Abstract: A liquid processing apparatus including: a second housing; a first housing capable of being brought into contact with the second housing; a holding part configured to hold an object to be processed; a rotation driving part configured to rotate the object to be processed held by the holding part; front-side process-liquid supply nozzle configured to supply a process liquid onto a peripheral portion of a front surface of the object to be processed held by the holding part; and a storage part disposed on a side of a rear surface of the object to be processed held by the holding part, the storage part being configured to store the process liquid having been passed through the object to be processed. The respective first housing and the second housing can be moved in one direction, so that the first housing and the second housing can be brought into contact and separated from each other.

Abstract: A method and system for cleaning a surface of a substrate after an etching operation includes determining a plurality of process parameters associated with the surface of the substrate. The process parameters define characteristics related to the surface of the substrate such as characteristics of the substrate surface to be cleaned, contaminants to be removed, features formed on the substrate and chemicals used in the fabrication operations. A plurality of application chemistries are identified based on the process parameters. The plurality of application chemistries includes a first application chemistry as an emulsion having a first immiscible liquid combined with a second immiscible liquid and solid particles distributed within the first immiscible liquid.

Abstract: An apparatus for cleaning a substrate includes a dispense head configured to supply a liquid medium as a meniscus to the surface of the substrate and a rinse head that is equipped with at least an inlet conduit to supply rinse chemical to a top substrate surface as a meniscus. An outlet conduit is disposed on either side of the inlet conduit and is configured to remove the rinse chemical and liquid medium from the substrate surface. The inlet conduit and the outlet conduits are perpendicular to the surface of the rinse head that faces the substrate and parallel to one another. A first and second transducers are disposed in a portion of the rinse head between the inlet conduit and each of the outlet conduits. The transducers are configured to transmit acoustic energy to the meniscus when formed between the surface of the rinse head and the substrate.

Abstract: A method of manufacturing a semiconductor device in which an insulating film is filled between patterns etched into a workpiece structure is disclosed. The method includes cleaning etch residues residing between the etched patterns by a first chemical liquid; rinsing the workpiece structure cleaned by the first chemical liquid by a rinse liquid; and coating the workpiece structure rinsed by the rinse liquid with a coating liquid for formation of the insulating film. The cleaning to the coating are carried out within the same processing chamber such that a liquid constantly exists between the patterns of the workpiece structure.

Abstract: Provided are a substrate processing apparatus and method. The substrate processing apparatus includes a substrate support member on which a substrate is placed and a movable spray member supplying a fluid onto the substrate placed on the substrate support member. The movable spray member includes a first nozzle arm rotating to spray at least one fluid and a second nozzle arm disposed on the first nozzle arm to spray at least one fluid.

Abstract: An apparatus for drying a substrate may include a spin chuck, a drying chamber and a drying fluid line. The spin chuck may be configured to support the substrate. The spin chuck may rotate the substrate. The drying chamber may be configured to receive the spin chuck. The drying chamber may have an inlet, an outlet and a vortex exhaust. A drying fluid may be supplied through the inlet into the drying chamber. The drying fluid may be drained through the outlet. A vortex of the drying fluid may be drained through the vortex exhaust The drying fluid line may be connected to the inlet.

Abstract: A method and apparatus for supplying a gas mixture to a load lock chamber is described. In one embodiment, the apparatus supplies a gas mixture to a pair of process chambers, comprising a first ozone generator to provide a first gas mixture to a first process chamber, a second ozone generator to provide a second gas mixture to a second process chamber, a first gas source coupled to the first ozone generator via a first mass flow controller and a first gas line, and coupled to the second ozone generator via a second mass flow controller and a second gas line, and a second gas source coupled to the first ozone generator via a third mass flow controller and a third gas line and coupled to the second ozone generator via fourth mass flow controller and a fourth gas line.

Abstract: A pipe thread cleaning system includes an air delivery system, a fluid delivery system, and a thread cleaner having a housing. A pipe support assembly includes an inflatable seal associated with an open end of the housing. A fluid supply assembly includes a rotating stem having a first end positioned inside the housing and having a hub associated therewith, and a second end positioned outside of the housing. A wand is fluidly coupled with the hub and has a fist portion extending radially from the hub, and a second portion extending parallel to the sidewall and including an opening configured to direct a volume of cleaning fluid and gas onto threads of the threaded pipe. A handle is associated with the rotating stem and configured to rotate the rotating stem relative to the housing such that the wand directs a volume of cleaning fluid and gas towards the threads.

Abstract: A substrate processing apparatus includes a substrate holding unit holding a substrate, a cleaning liquid supplying unit supplying, to the substrate held by the substrate holding unit, a cleaning liquid containing a foaming agent that foams due to application of foaming energy, and a foaming energy supplying unit applying the foaming energy to the cleaning liquid in contact with the substrate held by the substrate holding unit.

Abstract: An apparatus is provided that includes a substrate support assembly for holding the semiconductor substrate and a dispense head for applying a cleaning material to clean the contaminants from the substrate surface. The dispense head extends across a length of the semiconductor substrate and is positioned proximate to the substrate surface at a distance of between about 0.1 mm and about 4.5 mm. The proximate position enables application of a force to the cleaning material as it is applied to the substrate surface as a film, and the cleaning material provided through the dispense head contains a cleaning liquid, a plurality of solid components, and polymers of a polymeric compound, each of the plurality of solid components and polymers being greater than zero and less than 3% of the cleaning material, the plurality of solid components and the polymers are dispersed for application through the dispense head.

Abstract: A dishwasher for treating dishes according to at least one automatic cycle of operation and having a tub at least partially defining a treating chamber and defining an access opening, a sprayer providing a spray of liquid into the treating chamber, a liquid recirculation system defining a recirculation flow path for recirculating the sprayed liquid from the treating chamber to the sprayer and a drive system operable to control at least a position of the liquid diverter.

Abstract: A device and method for treating the surface of a semiconductor wafer provides a treatment fluid in the form of a dispersion of gas bubbles in a treatment liquid generated at acoustic pressures less than those required to induce cavitation in the treatment liquid. A resonator supplies ultrasonic or megasonic energy to the treatment fluid and is configured to create an interference pattern in the treatment fluid comprising regions of pressure amplitude minima and maxima at an interface of the treatment fluid and the semiconductor wafer. The resonator is mounted in the space between the rotary chuck body and a wafer carried in rotation with the chuck body; however, the resonator itself is stationary in relation to rotation of the wafer and chuck body.

Abstract: A dishwasher has a liquid supply system with a first conduit portion through which the liquid passes, and an air supply system with a second conduit portion through which the air passes. The first conduit portion at least partially forms the second conduit portion to define a thermal transfer interface. A heating system includes a heating element provided on the thermal transfer interface. Activation of the heating element provides heat to both the liquid supply system and the air supply system.

Abstract: A dishwasher includes a tub at least partially defining a wash chamber and at least one dish rack located within the wash chamber. The dishwasher also has at least one sprayer located in the wash chamber and at least one nozzle located in the wash chamber and configured to provide a spray of liquid into the dish rack. A diverter valve controls the supply of liquid from a liquid supply to the at least one nozzle.

Abstract: A substrate processing system which enables a minute piece of foreign matter attached to a substrate surface to be detected and are suitable for mass production of substrates. The substrate processing system has a substrate processing apparatus that carries out predetermined processing on a substrate. The substrate processing system comprises a substrate surface processing apparatus having a fluid supply unit that supplies onto a surface of the substrate a fluid containing an altering substance that alters a substance exposed at the surface of the substrate, and a substrate surface inspecting apparatus that inspects the surface of the substrate onto which the fluid has been supplied.

Abstract: A dishwasher having a tub defining a wash chamber and at least one dish rack located within the wash chamber. The dishwasher also has at least two spray zones and a diverter valve that controls the supply of liquid from a liquid supply to one of the two spray zones.

Abstract: A package for delivering a cleaning solution to a surface to be cleaned comprises a housing, a pocket in the housing having at least one piercing projection extending into the pocket and a passageway between the pocket and the surface to be cleaned beneath the housing. A sealed packet containing a cleaning solution can be configured to fit into the pocket and can have at least a portion of an outer surface thereof adapted to be pierced by the at least one piercing projection when the packet is placed in the pocket. The cleaning solution can be discharged from the packet when the packet is positioned in the pocket and the packet is pierced by the at least one piercing projection. The cleaning solution can then be dispensed through the passageway onto a surface to be cleaned.

Abstract: A cleaning apparatus for a semiconductor wafer includes: a gas jet device including a gas nozzle which jets a first gas onto the surface of a semiconductor wafer to thin the thickness of a stagnant layer on the surface of the semiconductor wafer; and a two-fluid jet device including a two-fluid nozzle which jets droplet mist onto a region where thickness of the stagnant layer of the semiconductor wafer is thinned, the droplet mist being mixed two-fluid of a liquid and a second gas.

Abstract: A hand sanitizer (2) comprises: (a) a first part (14) comprising a chlorite solution and contained in a first dispenser (4) whereby it will be dispensed as a spray or jet of liquid; and (b) a second part (16) comprising an acid solution and contained in a second dispenser (6) whereby it will be dispensed as a second spray or jet of liquid; wherein the chlorite and the acid will react to provide chlorine dioxide when the first part is mixed with the second part; and wherein a mixture (18) of equal quantities of the first part and the second part contains at least 15% alcohol by weight; and wherein at least a part of the alcohol comprises 3-methoxy-3-methylbutan-1-ol (MMB).

Abstract: The present invention is in the field devices for hand washing, in particular the washing and drying of hands in public bathrooms. Accordingly it is an object of the present invention to provide a device for cleaning hands, especially a device for wetting hands, depositing a cleansing and/or disinfecting composition and rinsing consecutively, using a low amount of water. It has been found that an air-water jet nozzle assembly comprising two nozzles wherein a first nozzle is in fluid communication with a feed liquid source; and a second nozzle connected to a source of compressed air may be used to clean hands using low amounts of water in a short time.

Abstract: A method of manufacturing a semiconductor device in which an insulating film is filled between patterns etched into a workpiece structure is disclosed. The method includes cleaning etch residues residing between the etched patterns by a first chemical liquid; rinsing the workpiece structure cleaned by the first chemical liquid by a rinse liquid; and coating the workpiece structure rinsed by the rinse liquid with a coating liquid for formation of the insulating film. The cleaning to the coating are carried out within the same processing chamber such that a liquid constantly exists between the patterns of the workpiece structure.

Abstract: An apparatus and method for processing wafer-shaped articles comprises an array of nozzles that are stationary in use, and are individually controlled to simulate the action of a moving boom arm without the actual need for such an arm. Preferably three such arrays are provided, for dispensing three different types of liquid at various process stages. The computer control of the nozzle valves may cause only one nozzle of each array to be open at any given time, or may cause a pair of adjacent nozzles to be open simultaneously.

Abstract: Provided is a liquid processing apparatus in which a target substrate is horizontally held on a substrate holding unit and rotated around a vertical shaft, and the chemicals are supplied from a chemical supplying unit to the bottom surface of the target substrate that is rotating. In particular, the liquid processing apparatus performs a first step in which the chemicals are supplied to the target substrate while rotating the target substrate at a first rotation speed, a second step in which the supply of the chemicals is halted and the chemicals are thrown off by rotating the target substrate at a second rotation speed higher than the first rotation speed, and a third step in which the rinse liquid is supplied to the target substrate while rotating the target substrate at a third rotation speed equal to or lower than the first rotation speed.

Abstract: An apparatus for cleaning a substrate is disclosed. The apparatus having a first head unit and a second head unit. The first head unit is positioned proximate to the surface of the substrate and has a first row of channels defined within configured to supply a foam to the surface of the substrate. The second head unit is positioned substantially adjacent to the first head unit and proximate to the surface of the substrate. A second and a third row of channels are defined within the second head unit. The second row of channels is configured to supply a fluid to the surface of the substrate. The third row of channels is configured to apply a vacuum to the surface of the substrate.

Abstract: A processing apparatus includes: a processing chamber configured to contain a workpiece; a first nozzle provided in the processing chamber, the first nozzle discharging vapor onto the workpiece; a wall enclosing the processing chamber; a fluid channel provided inside the wall; a fluid inlet; and a fluid outlet. The fluid inlet is provided in communication with the fluid channel. The fluid outlet is provided in communication with the fluid channel, where a fluid flows into the fluid inlet, passes through the fluid channel, and flows out of the fluid outlet. A processing method for processing a workpiece moving in a processing chamber, the processing method includes: discharging a vapor from a first nozzle toward the workpiece while flowing a fluid through a fluid channel which is provided inside a wall, the wall enclosing the processing chamber.

Abstract: A dishwasher with multiple physically separate treating chambers includes an air supply system selectively supplying drying air to the treating chambers, and a drying air exhaust system selectively removing drying air from the treating chambers. A method for operating a dishwasher selectively supplies heated drying air to and exhausts drying air from at least one treating chamber.

Abstract: Provided is a method and apparatus for cleaning a photomask. The photomask including a first region and a second region surrounding the first region, a pattern to be protected disposed on the first region, and a material to be removed exists on the second region. A cleaning liquid is sprayed from an inside region of the second region toward an outer region of the second region to remove the material, and a gas is blown from the first region toward the second region to protect the pattern.

Abstract: A liquid processing apparatus includes: a processing part 80 configured to process an object to be processed by a process liquid; a supply path 1 connected to the processing part 80, the supply path 1 being configured to guide the process liquid to the processing part 80; a solvent supply part 7 configured to supply a solvent to the supply path 1; and a chemical-liquid supply part 5 configured to supply a chemical liquid to the supply path 1 through a chemical-liquid supply path so as to generate a chemical liquid diluted with the solvent. A measuring part 10, which is configured to measure a conductivity of the chemical liquid diluted with the solvent, is disposed in the supply path at a position downstream from a connection points 25a, 35a, 45a, to which the chemical-liquid supply path 6 is connected.

Abstract: A washing apparatus and a method of deodorizing washing water that can prevent the unpleasant smell of washing water are provided. An electrolytic water producing means 2 produces strong acidic water and strong alkaline water by electrolysis of an electrolytic solution. The produced strong acidic water and strong alkaline water are stored in an acid container 3 and alkali container 4, respectively. A mist container 5 connected to the alkali container 4 produces a deodorant mist upon receiving a part of the strong alkaline water in the alkali container 4. A discharge port 6a is selectively connected to the acid container 3, alkali container 4, or water pipe 8 so as to discharge the strong acidic water, strong alkaline water, or tap water. A mist ejection portion 7 is formed to spray the deodorant mist of the strong alkaline water in the mist container 5 around the strong acidic water or tap water discharged from the discharge port 6a so that the mist surrounds the strong acidic water or tap water.

Abstract: A batch ware washing machine and/or related method of washing wares. The machine includes a moveable door which partially encloses a steam cavity. When the door is in the up or open position, hot moist air may be forcibly pulled from the steam cavity and into an exhaust plenum via an air inlet port that is strategically positioned above the top wall of the door when the door is in the closed position, but below the top wall when the door is in the open position. A controller causes the air to be forcibly pulled through the plenum for a predetermined exhaust time period, such as one minute, and then automatically stops the forced air exhaust movement. The exhaust plenum may be ducted directly to the outside of the surrounding building. The air conditioning load on the HVAC units serving the kitchen are reduced, thereby reducing energy consumption.

Abstract: Equipment (10) for cleaning and drying roll stands, particularly roll stands in a rolling train, wherein a roll change device movable into the roll stand on rails transversely to the rolling line is provided for changing the rolls, wherein the device (10) is movable, similarly to the roll change device, on the rails (12) thereof and comprises a plurality of jet nozzles, which can be directed towards the roll stand (11), for a liquid cleaning medium (16) and blow nozzles (22, 22a, 22b, 22c) for a drying medium (24).

Abstract: A device for cleaning and doping (lubrication) equipment for threads (3b, 4b) of the type used to join pipes (4) to a pipe string (3), especially in connection with petroleum production, where cleaning fluid and dope (lubricant) are sprayed at the threads (3b, 4b) at relatively high pressure from at least one nozzle (5, 6) mounted in the rotatable make-up section (1) of a power tong, and where at least one injection pump (7, 8) arranged to supply cleaning fluid or dope to the at least one nozzle (5, 6) is located in the rotatable make-up section (1).

Abstract: A conveyor dishwasher (2) has a control apparatus (50) for automatically setting the quantity of final rinse liquid sprayed in the final rinse zone (18) per unit time as a function of the conveying speed and/or as a function of the type of washware conveyed through the final rinse zone (18). A rinse aid metering apparatus (57) is also provided which is designed to add in a metered fashion a constant quantity of rinse aid per unit time to the fresh water provided for final rinsing purposes independently of the quantity of final rinse liquid sprayed in the final rinse zone (18) per unit time.

Abstract: A liquid processing apparatus of the present disclosure includes a rotatable substrate holder that holds a wafer from above, and a top plate nozzle that supplies at least rinse liquid to the wafer and is provided in the rotation center of the substrate holder. The top plate nozzle is movably configured with the substrate holder in the top-bottom direction, and the rinse liquid is supplied to the wafer from the top plate nozzle while the top plate nozzle is spaced from the substrate holder. When the top plate nozzle approaches to the substrate holder, the rinse liquid is supplied to the lower surface of the substrate holder from the top plate nozzle to clean the lower surface of the substrate holder.

Abstract: Provided is a method and apparatus for cleaning a photomask. The photomask including a first region and a second region surrounding the first region, a pattern to be protected disposed on the first region, and a material to be removed exists on the second region. A cleaning liquid is sprayed from an inside region of the second region toward an outer region of the second region to remove the material, and a gas is blown from the first region toward the second region to protect the pattern.

Abstract: According to one embodiment, a method for cleaning a semiconductor substrate comprises supplying water vapor to a surface of a semiconductor substrate on which a concave-convex pattern is formed while heating the semiconductor substrate at a predetermined temperature, cooling the semiconductor substrate after stopping the heating and the supply of the water vapor and freezing water on the semiconductor substrate, after freezing the water, supplying pure water onto the semiconductor substrate and melting a frozen film, and after melting the frozen film, drying the semiconductor substrate.

Abstract: Disclosed are a liquid processing apparatus and a liquid processing method. The liquid processing apparatus includes an ejection port ejecting a first liquid to a wafer, a first liquid supply mechanism supplying sulphuric acid to the ejection port, and a second liquid supply mechanism supplying hydrogen peroxide solution to the ejection port. The first liquid supply mechanism includes a first temperature adjustment mechanism maintaining the first liquid heated to a first temperature, a second temperature adjustment mechanism connected to the first temperature adjustment mechanism, and an ejection line connecting the second temperature adjustment mechanism with the ejection port. The second temperature adjustment mechanism includes a second circulation line and a second heater. The ejection line connects the second circulation line through a switching valve at a location further downstream than the second heater.

Abstract: A water-conducting domestic appliance including a line system, a detergent feed facility that supplies at least one detergent into the line system, wherein the detergent feed facility includes at least one reservoir configured to be filled with detergent, and a refill fitting having a connection to the at least one reservoir, the refill fitting being arranged on a door of the water-conducting domestic appliance.

Abstract: A method includes providing a wafer and providing a first spray bar spaced a distance from the wafer. A first spray is dispensed from the first spray bar onto a first portion (e.g., half) of the wafer. Thereafter, the wafer is rotated. A second spray is dispensed from the first spray bar onto a second portion (e.g., half) of the rotated wafer. In embodiments, a plurality of spray bars are positioned above the wafer. One or more of the spray bars may be tunable in separation distance and/or angle of dispensing.

Abstract: Systems and methods for oscillating exposure of a semiconductor workpiece to multiple chemistries are disclosed. A method in accordance with one embodiment includes sequentially exposing a portion of a semiconductor workpiece surface to a first chemistry having a first chemical composition and a second chemistry having a second chemical composition different than the first. Prior to rinsing the portion of the workpiece surface, the portion is sequentially exposed to the first and second chemistries again. The first and second chemistries are removed from the portion, and, after sequentially exposing the portion to each of the first and second chemistries at least twice, and removing the first and second chemistries, the portion is rinsed and dried.

Abstract: A method and apparatus for providing multiple spray zones to different subportions of a silverware basket within the wash chamber of a dishwasher.

Abstract: A cleaning method of cleaning a joint surface of a processing target substrate separated from a superposed substrate, while the processing target substrate is placed inside an annular frame and held by a tape bonded to a surface of the frame and a non-joint surface of the processing target substrate, the cleaning method including: a placement step of placing a cleaning jig to face the processing target substrate such that a supply surface of the cleaning jig for supplying a solvent for the adhesive onto the joint surface of the processing target substrate covers the joint surface and a distance between the supply surface and the joint surface is a predetermined distance; and a cleaning step of then supplying the solvent between the supply surface and the joint surface and diffusing the supplied solvent over the joint surface by a surface tension.

Abstract: In an embodiment, the present invention discloses cleaned storage processes and systems for high level cleanliness articles, such as extreme ultraviolet (EUV) reticle carriers. A decontamination chamber can be used to clean the stored workpieces. A purge gas system can be used to prevent contamination of the articles stored within the workpieces. A robot can be used to detect the condition of the storage compartment before delivering the workpiece. A monitor device can be used to monitor the conditions of the stocker.

Abstract: In an embodiment, the present invention discloses a EUV cleaner system and process for cleaning a EUV carrier. The euv cleaner system comprises separate dirty and cleaned environments, separate cleaning chambers for different components of the double container carrier, gripper arms for picking and placing different components using a same robot handler, gripper arms for holding different components at different locations, horizontal spin cleaning and drying for outer container, hot water and hot air (70 C) cleaning process, vertical nozzles and rasterizing megasonic nozzles for cleaning inner container with hot air nozzles for drying, separate vacuum decontamination chambers for outgassing different components, for example, one for inner and one for outer container with high vacuum (e.g., <10?6 Torr) with purge gas, heaters and RGA sensors inside the vacuum chamber, purge gas assembling station, and purge gas loading and unloading station.

Abstract: An apparatus for cleaning a substrate is disclosed. The apparatus includes a first chamber through which a substrate is conveyed, a second chamber where an oxide film formed on the substrate conveyed from the first chamber is removed; and a third chamber that discharges the substrate conveyed from the second chamber to the outside after rinsing the substrate, wherein the first chamber and the third chamber are disposed on top and on bottom.

Abstract: A mold release treatment method of the present invention includes: the step of providing a mold releasing agent and a mold which has a porous alumina layer over its surface, the mold releasing agent containing a fluoric compound which has mold releasability and a solvent; the step of applying over the surface of the mold a solvent that is capable of dissolving the fluoric compound; and thereafter, the step of applying the mold releasing agent over the surface of the mold according to a spray coating method. According to the present invention, a mold release treatment can be performed over a surface of the mold which has the porous alumina layer over its surface, without causing uneven application.

Abstract: Conditioning fluid flow into a proximity head is provided for fluid delivery to a wafer surface. An upper plenum connected to a plurality of down flow bores is supplied by a main bore. The down flow bores provide fluid into the upper plenum, and a resistor bore is connected to the upper plenum. The resistor bore receives a resistor having a shape so as to limit flow of the fluid through the resistor bore. A lower plenum connected to the resistor bore is configured to receive fluid from the resistor bore as limited by the resistor for flow to a plurality of outlet ports extending between the lower plenum and surfaces of the head surface. Fluid flowing through the upper plenum, the resistor bore with the resistor and the lower plenum is substantially conditioned to define a substantially uniform fluid outflow from the plurality of outlet ports, across the width of the proximity head.

Abstract: A rotary atomizing head (125, 226) is rotatably provided on a leading end of a coating gun (115, 215). The rotary atomizing head (125, 226) is provided with a central paint discharge opening (141, 241) provided in a vicinity of a rotation axis (137, 237) of the rotary atomizing head (125, 226) and an outer paint discharge opening (142, 242) having a central axis (148, 248) inclined relative to the rotation axis (137, 237). A cleaning nozzle (124, 225) has an axis (127, 228) which aligns with the central axis (148, 248) of the outer paint discharge opening (142, 242) when the coating gun (115, 215) is cleaned.

Abstract: Disclosed is a liquid processing method capable of rapidly penetrating a liquid chemical into a concave portion formed on the surface of a substrate with the chemical liquid. The liquid processing method includes wetting the inside of the concave portion by supplying an organic solvent having surface tension smaller than the chemical liquid to the substrate, and cleaning the inside of the concave portion with the chemical liquid by supplying a cleaning liquid including the chemical liquid to the substrate and substituting the liquid inside the concave portion with the chemical liquid.

Abstract: A cleaning and drying-preventing method including: positioning a nozzle in a container such that a funnel-like inner circumferential surface of the container is located around a periphery of a distal end of the nozzle; sucking a liquid in the nozzle to retract a level of the liquid to a side of a supply passage; supplying a solvent into the container to form a swirl flow of the solvent turning around the distal end of the nozzle, and cleaning the nozzle by the swirl flow; supplying a solvent into the container to form a liquid pool of the solvent; and further retracting the level of the liquid in the nozzle to the side of the supply passage. A liquid layer, an air layer, and a solvent layer are formed in the nozzle in this order from the side of the supply passage, to prevent drying of the liquid in the nozzle.