Abstract: Disclosed are a device for automatically cleaning printed circuit board and a method using the same. The device includes: a printed circuit board (PCB) tray, a transferring unit, an elevator unit, a cleaning unit and a unloading deck; the elevator unit includes a horizontal part and a vertical part; when the elevator unit is descended to the lowest position, an upper surface of the transferring unit is at a same horizontal position with an upper surface of the horizontal part of the elevator unit; the elevator unit is located below the cleaning unit, and the unloading deck is located above the transferring unit. The invention can not only save manpower, but also achieve standardization of the cleaning process and improve working efficiency.

Abstract: An optoelectronic sensor (10) has a circumferential front screen (42) comprising a curvature both in a circumferential direction and in a transverse height, thus focusing light reflected at the inside of the front screen (42). Test light passes from a test light transmitter (50a-f) through the front screen (42) to a reflector (52a-f) and subsequently onto a test light receiver (56a-b). A decreasing light transmissivity of the front screen (42) is detected based on a decrease of a signal generated by the test light in the test light receiver (56a-b). The test light receiver (56a-b) is arranged on a same side of the front screen (42) as the reflector (52a-f) such that the test light path (54a-f) leads from the reflector (52a-f) via reflection on the inside of the front screen (42) to the test light receiver (56a-b).

Abstract: Embodiments of mechanisms for cleaning a wafer are provided. A method for cleaning a wafer includes cleaning a wafer by using a wafer scrubber and cleaning the wafer scrubber in a scrubber cleaning module. An agitated cleaning liquid is applied on the wafer scrubber to clean the wafer scrubber. The method also includes cleaning the wafer or a second wafer by the wafer scrubber after the wafer scrubber is cleaned by the agitated cleaning liquid.

Abstract: A showerhead assembly for a substrate processing system includes a back plate connected to a gas channel. A face plate is connected adjacent to a first surface of the back plate and includes a gas diffusion surface. An electrode is arranged in one of the back plate and the face plate and is connected to one or more conductors. A gas plenum is defined between the back plate and the face plate and is in fluid communication with the gas channel. The back plate and the face plate are made of a non-metallic material.

Abstract: A method of manufacturing a semiconductor device including performing a first thermal processing a silicon substrate in a first atmosphere and at a first temperature to remove an oxide film above a surface of the silicon substrate, and after the first thermal processing, performing a second thermal processing the silicon substrate in a second atmosphere containing hydrogen and at a second temperature lower than the first temperature to terminate the surface of the silicon substrate with hydrogen.

Abstract: [Problem] To provide a fluoride spray coating covered member adhered with a fluoride spray coating having excellent properties on quality by suppressing a thermal decomposition reaction and an oxide reaction, and to propose a method for forming a cover by firmly adhering the coating. [Solution] A method for forming a fluoride spray coating in an implantation structure onto a substrate surface by spraying particles of a fluoride spraying material onto a substrate surface or a pretreated substrate surface, if necessary through an undercoat layer or spray particle dotted parts of carbide cermet, at a flying velocity of particles of not less than 500 m/sec with an inert gas as a working gas for coating formation at an inert gas temperature of 600° C.-1300° C. as well as a fluoride spray coating covered member.

Abstract: Polysilicon fragments are purified to remove metal contaminates by contacting the fragments with a purifying liquid at a flow rate >100 mm/sec. Effective removal without abrasion is accomplished.

Abstract: The present invention provides a chemical-liquid mixing method and a chemical-liquid mixing apparatus capable of sufficiently generating a peroxomonosulfuric acid that is effective in removing a resist from a substrate, when a sulfuric acid and a hydrogen peroxide solution are mixed with each other. At first, an inner tank 10 is filled up with a sulfuric acid and the sulfuric acid overflowing from the inner tank 10 is allowed to flow into an outer tank 12. Then, a hydrogen peroxide solution is supplied into the inner tank 10 and the hydrogen peroxide solution is allowed to flow into the outer tank 12 whereby the two kinds of liquids of the hydrogen peroxide solution and the sulfuric acid are stored in the outer tank 12. Simultaneously when the hydrogen peroxide solution flows into the outer tank 12, a return pump 16 is activated.

Abstract: This invention relates to an apparatus and method for cleaning a photomask. This apparatus, suitable for use in removing an adhesive residue from a photomask, includes a photomask disposed such that a surface thereof on which an adhesive residue is left behind is directed downwards, a metal plate formed adjacent to the adhesive residue, and a laser generator for irradiating a laser onto the metal plate so that the adhesive residue is removed by heat generated from the metal plate.

Abstract: A method of manufacturing a semiconductor device including performing a first thermal processing a silicon substrate in a first atmosphere and at a first temperature to remove an oxide film above a surface of the silicon substrate, and after the first thermal processing, performing a second thermal processing the silicon substrate in a second atmosphere containing hydrogen and at a second temperature lower than the first temperature to terminate the surface of the silicon substrate with hydrogen.

Abstract: A method of wet cleaning an aluminum part having bare aluminum surfaces and anodized aluminum surfaces. The method includes CO2 dry ice blasting the surfaces of the aluminum part at approximately 35 to approximately 45 psi, masking the aluminum part to conceal the bare aluminum surfaces, soaking the dry ice blasted and masked aluminum part in deionized water at or above approximately 60° C., scrubbing the aluminum part with an abrasive pad and deionized water after completion of the soaking in deionized water, and repeating the soaking and scrubbing in the recited order at least three additional times.

Abstract: A wet-type developing device and a wet-type image forming apparatus each employ a developer including a carrier liquid and toner particles dispersed in the carrier liquid. A charging unit is applied with positive voltage. A neutralizing unit is applied with negative voltage. The charging unit and the neutralizing unit are made different from each other in one of a sectional configuration and a length to a developer carrier such that an absolute value of a voltage-current characteristic of the neutralizing unit becomes smaller than an absolute value of a voltage-current characteristic of the neutralizing unit including a constituent element equal to a constituent element of the charging unit.

Abstract: A megasonic cleaning method and a megasonic cleaning apparatus are provided. Microcavitation bubbles may be formed by applying an electromotive force to a cleaning solution using a megasonic energy in a separate room from an object to be cleaned. The microcavitation bubbles having a stable oscillation among the formed microcavitation bubbles may be moved to the object to be cleaned. A surface of the object to be cleaned may be cleaned using the microcavitation bubbles having the stable oscillation. Particles attached onto the surface of the object to be cleaned may be effectively removed while preventing pattern damage.

Abstract: In some embodiments methods of processing a substrate include: providing a substrate having a contact structure formed on the substrate, wherein the contact structure comprises a feature defined by gate structures, a silicon nitride layer disposed on a upper surface of the gate structures and on sidewalls and a bottom of the feature, and an oxide layer disposed over the silicon nitride layer and filling the feature; etching an opening through the oxide layer to the silicon nitride layer disposed on the bottom of the opening, wherein a width of the opening is less than a width of the feature; expanding the opening in the oxide layer to form a tapered profile; exposing the substrate to ammonia and nitrogen trifluoride to form an ammonium fluoride gas that forms an ammonium hexafluorosilicate film on the oxide layer; and heating the substrate to a second temperature to sublimate the ammonium hexafluorosilicate film.

Abstract: Ultrasonic cleaning apparatuses and methods of cleaning substantially planar articles. An apparatus comprises (i) a substantially circular tank; (ii) a plurality of cleaning fluid inlets for delivering a cleaning fluid to the tank; (iii) an intermediate support for receiving an article to be cleaned; and (iv) an ultrasonic generator coupled to the tank for generating ultrasonic waves in the tank and cleaning fluid received therein. The apparatus is configured to remove particles from a substantially planar article and have them carried by flow of cleaning fluid away from the article and out of the tank. Using such an apparatus, a cleaning method comprises introducing a substantially planar article to be cleaned into the tank; introducing a cleaning fluid into the tank through the plurality of cleaning fluid inlets; and exciting the cleaning fluid with ultrasonic waves.

Abstract: A device for cleaning a dental appliance is disclosed. The device includes a holding container including an upper portion and a lower portion, the holding container adapted to receive at least one dental appliance; an electrolytic cell for generating chlorine dioxide from a chlorine dioxide precursor; and an electrical current supply including a circuit operably connecting the electrical current supply to the electrolytic cell.

Abstract: A biometric authentication device includes: a memory configured to store an enrollment feature data; a biometric sensor that obtains a biometric image of a user; and a circuitry configured to: obtain a surface reflection degree of the biometric image; extract a comparison-use feature data from the biometric image; perform a comparing based on a similarity between the comparison-use feature data and the enrollment feature data; and reflect a correction coefficient and the surface reflection degree related to a region of the biometric image to the similarity.

Abstract: The invention relates to a method for improving the mechanical strength of a ceramic matrix composite material of the SiC/SiC type, this composite material being obtained by (a) forming a fiber preform from 3rd generation silicon carbide fibers and (b) forming a ceramic matrix around the fiber preform, this ceramic matrix comprising silicon carbide. The method comprises a chemical etching treatment of the surface of the fibers by bringing said fibers into contact with a solution comprising an oxidizer, this treatment being carried out before step (a) or between steps (a) and (b).

Abstract: A method for processing flat articles with acoustical energy. The inventive system method can remove particles from both sides of a wafer more efficiently and effectively. In one aspect, the invention is a method for processing flat articles wherein a liquid is applied to both major surfaces of the flat article. A first transducer assembly is positioned adjacent to a first of the major surfaces of the flat article and a second member is positioned adjacent to a second of the major surfaces. The first transducer assembly generates and transmits acoustical energy to the first major surface of the flat article while the second member either: (1) reflects the acoustical energy generated by the first transducer assembly back to the second major surface of the flat article; and/or (2) generates and transmits acoustical energy to the second major surface of the flat article.

Abstract: An active electroadhesive cleaning device or system includes electrode(s) that produce electroadhesive forces from an input voltage to adhere dust or other foreign objects against an interactive surface, from which the foreign objects are removed when the forces are controllably altered. User inputs control the input voltage and/or designate the size of foreign objects to be cleaned. An active power source provides the input voltage, and the interactive surface can be a continuous track across one or more rollers to move the device across a dirty foreign surface. Electrodes can be arranged in an interdigitated pattern having differing pitches that can be actuated selectively to clean foreign objects of different sizes. Sensors can detect the amount of foreign particles adhered to the interactive surface, and reversed polarity pulses can help repel items away from the interactive surface in a timely and controlled manner.

Abstract: A liquid immersion lithography apparatus includes a projection system, an opening from which liquid is supplied to a space under the projection system, the opening being connectable to a liquid source via a flow passage to supply the liquid to the space and the opening being connectable to a vacuum source via the flow passage, and a holding member by which a substrate is held, the holding member being movable below the projection system and the opening. The substrate held by the holding member is exposed through the liquid that is supplied from the opening and that covers only a portion of an upper surface of the substrate.

Abstract: An apparatus to enhance oil extraction from pores of a bowling ball includes a housing unit with an opening, a tank disposed within the opening and able to store a fluid, a rack disposed within the tank to secure the bowling ball in a stationary position and orient the ball such that at least one finger hole of the ball is positioned above an upper level of the stored fluid, a heating unit coupled to the tank to heat the stored fluid, and at least one ultrasonic transducer coupled to the tank. The at least one transducer directs sound waves through the heated fluid toward the secured bowling ball, thereby extracting oil from the bowling ball.

Abstract: A system and method for detecting a feature located on a surface, comprising: attaching a label to said feature; generating a label radiation from said label, a feature radiation from said feature, and a surface radiation from said surface; collecting said label radiation, said feature radiation, and said surface radiation; separating said label radiation from said feature radiation and said surface radiation; capturing the separated label radiation for generating an image of label, with said image of label having one or more pixels; and locating label pixels corresponding to said label radiation by searching for pixels, in said image of label, that possess substantially different pixel values when compared to other pixels in local neighborhood, whereby said feature is located by detecting said label.

Abstract: A cleaning system can include a noble gas, and one or more vessels configured to convert the noble gas into a supercritical fluid, and/or receive and clean an article of manufacture with the noble gas in the supercritical fluid state. A cleaning process can include converting a noble gas into a supercritical fluid state; and cleaning an article of manufacture with the noble gas in the supercritical fluid state so as to remove one or more contaminants from the article of manufacture. A cleaning composition can include a noble gas in a supercritical fluid state, and a textile article of manufacture having one or more contaminants located in the supercritical noble gas.

Abstract: The etching method of the present invention comprises first and second etching steps (S1, S3) having different types of films to be etched and different types of process gases. During a transition from the first etching step (S1) to the second etching step (S3), a first switching process step (S2) is performed in which the process container is filled with a cleaning gas and the cleaning gas is turned into a plasma to remove the reaction product deposited in the process container in the first etching step. During a transition from the second etching step (S3) to the first etching step (S1), a second switching process step (S4) is performed in which the process container is filled with a cleaning gas and the cleaning gas is turned into a plasma to remove the reaction product deposited in the process container in the second etching step.

Abstract: Among other things, one or more techniques and systems for cleaning a scrub brush of a scrubber utilized in semiconductor fabrication are provided. In particular, a charge modification element, such as a base pH material or ammonia, is applied to the scrub brush to modify a charge of a particle on the scrub brush to a modified charge. The modified charge of the particle is similar to a charge of the scrub brush, such that the particle and the scrub brush repel one another. The particle can be detached from the scrub brush utilizing various techniques such as a de-ionized water technique or a mechanical cleaning bar technique. In this way, one or more particles can be detached from the scrub brush to clean the scrub brush of particles so that the scrub brush can be used to clean a semiconductor wafer.

Abstract: An apparatus and method for hydrogenating a sample, such as a semiconductor wafer. The invention utilizes a top electrode comprising a UV-transparent dielectric and a metal contact to provide an electric field to the sample while the sample is irradiated with UV light and hydrogenated with a hydrogenating gas or gasses. The field may be applied to the sample at a number of different pressures, temperatures and concentrations of gas to manipulate the rate and type of hydrogenation. Further, the method of hydrogenating the sample may be used in conjunction with masking and etching techniques.

Abstract: A hydrocarbon fluid pipeline may include pipeline segments connected together in end-to-end relation between first and second spaced apart geographic locations and configured to carry hydrocarbon fluid therethrough. The hydrocarbon fluid pipeline may also include a radio frequency (RF) heating station that may include an RF source and an RF heater between adjacent pipeline segments of the plurality thereof. The RF heater may include an inner tubular dielectric coupler between the adjacent pipeline segments, and an electrically conductive outer housing surrounding the inner tubular dielectric coupler and connected to the RF source to heat the hydrocarbon fluid.

Abstract: An active electroadhesive cleaning device or system includes electrode(s) that produce electroadhesive forces from an input voltage to adhere dust or other foreign objects against an interactive surface, from which the foreign objects are removed when the forces are controllably altered. User inputs control the input voltage and/or designate the size of foreign objects to be cleaned. An active power source provides the input voltage, and the interactive surface can be a continuous track across one or more rollers to move the device across a dirty foreign surface. Electrodes can be arranged in an interdigitated pattern having differing pitches that can be actuated selectively to clean foreign objects of different sizes. Sensors can detect the amount of foreign particles adhered to the interactive surface, and reversed polarity pulses can help repel items away from the interactive surface in a timely and controlled manner.

Abstract: The present invention relates to a method of transferring a graphene film comprising the steps of (A) providing a carrier, wherein the carrier has a first surface, and a second surface, and a first graphene film is formed on the first surface; (B) disposing a patterned protection layer on the second surface of the carrier; (C) patternin carrier with the first graphene film on a target substrate; (E) removing the the carrier to expose the first graphene film; (D) disposing the patterned carrier to transfer the first graphene film on the substrate.

Abstract: A method of particle mitigation which includes obtaining a semiconductor wafer having a nonfunctional backside and a functional frontside on which semiconductor devices are formed by one or more lithography processes; coating the backside with a mitigating layer comprising silicon or amorphous carbon; patterning the mitigating layer to form indentations in the mitigating layer; placing the semiconductor wafer onto a wafer chuck such that the wafer chuck makes direct contact with the coated and patterned backside mitigating layer; and while maintaining the coated and patterned backside mitigating layer in direct contact with the wafer chuck, performing a first lithographic process on the frontside.

Abstract: Ultrasonic cleaning apparatuses and methods of cleaning substantially planar articles. An apparatus comprises (i) a substantially circular tank; (ii) a plurality of cleaning fluid inlets for delivering a cleaning fluid to the tank; (iii) an intermediate support for receiving an article to be cleaned; and (iv) an ultrasonic generator coupled to the tank for generating ultrasonic waves in the tank and cleaning fluid received therein. The apparatus is configured to remove particles from a substantially planar article and have them carried by flow of cleaning fluid away from the article and out of the tank. Using such an apparatus, a cleaning method comprises introducing a substantially planar article to be cleaned into the tank; introducing a cleaning fluid into the tank through the plurality of cleaning fluid inlets; and exciting the cleaning fluid with ultrasonic waves.

Abstract: Methods of cleaning workpieces are described. One method includes performing both a sonication cleaning operation and a rinse cleaning operation within a single cleaning tank. Another cleaning method described includes the use of cross flow of cleaning liquid within a cleaning tank while performing a rinse clean. The cleaning method includes the oscillation of one or more workpieces in the cleaning tank to perform the rinse clean.

Abstract: The portable, compact, silverware washing apparatus is disclosed. The apparatus is manufactured so as to easily mount on top of a kitchen countertop or to be easily portable to other locales. The appliance is designed so as to not be connected to a water supply within a home or apartment, but rather rely upon the user to pour in an independent supply of water. The device includes a motor and pump assembly to fill a washing chamber with water and detergent, while a sonic transducer bombards the silverware loaded therein with sonic vibrations. The pump assembly automatically drains the water and waste after completion of the washing cycle. The appliance is configured with a specialized basket for holding the silverware in individualized compartments.

Abstract: A method and apparatus for cleaning a cavity of a vacuum insulated glass window assembly is provided in which a cleaning gas mixture of or including ozone is introduced into the cavity of the vacuum insulated glass assembly and allowed to react with residual materials, such as, for example, hydrocarbons and/or polymers. Reacted hydrocarbons and/or polymers are then removed from the vacuum cavity along with any residual cleaning gas mixture. The cleaning method is preferably performed at substantially ambient temperatures or at least temperatures below about 250° C. The ozone cleaning cycle may be repeated multiple times and followed by additional purges with other gases, such as for example nitrogen. Additional energy may be provided by heating, RF plasma; corona discharge, UV lamp, and/or the like.

Abstract: After performing a dividing step to divide a wafer into individual chips, an irradiation step is performed to apply ultraviolet radiation or plasma to the mount side of each chip, thereby generating ozone and active oxygen, which functions to remove organic matter sticking to the mount side of each chip. Accordingly, it is possible to remove from the mount side of each chip not only foreign matter sticking to the wafer during handling the wafer, but also foreign matter generated in dividing the wafer, so that faulty mounting of each chip can be reduced.

Abstract: The static eliminating and dust removing apparatus comprises a big container and a small container disposed within the big container. The big container opens at the top and bottom ends to suck the dust in upwardly and discharge the dust. The small container is of hollow cylindrical or truncated conical structure and of a construction that the cyclone and tornado are generated within the small container. Furthermore, the static eliminating and dust removing apparatus has an ion generator disposed in the small container for generating ions which is injected or introduced in the small container and a dried compressed air injection opening formed on the small container for injecting the dried compressed air into the small container to generate cyclone and tornado within the small container.

Abstract: A method for cleaning a reaction chamber is conducted after depositing an oxide, nitride, or oxynitride film on a substrate in a reaction chamber having interior surfaces on which oxide, nitride, or oxynitride is accumulated as a result of the deposition, said oxide, nitride, or oxynitride being selected from the group consisting of silicon oxide, silicon nitride, silicon oxynitride, metal oxide, metal nitride, and metal oxynitride. The method includes: oxidizing or nitriding the oxide, nitride, or oxynitride is accumulated on the interior surfaces of the reaction chamber, by RF-excited plasma of an oxygen- or nitrogen-containing gas in the absence of halide gas as a pre-cleaning step; and cleaning the interior surfaces of the reaction chamber, by RF-excited plasma of a halide cleaning gas.

Abstract: The invention relates to a material composition, which may be a support material, for three-dimensional (3D) inkjet printing, comprising a glycol polymer, a low molecular weight polar substance and a surface active agent. The invention further provides a method for 3D inkjet printing comprising building a 3D object in layers, wherein at least one layer comprises a model material composition and a support material composition comprising PEG and a low molecular weight polar substance, wherein the layers are solidified before deposition of subsequent layers; and wherein, after solidification, the support material composition is removed by immersion of the solidified objet with the support in a liquid composition comprising a solvent.

Abstract: A wet chemical processing method and apparatus for use in semiconductor manufacturing and in other applications, is provided. The method and apparatus provide for energizing a processing liquid such as a cleaning or etching liquid using ultrasonic, megasonic or other energy waves or by combining the liquid with a pressurized gas to form a pressurized spray, or using both. The energized, pressurized fluid is directed to a substrate surface using a fluid delivery system and overcomes any surface tensions associated with liquids, solids, or air and enables the processing liquid to completely fill any holes such as contact holes, via holes or trenches, formed on the semiconductor substrate.

Abstract: Methods of removing copper residue from interior surfaces of an etch process chamber are described. A plasma treatment using halogen-containing precursors transforms the copper residue into halogen-copper complexes. Plasma-excited inert gases are used to desorb the halogen-copper complexes. In this way, the copper residue is removed from the interior surfaces of the etch process chamber.

Abstract: Methods and apparatus provide for non-destructive cleaning of magnetic tape. In one embodiment, a continuing length of the magnetic tape is submersed and passed through a covered solvent bath; and each side (front and back) of the continuing length of magnetic tape is swabbed with a cotton swab subsequent to the submerging step. The cotton swabs are arranged to swab each respective side of the magnetic tape.

Abstract: A surface treating appliance including an electrical influence machine comprising a first non electrically conductive support structure spaced from a second non electrically conductive support structure, at least one of the support structures being arranged to move with respect to the other support structure, and at least two charge collecting points, and further comprising an air turbine for rotating at least one of the support structures.

Abstract: In certain embodiments the metal liftoff tool comprises an immersion tank for receiving a wafer cassette with wafers therein, the immersion tank including an inner weir, a lifting and lowering mechanism capable of raising and lowering the wafer cassette while submerged in fluid in the immersion tank, low pressure high velocity primary spray jets for stripping the metal, the primary spray jets positioned at opposing sides of the immersion tank parallel to the wafer surfaces planes, and secondary spray jets for pressure equalization force, positioned at the bottom of the immersion tank. A wafer lift insert is positioned at the bottom of the immersion tank to receive and periodically lift the wafers within the cassette.

Abstract: The present invention describes a method of using an ultrasonic bath to enhance tissue perfusion, enhance the development of collateral blood vessels and/or enhance collateral circulation in an extremity in need thereof. Also described is an ultrasonic bath adapted to hold media and to permit the immersion of an extremity and comprising one or more ultrasonic transducers to generate and transmit ultrasonic energy to the extremity or the inventive method.

Abstract: The present invention provides an ultraviolet light based cleansing method and cleansing device. The method includes: (1) irradiating a substrate to be cleansed with ultraviolet light and controlling output energy of the ultraviolet light in order to control photon energy received by TFT component patterns formed on the substrate to be cleansed within an irradiation time period to be less than electron excitation energy that breaks down TFT component patterns; (2) cleansing the substrate to be cleansed with an alkaline solution; (3) cleansing the substrate to be cleansed with water/gas dual-fluid; (4) cleansing the substrate to be cleansed with deionized water; (5) drying the substrate to be cleansed with an air knife; and (6) subjecting the substrate to be cleansed to dehydration and drying to complete the cleansing operation, thereby improving product yield rate and cleanness.

Abstract: A detergent for cleaning media is provided. The detergent comprises deionized water, between about 1% and about 5% by weight of a nonionic surfactant having an hydrophile/lipophile balance (HLB) value between about 10 and about 20, and an ethoxylation level between about 5 and about 20, between about 1% and about 5% by weight of a dispersing agent, between about 3% and about 10% by weight of a chelating agent comprising phosphonic acid, and between about 2% and about 6% by weight of an inorganic salt.

Abstract: A method for removing an adhesive agent from a base plate with a plurality of accessories installed adjacent to the adhesive agent includes certain steps. The steps form a protection layer on the base plate, and the protection layer completely covers the electronic members and completely or partially covers the adhesive agent. The protection layer is solidified and a part of the protection layer is removed to expose the adhesive agent. The base plate is soaked in a removing solution to soften the adhesive agent and decrease an adhering strength of the adhesive agent, the protection layer being resistant to the removing solution to protect the electronic members. The softened adhesive agent is scraped off and the remaining protection layer removed.

Abstract: The cleaning process of cleaning an imprinting mold including a release layer coupled via siloxane bonds to a substrate of that release layer includes a first cleaning step and a second cleaning step. In the first cleaning step, the angle of contact of the surface of the release layer with water is made small, and in the second cleaning step, the alkali cleaning agent is brought in contact with the release layer that has gone through the first cleaning step.

Abstract: Systems and methods for cleaning a substrate include a combined treatment of hydrogen peroxide and ultraviolet (UV) irradiation. Specific embodiments include the direct irradiation with 185/254 nm UV of a spinning substrate immersed under a liquid film of dilute hydrogen peroxide solution. Such a cleaning treatment can result in about a 100% improvement of TiN strip rate compared to processing with the same hydrogen peroxide solution without UV exposure. Such method can also be executed at room temperature and still provide improved cleaning efficiency.