Abstract: The present disclosure relates to methods of preparing a material for welding. The material is prepared by utilizing a laser to obliterate contaminants from the material surface.

Abstract: An ultrasonic cleaning method for cleaning an object in a liquid in which a gas is dissolved includes preparing the liquid in which the gas is dissolved. The object is cleaned while applying ultrasonic waves to the liquid so that a ratio determined by dividing a vibration strength of the liquid at a fourth-order frequency of the ultrasonic waves by a vibration strength of the liquid at a fundamental frequency of the ultrasonic waves is larger than 0.8/1000.

Abstract: An ultrasonic cleaning method for cleaning an object in a liquid in which a gas is dissolved includes preparing the liquid in which the gas is dissolved and stirring the liquid while irradiating the liquid with the ultrasonic waves so as to realize a state where bubbles containing the gas dissolved in the liquid continue to be generated. The object is cleaned in the state where the bubbles containing the gas continue to be generated.

Abstract: There are provided an ultrasonic cleaning apparatus and an ultrasonic cleaning method capable of suppressing occurrence of damage on a substrate to be cleaned and capable of performing cleaning at a high cleaning level for highly precise substrates and the like used in an electronics industry. Occurrence of damage on the substrate to be cleaned is suppressed by holding an object to be cleaned so as to be positioned out of a region where perpendiculars extend from an oscillating surface of an ultrasonic transducer to a liquid surface (an ultrasonic-irradiated region) under and in the vicinity of the liquid surface of a cleaning solution, exciting a capillary wave on a surface of the cleaning solution by an ultrasonic wave, and separating particulate contamination of the object to be cleaned by an acoustic pressure generated by the capillary wave without irradiating the object to be cleaned directly with the ultrasonic wave.

Abstract: In a method of cleaning a fiber cap of a laser probe tip, a glass fiber comprising a cap body having an internal cavity and an opening to the cavity at a proximal end is provided. A particulate collecting member is also provided. An electrical charge is applied to the particulate collecting member. A distal end of the particulate collecting member is then inserted through the opening and into the cavity of the fiber cap. Particles located within the cavity are attracted to the particulate collecting member. The attracted particles attach to the particulate collecting member. The particulate collecting member is then removed from the cavity.

Abstract: Improved methods for stripping photoresist and removing etch-related residues from dielectric materials are provided. In one aspect of the invention, methods involve removing material from a dielectric layer using a hydrogen-based etch process employing a weak oxidizing agent and fluorine-containing compound. Substrate temperature is maintained at a level of about 160° C. or less, e.g., less than about 90° C.

Abstract: The invention relates to a method of ablating a surface layer of a wall by sweeping the said layer, comprising: a step of directional control by an optical deflector of a plurality of pulsed laser beams; a step of ablating the layer on impact zones created by the plurality of laser beams, each impact zone being defined by a centre and by a characteristic dimension; the method is characterized in that the impact zones are disjoint, the distance between each centre of the impact zones being equal to at least ten times the largest characteristic dimension of the impact zones. The invention also relates to a corresponding device.

Abstract: Provided herein are etching, cleaning and drying methods using a supercritical fluid, and a chamber system for conducting the same. The etching method includes etching the material layer using a supercritical carbon dioxide in which an etching chemical is dissolved, and removing an etching by-product created from a reaction between the material layer and the etching chemical using a supercritical carbon dioxide in which a cleaning chemical is dissolved. Methods of manufacturing a semiconductor device are also provided.

Abstract: A method for removing species from a substrate includes arranging a purge ring in a chamber proximate to a pedestal. The purge ring includes an inlet portion and an exhaust portion. The inlet portion defines an inlet plenum and an inlet baffle. The inlet baffle includes a continuous slit that is substantially continuous around a peripheral arc not less than about 270°. The exhaust portion includes an exhaust channel that is located substantially opposite the inlet baffle. The method further includes supplying ozone to the inlet plenum; at least partially defining a ring hole space having a periphery using the inlet portion and the exhaust portion; conveying gas from the inlet plenum into the ring hole space using the inlet baffle; conveying gas and other matter out of a purge space using the exhaust portion; and inhibiting deposition of material evolved from the substrate during curing using the purge ring.

Abstract: There is provided an ultrasonic cleaning method capable of reliably cleaning to remove adhesive components even when the adhesive components adhere to a rigid substrate. The ultrasonic cleaning method comprises performing the following steps (1) to (5), in this order: (1) a step of immersing a rigid substrate having an adhesive adhering to a surface thereof in an aromatic alcohol-based cleaning liquid at 25 to 60° C.; (2) a step of cleaning off the adhesive on the rigid substrate by ultrasonic oscillation while keeping the state where the rigid substrate is immersed in the step (1); (3) a step of subsequently immersing the rigid substrate in a glycol ether-based cleaning liquid at 25 to 60° C.

Abstract: Method and systems for managing clear-down are provided. The method can include generating a clear-down trigger associated with an ion mobility spectrometer and operating the ion mobility spectrometer in fast clear-down mode in response to the clear-down trigger. Methods and systems can further provide that where the ion mobility spectrometer operates in fast-switching mode, the ion mobility spectrometer alternating a plurality of times between operation according to a positive ion mode and operation according to a negative ion mode, and further operating according to the positive ion mode for less than about 1 second before switching to the operation according to the negative ion mode, and operating according to the negative ion mode for less than about 1 second before switching to the operation according to the positive ion mode.

Abstract: High intensity ultrasound is used for pipeline obstruction remediation. Ultrasound transducers are positioned around an outside of the pipeline. The transducers transmit acoustic energy into the obstruction. The acoustic energy heats the obstruction at a location spaced away from the walls of the pipeline. As the obstruction heats, an opening may be formed in the obstruction, relieving pressure build-up without releasing the plug.

Abstract: In one embodiment, a system and method may be described for cleaning jewelry and precious items. The method may use an automated cleaning machine and submerge a basket constructed for holding jewelry in a bath of cleaning solution; soak jewelry in the basket for a predetermined time; automatically draining the cleaning solution after the predetermined time; and subsequent to the draining of the cleaning solution, automatically rinsing the jewelry at least one time in the basket with water heated to at least close to the boiling point.

Abstract: To provide an electromagnetic-wave shielding plate superior in an electromagnetic-wave shielding property, a light-transmitting property and non-visibility of a mesh pattern at low cost. A pattern of a resin layer is printed on a metal layer of a transparent substrate by a printing method. After that, the metal layer is over-etched with the resin layer used as an etching mask, and a part of the resin layer protruding from the remaining metal layer in a plate-surface direction is removed. As a result, an electromagnetic-wave shielding plate superior in an electromagnetic-wave shielding property and non-visibility and having, for example, a pattern line width of 3 ?m or more and 25 ?m or less.

Abstract: A method for cleansing a mold of the present invention suppresses generation of damage is a method for cleansing a nanoimprinting mold, in which a mesa type mold is immersed in cleansing fluid and ultrasonic cleansing is performed in a state in which a mold release layer containing a fluorine compound is provided on a patterned region of the mesa type mold.

Abstract: Disclosed herein are methods of cleaning a lipseal and/or cup bottom of an electroplating device by removing metal deposits accumulated in prior electroplating operations. The methods may include orienting a nozzle such that it is pointed substantially at the inner circular edge of the lipseal and/or cup bottom, and dispensing a stream of cleaning solution from the nozzle such that the stream contacts the inner circular edge of the lipseal and/or cup bottom while they are being rotated, removing metal deposits. In some embodiments, the stream has a velocity component against the rotational direction of the lipseal and/or cup bottom. In some embodiments, the deposits may include a tin/silver alloy. Also disclosed herein are cleaning apparatuses for mounting in electroplating devices and for removing electroplated metal deposits from their lipseals and/or cup bottoms. In some embodiments, the cleaning apparatuses may include a jet nozzle.

Abstract: An ultrasonic cleaning apparatus including: a cleaning tank for storing a cleaning liquid; an object-to-be-processed holder for insertion into the cleaning tank, the holder holding an object to be processed and immersing the object into the cleaning liquid; a vibrator disposed on a bottom part of the cleaning tank; and an ultrasonic oscillator configured to make the vibrator ultrasonically vibrate. In the cleaning tank, a lateral holding member configured to hold the object is disposed. The holder is configured to be laterally moved by a driving apparatus. The control device is configured to control the driving apparatus such that the holder is laterally moved after the object has been held by the lateral holding member, and the control device is configured to control the ultrasonic oscillator such that the vibrator is made to ultrasonically vibrate so that the ultrasonic vibration from the vibrator is propagated to the object.

Abstract: A dynamic cyclic nucleation transport (D-CNX) process can be used to wet process an object, such as cleaning or etching. In the D-CNX process, the chamber volume is cyclically enlarged and reduced, effectively reducing and increasing the chamber pressure, respectively. During the pressure reduction phase, bubbles can be generated, which can be terminated or travel to the liquid surface during the pressure increment phase. The generation and termination of bubbles can clean or etch the object, even in hard to reach places.

Abstract: Methods for cleaning a surface of a substrate and for increasing the useable lifetime of a photomask substrate are provided. In one method, the surface of a substrate having a contaminating particulate disposed thereon is cleaned by directing a laser towards the substrate, generating a temperature increase in the substrate and transferring thermal energy from the substrate to the particulate to decompose the particulate. The laser has a wavelength that is substantially the same as a local maximum of the substrate absorption spectrum.

Abstract: Methods of cleaning workpieces are described. One method includes performing both a sonication cleaning operation and a rinse cleaning operation within a single cleaning tank. Another cleaning method described includes the use of cross flow of cleaning liquid within a cleaning tank while performing a rinse clean. The cleaning method includes the oscillation of one or more workpieces in the cleaning tank to perform the rinse clean.

Abstract: A dry cleaning method of a substrate processing apparatus includes forming a metal oxide by oxidizing a metal film adhered to the inside of a processing chamber of the substrate processing apparatus; forming a complex by reacting the metal oxide with ?-diketone; and sublimating the complex to be removed. A cleaning gas containing oxygen and ?-diketone is supplied into the processing chamber while heating the inside of the processing chamber. A flow rate ratio of oxygen to ?-diketone in the cleaning gas is set such that a formation rate of the metal oxide is lower than a formation rate of the complex.

Abstract: A wafer fabrication process with removal of haze formation from a pellicalized photomask surface is provided. The wafer fabrication process includes pre-print wafer processing, wafer print processing using at least one photomask having a pellicle, photomask clean processing, wafer print processing using the photomask, and post-print wafer processing. The photomask clean processing step includes directing a laser through the pellicle towards an inorganic particle disposed on the photomask to remove the particle from the photomask by thermal decomposition.

Abstract: A dissolved nitrogen concentration monitoring method is used for monitoring a dissolved nitrogen concentration of a cleaning liquid when an ultrasonic wave is irradiated onto the cleaning liquid in which a substrate is dipped. The method includes measuring an amount of increase of a dissolved oxygen concentration of the cleaning liquid resulting from an oxygen molecule generated from a water molecule as a result of a radical reaction caused by ultrasonic wave irradiation. A dissolved nitrogen concentration of the cleaning liquid is calculated from the measured amount of increase of dissolved oxygen concentration based on a predetermined relationship between a dissolved nitrogen concentration and an amount of increase of dissolved oxygen concentration.

Abstract: Improved methods and apparatus for cleaning substrates and enhancing diffusion limited reaction at substrate surfaces use piezoelectric transducers operating in the gigasonic domain. The resonator assemblies include plural transducer stacks each including a thin film piezoelectric element coupled to a resonator plate that faces the substrate. At the disclosed frequencies and powers used, Eckart or Rayleigh streaming can be induced in a liquid treatment medium without substantial generation of cavitation.

Abstract: A method for cleaning plated polished disks used in hard drive media is provided. The method includes positioning plated polished disks in a first batch scrubber having multiple first brushes, wherein each of the plated polished disks is positioned between two of the first brushes, and scrubbing the plated polished disks with the first brushes. The method further includes positioning the plated polished disks scrubbed in the first batch scrubber in a second batch scrubber having multiple second brushes, wherein each of the plated polished disks is positioned between two of the second brushes, and scrubbing the plated polished disks with the second brushes.

Abstract: The invention provides a method and a system for cleaning a microwave oven, and a suitable foaming microwave cleaning composition.

Abstract: A system for cleaning a conditioning device to improve the efficiency of the conditioning of a polishing pad using the conditioning device as part of a chemical-mechanical polishing process, the system comprising a conditioning device; a fluid dispenser arranged to dispense a fluid on the conditioning device; and an acoustic nozzle arranged to emit a megasonic or ultrasonic signal at the conditioning device while the fluid dispenser is dispensing the fluid on the conditioning device.

Abstract: A getter layer is deposited on an electrode layer on one side of a substrate. The electrode layer is configured to provide a first electrode to hold charges in the getter layer positioned between the first electrode and a second electrode. The getter layer may include a polymer. In one embodiment, an optically dark layer in a reflection mode or in a transmission mode is deposited on other side of the substrate. In one embodiment, one or more optically reflective films are deposited on a second side of the substrate. In one embodiment, a getter reticle having a getter layer on an electrode layer on a substrate is moved toward a surface. The getter layer of the getter reticle is attached to the surface by an electrostatic force. Contaminants are transferred from the surface to the getter layer by the electrostatic force.

Abstract: Methods and apparatus for the cleaning reaction chambers using molecular fluorine as the cleaning material. The molecular fluorine is dissociated in-situ in the reaction chamber using the chamber RF power source.

Abstract: The present invention provides a method for cleansing a glass substrate of a TFT-LCD, includes the following steps: providing an ultrasonic cleansing machine, a glass substrate in-feeding conveyor, and a glass substrate out-feeding conveyor, wherein the ultrasonic cleansing machine includes a cleansing tank, a cleansing liquid contained in the cleansing tank, and first and second ultrasonic frequency generators arranged in the cleansing tank and having different frequencies; conveying a glass substrate with the glass substrate in-feeding conveyor into the cleansing tank; immersing the glass substrate in the cleansing liquid of the cleansing tank; generating ultrasonic waves of different frequencies with the first and second ultrasonic frequency generators to be applied to the cleansing liquid to effect ultrasonic cleansing of the glass substrate; and conveying the cleansed glass substrate out of the cleansing tank with the glass substrate out-feeding conveyor.

Abstract: Technologies are generally described for systems and methods effective to implement particle removal. In one example, a method for at least partially removing particles from a region is generally described. In some examples, the method includes applying an electric field to a material to produce an acoustic wave from the material. The material may have a periodic piezoelectric coefficient. The method may include applying the acoustic wave to the region to produce an agglomeration. The agglomeration may include at least two of the particles. The method may further include at least partially removing the agglomeration from the region.

Abstract: A method for cleaning collector mirrors in an EUV light generator in which a target is made into a plasma state and EUV light generated is collected by a collector mirror, the method being adopted to the EUV light generator for cleaning contaminants adhering thereto, the method comprising: preparing at least two collector mirrors; locating one of the mirrors at an EUV light condensing position while locating the other mirror at a cleaning position; determining whether the mirror at the cleaning position is cleaned while determining whether the mirror at the light condensing position requires cleaning; and once determined that the mirror at the cleaning position is cleaned and the mirror at the light condensing position requires cleaning, conveying the mirror at the light condensing position and requiring cleaning to the cleaning position while conveying the mirror at the cleaning position and having been cleaned to the light condensing position.

Abstract: This invention discloses an image capturing device and a vibration dust removal method thereof. The image capturing device comprises a power supply component, an image sensor, a vibration dust removal component, a power detection module and a controller. The vibration dust removal component produces vibrations for dust removal. The power detection module detects a power value of the power supply component, and produces an electric power signal. The controller electrically connects the vibration dust removal component and the power detection module. The controller determines a maximum value of the amplitude of a vibration produced by the vibration dust removal component according to the electric power signal to control the vibration dust removal component to execute a vibration dust removal operation of the image sensor.

Abstract: A method for cleaning casino chips includes the step of providing a chip-cleaning system having an ultrasonic cleaning station with ultrasonic cleaning means. The method proceeds by taking a batch of chips to be cleaned out of service and cleaning the batch of chips at the ultrasonic cleaning station with the ultrasonic cleaning means. Preferably, the chip-cleaning system also includes a rinsing station, a coating station, and a drying station, and the method further comprises rinsing the batch of chips at the rinsing station, coating the batch of chips at the coating station, and drying the batch of chips at the drying station. A preferred chip-cleaning system includes a console with four tanks providing the above features, together with two foldable table-top extensions providing a chip staging area wing and a chip re-stacking area wing, and a counterbalancing arm for assisting an operator move the batch of chips between stations.

Abstract: An optical irradiation equipment provided with a cage body having an UV radiation transmission window, and an excimer lamp which is arranged in an interior of said cage body, wherein gas flow openings being connected to one of a cooling gas supply mechanism and a cooling gas suction mechanism are provided at a periphery of said UV radiation transmission window.

Abstract: Methods and apparatus for the cleaning reactor box chambers using molecular fluorine as the cleaning material. The molecular fluorine is dissociated in-situ in the chamber using the chamber RF power source.

Abstract: The present invention relates to a method for producing a bone transplant material using an extracted tooth, and to a bone transplant material produced by same, and particularly, to a method for producing a bone transplant material which enables the production of bone transplant material in a short amount of time using an extracted tooth of a patient or a similar tooth.

Abstract: A cleaning apparatus is provided. The apparatus includes a casing that defines an inlet opening on a first surface thereof and an outlet opening on a second surface thereof. An elongate path is formed therebetween for receiving an article to be cleaned. A sanitizing device is carried by the casing in proximity to the path for sanitizing the article to be cleaned. A first roller is carried by the casing and extends into the path. The first roller is configured to rotate in the direction of the path to thereby translate the article to be cleaned from the inlet opening to the outlet opening.

Abstract: A transfer pick provided at a leading end of a transfer arm of a transfer device for transferring a substrate includes a substrate support surface for supporting the substrate thereon; a plurality of contact members protruded from the substrate support surface to contact with the substrate; and a voltage applying unit for charging the contact members with electricity. Further, the transfer pick has a self-cleaning function of removing particles adhered to the contact members by using repulsive force of an electric charge. In addition, a computer readable memory medium storing a computer executable control program, wherein the control program controls a substrate processing apparatus to perform the transfer pick cleaning method.

Abstract: In a method of manufacturing a disk drive device, a cleaning process and an assembly process are performed in succession in a clean room having a predetermined cleanness level. The cleaning process includes an alkali cleaning process, a first purified water cleaning process, a second purified water cleaning process, a spray cleaning process, a draining process and a drying process. In the first purified water cleaning process, purified water ultrasonic wave cleaning is sequentially performed on the base member of the disk drive device to be cleaned by using ultrasonic waves of frequencies of 40 kHz, 68 kHz and 132 kHz in purified water filled in a first purified water cleaning tank. The cleaned base member and other components having a predetermined cleanness level are assembled in the assembly process continuous from the cleaning process.

Abstract: A cleaned component having a polycrystalline structure, a method and apparatus for cleaning a leached component to form the cleaned component, and a method for determining the effectiveness of cleaning the leached component. The cleaned component includes a leached layer that has at least a portion of by-product materials removed. The by-product materials were deposited into the leached layer during a leaching process that formed the leached layer. The apparatus and method for cleaning includes a tank, a cleaning fluid placed within the tank, and at least a portion of the leached layer immersed into the cleaning fluid. Optionally, a transducer emits ultrasonic waves into the leached layer. The method for determining the effectiveness of cleaning includes cleaning the leached component to form the cleaned component, measuring one or more capacitance values of the cleaned component, repeating the cleaning and the measuring until achieving a stable lower limit capacitance value.

Abstract: A cleaned component having a polycrystalline structure, a method and apparatus for cleaning a leached component to form the cleaned component, and a method for determining the effectiveness of cleaning the leached component. The cleaned component includes a leached layer that has at least a portion of by-product materials removed. The by-product materials were deposited into the leached layer during a leaching process that formed the leached layer. The apparatus and method for cleaning includes a tank, a cleaning fluid placed within the tank, and at least a portion of the leached layer immersed into the cleaning fluid. Optionally, a transducer emits ultrasonic waves into the leached layer. The method for determining the effectiveness of cleaning includes cleaning the leached component to form the cleaned component, measuring one or more capacitance values of the cleaned component, repeating the cleaning and the measuring until achieving a stable lower limit capacitance value.

Abstract: The frequency and power of ultrasonic waves is adjusted to materialize the relation 0.04f?20.0?P?0.09f?7.5, wherein f (kHz) is the frequency of the ultrasonic waves and P (W/L) is the power per unit fluid volume obtained by dividing the power (W) of the ultrasonic waves by the volume (L) of a cleaning fluid. The discharge condition of the cleaning fluid by a pump is adjusted such that the proportion (C5) of the brightness of the fluid when 5 seconds has passed since the state wherein both an ultrasonic wave irradiation means and a bubble supply means are concurrently operating to the brightness of the fluid when no bubbles exist in the fluid is 0.75 or less. The coalition and crush of bubbles due to the irradiation of ultrasonic waves are suppressed, and the both actions can be utilized for a long period.

Abstract: In a piezoelectric device, a first electrode and a second electrode are disposed to be opposed to each other on plate surfaces of the piezoelectric device, a first electrode plane of the piezoelectric device is fixedly bonded to a plate surface of a vibrating plate, a piezoelectric material forming the piezoelectric device is polarized in a direction parallel to the first electrode plane, the piezoelectric device is fixed to a base through a second electrode plane of the piezoelectric device, and the piezoelectric device generates a thickness-shear vibration with the fixed second electrode plane being a reference plane. The piezoelectric vibration generated by the piezoelectric device generates a flexural vibration in the vibrating plate, to thereby remove dust adhering to a surface of the vibrating plate.

Abstract: A system for ultrasonically cleaning one or more wires of a wire saw for slicing semiconductor or solar material into wafers. The system includes an ultrasonic transducer connected to a sonotrode. The system also includes a sonotrode plate adjacent to one or more of the wires. The sonotrode plate has an opening that exposes the sonotrode to one or more of the wires. The system further includes a tank for delivering a flow of liquid to contact the sonotrode and one or more of the wires. The tank is positioned on the same side of the wires as the sonotrode plate. The ultrasonic transducer is configured to vibrate and form cavitations in the liquid for the removal of contaminants from a surface of one or more of the wires.

Abstract: A substrate cleaning chamber includes a contoured ceiling electrode having an arcuate surface that faces a substrate support and has a variable cross-sectional thickness to vary the gap size between the arcuate surface and the substrate support to provide a varying plasma density across the substrate support. A dielectric ring for the cleaning chamber comprises a base, a ridge, and a radially inward ledge that covers the peripheral lip of the substrate support. A base shield comprises a circular disc having at least one perimeter wall. Cleaning and conditioning processes for the cleaning chamber are also described.

Abstract: A cleaning apparatus for cleaning an object includes a cleaning tank holding a cleaning liquid, the object being cleanable by the cleaning liquid. A coupling tank holding an intermediate medium is in contact with a portion of the cleaning tank. An ultrasonic wave generation unit is disposed at the coupling tank and configured to ultrasonically vibrate the cleaning liquid via the intermediate medium. A modification unit is configured to modify a difference in sonic velocity between the cleaning liquid and the intermediate medium.

Abstract: A cleaning method for cleaning an object includes preparing a cleaning liquid. A dissolved nitrogen concentration in the cleaning liquid is adjusted based on a size of a foreign substance to be removed from the object with a highest removal efficiency. The object is dipped in the cleaning liquid while irradiating the cleaning liquid with ultrasonic waves.

Abstract: The invention is a method and apparatus for cleaning and disinfecting laparoscopic surgical instruments. The method comprises the introduction into the interior channels of the instruments of cleaning fluid heated at a predetermined temperature, and activated of the fluid by the introduction of sonic energy into the fluid at varying frequencies. The apparatus includes a unitary cleaning enclosure containing receptacles for holding the laparoscopic instruments in a bath, and for directing cleaning fluid from the bath through the interior of the instruments while providing a source of ultrasonic mechanical energy to the cleaning fluid both inside and outside the laparoscopic instruments.

Abstract: A method of cleaning a medical instrument, in which a medical instrument to which a body fluid adheres is subjected to ultrasonic cleaning in a cleaning solution in which chlorine dioxide is dissolved, and a cleaning apparatus including a cleaning tank constructed to be capable of ultrasonic cleaning, a mixing portion for generating the cleaning solution in which chlorine dioxide is dissolved, a first pipe for supplying the cleaning solution to the cleaning tank from the mixing portion, and a second pipe for supplying water to the cleaning tank, and constructed to dilute the cleaning solution supplied from the mixing portion through the first pipe with water supplied through the second pipe such that a prescribed concentration of chlorine dioxide dissolved in the cleaning solution is attained in the cleaning tank are provided.