglomeration and can be used as a conductive paste for firing, in particular, a conductive paste for use in making a multilayer ceramic capacitor. The aqueous nickel slurry comprising nickel fine powder stably dispersed in the slurry in a high concentration without causing any re-agglomeration is prepared by the method of the present invention.

Abstract: The invention provides methods and kits to form water swellable gel coatings, preferably lubricious coatings, on substrates, and coated substrates thus formed. The coatings contain one or more antimicrobial metals formed with atomic disorder, together with one or more antimicrobial metals formed with atomic disorder such that the coatings provide an antimicrobial and anti-inflammatory effect when wet. The invention also provides a method to produce metal powders by sputtering a coating onto a moving surface, and then scraping the coating with one or more scrapers to produce the metal powder. The method is particularly useful for producing large amounts of nanocrystalline antimicrobial metal powders formed with atomic disorder, useful in the water swellable gel coatings of this invention.

Abstract: The invention relates to a paste, which can undergo screen printing, for producing a porous polymer membrane. Said paste contains at least one polymer, one or more solvents for the polymer having a boiling point of >100° C., one or more non-solvents for the polymers (pore-forming agents) having a higher boiling point than that of the solvent(s), and contains a hydrophilic viscosity modifier.

Abstract: The present invention relates to composite polymers containing nanometer-sized metal particles and manufacturing method thereof, which can be uniformly dispersed nanometer-sized metal particles into polymers, thereby allowing the use thereof as optically, electrically and magnetically functional materials. The method for manufacturing composite polymers containing nanometer-sized metal particles includes the steps of: dispersing at least one metal precursor into a matrix made of polymers in a molecule level; and irradiating rays of light on the matrix containing the metal precursors dispersed in the molecule level and reducing the metal precursors into metals and fixing nanometer sized metal particles inside of matrix.

Abstract: The present invention provides compositions and methods for electroless deposition of bright silver layers of uniform thickness. The compositions contain silver ions, water, one or more complexing agents and one or more carboxylic acid-substituted nitrogen-containing heterocyclic compound. Such compositions and methods are particularly useful in the manufacture of electronic devices.

Abstract: A method of introducing small amounts of a refractory element into a vapor deposition coating. A second material (30), containing at least two elements which are desired to be deposited as a coating on a base material, has placed over it a first material (20) substantially comprising such two elements and a refractory element. The first material (20) is adapted to permit transport of the at least two elements in the second material (30) through the first material (20) when the first (20) and second (30) material are in a molten state and in touching contact with the other so as to permit evaporation of the two elements and the refractory element from an exposed surface. Heat is supplied to the first (20) and second (30) materials to permit evaporation of the at least two elements of second material (30) and the refractory element in the first material (20), and the resulting vapors are condensed as a deposit on a base material (50).

Abstract: A process is provided for the preparation of a metallic oxide composite including mixing an aqueous solution of a water-soluble metal compound and colloidal silica, depositing the mixture upon a substrate, heating the mixture-coated substrates at temperatures from about 150° C. to about 300° C. for time sufficient to form a metallic oxide film, and, removing the silica from the metallic oxide film whereby a porous metal oxide structure is formed.

Abstract: Single imido tungsten imido precursors are described for the deposition of tungsten nitride on a substrate by processes such as metal organic chemical vapor deposition. The precursors may be employed to form diffusion barrier layers on microelectronic devices. A method for forming tungsten nitride layers includes the steps of providing a tungsten imido species having the formula LyW(NR)Xn, where R is a carbon containing group, y is an integer between 0 and 5, n is an integer between 0 and 4 and Ly and Xn are selected from the group of non-imido ligands. The single imido tungsten imido species is flowed to a surface of a substrate where the single imido tungsten imido species decomposes to form a tungsten nitride layer.

Abstract: An electroplating bath is disclosed that is particularly suited to the electrodeposition of tin, zinc and alloys of the foregoing in a smooth and bright electrodeposit. The disclosed electroplating bath comprises propanedioic acid, diethyl ester, polymer with N-(3-aminopropyl)-1,3-propanediamine, N-(2-carboxy benzoyl) as a brightener additive. In addition, the electroplating bath may also comprise carboxylic acids, ammonium salts, aldehyde compounds and a variety of co-brighteners.

Abstract: The disclosure relates to a process for forming a deposit on the surface of a metallic or conductive surface. The process employs an electrolytic process to deposit a mineral containing coating or film upon a metallic or conductive surface.

Abstract: A composition and process for electroplating tin or tin alloys onto a substrate at relatively high current densities. The electrolyte comprises toluene sulfonic acid and a source of ammonium ions and/or magnesium ions. The process is particularly suited to high speed reel to reel or strip steel plating.

Abstract: An neutral electroless gold plating method that minimises “black band” corrosion problem in the final product. The electroless gold plating solution is provided at neutral pH in the presence of a reducing agent, a complexing agent and an accelerator to allow a gold layer of the desired thickness to be plated under manufacturing conditions The gold layer produced thereof has good bondability and solderability.

Abstract: The transparent conductive film of the present invention is formed to have a conductive layer containing at least ruthenium fine particles, gold fine particles and silver fine particles, the weight ratio of ruthenium fine particles and gold fine particles in the conductive layer being within the range of 40:60 to 99:1. As a result, this transparent conductive film and a display device having this transparent conductive film have superior electromagnetic wave shielding effects and anti-reflection effects, high chemical stability and superior visibility.

Abstract: A method for applying a bond coat on a metal-based substrate is described. A slurry which contains braze material and a volatile component is deposited on the substrate. The slurry can also include bond coat material. Alternatively, the bond coat material can be applied afterward, in solid form or in the form of a second slurry. The slurry and bond coat are then dried and fused to the substrate. A repair technique using this slurry is also described, along with related compositions and articles.

Abstract: A composition capable of forming a metal ruthenium film and a ruthenium oxide film by a simple application/baking process, a process for forming a metal ruthenium film and a ruthenium oxide film from the composition, a metal ruthenium film and a ruthenium oxide film formed by the process, and electrodes formed of the films.

Abstract: A method for applying a bond coat on a metal-based substrate is described. A slurry which contains braze material and a volatile component is deposited on the substrate. The slurry can also include bond coat material. Alternatively, the bond coat material can be applied afterward, in solid form or in the form of a second slurry. The slurry and bond coat are then dried and fused to the substrate. A repair technique using this slurry is also described, along with related compositions and articles.

Abstract: The present invention provides a method for metal plating which makes it possible to perform electroless plating in a favorable manner even on materials difficult to apply electroless plating, and a pretreatment agent for this method.

Abstract: The present invention provides a solution suitable for forming a composite oxide type dielectric thin film containing at least one organometallic compound dissolved in at least one solvent selected from the group consisting of cyclic or acyclic diethers, alkyl-substituted cyclic monoethers, mono- or di-branched alkyl monoethers, alkoxy alcohols, diols, and acetoacetic esters, or dissolved in a solvent mixture comprising at least one solvent selected from the group consisting of cyclic and acyclic saturated hydrocarbons, and at least one solvent selected from the group consisting of cyclic or acyclic diethers, alkyl-substituted cyclic monoethers, mono- or di-branched alkyl monoethers, alkoxy alcohols, diols, acetoacetic esters, and unsubstituted or alkyl-substituted pyridine.

Abstract: An electroplating bath is disclosed that is particularly suited to the electrodeposition of tin, zinc and alloys of the foregoing in a smooth and bright electrodeposit. The disclosed electroplating bath comprises propanedioic acid, diethyl ester, polymer with N-(3-aminopropyl)-1,3-propanediamine, N-(2-carboxy benzoyl) as a brightener additive.

Abstract: A metal complex solution comprising an organic solvent, and a complex composed of an organic acid salt of at least one metal and an organic amine or organic ketone compound, dissolved in the organic solvent; a photosensitive metal complex solution comprising the metal complex solution, and a photosensitive resin added to the solution; and a method for forming metallic oxide films, using these solutions.

Abstract: A method is disclosed which can form a thin metal film in a cost-effective manner and by a simple process of applying a coating composition. The method involves applying a coating composition containing colloidal particles of noble metal or copper, as obtained by reducing a compound of the noble metal or copper in the presence of a polymeric dispersant, to form a coating film, and heating the coating film so that the colloidal particles present therein are fused together to form a thin metal film.

Abstract: A noise inhibitor for preventing a creaking noise production consisting of: a non-ionic or a carboxylic acid type negative ionic oil-soluble surfactant; and water or a wax emulsion solution, the surfactant being diluted by 2 to 15 times with the water or the wax emulsion solution. The range of HLB of the surfactant is from 8.0 to 10 and the range of pH of the noise inhibitor is from 7.5 to 9.5.

Abstract: Methods of forming a film on a substrate using chemical vapor deposition techniques and pyrazolyl complexes. The complexes and methods are particularly suitable for the preparation of semiconductor structures.

Abstract: The use of alkali metal, alkaline earth metal, ammonium and substituted ammonium salts of alkyl and alkanol sulfonic acids as additives in pure metal and metal alloy sulfate electroplating baths has a number of unexpected benefits including wider useful current density range, improved appearance and in the case of tin improved oxidative stability. The metals and alloys include but are not limited to tin, nickel, copper, chromium, cadmium, iron, rhodium, ruthenium, iron/zinc and tin/zinc.

Abstract: The invention relates to a structural component for a device for the treatment of melts, especially of glass melts;

Abstract: A tin/indium alloy plating solution not containing any cyanide and serving as a substitute for tin/lead alloy plating is provided. The tin/indium alloy plating solution is a weakly alkaline aqueous solution for tin/indium alloy electroplating, prepared by adding, as metal salts, a tetravalent tin salt of metastannic acid and a trivalent indium salt of an organosulfonic acid, further adding a chelating agent, and adjusting the pH of the aqueous solution to a value of 7 to 11 with a caustic alkali.

Abstract: The disclosure relates to a process for forming a deposit on the surface of a metallic or conductive surface. The process employs an electrolytic process to deposit a mineral containing coating or film upon a metallic or conductive surface.

Abstract: An organic copper compound is provided that is represented by the following formula (1) in which monovalent copper is coordinated with a &bgr;-diketone compound and an unsaturated hydrocarbon compound having a silyloxy group: wherein R Is an unsaturated hydrocarbon moiety, L is the &bgr;-diketone compound, X1, X2, and X3 are each a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms, and X1, X2, and X3 may be the same or different from each other. The organic copper compound is barely decomposed in a stock solution before use, has a prolonged storage life, exhibits a high film deposition rate, can be effectively decomposed on a substrate, is highly volatile, and exhibits high adhesiveness to an underlayer.

Abstract: A metal compound solution of a metal compound represented by formula (I): 1

Abstract: This invention is a method to extend the bath life of certain alkaline accelerators used in metal/tin colloid catalyst used in direct plating processes on printed circuit boards. The method is comprised of the following steps: measuring the pH of the alkaline activator bath, and restoring, the pH of the alkaline activator bath to a desired pH range between 12.2 and 12.6.

Abstract: A method to make volumetric additions of dilute aqueous acid solutions to a colloidal catalyst bath that will retard the salt crystallization. The process includes the steps of measuring the volumetric loss of water by physical measurements and adding dilute aqueous acid solution to the bath in the amount of the loss or by measuring the density or specific gravity of the solution and adding dilute aqueous acid solutions to maintain the specific gravity in the desired range.