Abstract: A method and an apparatus for removing a liquid, i.e a wet processing liquid, from a surface of at least one substrate is disclosed. A liquid is supplied on a surface of substrate. Simultaneously or thereafter besides the liquid also a gaseous substance can be supplied thereby creating at least locally a sharply defined liquid-vapor boundary. The gaseous substance and the liquid can be selected such that the gaseous substance is miscible with the liquid and when mixed with the liquid yields a mixture having a surface tension lower than that of the liquid. According to the invention, the substrate is subjected to a rotary movement at a speed to guide said liquid-vapor boundary over said substrate thereby removing said liquid from said substrate.

Abstract: A soft spray nozzle discharging a cleaning mist is vertically directed and fixed to an arm. A rinse nozzle discharging rinsing deionized water for suppressing obstruction is vertically fixed to the arm at a prescribed distance from the soft spray nozzle. During cleaning, it follows that both nozzles discharge detergents while keeping relative layout relation. Therefore, the discharged cleaning mist and rinsing deionized water do not interfere with each other before reaching the substrate but the used detergents are entirely horizontally splashed and recovered in a cup. Thus, the cleaning mist is prevented from scattering and adhering to the periphery.

Abstract: A detergent pack for use in conjunction with a washing machine and which comprises two or more detergent or auxiliary products, storage means comprising separate but associated portions of the two or more products, and means for delivering quantities of the two or more products into the same or different cycles of a washing machine, said means for delivering comprising means for dispensing quantities of the two or more products, and means for controlling the relative dispensing rate of the two or more products from the storage means.

Abstract: A method and apparatus for removing contaminants from the surface of a metallic article comprises a continuously flowing acid bath whose level of acidity and temperature is controlled and over which a purging gas flows to continuously remove hazardous gases generated during the removal of contaminants from the metallic article.

Abstract: A method of cleaning a semipermeable membrane, the semipermeable membrane being configured for carrying a fiber web, includes the steps of providing a cleaning fluid and applying the cleaning fluid on the semipermeable membrane. Further, an air press configured for carrying the semipermeable membrane therethrough is provided, and the air press has pressurized air therein. The semipermeable membrane is conveyed through the air press and is subjected to the pressurized air within the air press. The pressurized air thereby flushes the cleaning fluid through the semipermeable membrane.

Abstract: Method and system for purging a process line of a process gas used in a semiconductor wafer fabrication process. Inert gas (e.g., nitrogen gas) is repeatedly charged from an inert gas source into the process line and evacuated using a vacuum system. The vacuum system is preferably supplied with inert gas having a pressure in excess of 30 psig from the inert gas source. The inert gas is introduced into the process line from an inert gas conduit at a predetermined pressure to prevent process gas from liquefying in the process line. A set pressure regulator or an absolute pressure regulator may be used to reduce he pressure of the inert gas to below the vapor pressure of the process gas.

Abstract: An apparatus is disclosed for drying wafer substrates in a process tank having an object supporting member for supporting one or more wafer substrates, the object supporting member having apertures through which “vacuum force” can be applied to essentially remove trace amounts of liquid from object contact points formed by the support of the wafer substrate by the object supporting member. Also disclosed is a method of implementing the disclosed apparatus comprising transferring a wafer substrate from an object transporting member to the object supporting member, providing an aperture at or near each contact point, and applying a “vacuum force” through the apertures to remove any trace amounts of liquid. Also disclosed and claimed are wafer substrates resulting from application of the disclosed drying process and apparatus.

Abstract: A modular gas control device for use with a compressed gas cylinder (111) comprises a primary module (152) and a secondary module (252) mounted on the primary module. The primary module comprises a first supporting body (154) having a first main gas flow path (155) through the body. The supporting body has input connecting means (156) for mounting the body on the cylinder (111) and connecting the gas flow path (155) to communicate with the gas cylinder through a first flow. path (157). Pressure reducing means (166) provides gas in the flow path at a lower pressure than in the container. Output connecting means (170) downstream of the pressure reducing means provides a low pressure outlet from the main gas flow path. A high pressure shut-off valve (164) is positioned upstream of the pressure reducing means, and filling means (161, 160) allows filling of the cylinder with compressed gas through the input connecting means (156) along a second flow path (159) separate from the input flow path (157).

Abstract: A non-contact wiper and washer assembly for surveillance camera domes having a semicircular perforated tube in close proximity to the dome surface. The tube is pivotable by a motorized mechanism so that either washer solution or compressed air may be dispensed over the entire surface of the dome thereby washing it and cleaning it from any water droplets.

Abstract: An apparatus for cleaning castings includes a cleaning cabinet having a rotary clamping device which clamps a casting to be cleaned upon a freely rotatable plate in the cabinet. An elongate lance having a high pressure nozzle at its inner end projects into the cabinet and delivers a high pressure water jet against the casting at a pressure of 1,000 psi to 40,000 psi. A spherical bearing pivotally and rotatably mounts the lance on a vertically reciprocal carriage. A pair of pneumatic cylinder and piston units are connected to lance and are differentially operated with respect to actuation times and length of piston stroke to thereby produce random movement of the lance during the cleaning operation.

Abstract: Workpieces requiring low levels of contamination, such as semiconductor wafers, are loaded into a rotor within a process chamber. The process chamber has a horizontal drain opening in its cylindrical wall. The chamber is closed via a door. A process or rinsing liquid is introduced into the chamber. The liquid rises to a level so that the workpieces are immersed in the liquid. The chamber slowly pivots or rotates to move the drain opening down to the level of the liquid. The liquid drains out through the drain opening. The drain opening is kept near the surface of the liquid to drain off liquid at a uniform rate. An organic solvent vapor is introduced above the liquid to help prevent droplets of liquid from remaining on the workpieces as the liquid drains off. The rotor spins the workpieces to help to remove any remaining droplets by centrifugal force.

Abstract: The subject of the present invention is a method and a device for filling a distribution line (20) with corrosive gas. The said method is a method for filling with gas, with passivation, a line (20) for distributing corrosive gas, which line is intended to distribute the said corrosive gas to a system (3) located immediately downstream of the said line (20); the said method comprising: prior conditioning of the said line (20); the actual filling of the said line (20) with the said corrosive gas known as an active gas. Characteristically, the said actual filling with gas comprises: at least one cycle of filling the said line (20) with active gas as far as immediately upstream of the system (3) and of removing the said active gas thus introduced into the said line (20); the said removal being performed without the said active gas passing through the said system (3); followed by the final filling of the said line (20) with gas so as to make the said gas available to the said system (3).

Abstract: A method of cleaning substrates is provided. Prior to, during or prior to and during a cleaning process, fluid is applied to a substrate surface to form a fluid film thereon. Ice crystals are introduced into the fluid film on the substrate surface. The ice crystals have a temperature that is lower than the temperature of the fluid such that the fluid changes the ice crystals into a gaseous state to form a pulse generated in the fluid film. The depth of penetration of the ice crystals into the fluid film is controlled such that the ice crystals do not strike the substrate surface. The substrate surface is cleaned with the pulse.

Abstract: For use with a city water system having a plurality of street water mains interconnected by branch water mains and having hydrants connected to the branch water mains, a city water flushing and sludge prevention method consisting the steps of: inserting a sludge-prevention control valve into a branch water main between two street water mains and closer to one of the two street water mains; the sludge-prevention control valve in the closed position preventing water from flowing through the branch water main from the closer street water main during a flushing operations, whereby all water flows through the branch water main from the more distant street water main and thereby flushes the portion of the branch water main between the sludge-prevention control valve and the more distant street water main; and an optional control mechanism adapted to close and open the sludge-prevention control valve. The control mechanism can utilize any power source such as electric, pneumatic, hydraulic, etc.

Abstract: A method and an apparatus for removing a liquid, i.e a wet processing liquid, from a surface of at least one substrate is disclosed. A liquid is supplied on a surface of substrate. Simultaneously or thereafter besides the liquid also a gaseous substance can be supplied thereby creating at least locally a sharply defined liquid-vapor boundary. The gaseous substance and the liquid can be selected such that the gaseous substance is miscible with the liquid and when mixed with the liquid yields a mixture having a surface tension lower than that of the liquid. According to the invention, the substrate is subjected to a rotary movement at a speed to guide said liquid-vapor boundary over said substrate thereby removing said liquid from said substrate.

Abstract: The invention relates to a process for liquid treatment of a defined area of a wafer-shaped article, especially of a wafer, near the edge, in which the liquid is applied to a first surface, flows essentially radially to the outside to the peripheral-side edge of the wafer-shaped article and around this edge onto the second surface, the liquid wetting a defined section near the edge on the second surface and thereupon being removed from the wafer-shaped article. Furthermore the invention relates to a device for executing this process.

Abstract: A valve arrangement is provided that more effectively purges processing liquid from a processing liquid delivery system. With the valve arrangement only a small portion of the processing liquid path having a small wetting perimeter must be purged to affect replacement of a dysfunctional injection valve or any other component within the processing liquid delivery system. The valve arrangement comprises a first and a second isolation valve, a pump valve and purge valve configured to reduce the wetting perimeter defined by the four valves. The valve arrangement allows a dysfunctional injection valve or any other component to be replaced without health risk to humans or damage risk to a processing liquid delivery system employing the valve arrangement. During component replacement, the first and the second isolation valves are closed and the pump and the purge valves are opened so as to purge processing liquid from the isolated volume defined by the four valves.

Abstract: Where a substrate such as a semiconductor wafer held in a process space in a process chamber consisting of an outside chamber and an inside chamber is subjected to a cleaning processing, a chemical agent such as IPA or a solvent having a surfactant added thereto is supplied in the form of a mist or a vapor toward the substrate under the sate that the substrate is stopped or rotated at a low speed after processing with a chemical agent and a subsequent rinsing processing with a pure water. After the supply of the chemical agent is stopped, the substrate is rotated at a rotating speed higher than said low speed so as to centrifugally remove the chemical agent attached to the substrate.

Abstract: An overall valving system is situated generally between a source of water and a habitable structure; a main valve is selectively openable and closable to permit and terminate flow from such source of water to the habitable structure; a conduit is provided for supplying pressurized air to an area downstream of the main valve when the main valve is closed.

Abstract: A modular gas control device for use with a compressed gas cylinder (111) comprises a primary module (152) and a secondary module (252) mounted on the primary module. The primary module comprises a first supporting body (154) having a first main gas flow path (155) through the body. The supporting body has input connecting means (156) for mounting the body on the cylinder (111) and connecting the gas flow path (155) to communicate with the gas cylinder through a first flow path (157). Pressure reducing means (166) provides gas in the flow path at a lower pressure than in the container. Output connecting means (170) downstream of the pressure reducing means provides a low pressure outlet from the main gas flow path. A high pressure shut off valve (164) is positioned upstream of the pressure reducing means, and filling means (161, 160) allows filling of the cylinder with compressed gas through the input connecting means (156) along a second flow path (159) separate from the input flow path (157).

Abstract: Method and apparatus for cleaning semiconductor devices and other workpieces using an aqueous rinse solution which is de-oxygenated by passing the aqueous rinse solution and a carrier gas through an osmotic membrane degasifier. A cleaning chamber is also disclosed for carrying out the cleaning method.

Abstract: A wet processing device of this invention is comprised of a chemical processing tank to store chemicals for processing the surface of the wafer, a wafer conveyor device to carry the wafer in and out of the interior of the chemical processing tank, and a sensor to determine the amount of air bubbles occurring within the chemical when present within the chemical processing tank and issue a first and a second control signal, and a wash tank to store water for washing the wafer carried out from the chemical processing tank by the wafer conveyor. The rising speed of the wafer conveyor device pulled the wafer up from the chemical processing tank is controlled in response to the first control signal, and the wash tank water fill quantity for supplying water to the wash tank is controlled in response to the second control signal.

Abstract: A method and device for cleaning vertically suspended lamellar blinds in collapsed state, is provided having a supply unit with a moveable supply container and functional elements for generating a fluid stream as well as a suspended spay device which is supported by the lamellae and comprises a spray head and a jacket foil enclosing the lamellar blind. The supply container is designed to be used separately with a washing solution or a rinse solution and is equipped with a pump, a pressurized line leading to the spray head and a return line. The pressurized line comprises a dual manifold disposed at the top and the return line has a connection at the top as well as a connection at the bottom.

Abstract: A method, apparatus and system for fabricating a stencil mask for ion beam and electron beam lithography are provided. The stencil mask includes a silicon substrate, a membrane formed from the substrate, and a mask pattern formed by through openings in the membrane. The method includes defining the mask pattern and membrane area using semiconductor fabrication processes, and then forming the membrane by back side etching the substrate. The apparatus is configured to electrochemically wet etch the substrate, and to equalize pressure on either side of the substrate during the etch process. The system includes an ion implanter for defining a membrane area on the substrate, optical or e-beam pattern generators for patterning various masks on the substrate, a reactive ion etcher for etching the mask pattern in the substrate, and the apparatus for etching the back side of the substrate.

Abstract: A system and method ensures that the wet lines of a bottom loading petroleum cargo tank remain free of hazardous liquid during transit. The system and method continuously monitor and automatically purge liquid that collects in the wet lines during transit, for example from a leaking emergency valve. The system includes a liquid sensor positioned at a low point in the wet line, a low pressure purge controller in electrical communication with the liquid sensor and a solenoid valve in electrical communication with the purge controller. The system further includes a one-way flow valve in flow communication with the solenoid valve and the wet line. The solenoid valve is also in flow communication with an external source of compressed gas, such as the air system of the cargo tank or an auxiliary air supply. Preferably, the system further includes a remote warning indicator for indicating to the operator of the cargo tank that a particular wet line is leaking excessively.

Abstract: A vehicle washing system is mounted adjacent the ceiling of a garage or other structure. It includes an upper frame and a mat is located beneath the frame for catching and draining off fluids used during the washing operation. After a vehicle is driven onto the mat beneath the frame, a mechanism is operated to lower a waterproof curtain from the frame down to a point adjacent the mat to completely surround the vehicle. In addition, fluid conduit rings also are lowered from the frame to various positions surrounding the vehicle. Nozzles in these rings are directed toward the vehicle location and washing and rinsing fluid is supplied, under pressure, to the rings in a pre-established sequence to effect the washing of the vehicle. In addition, hot air drying tubes and nozzles are lowered from the frame when the device is in use to permit the application of hot drying air to the vehicle after the washing cycle has been completed.

Abstract: An apparatus for degreasing solid and/or mass-produced parts, such as small metallic parts comprises a drum with a perforated drum wall rotatable and drivable around a vertical axis. A charge opening is furnished at the top and a discharge opening furnished at the bottom. The discharge opening is closable by an axially movable floor closure. A stationery outer ring channel surrounds the drum and exhibits at the bottom an outer ring trough with discharge port. An inner ring channel is disposed between the outer ring channel and the drum and axially adjustable by way of an adjustment member and including an inner ring trough at the bottom. Feed lines for treatment agent lead into the drum. The inner ring channel is formed adjustable from the starting position, releasing the drum perforations, into a center position covering the drum perforations on the outside, and into a sealing position for sealing the drum.

Abstract: A system (10) for processing wafers and cleaning wafer cassettes (160, 260, 460) includes a work cell (12) having a plurality of processing stations (14) for processing wafers, and at least one processing/cleaning station (30, 130, 230, 430) for receiving and delivering wafers to and from a wafer cassette (160, 260, 460), a transfer mechanism (16) for moving the wafers between the plurality of processing stations (14) and the cleaning station (30). The cleaning station (30, 130, 230, 430) may have an exterior door (32, 132, 232, 432), an exhaust (34, 134, 234, 434), an interior door (40, 140, 240, 440), a plurality of gas nozzles (166, 266, 466) for delivering a sweeping gas over the wafer cassette (160, 260, 460). The cleaning process can also be done with a loaded cassette (160, 260, 460) that is unloaded before cleaning.

Abstract: For use with a city water system having a plurality of street water mains interconnected by branch water mains and having hydrants connected to the branch water mains, a city water flushing and sludge prevention apparatus consisting of: a sludge-prevention control valve insertable into a branch water main between two street water mains and closer to one of the two street water mains; the sludge-prevention control valve in the closed position preventing water from flowing through the branch water main from the closer street water main during a flushing operation, whereby all water flows through the branch water main from the more distant street water main and thereby flushes the portion of the branch water main between the sludge-prevention control valve and the more distant street water main; and a control mechanism adapted to close and open the sludge-prevention control valve.

Abstract: An apparatus for servicing a wafer chuck such as an electrostatic chuck that is equipped with vent holes for cooling the backside of a wafer positioned on the chuck and for clearing the vent holes is provided. The novel apparatus can be used either in replacing a gas supply conduit to the electrostatic chuck without having to break vacuum in the process chamber, or can be used in clearing the vent holes when servicing an electrostatic chuck. The apparatus consists of a three-way control valve and a high pressure gas supply line of a suitable inert gas.