Abstract: The present invention provides a method for manufacturing an electronic part that can cope with downsizing, improvement in performance and quality of a multilayer electronic part.

Abstract: In a method and apparatus for manufacturing ceramic green sheets, first and second long ceramic green sheets are selectively drawn out by means of first and second draw-out rollers into a commonly used punching station. In the punching station, predetermined areas of the long ceramic green sheets are punched, so that ceramic green sheet cut pieces having predetermined sizes are formed. A cut piece held by a punching head is conveyed to a lamination station adjacent to the punching station, where lamination and press-bonding are carried out.

Abstract: A method of providing a resistance to oxidation of Nickel at high temperatures by combining Ni powder with five percent Pt resinate, and heating the same to a temperature of 500° C. to 1300° C. Electro-conductive components serving as electrodes and the like comprise a Ni/Pt powder subjected to temperatures of between 500° C. and the respective melting points of Ni and Pt.

Abstract: Disclosed is a method of forming an LTCC structure that involves providing at least a first ceramic tape sheet, laminating at least a second ceramic tape sheet to the at least a first ceramic tape sheet to form a substructure, laminating at least a third ceramic tape sheet to the substructure to form an intermediate structure, and laminating at least a fourth ceramic tape sheet to the intermediate structure to form an LTCC structure.

Abstract: The present invention relates to a semiconductor electret condenser microphone capable of being reduced in size and including an acoustic sensor 100 and a case 200 for accommodating the acoustic sensor 100, the acoustic sensor 100 has a semiconductor chip 110 forming necessary electronic circuits 111A to 111C, and opening a through hole 112 away from the electronic circuits 111A to 111C, an electrode layer 120 formed on the surface of the semiconductor chip 110 away from the through hole 112, an electret member 130 laminated away from part of the electrode layer 120 and through hole 112, and a diaphragm 140 provided with a spacing 160 to the electret member 130, in which the electrode layer 120 exposed from the electret member 130 is connected to the electrode 111a of the electronic circuit 111A through the case 200 (FIG. 6).

Abstract: Magnetoelectric multilayer composites comprising alternate layers of a bimetal ferrite wherein one of the metals is zinc and a piezoelectric material for facilitating conversion of an electric field into a magnetic field or vice versa. The preferred composites include cobalt, nickel, or lithium zinc ferrite and PZT films which are arranged in a bilayer or in alternating layers, laminated, and sintered at high temperature. The composites are useful in sensors for detection of magnetic fields (10); sensors for measuring rotation speed, linear speed, or acceleration; read-heads in storage devices by converting bits in magnetic storage devices to electrical signals; magnetoelectric media for storing information; and high frequency devices for electric field control of magnetic devices or magnetic field control of electric devices.

Abstract: A method of manufacturing an Electro Static Discharge (ESD) protection componentin which slurry including varistor particles and a resin binder is produced, and a varistor green sheet is formed from this slurry. A conductor layer is formed on a surface of the varistor green sheet. A adhesive layer is formed on a baked ceramic substrate, the varistor green sheet is adhered to the adhesive layer and then baked. The method produces a high-performance and uniform ESD protection component.

Abstract: Described herein is a process for fabricating microfluidic systems with embedded components in which micron-scale features are molded into the polymeric material polydimethylsiloxane (PDMS). Micromachining is used to create a mold master and the liquid precursors for PDMS are poured over the mold and allowed to cure. The PDMS is then removed form the mold and bonded to another material such as PDMS, glass, or silicon after a simple surface preparation step to form sealed microchannels.

Abstract: By increasing the quantity of resin binder of at least one of conductive paste and ceramic green sheet, adhesion between conductive film and the ceramic green sheet is improved when an intaglio filled with the conductive paste is hot pressed on the ceramic green sheet. As a result, transfer failure at intaglio transfer is removed and internal fracture of the ceramic green sheet is suppressed. Also, by coating an adhesive layer on an intaglio filled with conductive paste, adhesion with ceramic green sheet is improved and transfer failure at intaglio transfer is suppressed.

Abstract: This invention relates to a process which produces flat, distortion-free, zero-shrink, low-temperature co-fired ceramic (LTCC) bodies, composites, modules or packages from precursor green (unfired) laminates of three or more different dielectric tape chemistries that are configured in an uniquely or pseudo-symmetrical arrangement in the z-axis of the laminate.

Abstract: A process for producing a ceramic substrate includes preparing a base body using a stack of layers that contain an unsintered ceramic material and a sintering agent, and sintering the stack of layers. At least one of the layers contains an increased proportion of sintering agent relative to an adjacent layer.

Abstract: Multilayer ceramic chip capacitors which satisfy COG requirements and which are compatible with reducing atmosphere sintering conditions so that non-noble metals such as copper and copper alloys thereof may be used for internal and external electrodes are made in accordance with the invention. The capacitors exhibit desirable dielectric properties (high capacitance, low dissipation factor, high insulation resistance), excellent performance on highly accelerated life testing, and very good resistance to dielectric breakdown. The dielectric layers comprise a composite oxide formed by calcining rare earth titanates, barium titanate, together with other metal oxides such as MgO, CaO, ZnO, MnO2, ZrO2, SiO2, Ga2O3, Nd2O3, Nb2O5, and Y2O3.

Abstract: A method for producing a multilayer ceramic substrate having a cavity formed therein includes punching a through opening corresponding to the cavity in green sheets constituting a laminate, and printing a conductor at a predetermined position of the green sheets, laminating the green sheets to constitute a green sheet laminate, and applying a pressure to the green sheet laminate by using a compression member having a projection at a position corresponding to the cavity to thereby compress the green sheet laminate. The projection has a height which is equal to the depth of the cavity multiplied by compression ratio of the green sheet laminate, and the green sheet laminate is compressed by applying the pressure such that compression ratio of the bottom of the cavity is identical with the compression ratio of other parts of the green sheet laminate.

Abstract: Unfired first ceramic layers 11 and at least one unfired second ceramic layer 12 having a different color from the unfired first ceramic layers 11 are laminated to prepare an unfired ceramic laminate 13. Notches 14 are then formed on a surface of the unfired ceramic laminate 13 using the second ceramic layer 12 as a reference. The unfired ceramic laminate 13 is fired to provide a fired ceramic laminate 13a, which is then divided along the notches 14 into ceramic composites 13b. In this process, notches having the proper depth can be formed on the unfired ceramic laminate 13.

Abstract: Methods for preparing a multi-layer acoustic transducer with reduced total electrical impedance. The methods are based on the stacking of individual piezoelectric layers with metallized surfaces to form a plate in which the metal layers are electrically connected to form interdigitated electrodes. The total electrical impedance of a multi-layer stack comprised of piezoelectric layers connected in this manner is inversely related to the square of the number of layers in the stack. This provides for better matching of the acoustic stack impedance to that of the electrical cable and improved acoustic element sensitivity.

Abstract: The present invention relates to a method to achieve the suppression of planar shrinkage in LTCC ceramic tape laminate structures without externally applied forces or sacrificial constraining tape. The method utilizes a non-sacrificial constraining tape that constrains a tape assembly.

Abstract: A method of production of a ceramic electronic device such as a multilayer ceramic capacitor, comprising forming a first ceramic coating layer on the surface of a substrate, forming an internal electrode on the surface of the first ceramic coating layer, then forming a second ceramic coating layer on the surface of the first ceramic coating layer so as to cover the internal electrode. In this case, when a mean particle size of ceramic particles of the first ceramic coating layer is ?1, a thickness of the first ceramic coating layer is T1, a mean particle size of ceramic particles of the second ceramic coating layer is ?2, and a thickness of the second ceramic coating layer is T2, the conditions of ?1??2, 0.05<?1?0.35 ?m, T1<T2, and 0<T1<1.5 ?m are satisfied. As a result, it is possible to provide a ceramic electronic device, in particular a multilayer ceramic capacitor, resistant to short-circuit defects, withstand voltage defects, and other structural defects.

Abstract: An LTCC module includes a base on one or more surfaces for receiving one or more external components to be attached to the module. A base is formed of a plurality of layers of metallization in a predetermined pattern. The layers include an adhesion layer on the LTCC module surface, with one or more intermediate layers, followed by a top layer. The module is fired with each application of the layers at a reduced temperature lower than the normal cofiring temperature of the LTCC module, but of sufficient value to partially sinter the layers. After the last applied top layer, the module is fired once at an elevated temperature to fully sinter the layers.

Abstract: On a surface of a glass cloth adhered a mica layer sheet, a mixture of inorganic particles having a thermal conductivity of at least 5 W/mK, a resin, and a solvent is applied to form a layer of the mixture of the inorganic particles, the resin, and the solvent; the layer of the mixture is reduced in thickness using a doctor blade, followed by pressurizing to form a high thermally conducting layer; the mica layer sheet on which the high thermally conducting layer is disposed is cut to obtain a mica insulating tape; and the mica insulation tape is wound around a coil conductor. As a result, an insulated coil that is excellent in the voltage endurance characteristics and has a high thermal conductivity is manufactured.

Abstract: A method for producing a ceramic substrate which employs a cofiring process using restraint sheets in which a second ceramic green sheet 7 is laminated on a green ceramic substrate 30 so as to cover surface conductors 32 of the green ceramic substrate 30, the second ceramic green sheet 7 subsequently being integrated with the green ceramic substrate 30. Restraint sheets 9, which are not sintered at a sintering temperature at which the green ceramic substrate 30 is sintered, are laminated on corresponding opposite sides of the green ceramic substrate 30 so as to restrain the green ceramic substrate 30 together with the second ceramic green sheet 7. The second ceramic green sheet 7 and the green ceramic substrate 30 are fired at a temperature at which the second ceramic green sheet 7 and the green ceramic substrate 30 are integrally sintered, whereas the restraint sheets 9 are not sintered, to thereby yield a ceramic substrate 40.

Abstract: A method of producing ceramic laminates includes forming a ceramic green sheet by applying a ceramic slurry on a carrier film; forming, maintaining a predetermined gap, a plurality of electrically conducting patterns having inclined surfaces at the ends by printing an electrically conducting paste on the main surface of the ceramic green sheet; forming ceramic patterns having inclined surfaces at the ends among the electrically conducting patterns by printing a ceramic paste with a distance of not smaller than 10?m from the electrically conducting patterns; and laminating ceramic green sheets on which are formed the electrically conducting and ceramic patterns.

Abstract: A method for manufacturing a multilayer ceramic substrate including the steps of providing multilayers of ceramic green sheets each having an electrode layer formed on a dielectric layer such that, after firing, at least one electrode layer which is separated by the dielectric layer from the adjacent electrode layer in the substrate has an overlapping area of 0.4 mm2 or smaller with the adjacent electrode; and firing the multilayers of the ceramic green sheets at a selected temperature such that, after firing, an interface between the dielectric layer and the electrode layer in the substrate has irregularities with a roughness Rmax of 6 ?m or less per 100 ?m standard length and the dielectric layer has a saturation sintered density.

Abstract: The present invention relates to a semiconductor electret condenser microphone capable of being reduced in size and including an acoustic sensor 100 and a case 200 for accommodating the acoustic sensor 100, the acoustic sensor 100 has a semiconductor chip 110 forming necessary electronic circuits 111A to 111C, and opening a through hole 112 away from the electronic circuits 111A to 111C, an electrode layer 120 formed on the surface of the semiconductor chip 110 away from the through hole 112, an electret member 130 laminated away from part of the electrode layer 120 and through hole 112, and a diaphragm 140 provided with a spacing 160 to the electret member 130, in which the electrode layer 120 exposed from the electret member 130 is connected to the electrode 111a of the electronic circuit 111A through the case 200 (FIG. 6).

Abstract: This invention relates to a process which produces flat, distortion-free, zero-shrink, low-temperature co-fired ceramic (LTCC) bodies, composites, modules or packages from precursor green (unfired) laminates of three or more different dielectric tape chemistries that are configured in an uniquely or pseudo-symmetrical arrangement in the z-axis of the laminate.

Abstract: A method of producing a ceramic stack is provided, including the steps of providing at least a first ceramic green sheet to be formed into a long ceramic plate and having a principal surface, providing at least a second ceramic green sheet to be formed into a short ceramic plate and having a length that is less than a length of the principal surface of the first ceramic green sheet, and laminating the second ceramic green sheet to the principal surface of the first ceramic green sheet to form a ceramic green sheet laminate having a lamination border defined between at least a side surface of the second ceramic green sheet and the principal surface of the first ceramic green sheet. The method also includes the steps of forming a member having a curved surface at the lamination border by applying a paste to the lamination border such that the curved surface includes at least one inflection point when viewed in cross-section, and sintering the laminate into an integral unit to form the ceramic stack.

Abstract: This invention provides a stacked ceramic body that prevents reaction between components of dielectric layers and components of electrode layers of an unsintered stacked body during sintering and in which both components do not easily form a liquid phase, and a production method of such a stacked ceramic body. A print portion 13 is formed on a green sheet 1, 12 containing lead by use of an electrode paste consisting of copper oxide as its main component. A desired number of print sheets 10 are stacked to give an unsintered stacked body 15. Degreasing is conducted in an atmosphere to degrease organic components. The print portion 13 is subjected to reducing treatment in a reducing atmosphere containing hydrogen and is converted to a print portion 13 containing copper as its main component. The unsintered stacked body 15 is sintered in a reducing atmosphere.

Abstract: A multilayer ceramic electronic component includes a laminate having ceramic layers and internal electrodes stacked alternately one on another, and at least one kind of metal oxide between respective one of the ceramic layers and corresponding one of the internal electrodes. A method of manufacturing a multilayer ceramic electronic component includes a first step of stacking ceramic sheets and metal layers alternately one on another to fabricate a laminate and a second step of firing the laminate. Respective one of the metal layers has, on the surface of a sheet-like first metal, a second metal more susceptible to oxidation than the first metal. The second step is performed at an oxygen partial pressure at which the first metal is hardly oxidized and the second metal is oxidized.

Abstract: A surface mounted device (SMD) package using coaxial cables and a method of manufacturing the SMD by forming green sheets and selecting portions for mounting the coaxial cables on the green sheets and forming holes in the portions selected, stacking and heating the green sheets having the holes, and inserting the coaxial cables into the holes of the green sheets. The SMD includes a device mounting unit formed in the package for mounting a high frequency electronic device which transmits and receives high frequency signals, transmission lines electrically connected to the high frequency electronic device, and the coaxial cables penetrating internal and external portions of the package and including internal lead wires which contact the transmission lines. The SMD package is formed to conveniently transfer high frequency signals without the signal transfer loss.

Abstract: A first step of alternately stacking a ceramic sheet and an internal electrode with an adhesive layer between the ceramic sheet and the internal electrode to obtain a laminated body, and a second step of sintering the laminated body are provided. The adhesive layer includes a thermoplastic resin and at least one of Cr, Mg, Al, Si, a Cr compound, an Mg compound, an Al compound, an Si compound and an inorganic powder included in the ceramic sheet. This manufacturing method improves adhesion between a ceramic layer and the internal electrode after sintering and suppresses a structural defect such as delamination or a crack.

Abstract: A method of fabricating a thin dielectric film, a thin dielectric film formed according to the method, and a system including the thin dielectric film. The method includes: depositing a ceramic precursor material on a metal sheet, the ceramic precursor material including a mixture comprising ceramic particles and an organic carrier medium; heat treating the ceramic precursor material such that the organic carrier medium is substantially burnt off, and further such that a dielectric layer is formed including ceramic grains formed from the ceramic particles, and having grain sizes between about 100 nm and about 500 nm; depositing a CSD precursor material onto the dielectric layer; and heat treating the CSD precursor material such that organics in the CSD precursor material are substantially burnt off, and further such that a CSD medium is formed from the CSD precursor material including CSD grains substantially filling the voids between the ceramic grains.

Abstract: Embedded, coupled, shaped waveguide resonators having conductive walls sandwiched between two fired green tape stacks, said conductive walls having apertures therein whose size and location determine the degree of coupling. These waveguides are made by forming openings in a first green tape stack, defining walls and apertures therein, mounting a second green tape stack having a conductive layer thereon thereover and firing the assembly. E-plane probes are inserted in openings in the second green tape stack and connected to microstrip transmission lines on an external surface pf this green tape stack.

Abstract: The invention provides a ceramic package, a ceramic package having such a sealing structure and a fabrication method of thereof. In the ceramic package, a wall layer made of a plurality of laminated ceramic sheets and having a cavity formed in a central portion thereof is stacked on a top of a base layer made of a plurality of laminated ceramic sheets. A metal layer is coated on the wall layer around the cavity to expose an outer peripheral portion of the wall layer. A glass layer is coated on the outer peripheral portion of the wall layer, which is not coated with the metal layer, to contact with the metal layer. A lid is attached on the metal layer to seal the cavity. The glass layer is coated around the metal layer, which is attached on the ceramic wall layer around the cavity, to reinforce the bonding force between the metal layer and the underlying ceramic wall layer thereby potentially preventing creation of cracks between the metal layer and the underlying ceramic wall layer.

Abstract: A method for making an embedded toroidal inductor (118) includes forming in a ceramic substrate (100) a first plurality of conductive vias (102) radially spaced a first distance from a central axis (101) so as to define an inner circumference. A second plurality of conductive vias (104) is formed radially spaced a second distance about the central axis so as to define an outer circumference. A first plurality of conductive traces (110) forming an electrical connection between substantially adjacent ones of the first and second plurality of conductive vias is formed on a first surface (106) of the ceramic substrate. Further, a second plurality of conductive traces (110) forming an electrical connection between circumferentially offset ones of the first and second plurality of conductive vias is formed on a second surface of the ceramic substrate opposed from the first surface to define a three dimensional toroidal coil.

Abstract: This invention relates to the fabrication of planar inductive components whereby the design in cross-section describes a conductor surrounded by magnetic material along the length of the conductor; an electrical insulator is placed between the conductor and the magnetic material. Cases also apply where more than one independent conductor is used. The planar form allows integration of inductive components with integrated circuits. These inductive components can be embedded in other materials. They can also be fabricated directly onto parts.

Abstract: A method of fabricating a ceramic tube with electrodes thereon suitable for use as a tubular reaction chamber for a fuel cell. In one embodiment, the method includes wrapping a first electrode material around a mandrel, then wrapping a green ceramic material over the first electrode material, and then wrapping a second electrode material over the green ceramic material. The wrapped layers are laminated together, and then removed from the mandrel and sintered, in either sequence, to produce the laminated ceramic tube having an inner first electrode and an outer second electrode. Alternatively, a first electrode tube is provided in place of the mandrel and around which the green ceramic material is wrapped. The outer second electrode may be produced by wrapping a second electrode material around the green ceramic material, before or after laminating, or by printing the electrode material onto the sintered ceramic tube.

Abstract: A ceramic substrate having a defined curvature and a method of its manufacture are described. For this purpose at least two ceramic layers having different defined temperature coefficients of expansion are positioned on top of one another and are permanently bonded together. A curved ceramic substrate may be advantageously utilized in micro-hybrid technology, in multilayer ceramic technology, or in hybrid technology, e.g., as a membrane element of a piezoresistive pressure sensor element.

Abstract: Methods for forming and the intermediate greensheet products formed are provided by attaching a removable support film to a first surface of a greensheet and a frame to a second surface of the greensheet. The support film is preferably a peelable support film cast to the first surface of the greensheet for providing strength thereto. A plurality of openings are formed in the greensheet by punching into the support film, through the support film and then through the greensheet. During this process, the support film provides added strength to the greensheet therein significantly reducing embossing and deformation of such greensheet. A second support film may be attached to the removable support film using an adhesive layer, which, is extruded into the openings upon attachment. The support film(s) may be peeled off the greensheet with little or no impact on via locations as a metal frame continues to support the greensheet.

Abstract: A monolithic self-constrained green body tape for use in low temperature ceramic co-firing is provided. The tape contains at least two layers: one low temperature ceramic layer containing particles of a glass, a ceramic, and an organic binder, and a self-constraining layer containing a refractory ceramic and a wetting agent for the glass in the first layer. When the tape is fired at a sintering temperature of the low temperature ceramic layer, densification occurs in the z (thickness) direction, but essentially no shrinkage (less than about 1%) occurs in the x-y planes. A method for forming a multilayer green body tape using simultaneous wet on wet ceramic slurry deposition is also provided. A dense, monolithic, low temperature, co-fired, self-constrained, multicomponent structure is also provided. The structure contains at least two multilayer ceramic substrates having electronic circuit components mounted thereon or therein.

Abstract: An insulating ceramic composition includes a mixture of a ceramic powder containing MgAl2O4 and a glass powder containing 30-60% by mole of silicon oxide on the basis of SiO2 and 20-55% by mole of magnesium oxide on the basis of MgO, and the ceramic powder further includes Mg2SiO4 and TiO2. The insulating ceramic composition can be fired at 1000° C. and co-sintered with Ag and Cu. An insulating ceramic obtained by sintering the insulating ceramic composition has a high Q-factor and is therefore suitable for ceramic multilayer substrates used at high frequencies.

Abstract: A method for manufacturing multilayer ceramic substrates in accordance with a multiple formation method using a non-shrinkage process allows the multilayer ceramic substrates to be smoothly formed by dividing a sintered multilayer mother substrate, and in addition, external terminal electrodes in a preferable state can be efficiently formed. When a green composite laminate comprising shrinkage suppression layers and a green multilayer mother substrate provided therebetween is formed, through-holes are provided on dividing lines so as to divide conductors, and in addition, cut-in grooves are provided along the dividing lines. After the shrinkage suppression layers are removed from the fired composite laminate, the multilayer ceramic substrates are obtained by dividing the multilayer mother substrate along the through-holes and the cut-in grooves.

Abstract: A method for manufacturing a piezoelectric film type actuator, which is provided with a piezoelectric film and an oscillating plate structural member bonded therefor, comprises the steps of forming a piezoelectric film on an intermediate transfer member; bonding the piezoelectric film on the intermediate member and the oscillating plate structural member; and peeling off the intermediate transfer member from the piezoelectric film. Through the steps thus arranged, it becomes possible to enhance the bonding strength and durability of the piezoelectric film and the oscillating plate structural member without using a bonding agent in the manufacture of a highly reliable piezoelectric film type actuator.

Abstract: An electrical component includes a stack of layers. The layers include dielectric layers and electrode layers. The dielectric layers have a resistance with a positive temperature coefficient. The electrode layers are electrically conductive and are interspersed among the dielectric layers. At least one of the electrode layers includes a constituent that is comprised of a base metal and that is at least partially coated with a protective layer. The protective layer includes a material that slows oxidation of the base metal.

Abstract: In manufacturing a monolithic ceramic electronic part, an oxide of a conductive metal component contained in internal electrodes is mixed with a ceramic green sheet used for forming a ceramic layer by burning. Therefore, even if the conductive metal component diffuses and dissolves from the internal electrodes, the occurrence of non-uniformity in the concentration of the oxide of the conductive metal component is suppressed over the entire region of a laminate, and thus the entire laminate can be sufficiently uniformly sintered.

Abstract: Disclosed herein are a multilayer ceramic capacitor, a dielectric composition capable of sintering at a lower temperature and having a small variation in dielectric constant, a multilayer ceramic capacitor using the same, and a method thereof. The dielectric composition includes BaTiO3, MgCO3, Y2O3, Cr2O3, Mn2V2O7, and xBaO-yZrO2-zSiO2 acting as a sintering agent (where 0.1?x?0.3, 0.1?y?0.3 and 0.4?z?0.8, x+y+z=1), wherein when representing the composition with the formula aBaTiO3-bMgCO3-cY2O3-dCr2O3-e(Mn2V2O7)-f(xBaO-yZrO2-zSiO2), the ratio of the components satisfies the conditions of a=100, 0.1?b?3.0, 0.3?c?2.0, 0.05?d?0.2, 0.01?e?1.5, 0.5?f?3.0 based on the molar ratio. When manufacturing a multilayer ceramic capacitor of a higher capacitance, which is formed to have the thin layer structure of 4 ?m or less, short circuits between internal electrodes and the deterioration in capacitance due to massing of the electrodes into ball at the ends may be remarkably reduced.

Abstract: A negative temperature coefficient thermistor includes a thermistor element containing a transition metal oxide as a main component; internal electrodes disposed in the thermistor element; and external electrodes, electrically connected to the internal electrodes. A method for manufacturing such a thermistor includes providing green ceramic sheets for forming the thermistor element; applying a conductive paste for forming the internal electrodes onto some of the green ceramic sheets to form internal electrode layers; stacking the green ceramic sheets and the green ceramic sheets with the paste to form a green compact; firing the green compact to obtain a fired compact; and forming the external electrodes.

Abstract: A circuit board having coupled multilayered ceramic capacitors mounted thereon considerably reduces the generation of sounds developed by piezoelectric effects in the capacitors. A method for mounting the capacitors on the circuit board includes the step of forming lands for mounting the capacitors thereon at substantially plane-symmetrical positions on the front surface and the back surface of the circuit board, two lands at their substantially plane-symmetrical positions being connected each other. The capacitors, which are substantially identical each other, are then mounted on the lands of the front and the back surfaces such that the capacitors are disposed at substantially plane-symmetrical positions and electrically coupled to the lands.

Abstract: A base layer, which is supposed to be burnt off by baking, is formed on an unbaked member such as ceramic green sheet or laminated ceramic green sheets. This base layer improves ink acceptability of the unbaked ceramic member particularly for low viscosity ink such as jet-ink, and prevents oozing, draining, uneven thickness. This structure thus allows the inkjet to form a precise pattern. The base layer is burnt off at the baking step in the manufacturing process of electronic components, thus it does not adversely affect the reliability of the electronic component.

Abstract: A ceramic green sheet having good surface roughness and few pinhole defects even when producing a thin ceramic green sheet is stably produced, to permit efficiently and securely manufacturing a multilayer ceramic electronic part in which deterioration of its life due to unevenness of interfaces between internal electrodes and ceramic layers and the occurrence of structural defects, such as delamination, bending of an electrode portion, etc, in a multilayer thin film to be suppressed. A dry sheet obtained by forming ceramic slurry to a sheet on a carrier film is smoothed by pressing using a plate press, a hydrostatic press or a calender roll under predetermined temperature and pressure conditions to improve the surface smoothness of the ceramic green sheet independently of the particle diameter of the ceramic and its dispersibility. An electrode paste is coated in a predetermine pattern on the thus-produced ceramic green sheet to form a sheet provided with an electrode.

Abstract: Methods to create raised pedestal parts in ceramic substrates sintered under a load. The invention uses a patterned, buried, non-sintering layer that provides the needed transfer of load during the sintering process to the raised or pedestal portion of the substrate while maintaining dimensional control of the metallized features on the surface of the pedestal base. The methods involve cutting channels in the ceramic substrate corresponding in position to the perimeter of the opening in the patterned non-sintering contact sheet. The channels may be cut either before or after the sintering of the ceramic substrates.

Abstract: A method to produce a distortion-free asymmetrical low-temperature co-fired ceramic structure comprising at least one layer of glass-containing internal constraining tape and at least one layer of glass-containing primary tape wherein the internal constraining tape and the primary tape are laminated to form an asymmetrical laminate and wherein a release layer is deposited on at least one surface of the laminate forming an assembly, wherein the surface is opposite the position of greatest asymmetry of the laminated layers and wherein the assembly is thermally processed producing a structure exhibiting an interactive suppression of x,y shrinkage.