Abstract: Acrylate adhesive composition comprising N-methacryloyl-3,4-dihydroxyphenylalanine and/or N-acrylol-3,4-dihydroxyphenylalanine. The adhesive composition ensures an adhesion of substrates under moist conditions, in particular a biocompatible and waterproof adhesion to human skin.

Abstract: The present invention relates to the technical field of manufacturing engineer wood floor for indoor decoration, and in particular to a manufacturing method that does not release any dissociated formaldehyde. The manufacturing steps are as the followings: Mix the adhesive agent; pour the mixed adhesive agent on a glue spreader at the linear velocity of ?20 meters/minute; deliver the wooden middle boards to the glue spreader to carry out spreading glue; superimpose wooden middle boards having been coated with glue longitudinally and latitudinally, and deliver them to a cold press for cold press; put the rough middle boards having been coldly pressed on a hot press for hot pressing, in order to make them become base material of engineer wood floor; Stick decorative surface material on the base material of engineer wood floor in order to make them become a engineer wood floor; and form, paint, and pack the engineer wood floor finally.

Abstract: The invention relates to plywood, comprising at least two wood veneer layers and at least one adhesive layer, whereby the adhesive layer comprises a resin composition comprising a triazine compound (T), formaldehyde (F) and optionally urea, wherein the molar F/(NH2)2 ratio of the adhesive layer lies between 0.70 and 1.10 and the molar F/T ratio of the adhesive layer lies between 1.0 and 3.5. The invention further relates to a process for the preparation of plywood.

Abstract: A steel sheet overlap structure including a pair of joined steel sheets and an antirust layer which comprises an electrically conductive polymer, and which is provided between joining surfaces of the steel sheets.

Abstract: Core-skin bonding is improved between honeycomb and composite face sheets by applying a nylon-based (polyamide) adhesive to the edge of the honeycomb prior to bonding. Edge coating of honeycomb with polyamide adhesives is useful in further increasing the bond strength between honeycomb and prepreg face sheets, especially when the matrix resin of the prepreg is designed to adhere the prepreg to the honeycomb.

Abstract: Disclosed is a composite wood component having upper and lower surface layers and a core layer; a first glueline layer; a second glueline layer; and an overlay layer.

Abstract: A fuel cell, having improved sealing against leakage, includes a sealant disposed over the peripheral portions a membrane electrode assembly such that the cured sealant penetrates a gas diffusion layer of the membrane electrode assembly. The sealant is applied through liquid injection molding techniques to form cured sealant composition at the peripheral portions of the membrane electrode assembly. The sealant may be thermally cured at low temperatures, for example 130° C. or less, or may be cured at room temperature through the application of actinic radiation. The sealant may be a one-part or a two-part sealant. The sealant includes a polymerizable material, such as a polymerizable monomer, oligomer, telechelic polymer, functional polymer and combinations thereof functionalized with a group selected from epoxy, allyl, vinyl, (meth)acrylate, imide, amide, urethane and combinations thereof.

Abstract: A curable, alkoxysilane-functional polyether urethane composition formed by combining a) a first silane terminated polyurethane prepared by reacting i) a mono-functional compounds with ii) an isocyanate component containing two isocyanate groups, the reaction product reacted with iii) a compound containing an isocyanate-reactive group and one or more reactive silane groups to form a moisture-curable, alkoxysilane-functional polyether urethane; and b) a second silane terminated polyurethane prepared by reacting i) an alkyl monofunctional alcohol, amine, and/or thiol, with ii) an isocyanate component containing two isocyanate groups, the reaction product reacted with iii) a compound containing an isocyanate-reactive group and one more reactive silane groups. The urethane composition can be used in coating, sealant and/or adhesive compositions. The coating compositions are used to form a coated substrate.

Abstract: The present invention relates to laminates of a plasticizer-containing plastic, obtained by bonding by means of a moisture-reactive hot-melt adhesive which comprises at least one aldimine and at least one polyurethane polymer which contains isocyanate groups and is solid at room temperature. The bonded assembly is notable for improved adhesive, particularly following heat/moisture storage or alternating storage. Preferred embodiments of such laminates are bonded films or film-laminated supports, the film preferably being a pPVC film.

Abstract: An inflatable automotive protective cushion and method of formation. The protective cushion includes a multilayer film coating with an adhesive layer and an overlying barrier layer. The adhesive layer is adapted to bond to a textile substrate and the barrier layer is adapted to block air permeability.

Abstract: Producing a printed circuit board, by coating a resin composition comprising an aromatic cyanate compound having two or more cyanato groups in a molecule and a radical-polymerizable resin on a circuit substrate, photo-curing the resin composition, and thermally curing the photo-cured resin composition to thereby form an insulation layer, affords an insulation layer with improved surface smoothness and excellent dielectric properties.

Abstract: A flame resistant RFID tag comprises: a first flame resistant polymer film having a major surface; an RFID device secured to the major surface of the first flame resistant polymer film, the RFID device having proximal and distal surfaces and comprising an antenna electrically connected to an integrated circuit; and a first flame resistant pressure sensitive adhesive layer covering the distal surface of the RFID device. Methods of making the flame resistant RFID tags are also disclosed.

Abstract: Reactive polyurethane hotmelts comprising crystallizing polyesterpolyols based on fumaric acid and 1,6-hexanediol. These hotmelts exhibit good pressure-sensitive adhesive (PSA) properties over a very broad temperature range. The reactive polyurethane hotmelts are prepared by mixing a polyol mixture containing at least on crystallizing polyesterpolyol with an excess of polyisocyanates.

Abstract: A pasty single component polyurethane adhesive is provided. The NCO terminated polyurethane prepolymer is substantially linear, contains from 2.0% to 8.0% based on the weight of the prepolymer, of highly disperse silica and up to 10% by weight, based on the weight of the prepolymer, of additives. The one component adhesive has an Expressed Volume of at least 2,000 g/min measured according to DIN EN 29048 and a Creep Resistance measure according to DIN EN 27390 below 6.0 after 5 minutes.

Abstract: The invention relates to the use of aqueous, isocyanate-free, polyurethane dispersions with a solid content of ?30 wt. % and a solvent content of ?10 wt. % in sports floor coverings. The inventive polyurethane dispersions are particularly suitable for use as bonding agents for elastic coatings, spray coatings or flow coatings on elastic or rigid undersurfaces, adhesion promoters or primary coatings, fillers for sealing pores, adhesives for gluing pre-fabricated plastic coatings or for sealing sports floor coverings. The inventive polyurethane dispersions are environmentally friendly and easy to manufacture. They are also partly characterized by improved product features, e.g. mechanical properties, UV resistance and color stability, with respect to the corresponding sports floor coverings.

Abstract: An iodine/iodide-containing hot melt coatable adhesive is provided. This adhesive is prepared by mixing iodine and an iodide salt, individually or in combination, with solubilizing liquids. The iodine and iodide salt are combined with a pre-adhesive composition in a hot melt mixer, with an iodine/iodide complexing agent being present in the mixture. The mixture is mixed at a temperature from about 130° C. to about 200° C. and sufficiently to form an iodine/iodide-containing hot melt coatable adhesive. Alternatively, the iodide may be generated in situ. The adhesive so prepared may be packaged for coating on a substrate at a later time, or may be immediately coated to form an adhesive composite. Adhesive composites, particularly surgical incise drapes, are provided incorporating this hot melt coatable adhesive.

Abstract: The invention provides a process for producing a substrate for flexible circuit boards which comprises: providing a multilayered insulating resin layer comprising an insulating layer and an adhesive layer; and laminating a metal foil to the insulating layer of the multilayered insulating resin layer via the adhesive layer at a temperature not lower than the glass transition temperature of the insulating layer.

Abstract: High green strength reactive hot melt adhesives are prepared using crystalline monofunctional reactants.

Abstract: The present invention is directed to ion triggerable, water-dispersible cationic polymers. The present invention is also directed to a method of making ion triggerable, water-dispersible cationic polymers and their applicability as binder compositions. The present invention is further directed to fiber-containing fabrics and webs comprising ion triggerable, water-dispersible binder compositions and their applicability in water-dispersible personal care products, such as wet wipes.

Abstract: There is provided an electromagnetic wave shielding member which has see-through properties and electromagnetic wave shielding properties, is free from a change in color of an adhesive at the time of the formation of a mesh by etching, is improved in etchability, and can withstand etching at the time of the formation of the mesh. The electromagnetic wave shielding member according to the present invention comprises: a transparent film substrate; and a mesh consisting of a metal foil provided on the surface of the substrate through an adhesive, the adhesive comprising a styrene-maleic acid copolymer-modified polyesterpolyurethane and an aliphatic polyisocyanate.

Abstract: A pressure sensitive adhesive composition is provided that includes a pressure sensitive adhesive polymer. The polymer includes: at least one copolymerized monoethylenically unsaturated (meth)acrylic acid ester monomer, wherein the (meth)acrylic acid ester monomer, when homopolymerized, has a Tg of less than about 25° C.; at least one copolymerized monoethylenically unsaturated reinforcing monomer, wherein the reinforcing monomer, when homopolymerized, has a Tg of at least about 25° C.; covalently bonded quarternary ammonium functionality; and, optionally, at least one copolymerized monoethylenically unsaturated poly(alkylene oxide) monomer. The composition optionally further includes at least one nonreactive poly(alkylene oxide) polymer and/or at least one antimicrobial agent.

Abstract: A structure made of a fluoropolymer layer and directly attached to one of its sides a tie layer based on a polyamide which results from the condensation of at least one diacid and at least one diamine of the following formula (1): in which R1 represents H or -Z1-NH2 and Z1 represents an alkyl, a cycloalkyl or an aryl having up to 15 carbon atoms and R2 represents H or -Z2-NH2 and Z2 represents an alkyl, a cycloalkyl or an aryl having up to 15 carbon atoms, it being possible for R1 and R2 to be identical or different. The tie resin may also be a copolymer having polyamide blocks and polyether blocks, the polyamide blocks resulting from condensation of at least one diacid and at least one diamine of formula (1). The invention also relates to a structure comprising a fluoropolymer layer, the tie layer and a substrate layer, respectively, as well as to a structure comprising a tie layer, respectively.

Abstract: The substrates of the present invention comprise a polyimide base polymer derived at least in part from collinear monomers together with crankshaft monomers. The resulting polyimide material has been found to provide advantageous properties, particularly for electronics type applications.

Abstract: An iodine/iodide-containing hot melt coatable adhesive is provided. This adhesive is prepared by mixing iodine and an iodide salt, individually or in combination, with solubilizing liquids. The iodine and iodide salt are combined with a pre-adhesive composition in a hot melt mixer, with an iodine/iodide complexing agent being present in the mixture. The mixture is mixed at a temperature from about 130° C. to about 200° C. and sufficiently to form an iodine/iodide-containing hot melt coatable adhesive. Alternatively, the iodide may be generated in situ. The adhesive so prepared may be packaged for coating on a substrate at a later time, or may be immediately coated to form an adhesive composite. Adhesive composites, particularly surgical incise drapes, are provided incorporating this hot melt coatable adhesive.

Abstract: The present invention provides an aqueous adhesive composition including a resinous phase dispersed in an aqueous medium, the resinous phase containing (a) a polychloroprene, (b) optionally, a halogenated polyolefin different from (a), and (c) optionally, an aminoplast resin. Further provided is an aqueous adhesive composition of a resinous phase dispersed in an aqueous medium wherein the resinous phase includes (a) a polychloroprene, (b) a halogenated polyolefin different from (a), and (c) a polyurethane polymer having ionic salt groups. A multi-layer composite and methods for adhering a thermoplastic material to a rigid substrate using the aqueous adhesive compositions also are provided.

Abstract: A polymer dispersion comprising an aqueous, continuous phase and dispersed particles of polyurethane, which is based on organic, non-aromatic isocyanates with a functionality of at least 2, said polyurethane having a high degree of crystallinity and whose crystalline phase has a melting point between 25 and 70° C., and a copolymer and/or terpolymer having a Tg (glass transition temperature) between ?20 and +50° C. obtainable by emulsion polymerization of ethylenically unsaturated monomeric materials containing only C, H, O and/or N atoms, which monomeric materials comprise from 0.

Abstract: An adhesive composition that includes a) an emulsion that includes a multi-stage polymer that includes a first stage polymer having a Tg from ?20° C. to 90° C. and including from about 0.5% by weight to about 3% by weight latent crosslinking monomer based on the first stage monomer weight, and a second stage polymer having a Tg from 40° C. to 140° C., the second stage polymer being different from the first stage polymer, b) formaldehyde-based crosslinking agent, and c) catalyst, the composition being capable of passing the DIN EN 204 Test Method.

Abstract: A pressure sensitive adhesive comprising a mixture of: a radiation-crosslinkable polymer A) composed of at least 40% by weight of C1 to C18 alkyl (meth)acrylates, and a polymer B) composed of at least 20% by weight of vinylpyrrolidone and of less than 40% by weight of C1 to C18 alkyl (meth)acrylates, wherein the fraction of the polymer B) in the mixture is less than 15% by weight, based on the sum of A)+B).

Abstract: Adhesive-coated, peelable protective films and peelable labels, wherein the adhesive contains a copolymer that is capable of undergoing free-radical polymerization and which comprises, to an extent of from 0.1 to 10 wt %, based on the copolymer, a compound A compound of at least one copolymerizable, ethylenically unsaturated group and a group of the formula in which R1 and R2 independently stand for hydrogen or a C1-C5 alkyl group or R1 and R2 together form a bridging C2-C4 alkylene group which can be mono- or di-substituted by a C1-C4 alkoxy group or hydroxyl group and X stands for O or S.

Abstract: The invention relates to an adhesive based on highly saturated, carboxylated nitrile-butadiene rubber (HXNBR), to its use, to processes for its preparation, to its use for the bonding of substrates and to products manufactured therewith.

Abstract: A method for increasing the adhesion of a first layer comprising a fluoropolymer substantially free of interpolymerized units derived from vinylidene fluoride to a second layer comprising a curable elastomer is described. The method comprises adding a dehydrofluorinating composition to the curable elastomer, contacting the layers and curing the layered article so formed. The resulting multilayer compositions and articles are also disclosed.

Abstract: A filter assembly and method includes a filter media attached to a perimeter frame using a polyimide material.

Abstract: This invention relates to a jointing compound of an acrylate/acrylonitrile copolymer containing 2 to 8 carbon atoms in the alcohol component as binder and fatty compounds as plasticizer and also fillers and auxiliaries. Epoxystearic acid methyl ester in particular may be used as the fatty compound while a butyl acrylate/acrylonitrile copolymer in particular may be used as the acrylate/acrylonitrile copolymer. The combination of the two substances results in jointing compounds characterized by a dramatic improvement in elasticity (resilience). Accordingly, they are particularly suitable for substrates with different coefficients of thermal expansion.

Abstract: The present invention provides an one-part moisture-curable urethane composition which exhibits excellent adhesion particularly to a coated steel plate difficult to bond with no-primer and is useful in the bonding of automobile window glass. The urethane composition of the present invention comprises an isocyanate-terminated urethane prepolymer as the main component, to which (A) a compound having solubility parameter value of 6.0 to 9.

Abstract: There is disclosed an air bag system and a method of forming the same. The system preferably includes a first panel portion and a second panel portion that are adhered to each other to form a laminate member. An air bag of the air bag system is preferably configured for opening the laminate member upon inflation of the air bag.

Abstract: The following invention relates to phenyl-linked polybenzoxazoles having terminal, aryl- or heteroaryl-attached cyanate groups which can be used for adhesive bonding and as dielectrics, especially for electronic components, and to a process for preparing them.

Abstract: The present invention describes the use of poly-o-hydroxy amides (PHAs) for adhesively bonding articles or materials, especially components used in the semiconductor industry, such as chips and wafers, a process for adhesively bonding materials, especially chips and/or wafers, chip and/or wafer stacks produced by the process, and adhesive compositions which comprise the poly-o-hydroxy amides of the formula (I).

Abstract: A moistureproof multilayer film, including a composite film having a non-moisture absorbing resin layer and a vapor deposited film of an inorganic oxide or a metal formed on at least one side of the non-moisture absorbing resin layer, the multilayer film having such a layer structure where the vapor deposited film surface of the composite film is laminated through an adhesive layer on a vapor deposited film surface of another composite film or a surface of another non-moisture absorbing resin layer, wherein a total number (n) of the deposited films laminated adjacent to the adhesive layer is 2 to 8, and wherein a moisture permeabihty (W; unit: g/m2.day) as measured under conditions of a temperature of 40° C. and a relative humidity of 100% satisfies a relation represented by equation W≦(1/n)×0.20, and a method for producing the moistureproof multilayer film including heat-treating the multilayer film in a hot dry atmosphere having a temperature lower than 140° C. but not lower than 55° C.

Abstract: A multi-layer structure includes a fluoropolymer bonded to a substrate. The structure is prepared by exposing a bonding composition to actinic radiation, such as ultraviolet radiation, to form the bond. The bonding composition includes a light-absorbing compound and an electron donor. The bonding composition includes non-adhesive materials.

Abstract: An adhesive film for semiconductor, which comprises at least one resin layer, and, after bonded to a lead frame, has at 25° C. a 90°-peel strength of at least 5 N/m between the resin layer and the lead frame, and, after a lead frame is bonded to the adhesive film for semiconductor and sealed with a sealing material, has at least at one point of temperatures ranging from 0 to 250° C. a 90°-peel strength of at most 1000 N/m between the resin layer and each of the lead frame and the sealing material; a lead frame and a semiconductor device using the adhesive film for semiconductor; and a method of producing a semiconductor device.

Abstract: A process is described for the preparation of end-products made of acrylic fiber, for external use, by the joining of one or more sheets with a copolyamide adhesive, resistant to solar light, the above junction been effected by the melting of said adhesive on the acrylic matrix and subsequent pressing of the glued area with a system capable of exerting an adequate pressure.

Abstract: Hot melt adhesives are prepared using thermoplastic polyamides derived from polymerized fatty acid components. The adhesives are particularly useful for bonding nonpolar substrates such as poly-&agr;-olefins.

Abstract: Priming compositions and methods, wherein the compositions include a polydiorganosiloxane polyurea copolymer comprising electron rich groups.

Abstract: The present invention describes the use of poly-o-hydroxy amides (PHAs) for adhesively bonding articles or materials, especially components used in the semiconductor industry, such as chips and wafers, a process for adhesively bonding materials, especially chips and/or wafers, chip and/or wafer stacks produced by the process, and adhesive compositions which comprise the poly-o-hydroxy amides of the formula (I).

Abstract: Disclosed is a composite film, a method of producing a lead frame with the composite film attached, and a method of bonding a semiconductor chip to this lead frame having the composite film attached. The composite film includes a base film and an adhesive layer on one or both sides of the base film. The composite film has a thickness of T (&mgr;m), the base film has an edge tearing strength of R (kg/20 mm), the adhesive layer has a total thickness of A, and the base film has a thickness of B, T being related to R by a numerical formula R>0.6T-8 when T≦60, or by a numerical formula R≧28 when T>60, and A/B being 0.5 to 1.4.

Abstract: A halogen-free dielectric resin mixture is described for use in microvia and other similar applications. The resin mixture contains a cyanate ester monomer or prepolymer a bismaleimide, an epoxy and a flame inhibiting compound selected from the group consisting of a phosphinic acid anhydride, a phosphonic acid andydride and a phosphonic acid half-ester. The flame inhibitor is present in an amount wherein the elemental phosphorus content is between about 2% and about 20% by weight, based on the weight of the resin mixture. The resin mixture can also include one or more coloring, fluorescent and UV absorbing agents. Prepregs based on the resin mixture with inorganic or organic reinforcing agents, as well as circuit boards and chip carriers made from the prepregs are also described. A resin coated article for use in microvia laser applications is likewise included.

Abstract: A multi-layer structure includes a fluoropolymer bonded to a substrate. The structure is prepared by exposing a bonding composition to actinic radiation, such as ultraviolet radiation, to form the bond. The bonding composition includes a light-absorbing compound and an electron donor. The bonding composition includes non-adhesive materials.

Abstract: A process for producing a semiconductor wafer having an adhesive film, by adhering an adhesive film onto a bump-formed surface of a semiconductor wafer having formed thereon bumps with a predetermined arrangement, which comprises: determining a particular arrangement axis direction in which intervals between adjacent linear arrangement axes connecting the bumps becomes the shortest; and adhering the adhesive film in the direction substantially at a right angle with the determined arrangement axis direction, so as to markedly reduce voids included in the adhesion surface upon adhering an adhesive film such as underfill onto a semiconductor wafer.

Abstract: A polyacetal composite according to the invention includes a polymer unit (A) composed of a polyacetal resin, and a polymer unit (B) composed of a thermoplastic resin or elastomer having an acidic group, and the polymer unit (A) and the polymer unit (B) directly adhere to each other. The acidic group includes, for example, a carboxyl group and a carboxylic anhydride group. The thermoplastic resin or elastomer having an acidic group includes a comonomer having at least one selected from among acrylic acid, methacrylic acid, fumaric acid, maleic acid, maleic anhydride, and itaconic acid as a comonomer, and typical examples thereof include, for example, acid-modified polystyrene and acid-modified NBR (acid-modified nitrile rubber). In this polyacetal composite, the polyacetal resin and another polymeric material are firmly fixed with each other.

Abstract: A fabrication and adhesion method for a polyaryl-ether-ketone (PAEK) device, such as a microfluidic device, is disclosed. At least one glassy uncrystallized PAEK substrate is heated up to near or above the glass transition temperature to allow the substrate to crystallize from the glass state, while embossing the substrate with patterns. Bonding the PAEK substrate to another substrate is accomplished using a solvent-resistant adhesive, such as a polyimide-based adhesive, in combination with an adhesion enhancement treatment. In certain embodiments, the adhesion enhancement treatment is a plasma treatment or a chemical sulfonation treatment.