Abstract: When ceramic electronic parts such as multilayer ceramic substrates that have a substrate body and metal wiring conductors comprising silver are manufactured, a composition comprising not only a borosilicate glass powder and a ceramic powder, but also an additive powder comprising at least one of cerium oxide, bismuth, bismuth oxide, antimony and antimony oxide is used as a composition for preparing the substrate body. Gray discoloration of the substrate body and yellow discoloration in the vicinities of the metal wiring conductors can be prevented.

Abstract: A ceramic green sheet having good surface roughness and few pinhole defects even when producing a thin ceramic green sheet is stably produced, to permit efficiently and securely manufacturing a multilayer ceramic electronic part in which deterioration of its life due to unevenness of interfaces between internal electrodes and ceramic layers and the occurrence of structural defects, such as delamination, bending of an electrode portion, etc, in a multilayer thin film to be suppressed. A dry sheet obtained by forming ceramic slurry to a sheet on a carrier film is smoothed by pressing using a plate press, a hydrostatic press or a calender roll under predetermined temperature and pressure conditions to improve the surface smoothness of the ceramic green sheet independently of the particle diameter of the ceramic and its dispersibility. An electrode paste is coated in a predetermine pattern on the thus-produced ceramic green sheet to form a sheet provided with an electrode.

Abstract: A manufacturing method of a thin-film laminate for manufacturing the thin-film laminate by sequentially laminating thin-film sheets having conductive patterns formed thereon, comprising the steps of housing thin-film sheets held by a carrier films adjusted to a prescribed size in a housing case; and in the middle of conveyance of the thin-film sheets in a state held by the carrier films and taken out from the housing case to a pressing and laminating position, stripping the thin-film sheets off the carrier films while conveying the same.

Abstract: A capacitive filtered feedthrough assembly is formed in a solid state manner to employ highly miniaturized conductive paths each filtered by a discoid capacitive filter embedded in a capacitive filter array. A non-conductive, co-fired metal-ceramic substrate is formed from multiple layers that supports one or a plurality of substrate conductive paths and it is brazed to a conductive ferrule, adapted to be welded to a case, using a conductive, corrosion resistant braze material. The metal-ceramic substrate is attached to an internally disposed capacitive filter array that encloses one or a plurality of capacitive filter capacitor active electrodes each coupled to a filter array conductive path and at least one capacitor ground electrode. Each capacitive filter array conductive path is joined with a metal-ceramic conductive path to form a feedthrough conductive path.

Abstract: To provide effective seals between the separator plates of fuel cells, particularly planar solid oxide fuel cells (SOFC's), a method of applying a glass-ceramic coating to such a separator plate comprises providing a laminar body incorporating a glass powder, e.g., a tape-cast sheet, forming a bond between the laminar body and the separator plate to form. an assembly comprising the separator plate and the laminar body, and heat-treating the assembly to convert the glass powder to a glass-ceramic.

Abstract: An intermediate low-pressure laminated ceramic device is formed from a plurality of layers of unfired ceramic material each including ceramic particles in an organic binder. A polymer interfacial layer having a glass transition temperature such that it flows at a temperature below a temperature required for the unfired ceramic layers to substantially deform, is deposited on one surface of each of the unfired ceramic layers. The unfired ceramic layers are stacked with an interfacial layer positioned between adjacent unfired ceramic layers in the stack. The stack is heated to a temperature greater than the glass transition temperature of the interfacial layers and a pressure is applied to the heated stack below approximately 1200 psi to fixedly bond the plurality of layers in the stack together.

Abstract: A method of processing greensheets for use as microelectronic substrates comprises providing a greensheet having a width, a length and a thickness, bonding to the greensheet, within the greensheet width and length, a frame adapted to constrain movement of the greensheet within the frame, processing the greensheet and bonded frame, and removing the frame from the processed greensheet. The processing of the greensheet and bonded frame may include punching vias in the greensheet, filling the vias in the greensheet with conductive material, patterning the greensheet by applying conductive paste to the vias and greensheet surface, stacking the patterned greensheet and bonded frame with at least one other patterned greensheet and bonded frame, and laminating the greensheets. The frame is preferably removed from the processed greensheet after laminating the greensheets, and before the laminated greensheets are subsequently sintered.

Abstract: A ceramic slurry composition has a powdered ceramic uniformly dispersed therein without excessive damage thereto. A method for producing a ceramic green sheet using the ceramic slurry composition and a method for producing multilayer ceramic electronic devices are also disclosed. The ceramic slurry composition contains the powdered ceramic, a dispersing agent, a binder and a solvent, in which an anionic dispersing agent is used as the dispersing agent, and the content of the anionic dispersing agent is set to be such that the total acid content thereof corresponds to about 10 to 150% of the total base content of the powdered ceramic. In addition, the powdered ceramic having an average particle diameter of about 0.01 to 1 &mgr;m is used.

Abstract: A metal-ceramic composite is provided in which a solder layer and a ceramic member are held in contact with each other at an annular area extending along an entire circumference of an axial end surface of the ceramic member and having an average width W (mm), and in which the average width W and an outer diameter D (mm) of the ceramic member satisfy D≧30 and (⅙)×D≧W≧(D/30)+2.6.

Abstract: A method for forming a low temperature cofired ceramic (LTCC) device includes forming a channel in a first LTCC tape layer. A wax is inserted in the channel. The wax is of a type that bums out at a temperature below a sintering temperature of the first LTCC tape layer. At least a second LTCC tape layer is stacked on the first LTCC tape layer to form a stack. The stack is pressed sufficiently for the first and second layers to bond into a laminate. The laminate is fired at the sintering temperature to form a sintered ceramic structure from the first and second LTCC tape layers, so that all or substantially all of the wax is burned out from the channel.

Abstract: This invention provides a method for producing a stacked ceramic body that does not require strict control of an oxygen partial pressure in a sintering gas. To produce a stacked ceramic body by alternately stacking dielectric layer and electrode layers, an unsintered stacked body 2 is prepared by alternately stacking unsintered dielectric layers containing a PZT type dielectric material and unsintered electrode layers containing an electrode material, and is sintered in a sintering gas to which a dielectric layer anti-reducing agent 21 and an electrode layer anti-oxidant 22 are introduced. Alternatively, sintering is conducted in a gas containing only the dielectric layer anti-reducing agent 21 or in a gas containing only the electrode layer anti-oxidant 22.

Abstract: A manufacturing method of ceramic multi-layer boards including a step of forming adhesive layer (12) on ceramic board (11), and adhesive layer (12) integrates board 11 and ceramic green sheet 14. Little shrinkage in an in-plane direction is observed after firing, so that the ceramic multi-layer boards having highly dimensional accuracy are manufactured.

Abstract: A method to control the post sinter distortion of free sintered multilayer ceramic substrates by placing a discrete non-densifying structure in the green ceramic laminate prior to sintering. One or several discrete non-densifying structures are placed on one or more ceramic greensheets which are then stacked and laminated to form a green ceramic laminate. The laminate is then sintered and the discrete non-densifying structure will locally control the dimensions of the free sintered multilayer ceramic substrate. The method can be used to control post sinter dimensions in MLC substrates manufactured as either single or multi-up substrates by placing the discrete non-densifying structure in the active area or in the kerf area between the individual product ups prior to sintering.

Abstract: A method of manufacturing a laminated ceramic electronic component includes the steps of forming a conductor having a large thickness, which includes a plurality of first coil conductor layers and a plurality of second conductor layers, transferring the plurality of first coil conductor layers, which are each provided on a carrier film, onto the upper surface of a ceramic green sheet, and transferring the plurality of second coil conductor layers, which are each held on a carrier film, onto the lower surface of the same ceramic green sheet.

Abstract: A multilayer ceramic micropump including a monolithic ceramic package formed of a plurality of ceramic layers defining therein an integrated first ball check valve, and a second ball check valve in microfluidic communication with the first ball check valve, and an actuator characterized as actuating a pumping motion, thereby pumping fluids through the first ball check valve and the second ball check valve.

Abstract: A method of production of a ceramic electronic device such as a multilayer ceramic capacitor, comprising forming a first ceramic coating layer on the surface of a substrate, forming an internal electrode on the surface of the first ceramic coating layer, then forming a second ceramic coating layer on the surface of the first ceramic coating layer so as to cover the internal electrode. In this case, when a mean particle size of ceramic particles of the first ceramic coating layer is &agr;1, a thickness of the first ceramic coating layer is T1, a mean particle size of ceramic particles of the second ceramic coating layer is &agr;2, and a thickness of the second ceramic coating layer is T2, the conditions of &agr;1≦&agr;2, 0.05<&agr;1≦0.35 &mgr;m, T1<T2, and 0<T1<1.5 &mgr;m are satisfied. As a result, it is possible to provide a ceramic electronic device, in particular a multilayer ceramic capacitor, resistant to short-circuit defects, withstand voltage defects, and other structural defects.

Abstract: The present invention mainly relates to a method for reducing X-Y shrinkage during sintering low temperature ceramic comprising piling a constrain layer on a dielectric layer on a green ceramic body, which is printed with heterogeneous materials for conductors, resistors, capacitors and the like and/or disposed conductors, resistors, capacitors and the like to reduce shrinkage of the dielectric layer and the green ceramic body. The invention is characterized in that the constrain layer comprises windows in positions complying with the heterogeneous materials and/or conductors, resistors, capacitors and the like printed and/or disposed on the dielectric layer and the green ceramic body to make the heterogeneous materials and/or conductors, resistors, capacitors and the like not being covered when piling the constrain layer and the dielectric layers of the green ceramic body.

Abstract: When ceramic electronic parts such as multilayer ceramic substrates that have a substrate body and metal wiring conductors comprising silver are manufactured, a composition comprising not only a borosilicate glass powder and a ceramic powder, but also an additive powder comprising at least one of cerium oxide, bismuth, bismuth oxide, antimony and antimony oxide is used as a composition for preparing the substrate body. Gray discoloration of the substrate body and yellow discoloration in the vicinities of the metal wiring conductors can be prevented.

Abstract: A method for manufacturing a laminated ceramic electronic component allows for production of highly reliable laminated ceramic electronic components even when the coating rate of a ceramic slurry on a surface of a carrier film is increased in order to reduce the thickness of the ceramic green sheet. A ceramic green sheet is formed by pulling out a carrier film from a carrier film roll, coating the film with a ceramic slurry using a coating apparatus, drying the film with a drying apparatus, and rolling up the film using a take-up apparatus. The carrier film is unrolled, an internal electrode pattern is printed thereon by a printing apparatus, the surface of the film is dried, and the film is rolled up by the take-up apparatus. The rolled carrier film is pulled out, the ceramic green sheet is peeled away, and a plurality of the ceramic green sheets are laminated. Following the cutting of the laminated body into individual elements, these elements are fired, and external electrodes are formed thereon.

Abstract: A method of processing greensheets for use as microelectronic substrates comprises providing a greensheet having a width, a length and a thickness, bonding to the greensheet, within the greensheet width and length, a frame adapted to constrain movement of the greensheet within the frame, processing the greensheet and bonded frame, and removing the frame from the processed greensheet. The processing of the greensheet and bonded frame may include punching vias in the greensheet, filling the vias in the greensheet with conductive material, patterning the greensheet by applying conductive paste to the vias and greensheet surface, stacking the patterned greensheet and bonded frame with at least one other patterned greensheet and bonded frame, and laminating the greensheets. The frame is preferably removed from the processed greensheet after laminating the greensheets, and before the laminated greensheets are subsequently sintered.

Abstract: The present invention relates generally to a new ceramic structure and process thereof. Basically, the present invention relates to a structure and method for forming laminated structures and more particularly to a structure and method for fabricating multi-layer ceramic products using very thin green sheets and/or green sheets with very dense electrically conductive patterns on top of a stronger support sheet. The structure and method of the present invention enables the screening, stacking and handling of very thin green sheets and/or green sheets with very dense metallized patterns in the manufacture of multi-layer ceramic packages. The thin green sheets were tacked/bonded to thicker and stronger support sheets to form a sub-structure which had excellent stability in screening and enabled further processing. The sheets are anchored or pinned in such a way as to allow the processing of the green sheet with the subsequent easy removal of the support sheet.

Abstract: A method of manufacturing a ceramic electronic component including: a first step of providing a plurality of ceramic sheets containing ceramic powder and polyethylene and having a porosity of 30% or more, and a conductor layer containing metal powder, plasticizer and resin on a base film; a second step of laminating and pressurizing the conductor layer together with the base film on one of the ceramic sheets, and peeling off the base film to form a ceramic sheet with the conductor layer; a third step of disposing another ceramic sheet on top of the conductor layer; a fourth step of laminating and pressurizing another conductor layer on top of the another ceramic sheet; a fifth step of repeating the third and the fourth steps to form a laminated body having a desired number of layers; and a sixth step of sintering the laminated body.

Abstract: A process for producing a monolithic ceramic electronic component, which includes: providing a ceramic slurry, a conductive paste, and a ceramic paste; forming a plurality of composite structures each comprising a ceramic green sheet produced by shaping the ceramic slurry, internal circuit element films formed by applying the conductive paste partially onto a main surface of the ceramic green sheet so as to provide step-like sections, and a ceramic green layer which compensates for spaces defined by the step-like sections, the ceramic green layer being formed by applying the ceramic paste onto the region on the main surface of the sheet on which the element films are not formed, so as to substantially compensate for the spaces; forming a green laminate by laminating the composite structures; and firing the green laminate, wherein the ceramic paste contains ceramic powder, an organic solvent, and an organic binder.

Abstract: A method for fabricating a multilayered structure out of sheets of green-tape without the application of high pressures includes the step of applying an adhesive to the sheets of green-tape. Selection of an adhesive with a polymer that decomposes at a higher temperature than the binder present in the green-tape promotes stability of the interfaces during the firing process and promotes void-free sintering within the interfacial regions.

Abstract: A method of manufacturing an ink-jety recording head in which an ink supply port forming substrate 21, a common ink chamber forming substrate 25, and a nozzle plate 27 are bonded together by inserting between them thermally fusible films 31 and 32 respectively, in which are formed through holes 45 and 45 at two or more positions, and by also filling the film through holes with an adhesive that is mixed with a gap material G for adjusting the thicknesses of the thermally fusible films when they are fused, so as to form a flow path unit 30; and then the flow path unit 30 and the actuator units 1 are bonded together by inserting between them a thermally fusible film 33, in which are through holes 64 at two or more positions, and by also filling the through holes with an adhesive that is mixed with a gap material G for adjusting the thickness of the thermally fusible film when it is fused.

Abstract: In a green laminate body including a plurality of base green layers and a plurality of constraining green layers for forming a monolithic ceramic substrate by using a non-shrinking process, when the thicknesses of the base green layers differ from each other, a thicker base green layer shrinks largely during sintering, and hence, the resulting monolithic ceramic substrate may warp in some cases. In order to solve this problem, the constraining green layers, which are in contact with the main surfaces of the individual base green layers, have different thicknesses so that a relatively thicker constraining green layer is in contact with a relatively thicker base green layer, and a relatively thinner constraining green layer is in contact with a relatively thinner base green.

Abstract: A method for manufacturing a multilayer ceramic electronic element includes the steps of forming ceramic green sheets having superior surface smoothness and small variations in thickness at a high speed, in which defects such as pinholes are prevented from occurring, and providing internal electrodes and step-smoothing ceramic paste on the ceramic green sheets with high accuracy. The method includes the steps of applying ceramic slurry to a base film by a die coater followed by drying performed in a drying furnace for forming the ceramic green sheets, and performing gravure printing of conductive paste and ceramic paste onto the ceramic green sheets by using a first and a second gravure printing apparatus, respectively. Accordingly, the internal electrodes are formed, and the step-smoothing ceramic paste is provided in regions other than those in which the internal electrodes are formed.

Abstract: A composite laminate includes first sheet layers and second sheet layers. The first sheet layers include a first particulate aggregate and the second sheet layers include a second particulate aggregate. Each of internal second sheet layers is disposed between two first sheet layers and two external second sheet layers constitute two main faces of the composite laminate. The thickness of the internal second sheet layers is greater than the thickness of the external second sheet layers. The first sheet layers and the second sheet layers are bonded to each other by penetration of a part of the first particulate aggregate contained in the first sheet layers into the second sheet layers. This configuration can reduce the transverse shrinkage in the firing step of the composite laminate.

Abstract: A method of producing ceramic slurry capable of producing uniformly dispersed ceramic slurry without excessively damaging a ceramic powder, and a method of producing a ceramic slurry composition used for producing a multilayer ceramic electronic part, from which an undissolved binder is precisely removed. Also provided is a method of producing a ceramic green sheet, and a method of producing a multilayer ceramic electronic part. A ceramic powder having an average particle diameter of about 0.01 to 1 &mgr;m is mixed with a dispersion solvent (solvent) and disintegrated by a medium-type dispersion method using a dispersion medium such as balls, beads, or the like to obtain mixed and disintegrated slurry, followed by high-pressure dispersion under a pressure of about 100 kg/cm2 or more.

Abstract: A multilayered microfluidic device having a substantially monolithic structure is formed by sintering together a plurality of green-sheet layers. The substantially monolithic structure has an inlet port for receiving fluid, an outlet port for releasing fluid, and an interconnection between the inlet port and the outlet port. The substantially monolithic structure may also include a variety of components to enable useful interaction with the fluid, such as electrically conductive pathways, heaters, fluid sensors, fluid motion transducers, and optically transmissive portions. The components are preferably fabricated using thick-film or green-sheet technology and are preferably co-fired with and sintered to the green-sheet layers to become integral with the substantially monolithic structure.

Abstract: The method of making a wide range oxygen sensor of the present invention enables ease of handling and processing, particularly in a mass production environment. This process comprises forming planar composite elements of the sensor where the elements are individually laminated. These laminated composites are easily handled and readily stacked. Furthermore, electrodes and electrode leads can be readily deposited on the laminated composites, across the intersection of the various materials forming the composite. After deposition of the electrodes, leads, and a heater, the elements are stacked accordingly and laminated to produce the oxygen sensor.

Abstract: A ceramic capacitor has at least one dielectric layer and at least two electrodes having the dielectric layers therebetween. The dielectric layer includes a sintered body of ceramic grains containing a primary component of a perovskite crystal structure in a form of ABO3 and a ratio A/B of outer portions of the ceramic grains is greater than that of an inner portions thereof.

Abstract: A multilayer ceramic wiring board prepared from a plurality of sheets formed from a ceramic-incorporating material containing a ceramic powder and a binder resin and each having a pattern of one or a plurality of circuit elements printed on a surface thereof with use of a conductive mixture material containing an electrically conductive powder and a binder resin, by placing the sheets over one another to form a laminate, and compressing and firing the laminate. The mean particle size Rs of the ceramic powder is not greater than the value of (Rd−&sgr;d) wherein Rd is the mean particle size of the conductive powder, and &sgr;d is the standard deviation obtained when the distribution of the particle sizes of the conductive powder is expressed by a normal distribution function. This feature prevents formation of projections which would otherwise extend from the surface of one circuit element toward another circuit element when the elements are formed by firing the laminate.

Abstract: A method of processing greensheets, wherein the following steps are performed: a) providing a greensheet having a width, length, thickness, a first side and a second side; b) bonding to the first side of the greensheet at least one strip, wherein the strip lies in a first plane; c) bonding to the second side of the green sheet at least one strip, wherein the strip lies in a second plane; d) processing the greensheet; and e) removing the strips from the processed greensheet.

Abstract: A low temperature co-fired ceramic assembly (LTCC) with a constraining core to minimize shrinkage of outer ceramic layers during firing. The outer ceramic layers have high density circuit features. A ceramic core includes several ceramic layers. Several via holes are located in the first and second ceramic layers. Several low density circuit features are located on the ceramic layers that make up the core. Outer ceramic layers are placed top and bottom of the ceramic core. The outer ceramic layers have via holes and high density circuit features. The circuit features patterned on the ceramic layers include resistors, capacitors, circuit lines, vias, inductors, or bond pads. The ceramic core is fired first in a furnace. The outer layers are then laminated to the ceramic core and fired. The ceramic core controls the shrinkage rate of the outer ceramic layers during firing allowing higher density circuit features on the outer layers.

Abstract: A multilayer ceramic micropump including a monolithic ceramic package formed of a plurality of ceramic layers defining therein an integrated first ball check valve, and a second ball check valve in microfluidic communication with the first ball check valve, and an actuator characterized as actuating a pumping motion, thereby pumping fluids through the first ball check valve and the second ball check valve.

Abstract: The present invention provides a method for readily and efficiently manufacturing a ceramic substrate having an excellent dimensional accuracy and small degree of warp comprising the steps of: preparing a non-sintered multilayer ceramic body formed by laminating ceramic layers and conductor layers; forming a multilayer ceramic body with constraint layers by adhering a first constraint layer and a second constraint layer on one major surface and the other major surface, respectively, of the multilayer ceramic body, the first and second constraint layers being prepared by dispersing a ceramic powder that is not sintered under the sintering condition of the multilayer ceramic body; firing the multilayer ceramic body with the constraint layers under the firing condition of the multilayer ceramic body; and removing the first constraint layer and the second constraint layer after sintering the multilayer ceramic body, wherein the thickness of the first constraint layer is made to be larger than the thickness of the

Abstract: A manufacturing method for a laminated ceramic electronic component includes the steps of printing a layer of a conductor and a ceramic green sheet formed around the conductor a plurality of times on a carrier film, thus preparing a composite sheet laminate in which composite sheets made up of the conductor and the ceramic green sheet are laminated, and pressing and attaching the composite sheet laminate to another ceramic green sheet and removing the carrier film.

Abstract: Internal electrode layers of a multilayer ceramic electronic element are structured such that spaces, which are formed between adjacent internal electrodes, are eliminated so as to substantially flatten the internal electrode layers. Moreover, the thickness of each green dielectric layer is reduced. To achieve this, a laminating process is performed by a thermal transfer printing method such that a thermal transfer conductor material and a thermal transfer dielectric material are used so as to form internal electrode portions and green dielectric portions. Thus, the internal electrode layers are formed.

Abstract: A method of producing a laminated ceramic electronic component results in an increased thickness of an internal electrode, reduced delamination, and produces a laminated ceramic electronic component having outstanding reliability. The method of producing a laminated ceramic electronic component includes the step of forming a green sheet supported on a carrier film and having an internal electrode paste layer configured to pass through the green sheet from the upper surface to the lower surface thereof, and a ceramic paste layer, the two layers being provided with a space therebetween, and the step of repeating the step of press-bonding the laminate of the green sheet and the carrier film, and separating the carrier film to obtain a ceramic laminate, pressing the ceramic laminate in the thickness direction, and then firing the laminate to obtain a ceramic sintered body.

Abstract: A method for producing the piezoelectric thin film is based on a sol-gel process and comprises the steps of: coating a substrate with a sol composition comprising a sol, of a metal component for constituting a piezoelectric film, and a polymer compound and then drying the coating to form a film; pre-sintering the film to form a porous thin film of gel comprising an amorphous metal oxide; pre-annealing the porous thin film of gel to convert the film to a film of a crystalline metal oxide; repeating the steps at least once to form laminated films of a crystalline metal oxide; and annealing the films thus prepared to grow crystal grains of perovskite type in the film into a larger size.

Abstract: A method of manufacturing a ceramic body and a gas sensor is disclosed. The method comprises mixing a ceramic material and an organometallic material with a solvent to form a mixture. The organometallic material comprises both a metallic component and an organic ligand. The mixture is disposed onto a surface, dried, and removed to form the ceramic body. The sensor is made by disposing the ceramic body adjacent to an unfired electrolyte body having an electrode disposed on each side thereof to form a green sensor. The green sensor is co-fired to form the sensor.

Abstract: A green laminate for obtaining a multilayer substrate includes base material layer green sheets held between constraint layer green sheets. The green laminate includes constraint layer green sheets laminated on the outside of a laminate of base material layer green sheets, and cutting grooves are formed in the constraint layer green sheets. By burning the green laminate to obtain a sintered laminate, the difference between expansion and shrinkage behaviors due to the difference between the thermal expansion coefficients of the glass ceramic sintered layer and the ceramic powder fixed layer occurs in each of the regions divided by the cutting grooves, thereby relieving stress due to the difference between expansion and shrinkage behaviors.

Abstract: The present invention relates generally to a new method and apparatus to enable high yielding double sided and/or multipass screening in the manufacture of multilayer ceramic packages. Also, the present invention enables the screened features to be buried partially or fully with flat surface being available for high yielding post-sinter operations.

Abstract: A micro-gas chromatograph column is formed by texturing a channel into a plurality of green-sheet layers, which are then sintered together to form a substantially monolithic structure. A thick-film paste may be added to the channel textured in the green-sheet layers to provide a porous plug sintered in the micro-gas chromatograph column in the substantially monolithic. A thermal conductivity detector is formed in the substantially monolithic structure by depositing a conductive thick-film paste on the surface of one of the green-sheet layers to define a resistor in an exit channel of the micro-gas chromatograph column.

Abstract: An intermediate low-pressure laminated ceramic device is formed from a plurality of layers of unfired ceramic material each including ceramic particles in an organic binder. A polymer interfacial layer having a glass transition temperature such that it flows at a temperature below a temperature required for the unfired ceramic layers to substantially deform, is deposited on one surface of each of the unfired ceramic layers. The unfired ceramic layers are stacked with an interfacial layer positioned between adjacent unfired ceramic layers in the stack. The stack is heated to a temperature greater than the glass transition temperature of the interfacial layers and a pressure is applied to the heated stack below approximately 1200 psi to fixedly bond the plurality of layers in the stack together.

Abstract: A method for producing ceramic composite bodies, in particular, cylindrical ceramic bodies for sheathed-element glow plugs, in which a plurality of shaping sleeves, which accommodate piece parts premolded by cold pressing, are inserted into corresponding bore holes of a vertically standing supporting plate that is heated via additional bore holes with the aid of cartridge heaters or a heat transfer liquid. The vertically standing supporting plate with the shaping sleeves is then clamped between two press plates of a press, and the piece parts located inside are subsequently pressed by press pins which, on both sides, pass through the press plates and into the shaping sleeves. Upon completion of the necessary pressure keeping period, the pressed compound, after retraction of the press pins and opening the press, can be hardened in a non-pressurized manner in the shaping sleeves located in the withdrawn supporting plate that is subjected to further heating.

Abstract: A green sheet including a binder containing an acrylic resin having no polar group and a ceramics material in powder is prepared, and connection via are formed in the green sheet. Further, a conductor layer having virtually no voids is placed on the green sheet and a mask is also placed on the conductor layer. Then, the conductor layer is patterned by wet-etching so that wiring is formed thereon. A plurality of the green sheets thus formed are laminated, and a binding sheet, which contains an inorganic composition that has virtually no sintering shrinkage at the firing temperature of the multi-layered body as a main component, is formed on either both surfaces or one surface of the laminated body, and this is then fired, and thereafter, the binding sheet is removed.

Abstract: The present invention provides a laminated body, comprising: a first sheet layer comprising an aggregate of a first powder, at least a part of the first powder being in a sintered state; a second sheet layer disposed so as to make contact with the first sheet layer and comprising an aggregate of a second powder, the second powder being in a non-sintered state; and the first powder and the second powder being solidified to each other by allowing a part of the first sheet layer material to diffuse or to flow into the second sheet layer.

Abstract: Pre-fired ceramic substrates are elected according to the desired electrical performance of the filter. If necessary for enhanced performance, the surfaces of the substrate may be lapped to assure that their top and bottom surfaces are parallel and their surface finish is smooth. The top surface of a lower layer is coated with a conductive film using thick film techniques then patterned to define the filter trace pattern. For precise dimensional control, photolithographic techniques may be used. The bottom and the sides of the lower layer are coated with the same conductive film. A seal glass which has a coefficient of thermal expansion which is matched as closely as possible to that of the ceramic substrate is screen printed onto the top surface of the lower layer. The top of the upper layer is screen printed with the conductive film and the bottom of the upper layer is coated with the seal glass. The upper and lower layers are bonded together by clamping them together and firing the seal glass.