Abstract: A bonded part such as a rubber to metal bonded part and process for producing a bonded part including a rubber and metal part, and particularly for producing an automotive torsional vibration damper, comprising the steps of placing uncured elastomer composition comprising an elastomer, at least one curative, and preferably, at least one rubber-to-metal adhesive adjuvant into a shape-forming mold, and curing the elastomer in two stages, wherein in the first curing stage the elastomer composition is less than fully cured and in the second curing stage, preferably performed with the elastomer composition in contact with a metal surface of the rubber and metal part, the elastomer composition is at least substantially fully cured. According to one embodiment, the present invention allows for the elimination of the step of applying an adhesive to the metal surface prior to application of the elastomer composition.

Abstract: An electrostatic chuck having a bonded structure comprising a ceramic electrostatic chuck member, a metal member and a bonding layer; the bonding layer having at least a first most outer bonding layer being joined to the ceramic electrostatic chuck member, a second most outer bonding layer being joined to the metal member, and a polyimide layer as an intermediate layer disposed between the first and second most outer bonding layers, and each of the most outer bonding layers being made of a silicone layer or an acrylic layer, and a method for manufacturing the same are provided: the bonding layer being excellent in airtightness, bonding strength, and corrosion resistance, free from bleeding of a bonding material even under high pressures at time of joining, and the junction body being good in heat conductivity, and having a good flatness of its adsorption surface, with a small deformation due to temperature change.

Abstract: A solventless node adhesive for use in bonding honeycomb layers together. The node adhesive includes thermoset resin and thermoplastic particles dispersed in the adhesive. The node adhesive is applied to the honeycomb node lines while the thermoplastic particles remain dispersed in the adhesive. The amount of thermoplastic particles in the node adhesive is selected to keep the viscosity of the adhesive between 30 and 150 poise at room temperature. The node adhesive may be applied to the honeycomb nodes using conventional application procedures. The thermoplastic particles are dissolved during heat curing of the thermoset resin to form a thermoplastic toughened node adhesive.

Abstract: A wet-skin adhesive includes a pressure-sensitive adhesive component that includes at least one monoethylenically unsaturated (meth)acrylic acid ester comprising an alkyl group having at least 4 carbons on average and at least one monoethylenically unsaturated reinforcing monomer; and a film-forming component that includes at least one monoethylenically unsaturated (meth)acrylic acid ester comprising an alkyl group having less than 4 carbons on average and at least one hydrophilic acidic monomer, wherein the wet-stick pressure-sensitive adhesive has an initial wet skin adhesion of at least about 0.8 N/dm. Advantageously, the wet-stick adhesive has an initial wet skin adhesion that is at least about 65% of an initial dry skin adhesion.

Abstract: A method of laminating two substrates by coating at least one side of a substrate with a laminating adhesive, bringing a coated side of the substrate into contact with a second substrate to form a three layer film, and treating the three layer film with a free radical initiator. The laminating adhesive is formed by mixing an ethylenically unsaturated acid, a bis-silane and a polyamine, and the polyamine optionally can have a crosslinker reacted therein.

Abstract: According to the present invention, there are provided a polarizing molded article, which comprises a polarizing plate-containing laminated structure in which a polarizer sheet layer is held between two protective sheet layers, wherein one layer of the protective sheet layer and a polyurethane sheet layer or a polyamide sheet layer are connected with an adhesive or a pressure-sensitive adhesive, and the polyurethane sheet layer or the polyamide sheet layer and a thermally molding resin layer are thermally adhered, and a process for preparing a polarizing molded article, which comprises preparing a polarizing plate having a structure in which a polarizer sheet layer is held between two protective sheet layers, preparing a polarizing composite in which a polyurethane sheet layer or a polyamide sheet layer is connected to one layer of the protecting sheet layer of the polarizing plate with an adhesive or a pressure-sensitive adhesive, heat press molding the polarizing composite into a spherical shaped body, and

Abstract: A heat-resistant adhesive is provided for use in an adhesive member for the fabrication of a semiconductor package by bonding a semiconductor chip to a lead frame with the adhesive member and sealing at least the semiconductor chip and a bonded part between the semiconductor chip and the lead frame with a sealant. The adhesive has a coming-out length of not more than 2 mm and a water absorption rate of not more than 3 wt. %. Preferably, the adhesive has a glass transition point of at least 200° C.

Abstract: A 2-cyanoacrylate composition comprising a cyclic phenol sulfide derivative. The composition has a high curing rate and is excellent in moist-heat resistance, surface curability and clearance curability.

Abstract: Solvent-free and water-free radiation-curable primers based on hydroxy-functional prepolymers and cycloaliphatic epoxides or based on hydroxy-functional prepolymers and olefinically unsaturated compounds or based on epoxides and vinyl ethers together with cationic or free-radical initiators may be applied in the same manner as conventional commercial solvent-free laminating adhesives and, for many coatings, allow subsequent in-line coating without there being any need to evaporate solvent or water from the primer coating.

Abstract: A flexible metal foil laminate sheet wherein a polyimide layer comprises a polyimide laminate having a three-layer structure in which thermoplastic polyimide layers are formed on both the surfaces of a polyimide film; metal foil layers are heated and pressed against both the sides of the polyimide laminate; and the thickness of the thermoplastic polyimide layer is 100% or more of an average roughness at 10 points on the surface of the metal foil which contacts the thermoplastic polyimide layer; and a method for manufacturing the flexible metal foil laminate sheet. According to the present invention, there can be manufactured the flexible metal foil laminate sheet in which a necessary and sufficient adhesive force is present in an interface between a metal foil and an insulating layer and which is excellent in heat resistance, chemical resistance, electrical properties and the like.

Abstract: Modified soy protein adhesives are provided which have increased bonding abilities. The adhesives are prepared by forming a dispersion of soy protein, water, and a modifier selected from two classes of modifiers. The preferred modifiers are urea, sodium dodecylbenzene sulfonate, sodium dodecyl sulfate, and guanidine hydrochloride. The resulting dispersion is stirred, freeze-dried, and milled into a powder to be stored until use. The adhesives of the invention have superior bonding qualities while being safe for the environment. The urea-modified, GH-modified, SDS-modified, and SDBS-modified soy protein adhesives have higher water resistance than non-modified soy protein adhesives.

Abstract: Method and system for applying an adhesive agent to a covering material in the process of bonding the covering material to a foam cushion member to produce a bonded unit forming a seat. As a base material of the adhesive agent, only a primary component material and secondary curing agent are used, without any organic solvent added in the primary component material. Heat of a predetermined temperature is continuously applied to the primary component material by heating elements so as to retain its lowered viscosity through a whole fluid passage from a storage point to a spray gun, so that the heated primary component material in a fluid state may be injected from the spray gun, while being mixed with the curing agent in the air at the same time, thereby applying a properly atomized state of the mixture, as an adhesive agent, to the covering material.

Abstract: Disclosed is a composite film, a method of producing a lead frame with the composite film attached, and a method of bonding a semiconductor chip to this lead frame having the composite film attached. The composite film includes a base film and an adhesive layer on one or both sides of the base film. The composite film has a thickness of T (&mgr;m), the base film has an edge tearing strength of R (kg/20 mm), the adhesive layer has a total thickness of A, and the base film has a thickness of B, T being related to R by a numerical formula R>0.6T−8 when T≦60, or by a numerical formula R≧28 when T>60, and A/B being 0.5 to 1.4.

Abstract: The invention concerns a laminate comprising: a) a plastics foil; b) an adhesion-promoting layer based on polyurethane containing one or a plurality of polyester diols with a molecular weight of between 600 and 1200, preferably between 800 and 1000; c) optionally a further plastics foil; d) optionally a further polyurethane-based adhesion-promoting layer, e) optionally a varnish layer, f) optionally a filler layer; and g) a carrier material layer, preferably of plastics, wood or metal.

Abstract: This invention relates to laminates for use in HDD suspensions which are composed of a stainless steel base material and successive layers formed thereon of polyimides and an electrical conductor and in which the linear expansion coefficient of the polyimide layer is controlled in the range of 1×10−5/° C. to 3×10−5/° C. and the adhesive strength between stainless steel and polyimide and that between polyimide and electrical conductor are controlled at 0.5 kg/cm or more. This invention also relates to a process for preparing laminates for use in HDD suspensions comprising applying a solution of polyimide precursors or polyimides to a stainless steel base material with a thickness of 10 to 70 &mgr;m in one layer or more, drying, performing heat treatment at 250° C. or more to form a layer of polyimides with a thickness of 3 to 20 &mgr;m and a linear expansion coefficient of 1×10−5/° C. to 3×10−5/° C.

Abstract: An adhesive composition includes compounds having the following formula: wherein R1 is alkyl, alkoxy alkyl, anhydride, ether, ester, or amide, and R2 and R3 are hydrogen, alkyl, alkoxy alkyl, hydroxy, alkenyl, ester, carboxylic acid or ether and wherein R1 is optionally omitted where R2 and R3 are not both hydrogen.