Abstract: The conductive particles can be sintered without being influenced by softening and removing of the adhesive layer. As a result, a wiring pattern of high precision can be formed without causing deformation of conductive pattern.

Abstract: A method for producing a ceramic slurry used for fabricating a ceramic electronic component includes a mixing and pulverizing step for mixing and pulverizing a ceramic powder having an average particle size of about 0.01 to 1 &mgr;m, a solvent and a dispersant by a dispersion process using a pulverizing medium, such as balls or beads, to obtain a mixed and pulverized slurry; and a high pressure dispersion step for performing high pressure dispersion at a pressure of about 100 kg/cm2 or more after a filtered binder solution is added to the mixed and pulverized slurry to obtain a dispersed slurry (final dispersed slurry), the filtered binder solution being prepared by dissolving a binder in a solvent, followed by filtration. A method for forming a ceramic green sheet and a method for fabricating a monolithic ceramic electronic component using the ceramic slurry are also disclosed.

Abstract: A process for the manufacture of a multilayer ceramic substrate includes fabricating the multilayer ceramic substrate from a monolith fabricated from universal layers and a monolith fabricated from custom layers. The universal layer monolith and the custom layer monolith are then joined to form the complete structure of the MLC substrate.

Abstract: A ceramic member for bonding comprises: a ceramic base which is a sintered ceramic; and a metallic layer formed on the ceramic base by metallization, wherein the metallic layer comprises 70 to 85% by weight of at least one of tungsten and molybdenum and 0.5 to 8.5% by weight of nickel.

Abstract: A method of producing a laminated ceramic electronic component results in an increased thickness of an internal electrode, reduced delamination, and produces a laminated ceramic electronic component having outstanding reliability. The method of producing a laminated ceramic electronic component includes the step of forming a green sheet supported on a carrier film and having an internal electrode paste layer configured to pass through the green sheet from the upper surface to the lower surface thereof, and a ceramic paste layer, the two layers being provided with a space therebetween, and the step of repeating the step of press-bonding the laminate of the green sheet and the carrier film, and separating the carrier film to obtain a ceramic laminate, pressing the ceramic laminate in the thickness direction, and then firing the laminate to obtain a ceramic sintered body.

Abstract: A glass ceramic multilayer substrate having a better flatness and a low sintering shrinkage ratio is made by sintering an unsintered laminated body formed by laminating together first and second green sheets capable of exhibiting different shrinking behaviors during a sintering process, thereby producing the desired glass ceramic multilayer substrate. When the shrinkage starting temperatures (° C.) of the first and second green sheets are TSa and TSb, the sintering process ending temperatures (°C.) of the first and second green sheets are TFa and TFb, and when the temperature rising speed is X° C./min, the respective parameters satisfy (TFa+3X)<TSb or (TFb+3X)<TSa.

Abstract: A method of producing a multilayered ceramic substrate in which wiring conductors can be provided on both main surfaces and the density of the wiring conductors can be increased by a non-shrinkage process. In the producing method, a green composite laminated product in which metallic foils are arranged to cover both main surfaces of a green laminated structure comprising a plurality of ceramic green sheets on which conductive paste is coated for forming internal wiring conductors is burned. In this burning step, shrinkage of the ceramic green sheets is suppressed by the metallic foils in the direction of the main surfaces thereof. After burning, the metallic foils are patterned by etching based on photolithographic technology to form external conductor films.

Abstract: A method for preparing a non-thermal plasma reactor substrate includes disposing electrical vias on green stage first and second ceramic plates; filling the electrical vias with conductive material; and forming electrical contact via cover pads; disposing conductive material on the first ceramic plate to form an electrode plate having a main electrode portion and a terminal lead for electrically connecting the main electrode portion to the electrical vias; laminating the electrode plate and the second ceramic plate together, embedding the electrode therebetween; co-firing the plates to form a laminated co-fired embedded-conductor element; stacking a plurality of the laminated co-fired embedded-conductor elements to form a multi-cell stack, the filled electrical vias aligning in the stack to provide an electrical bus for connecting alternating elements in the stack; and disposing spacers with matching vias and via cover pads between adjacent pairs of elements to form exhaust gas passages.

Abstract: A cast-on-resist (COR) method of forming a ceramic layer (114) with a recessed pattern is provided according to a preferred exemplary embodiment of the present invention. The COR method is comprised of depositing a resist (102) on a substrate (104) and selectively exposing the resist (102) to a radiation source such that a first portion (106) of the resist (102) having a positive image of the pattern is soluble in a solvent and a second portion (108) of the resist (102) having a negative image of the pattern is insoluble in the solvent. The COR method is further comprised of immersing the resist (102) in the solvent to remove the first portion (106) to form a casting substrate (110) having the negative image of the pattern, applying ceramic slurry (112) on the casting substrate (110), curing the ceramic slurry (112) on the casting substrate (110) and removing the ceramic layer (114) from the casting substrate (110) after the curing.

Abstract: Cast-on-resist (COR) methods and apparatus are provided for forming green-sheets. The COR method is comprised of depositing a resist (102) on a substrate (104) and selectively exposing the resist (102) to a radiation source such that a first portion (106) of the resist (102) having a positive image of the pattern is soluble in a solvent and a second portion (108) of the resist (102) having a negative image of the pattern is insoluble in the solvent. The COR method is also comprised of immersing the resist (102) in the solvent to remove the first portion (106) to form a casting substrate (100) having the negative image of the pattern, applying ceramic slurry (212) on the casting substrate (100), curing the ceramic slurry (212) on the casting substrate (100), and removing the ceramic slurry (212) from the casting substrate (100) after the curing.

Abstract: The invention relates to a method of laminating ceramic greenware sheets with electrodes embedded therein (25) which is formed on a support by pressure-adhering a ceramic greenware sheet with an electrode embedded therein onto a second ceramic greenware sheet or other electrodes (23), then peeling off the support alone and transferring the ceramic greenware sheet with the embedded electrodes onto the second ceramic greenware sheet or the other electrodes. This manufacturing method enables it to laminate ceramic greenware sheets each the thickness of which is as thin as 20 micrometers or less, while maintaining their mechanical strength and embedded electrodes in the ceramic greenware sheets, thereby enabling it to prevent a occurrence of surface irregularities due to the thickness of the electrodes even when laminating to a high degree.

Abstract: A capacitive filtered feedthrough assembly is formed in a solid state manner to employ highly miniaturized conductive paths each filtered by a discoid capacitive filter embedded in a capacitive filter array. A non-conductive, co-fired metal-ceramic substrate is formed from multiple layers that supports one or a plurality of substrate conductive paths and it is brazed to a conductive ferrule, adapted to be welded to a case, using a conductive, corrosion resistant braze material. The metal-ceramic substrate is attached to an internally disposed capacitive filter array that encloses one or a plurality of capacitive filter capacitor active electrodes each coupled to a filter array conductive path and at least one capacitor ground electrode. Each capacitive filter array conductive path is joined with a metal-ceramic conductive path to form a feedthrough conductive path.

Abstract: The present invention provides a method for manufacturing an electronic component of laminated ceramics such as a laminated ceramic capacitor in which, when a ceramic paste is applied on a ceramic green sheet in order to substantially eliminate steps caused by the thickness of a film of inner circuit elements such as an inner electrode, the ceramic paste is prevented from generating a gap between the paste and the film of inner circuit elements, or the thickness of the ceramic paste is prevented from being increased, by allowing the paste to overflow the film of inner circuit elements, even when the application position has been a little shifted, wherein an inclined face is formed at the periphery of an inner electrode that serves as the film of inner circuit elements, the ceramic paste being applied so as to overlap the periphery of the inner electrode, and wherein the used ceramic paste contains about 40% by weight to 85% by weight of solvents in order to facilitate smooth leveling of the applied ceramic pa

Abstract: There is disclosed a method of producing a ceramic multilayer substrate by laminating a plurality of glass-ceramic green sheets made of a glass-ceramic containing an organic binder and a plasticizer to form a laminate; and firing the laminate; further comprising: applying to or overlaying on the surfaces of the glass-ceramic green sheets inorganic compositions, the sintering temperature of the inorganic compositions being higher than that of the glass-ceramic green sheets; laminating a plurality of the glass-ceramic green sheets having the inorganic compositions applied to or overlaid on the surfaces of the glass-ceramic green sheets respectively, to form a part of the laminate; and laminating a plurality of the glass-ceramic green sheets to form the other part of the laminate.

Abstract: A method of forming low resistance contact pads on a metal support substrate for a multilayer ceramic printed circuit board comprising forming a patterned layer of a conductive metal on the metal support substrate made of the same metal as that used to form the circuitry on the ceramic circuit board, and firing the support substrate. The patterned conductive metal can be formed by electroplating, by screen printing from a fritless conductor ink or by screen printing from a glass frit-containing conductor ink that includes a reducing agent.

Abstract: A method of manufacturing a laminated ceramic electronic component includes the steps of forming a conductor having a large thickness, which includes a plurality of first coil conductor layers and a plurality of second conductor layers, transferring the plurality of first coil conductor layers, which are each provided on a carrier film, onto the upper surface of a ceramic green sheet, and transferring the plurality of second coil conductor layers, which are each held on a carrier film, onto the lower surface of the same ceramic green sheet.

Abstract: A method for fabricating a multilayer ceramic substrate having a cavity with multi-steps therein for mounting an electronic component is provided. A block is inserted into a lower cavity segment of the cavity formed in a green sheet laminate to be the multilayer ceramic substrate, wherein the block has substantially the same three-dimensional shape as that of the cavity segment and has a height equal to or larger than the depth of the cavity segment. Thus, the pressing step is performed in a state such that the cavity has an apparent single step.

Abstract: A conductive co-fired body for an electrochemical cell for an exhaust sensor comprises zirconia, yttrium oxide, and alumina. The body comprises about 15 to about 30 weight % monoclinic phase zirconia. This produces an electrochemical cell having low impedance wherein the zirconia body and alumina body are co-fired. One method for manufacturing the electrochemical cell comprises combining zirconia, yttria, and alumina with solvent and dispersant to form a mixture. After, binder is added to the mixture which is then de-aired and cast onto a tape surface. The tape is dried, metallized, and laminated to an unfired alumina surface. The structure is then co-fired to form a body for said electrochemical cell.

Abstract: This invention provides a method of producing a laminate type dielectric device free from peeling of an electrode layer and a ceramic layer and from voids in both electrode layer and ceramic layer, and an electrode paste material. The invention relates also to an electrode paste material for constituting electrode layers of a laminate type dielectric device produced by at least the steps of alternately laminating ceramic layers 11 containing a lead element as a constituent component and electrode layers 2, and degreasing and baking the laminate, wherein the electrode paste material contains CuO as a principal component of a starting material of an electrically conductive material, a solvent, a binder, and a cooperative material consisting of at least one kind of the main components constituting the ceramic layer 11.

Abstract: The present invention relates to an electrochemical sensor, which has a sensor element (10), and is used to determine a gas concentration of a gas to be analyzed. The sensor element (10) has a first solid electrolyte layer (30), an electrode (34) that includes an electrode surface (32) and an electrode lead (33), and a second solid electrolyte layer (40); a gas channel (31) being introduced into the first solid electrolyte layer (30) in such a manner, that the electrode (34) is situated in a first, clamped region (50) between the first and the second solid electrolyte layers (30, 40), and in a second, open region (51) between the second solid electrolyte layer (40) and the gas compartment (31). In a transition region (52) between the clamped region (50) and the open region (51), the electrode (34) borders on a layer pattern, which is constructed in such a manner, that the electrode (34) is subjected to a lower pressure during a laminating procedure.

Abstract: A composite multilayered ceramic board includes a multilayered ceramic board made of dielectric ceramics, a multilayered ceramic board made of magnetic ceramics and an adhesive layer made of thermosetting resin such as polyimide and the like. In this composite multilayered ceramic board, the dielectric multilayered ceramic board and the magnetic multilayered ceramic board are joined through the adhesive layer.

Abstract: A method of CNT field emission current density improvement performed by a taping process is disclosed. The method comprises following steps. First of all, a conductive pattern coated on a substrate by screen-printing a conductive slurry containing silver through a patterned screen is carried out. Thereafter, a CNT layer is attached thereon by screen-printing a CNT paste through a mesh pattern screen to form CNT image pixel array layer. The CNT paste consists of organic bonding agent, resin, silver powder, and carbon nano-tubes. After that the substrate is soft baked by an oven using a temperature of about 50-200° C. to remove volatile organic solvent. A higher temperature sintering process, for example 350-550° C. is then carried out to solidify the CNT on and electric coupled with the conductive pattern.

Abstract: Disclosed is a method for fabricating a piezoelectric/electrostrictive thick film, using a seeding layer. On a substrate is formed the seeding layer which is prepared from a ceramic sol solution or a ceramic paste, both identical or similar in composition to the piezoelectric/electrostrictive film. The ceramic paste is prepared from a mixture of a ceramic oxide powder, which has a particle size of 5 &mgr;m or less and is prepared from Pb and Ti-based piezoelectric/electrostrictive elements by a non-explosive oxidation-reduction combustion reaction at 100-500° C., and a ceramic sol solution in water or an organic solvent, identical or similar in composition to the ceramic oxide powder. Then, the seeding layer is subjected to an after-treatment. A piezoelectric/electrostrictive film is directly formed on the seeding layer. Alternatively, a piezoelectric/electrostrictive film, separately formed and sintered, is attached on the seeding layer.

Abstract: There is disclosed a method of producing a ceramic multilayer substrate by laminating a plurality of glass-ceramic green sheets made of a glass-ceramic containing an organic binder and a plasticizer to form a laminate; and firing the laminate; further comprising: applying to or overlaying on the surfaces of the glass-ceramic green sheets inorganic compositions, the sintering temperature of the inorganic compositions being higher than that of the glass-ceramic green sheets; laminating a plurality of the glass-ceramic green sheets having the inorganic compositions applied to or overlaid on the surfaces of the glass-ceramic green sheets respectively, to form a part of the laminate; and laminating a plurality of the glass-ceramic green sheets to form the other part of the laminate.

Abstract: A method of CNT field emission current density improvement performed by a taping process is disclosed. The method comprises following steps. First of all, a conductive pattern coated on a substrate by screen-printing a conductive slurry containing silver through a patterned screen is carried out. Thereafter, a CNT layer is attached thereon by screen-printing a CNT paste through a mesh pattern screen to form CNT image pixel array layer. The CNT paste consists of organic bonding agent, resin, silver powder, and carbon nano-tubes. After that the substrate is soft baked by an oven using a temperature of about 50-200° C. to remove volatile organic solvent. A higher temperature sintering process, for example 350-550° C. is then carried out to solidify the CNT on and electric coupled with the conductive pattern.

Abstract: An apparatus and a process for producing a laminate for electronic parts such as ceramic capacitors. After a predetermined pattern for forming an internal conductive layer is formed on a self-supporting green sheet which contains inorganic powder and an organic binder, the self-supporting green sheet is taken up by a columnar roll and laminated. At this point, the position of the same pattern on the green sheet G2 of the next cycle to be laminated adjacently onto the green sheet G1 of the previous cycle as the above pattern with respect to the predetermined pattern on the green sheet G1 taken up by the columnar roll is determined.

Abstract: A method of producing a laminated ceramic electronic component results in an increased thickness of an internal electrode, reduced delamination, and produces a laminated ceramic electronic component having outstanding reliability. The method of producing a laminated ceramic electronic component includes the step of forming a green sheet supported on a carrier film and having an internal electrode paste layer configured to pass through the green sheet from the upper surface to the lower surface thereof, and a ceramic paste layer, the two layers being provided with a space therebetween, and the step of repeating the step of press-bonding the laminate of the green sheet and the carrier film, and separating the carrier film to obtain a ceramic laminate, pressing the ceramic laminate in the thickness direction, and then firing the laminate to obtain a ceramic sintered body.

Abstract: The present invention relates generally to a new metal/magnetic-ceramic laminate with through-holes and process thereof. More particularly, the invention encompasses a new process for fabrication of a large area ceramic laminate magnet with a significant number of holes, integrated metal plate(s) and co-sintered electrodes for electron and electron beam control. The present invention also relates to a magnetic matrix display (MMD), and electron beam source, and methods of manufacture thereof.

Abstract: In the method for the preparation of a laminated ferrite inductor device comprising the steps of: laminating a ferrite green sheet lined with and supported by a substrate film of, for example, polyethylene terephthalate provided with a penetrating through-hole and a coil pattern to a second ferrite green sheet followed by removal of the substrate film by peeling to form a laminate of ferrite green sheets to be subjected to sintering, peelability of the substrate film from the ferrite green sheet can be improved to prevent the ferrite green sheet from occurrence of defects such as breaking, crease formation and stretching by providing a snap groove of an adequate incision depth having a rectangular profile of a frame and, along the outer periphery of the snap groove, a peel-facilitating reinforcement pattern by printing with a printing paste to have a specified line width and printing thickness.

Abstract: A method and apparatus are provided for forming metal circuit patterns and other designs on greensheets and other substrates. The method and apparatus utilize a metal containing transfer sheet whereby selected portions of the metal containing transfer sheet are transferred to the greensheet forming the desired circuit pattern and then the transfer sheet removed. The metal containing transfer sheet may contain a release layer. Transfer methods include stamping, hot rolling, laser beam, heat, etc. and combinations thereof The transfer sheet may also have a stratified or graded vertical profile so that different conductivities or other circuit properties (transfer sheet adhesion, etc.) may be obtained in the formed pattern on the substrate.

Abstract: The present invention provides a method for readily and efficiently manufacturing a ceramic substrate having an excellent dimensional accuracy and small degree of warp comprising the steps of: preparing a non-sintered multilayer ceramic body formed by laminating ceramic layers and conductor layers; forming a multilayer ceramic body-with constraint layers by adhering a first constraint layer and a second constraint layer on one major surface and the other major surface, respectively, of the multilayer ceramic body, the first and second constraint layers being prepared by dispersing a ceramic powder that is not sintered under the sintering condition of the multilayer ceramic body; firing the multilayer ceramic body with the constraint layers under the firing condition of the multilayer ceramic body; and removing the first constraint layer and the second constraint layer after sintering the multilayer ceramic body, wherein the thickness of the first constraint layer is made to be larger than the thickness of the

Abstract: A method for manufacturing a multilayer ceramic substrate includes a firing step wherein low-temperature-sinterable ceramic material contained in green base layers and inorganic material contained in green constraining layers chemically react each other, whereby a reaction layer is formed along an interface between the green base layer and the green constraining layer. The reaction layer acts to enhance a bonding force between the green base layer and the green constraining layer.

Abstract: A method of manufacturing closed end ceramic fuel cell tubes with improved properties and higher manufacturing yield is disclosed. The method involves bonding an unfired cap to a hollow unfired tube to form a compound joint. The assembly is then fired to net shape without subsequent machining. The resultant closed end tube is superior in that it provides a leak-tight seal and its porosity is substantially identical to that of the tube wall. The higher manufacturing yield associated with the present method decreases overall fuel cell cost significantly.

Abstract: A conductive paste which can form conductive films having superior stability due to prevention of change in viscosity with time, and having high reliability due to reduction of gas generation during a defatting is provided. The conductive paste is composed of a conductive powder having an average particle diameter of about 1.0 or less, an organic vehicle, an anionic macromolecular dispersing agent, and an amine having a boiling point of about 120° C. or more, but about 220° C. or less and constitutes about 0.1% to 5% by weight of 100% by weight of the conductive paste.

Abstract: A multilayered board includes a laminate including a plurality of glass-containing insulating layers, each glass-containing insulating layer being provided with an electrode on the surface thereof. The glass-containing insulating layer is formed by firing a layer containing 60% by volume or less of a glass component before firing, a portion of the glass component is segregated in the surface region of the glass-containing insulating layer by firing, and the electrode is bonded to the surface of the glass-containing insulating layer by means of the segregated glass component. A method for fabricating a multilayered board is also disclosed.

Abstract: A manufacturing apparatus for manufacturing electronic monolithic ceramic components, including a sheet supplier for supplying a plurality of ceramic green sheets of a plurality of types in a predetermined order, and a laminator for laminating the ceramic green sheets supplied by the sheet supplier. A plurality of trays is set in two vertical columns in a rack which is vertically movable. Each tray holds a stack of a plurality of ceramic green sheets of the same type. A particular tray positioned to a predetermined level by the vertical movement of the rack is drawn by a tray drawer device, and one ceramic green sheet is picked up from the tray, and is then conveyed to the laminator. The utilization efficiency of area in the sheet supplier is thus increased.

Abstract: A composite monolithic element for use as a hot surface ignitor or the like includes first and second regions or layers. The first region or layer comprises a low pressure ejection molded mixture of silicon carbide and silicon nitride particles or other compatible mix which will alter processing art as a resistor. This resistor includes two cold portions and a hot portion intermediate thereof. The second region or layer also includes an ejection molded mixture of silicon carbide and silicon nitride particles or other appropriate mixture, while the second layer contains the same or similar compounds as the first, the rations of the compound differ so that after processing it acts as an insulator and as a support for the first layer. These first and second layers are bonded together to form a joint free mechanically continuous structure and densified.

Abstract: A method of manufacturing a multi-layered ceramic substrate which does not require dies for making cavities, or aligning the green sheets. The method includes the steps of providing a plurality of green sheets having pre-fabricated via holes and wiring patterns therein; forming a layer for preventing sintering of adjacent green sheets at an area to become the bottom of the cavity; laminating and sintering the green sheets to create a multi-layered sintered body; and making a cut along the inner wall of the cavity all the way to the bottom of the cavity and removing the inside sintered portion leaving the formed cavity. This method eliminates the need for expensive dies, thus providing a simple, stable, and inexpensive manufacturing method for a multi-layered ceramic substrate.

Abstract: A method for forming a ceramic diaphragm structure includes providing a laminate of a ceramic green substrate having at least one window and a plurality of layers, and a thin ceramic green sheet superimposed on the ceramic green substrate to cover the at least one window. The laminate is fired so that the ceramic green sheet provides a diaphragm portion protruding in a direction away from the at least one window, and the fired laminate is subjected to a second firing step under load.

Abstract: The process for the production of a laminated electronic part containing a major component as represented by general formula: X(MgaZn(1−a))xSiOx+2—YAl2O3—ZSrTiO3 (where symbol a is defined by: 0.1≦a≦0.8; and symbol x is defined by: ≦x≦1.5); and an additive component comprised of a compound containing one or more elements selected from Nb, Ta and W; wherein a mole percent ratio of magnesium zinc silicate, (MgaZn(1−a))xSiOx+2, (X), to alumina, Al2O3, (Y), and strontium titanate, SrTiO3, (Z), each of which constitutes said major component, is set to be located in a region enclosed by a polygon having apexes at points A, B, C and D, as defined below, in a three-component composition map: A (94.9, 0.1, 5.0) B (85.0, 10.0, 5.0) C (65.0, 10.0, 25.0) D (65.0, 0.1, 34.9); and the additive component is contained at a rate of 0.01 to 0.

Abstract: A method of manufacturing a fiber assembly, the method comprising: (a) providing a plurality of layers, each layer comprising sintered fibers of piezoelectric material aligned substantially parallel; (b) laminating the plurality of layers; and (c) applying a matrix material to the laminated layers to affix the layers and form a fiber assembly.

Abstract: A multilayered air-fuel ratio sensing element comprises a solid electrolytic substrate having oxygen ion conductivity. A measuring gas sensing electrode is provided on one surface of the solid electrolytic substrate so as to be exposed to a measuring gas. A reference gas sensing electrode is provided on another surface of the solid electrolytic substrate so that the reference gas sensing electrode is exposed to a reference gas introduced into a reference gas chamber. The measuring gas sensing electrode is covered by a porous diffusive resistor layer. And, a hollow space is provided between the measuring gas sensing electrode and the porous diffusive resistor layer.

Abstract: A method of fabricating a printhead for use in an ink jet printing device which includes providing a substrate having at least one substantially planar surface. An array of heating elements are formed on the surface of the substrate and addressed with a current pulse from an electrode. Depositing an insulating layer over the surface. Next, the insulating layer is mechanically or chemically treated to expose the heating elements. An ink channel plate is formed and includes at least one ink reservoir and one ink channel. A key or keyway is formed on channel plate and a corresponding key or keyway is formed on the insulating layer. The said channel plate is then adhesively secured to the substrate using the key and keyway as an alignment aid to achieve proper positioning of the ink channels and the heating elements.

Abstract: An assembly apparatus for electronic appliances of the present invention includes an adhesive applicator for applying adhesive to a PCB; a mounting section for placing an electronic component on the PCB; two or more bonders for pressing the electronic component onto the PCB; a feeder for supplying the electronic component to the PCB; a mounting means for placing the electronic component on the PCB; and a recognizer for detecting the electronic component held by the mounting means. The assembly apparatus of the present invention has two or more bonders in a single equipment. This enables the mounting and bonding of the required components for assembling an electronic appliance using a single apparatus, allowing reduction of equipment costs for assembling electronic appliances. In particular, the assembly apparatus for electronic appliances of the present invention is effective for assembling display devices.

Abstract: As an electrically conductive paste for via-holes, an organic vehicle and an electrically conductive metal powder coated with a resin which is insoluble in the organic vehicle are prepared. Filling via-holes with the electrically conductive paste for via-holes produces a monolithic ceramic. Filling characteristics of the electrically conductive paste into via-holes are improved, and cracks and elevations of the conductive metal and cracks of the ceramic barely form during the baking step. Further, the resulting monolithic ceramic substrate can maintain excellent soldering wettability and plating characteristics.

Abstract: Electronic packages made with a high area percent coverage of blanket metal may be prone to certain kinds of ceramic defects. In aluminum nitride, these defects may be related to decomposition of the liquid sintering aid. In this experiment, unique additions to the metallization prevented the formation of certain ceramic defects. Our approach involves a unique composition used in an existing process.

Abstract: A manufacturing method for a laminated ceramic electronic component includes the steps of printing a layer of a conductor and a ceramic green sheet formed around the conductor a plurality of times on a carrier film, thus preparing a composite sheet laminate in which composite sheets made up of the conductor and the ceramic green sheet are laminated, and pressing and attaching the composite sheet laminate to another ceramic green sheet and removing the carrier film.

Abstract: A rotor assembly for a rotating machine includes a substantially cylindrical main rotor body having an outer surface. A plurality of longitudinal ribs project from the outer surface of the main rotor body. A plurality of primary recesses are defined by adjacent ribs and a secondary recess is defined in the outer surface within at least one primary recess. A magnet is positioned within at least one primary recess, and a layer of adhesive between the magnet and the outer surface of the main rotor body fills the secondary recess. Magnet retaining elements. in the form of either an encapsulation layer, star-shaped retainer or elongated retaining members may also be used. The magnet retaining elements may be used alone or in combination with the adhesive layer between the magnets and the main rotor body.

Abstract: An assembly of rib structures sandwiched between a dielectric glass layer and a glass substrate for use in a flat panel display, such as plasma addressed liquid crystal (PALC) displays, is formed by a number of methods. One method includes molding thermoplastic glass frit containing paste into rib structures, transferring the rib structures to a thin transparent layer of a thermoplastic dielectric glass frit containing composition on a drum, and transferring the rib structures with the thin transparent dielectric glass layer to a glass substrate having metallic electrodes already formed thereon.

Abstract: Ceramic green sheets of controlled microporosity and method of making same have been provided. Controlled microporosity is achieved by including certain ionic species in the ceramic composition, particularly boron, phosphorus and copper oxide.