Abstract: This invention is a method of forming features, such as counter-bore holes in a circuit board assembly. A first and second substrate are processed and counter-bore holes are formed in the first substrate. After the holes are formed, sealing glass is deposited on the bottom side of the first substrate and the top side of the second substrate and is sintered on the bottom side of the first substrate and the top side of the second substrate. After sintering, the bottom side of the first substrate is fixtured to the top side of the second substrate and the first and second substrate are refired, causing the sealing glass to reflow and fuse the bottom side of the first substrate to the top side of the second substrate. Finally, the first and second substrate are cooled.

Abstract: A method for producing a multi-layer ceramic capacitor 10 in which reliability of electrical contact between a via electrode 28 and an internal electrode layer 24 (24a or 24b) provided between ceramic layers 22 is enhanced. A laminated sheet 100 including ceramic layers 22 and internal electrode layers 24, the layers 22 and 24 being alternately laminated and combined together, is formed, through-holes 26 are formed in the laminated sheet 100 by means of laser irradiation, and an electrically conductive material is charged into the through-holes 26 using charging container 110, to thereby form via electrodes 28. The electrically conductive material is charged, under application of pressure, into each of the through-holes 26 via an opening of the through-hole 26.

Abstract: A manufacturing method of ceramic multi-layer boards including a step of forming adhesive layer (12) on ceramic board (11), and adhesive layer (12) integrates board 11 and ceramic green sheet 14. Little shrinkage in an in-plane direction is observed after firing, so that the ceramic multi-layer boards having highly dimensional accuracy are manufactured.

Abstract: A method for manufacturing a multilayer ceramic substrate includes a firing step wherein low-temperature-sinterable ceramic material contained in green base layers and inorganic material contained in green constraining layers chemically react each other, whereby a reaction layer is formed along an interface between the green base layer and the green constraining layer. The reaction layer acts to enhance a bonding force between the green base layer and the green constraining layer.

Abstract: A process for producing a monolithic ceramic electronic component, which includes: providing a ceramic slurry, a conductive paste and a ceramic paste; forming a plurality of composite structures each comprising a ceramic green sheet produced by shaping the ceramic slurry, internal circuit element films formed by applying the conductive paste partially onto a main surface of the ceramic green sheet so as to provide step-like sections, and a ceramic green layer which compensates for spaces defined by the step-like sections, the ceramic green layer being formed by applying the ceramic paste onto the region on the main surface of the sheet on which the element films are not formed so as to substantially compensate for the spaces; forming a green laminate by laminating the composite structures; and firing the green laminate. A monolithic ceramic electronic component which is produced through the process; a ceramic paste; and a production process for the paste are also disclosed.

Abstract: A method for manufacturing a ceramic circuit substrates having a high-density conductive pattern, as its internal conductor, formed by a film-intaglio-transfer-printing method is provided. The conductive pattern is temporarily transfer-printed on a heat-resistant substrate coated with an adhesive layer. An un-sintered ceramic green sheet is stacked on a surface of the conductive patterns of the heat-resistant substrate, and then, the conductive pattern is transfer-printed again onto the un-sintered ceramic green sheet like being embedded by heat-pressing. Consequently, the conductive pattern is formed on the green sheet. This then has a binder removed and is sintered, and provides the ceramic circuit substrate having the fine, high-density conductive patterns, as the internal conductor, formed by the film-intaglio-transfer-printing method.

Abstract: This invention provides a stacked ceramic body in which de-lamination (inter-layer peeling) does not easily occur, and a production method thereof. In the invention, a predetermined number of unit layers 151 and 152 each including a ceramic layer 111 112, an internal electrode layer 121, 122, a spacer 131, 132 having substantially the same thickness as the internal electrode layer 121, 122 and adhesive layers 14 stacked on the surface of the internal electrode layer and on the surface of the adhesive layer are stacked. A print portion for the internal electrode layer 121, 122 and a print portion for the spacer 131, 132 are formed on a green sheet for the ceramic layer 111, 112, and print portions for the adhesive layer 14 are formed on both of them to give an unsintered unit. The unsintered units are stacked to give an unsintered stacked body, are press-bonded and are then sintered.

Abstract: A green ceramic body, in particular a green ceramic film having a function layer which contains platinum and is applied in at least some areas is described; this function layer is photostructurable in daylight and in the presence of oxygen. In addition, a method of producing such a green ceramic body is described, including the process steps: a) making available a green ceramic starting body, b) applying a photostructurable paste containing platinum to the starting body in at least some areas, in particular by printing, in daylight and in the presence of oxygen, and c) photostructuring the applied paste to form the function layer. The green ceramic body described here is suitable in particular for further processing to form a temperature sensor.

Abstract: A ceramic capacitor has at least one dielectric layer and at least two electrodes having the dielectric layers therebetween. The dielectric layer includes a sintered body of ceramic grains containing a primary component of a perovskite crystal structure in a form of ABO3 and a ratio A/B of outer portions of the ceramic grains is greater than that of an inner portions thereof.

Abstract: A conductive co-fired body for an electrochemical cell for an exhaust sensor comprises zirconia, yttrium oxide, and alumina. The body comprises about 15 to about 30 weight % monoclinic phase zirconia. This produces an electrochemical cell having low impedance wherein the zirconia body and alumina body are co-fired. One method for manufacturing the electrochemical cell comprises combining zirconia, yttria, and alumina with solvent and dispersant to form a mixture. After, binder is added to the mixture which is then de-aired and cast onto a tape surface. The tape is dried, metallized, and laminated to an unfired alumina surface. The structure is then co-fired to form a body for said electrochemical cell.

Abstract: A glass ceramic multilayer substrate having a better flatness and a low sintering shrinkage ratio is made by sintering an unsintered laminated body formed by laminating together first and second green sheets capable of exhibiting different shrinking behaviors during a sintering process, thereby producing the desired glass ceramic multilayer substrate. When the shrinkage starting temperatures (°C.) of the first and second green sheets are TSa and TSb, the sintering process ending temperatures (°C.) of the first and second green sheets are TFa and TFb, and when the temperature rising speed is X° C./min, the respective parameters satisfy (TFa+3X)<TSb or (TFb+3X)<TSa.

Abstract: A method for manufacturing a monolithic ceramic electronic component formed by using a laminate allows a plurality of types of ceramic green sheets to be laminated with ease and efficiency. The method enables a reduction in space for lamination. This method includes first, a ceramic green sheet with a predetermined shape is cut out of a long first ceramic green sheet supported on a carrier film by a cutting/laminating head. The cut-out ceramic green sheet is laminated to the cutting/laminating head. A card-like second ceramic green sheet supported on a carrier film is cut by a cutting/laminating head. The cut ceramic green sheets is laminated to the cutting/laminating head. A laminate is formed by performing each of the first and second steps plural times.

Abstract: A method for manufacturing a laminated ceramic electronic component allows for production of highly reliable laminated ceramic electronic components even when the coating rate of a ceramic slurry on a surface of a carrier film is increased in order to reduce the thickness of the ceramic green sheet. A ceramic green sheet is formed by pulling out a carrier film from a carrier film roll, coating the film with a ceramic slurry using a coating apparatus, drying the film with a drying apparatus, and rolling up the film using a take-up apparatus. The carrier film is unrolled, an internal electrode pattern is printed thereon by a printing apparatus, the surface of the film is dried, and the film is rolled up by the take-up apparatus. The rolled carrier film is pulled out, the ceramic green sheet is peeled away, and a plurality of the ceramic green sheets are laminated. Following the cutting of the laminated body into individual elements, these elements are fired, and external electrodes are formed thereon.

Abstract: A method of manufacturing ceramic includes a first step of compressing a ceramic sheet (10a) containing ceramic powder and organic to reduce porosity, a second step of forming a conductor layer (2) of metallic paste on the ceramic sheet (10b), a third step of stacking a plurality of ceramic sheets (10b) into a laminate such that each ceramic sheet (10b) is sandwiched between conductor layers (2), and a fourth step of sintering the laminate. Since the conductor layer (2) is formed on the ceramic sheet (10b) with its porosity reduced, metallic components are hindered from passing into the ceramic sheet (10b). The conductor layer can be formed by transferring onto a ceramic sheet to suppress the diffusion of the metallic components of the conductor layer. This method reduces short circuits of ceramic devices and increases the yield rate.

Abstract: This invention provides a stacked ceramic body in which de-lamination (inter-layer peeling) does not easily occur, and a production method thereof. In the invention, a predetermined number of unit layers 151 and 152 each including a ceramic layer 111 112, an internal electrode layer 121, 122, a spacer 131, 132 having substantially the same thickness as the internal electrode layer 121, 122 and adhesive layers 14 stacked on the surface of the internal electrode layer and on the surface of the adhesive layer are stacked. A print portion for the internal electrode layer 121, 122 and a print portion for the spacer 131, 132 are formed on a green sheet for the ceramic layer 111, 112, and print portions for the adhesive layer 14 are formed on both of them to give an unsintered unit. The unsintered units are stacked to give an unsintered stacked body, are press-bonded and are then sintered.

Abstract: A monolithic self-constrained green body tape for use in low temperature ceramic co-firing is provided. The tape contains at least two layers: one low temperature ceramic layer containing particles of a glass, a ceramic, and an organic binder, and a self-constraining layer containing a refractory ceramic and a wetting agent for the glass in the first layer. When the tape is fired at a sintering temperature of the low temperature ceramic layer, densification occurs in the z (thickness) direction, but essentially no shrinkage (less than about 1%) occurs in the x-y planes. A method for forming a multilayer green body tape using simultaneous wet on wet ceramic slurry deposition is also provided. A dense, monolithic, low temperature, co-fired, self-constrained, multicomponent structure is also provided. The structure contains at least two multilayer ceramic substrates having electronic circuit components mounted thereon or therein.

Abstract: The present invention relates to a method to achieve the suppression of planar shrinkage in LTCC ceramic tape laminate structures without externally applied forces or sacrificial constraining tape. The method utilizes a non-sacrificial constraining tape that constrains a tape assembly.

Abstract: A method for fabricating a multilayered ceramic board includes forming a green laminate, the green laminate including a plurality of green base layers containing a low-temperature sinterable ceramic material which is a ceramic powder and a glass component, and a binder; at least one green constraining layer disposed in contact with a principal surface of a specific green base layer, the green constraining layer containing an inorganic material powder which is not sintered at the sintering temperature of the low-temperature sinterable ceramic material; and wiring conductors; and firing the green laminate at the sintering temperature of the low-temperature sinterable ceramic material. The firing step includes a binder removal step and a sintering step for obtaining the sintered state of the low-temperature sinterable ceramic material in which the ceramic powder is densified while the glass component is fluidized.

Abstract: A photoreactive resin composition contains (a) a powdered base metal, (b) an organic binder, (c) a photosensitive organic component, and (d) a polycarboxylic acid-based dispersing agent with a molecular weight of about 1,500 or less. Also disclosed is a method for making a circuit substrate or a ceramic multilayer substrate including the step of forming a conductive pattern using the photoreactive resin composition.

Abstract: A method to produce a distortion-free asymmetrical low-temperature co-fired ceramic structure comprising at least one layer of glass-containing internal constraining tape and at least one layer of glass-containing primary tape wherein the internal constraining tape and the primary tape are laminated to form an asymmetrical laminate and wherein a release layer is deposited on at least one surface of the laminate forming an assembly, wherein the surface is opposite the position of greatest asymmetry of the laminated layers and wherein the assembly is thermally processed producing a structure exhibiting an interactive suppression of x,y shrinkage.

Abstract: The method includes selecting two or more types of ceramic materials (202, 204), each having a distinct set of electrical properties different from the other of the types of ceramic materials. A substrate pattern can also be selected. The substrate pattern can comprise at least two types of distinct substrate areas having the distinct sets of electrical properties of the ceramic materials. Each distinct area can be selected so as to have dimensions much smaller than a wavelength at a frequency of interest. The ceramic materials (202, 204) can thereafter be fired and then cut into a size and shape consistent with the distinct areas to form dielectric pieces (206, 208). The process continues by selectively arranging the dielectric pieces on a base plate (302) in accordance with the pattern to form the textured ceramic dielectric substrate.

Abstract: An object of the present invention is to provide a ceramic substrate that is superior in heat uniformity and thermal shock resistance, and has a large chuck power in the case that the ceramic substrate is made to be an electrostatic chuck. The ceramic substrate of the present invention is a ceramic substrate comprising a conductor layer formed therein, characterized in that a section of the edge of the conductor layer is in a peaked shape.

Abstract: A multilayer thermistor with a positive temperature coefficient is manufactured by step 41 of forming a green laminate having thermistor green layers and internal electrode layers, step 42 of heat-treating this laminate at a temperature in the range of from 80 to less than 300° C., step 43 of performing dry-barrel polishing for the heat-treated green laminate, step 44 of forming external electrode films on respective end surfaces of this laminate, and step 45 of firing this laminate together with the individual electrode films. According to this method, a highly reliable multilayer thermistor with a positive temperature coefficient can be stably manufactured.

Abstract: In a method of manufacturing a laminated ceramic electronic component, a first transfer sheet in which a composite green sheet having a non-magnetic ceramic area and a magnetic ceramic area is supported by a supporting film, and a second transfer sheet in which a ceramic green sheet is supported by a supporting film are prepared. The method includes the first transfer step of sequentially transferring the ceramic green sheet onto a lamination stage, the second transfer step of transferring the composite green sheet, the third transfer step of transferring the ceramic green sheet of the second transfer sheet, and the step of obtaining a laminate.

Abstract: A method for making a monolithic piezoelectric ceramic element having high mechanical strength, excellent piezoelectricity, and high reliability is disclosed. The method includes the steps of applying a conductive paste including a conductor containing Ag as a principal ingredient to ceramic green sheets comprising a piezoelectric ceramic material containing a Pb compound, stacking the ceramic green sheets to form a laminate, and firing the laminate in an atmosphere with an oxygen concentration of about 90% by volume or more during the heating period and with an oxygen concentration of about 5% to 15% by volume during the isothermal period and during the cooling period.

Abstract: A method of manufacturing a fiber assembly, the method comprising: (a) providing a plurality of layers, each layer comprising sintered fibers of piezoelectric material aligned substantially parallel; (b) laminating the plurality of layers; and (c) applying a matrix material to the laminated layers to affix the layers and form a fiber assembly.

Abstract: The invention relates to a ceramic green body consisting of at least two ceramic bodies that are bonded together. The invention is characterised in that the green body is produced using an adhesive tape that consists of an adhesive film located on a release liner.

Abstract: A method of manufacturing a piezoelectric ceramic device having excellent piezoelectric characteristics and high reliability is described. The method includes the steps of coating conductive paste containing Ag as a main component on each of a plurality of ceramic green sheets each containing a piezoelectric ceramic material, laminating the plurality of ceramic green sheets to form a laminate, and burning the laminate under an atmospheric condition in which the oxygen concentrations in a heating process and a retention process are about 21% by volume or more, and the oxygen concentration in a cooling process is about 0.05% by volume to 3% by volume.

Abstract: An article comprising a ceramic material having a ceramic matrix composite backing adapted for use in a gas turbine engine is provided. The article comprises a structural ceramic material having a hot side facing toward a high temperature environment and a cold side facing away from the high temperature environment; and a ceramic matrix composite composition having a strength greater than the strength of the ceramic material attached to the back of the cold side of the ceramic material, whereby crack initiation and propagation are inhibited by the ceramic matrix composition to a greater degree than by the ceramic material.

Abstract: In a ceramic green-sheet stack to be fired to form a multilayered ceramic substrate having a cavity, a shrinkage-reducing pad is formed along a boundary interface between first ceramic green sheets having an opening for defining a cavity, and second ceramic green sheets having no opening. The shrinkage-reducing pad is exposed on the entire periphery of the inner peripheral surface of the cavity at the bottom end of the inner peripheral surface. The shrinkage-reducing pad contains a glass component, and serves to reduce shrinkage stress produced at the boundary interface between the first and second ceramic green sheets during the firing process.

Abstract: A method of producing a composite sheet in which a through hole formed in a predetermined portion of the first ceramic sheet is buried with a different kind of sheet having substantially the same thickness as the first ceramic sheet, such as a resin sheet a metal sheet or a ceramic sheet of a material different from that of the first ceramic sheet. A first method comprises a step of preparing a first ceramic sheet from a ceramic powder, and a different kind of sheet; a step of forming a through hole in a predetermined portion of the first ceramic sheet; a step of laminating the different kind of sheet on the ceramic sheet in which the through hole is formed; and a step of preparing a composite sheet by pressing the portion of the first ceramic sheet where the through hole is formed from the side of the different kind of sheet, such that the first ceramic sheet and the different kind of sheet are integrated together.

Abstract: A method for manufacturing a multi-layered ceramic substrate which enables to remove a shrinkage suppression sheet without damaging the multi-layered substrate. The shrinkage suppression sheets are formed on both faces of unfired laminated green sheets, and then the laminated green sheets are fired. For removing the shrinkage suppression sheets on both faces of the multi-layered ceramic substrate 2 after sintering, water, ceramic powder, or water and ceramic powder mixture is sprayed together with compressed air.

Abstract: A method for forming a low temperature cofired ceramic (LTCC) device includes forming a channel in a first LTCC tape layer. A wax is inserted in the channel. The wax is of a type that burns out at a temperature below a sintering temperature of the first LTCC tape layer. At least a second LTCC tape layer is stacked on the first LTCC tape layer to form a stack. The stack is pressed sufficiently for the first and second layers to bond into a laminate. The laminate is fired at the sintering temperature to form a sintered ceramic structure from the first and second LTCC tape layers, so that all or substantially all of the wax is burned out from the channel.

Abstract: A process for producing a ceramic member for bonding, which comprises: a first step of preparing a lower layer paste with the use of a first mixture comprising nickel, tungsten and molybdenum, applying the lower layer paste to a surface of a ceramic base which is a sintered ceramic, and drying the resultant coating layer to form a lower layer after the applying; a second step of preparing an upper layer paste with the use of a second mixture comprising one of nickel and nickel oxide and at least one of copper, copper oxide, manganese and manganese oxide, applying the upper layer paste to the lower layer, and drying the resultant coating layer to form an upper layer after the applying; and a third step of heating the lower layer and the upper layer to bake the lower layer and the upper layer.

Abstract: [Object] To produce a laminated electronic part which has a superior surge-proofing property, a sufficient resistance to a flux, and good electrical properties, without occurring of structural effects such as cracking, delamination, or the like.

Abstract: A manufacturing method for a laminated ceramic electronic component is performed such that the thickness of the inner electrode is greatly increased, delamination does not occur, and reliability is superior. The manufacturing method for the laminated ceramic electronic component includes a process in which a green sheet including the inner electrode paste layer and the ceramic paste layer, is provided on a carrier sheet such that the inner electrode paste layer penetrates the green sheet from the top surface to the bottom surface thereof, and a process, in which laminates of the green sheet and the carrier film are adhered by pressing, and thereafter the carrier film is peeled off, are repeated to obtain the ceramic laminate, and the ceramic laminate is fired after pressing in the direction of the thickness to obtain the ceramic sintered body.

Abstract: A composite substrate in which the surface of the insulating layer is not influenced by the electrode layer and which requires neither a grinding process nor a sol-gel process, is easy to produce and can provide a thin-film EL device having a high display quality when used therein; a thin-film EL device using the substrate; and a production process for the device. The thin-film EL device is produced by forming a luminescent layer, other insulating layer and other electrode layer successively on a composite substrate comprising a substrate; an electrode layer embedded in the substrate in such a manner that the electrode layer and the substrate are in one plane; and an insulating layer formed on the surface of a composite comprising the substrate and the electrode layer.

Abstract: A gas sensor is created comprising an electrochemical cell having a solid electrolyte layer disposed between an exhaust gas electrode and a reference electrode. A resistor is disposed in electrical communication with a heater and the reference electrode. The resistor can be disposed on a side of the gas sensor; on a side of the gas sensor such that the resistor is electrically connected through a via hole; over at least a portion of at least two sides of the gas sensor; or disposed in a void extending at least from the heater to the pump electrode, such that the void extends to at least a surface of the gas sensor, extends to at least partially through the gas sensor, or extends completely through the gas sensor. A method for using this gas sensor comprises applying a voltage to the heater within the gas sensor. A current is directed through the resistor to the reference electrode to pump oxygen into the reference electrode.

Abstract: In recent years, ceramic laminated devices are becoming a focus of great attention as considerable contribution to the miniaturization of high frequency wireless equipment such as a cellular phone, but it is difficult for the conventional ceramic laminated device to secure reliability while maintaining favorable high frequency characteristics. The present invention provides a ceramic laminated device including a reinforcement electrode, which is formed inside a laminated body in which a plurality of ceramic layers, a plurality of inner electrodes and inter-layer via holes are stacked, not electrically connected with inner electrodes nor inter-layer via holes but mechanically connected with the ceramic layers.

Abstract: A multilayer ceramic electronic component includes an electronic component body a notch formed in a side surface of the electronic component body, and a joining electrode formed by dividing a joining via hole conductor is formed at a portion of an inside surface defining the notch. A cover that is mounted to the electronic component body has a leg, with the leg of the cover being positioned inside the notch. By joining the leg to the joining electrode, the cover is secured to the electronic component body. The multilayer ceramic electronic component includes an LGA (land grid array) type external terminal electrode.

Abstract: A method of fabricating a thermal conductive plug of a ceramic substrate of a multi-chip package. A plurality of conductive openings and thermal conductive openings are formed on green tapes. A metal paste is filled into the conductive openings and the thermal conductive openings. The green tapes are stacked together so that the metal paste inside the conductive openings and the thermal conductive openings of every green tape is in contact respectively with its neighboring metal paste within the conductive openings and thermal conductive openings of the green tapes. Cofire those green tapes and the metal paste to form a pre-substrate. The pre-substrate comprises an insulating structure, a plurality of thermal conductive plugs and conductive plugs.

Abstract: A method for forming a multi-layer ceramic electronic device includes the steps of (a) forming a circuit layer with a pattern of contacts on a ceramic substrate, (b) forming at least a dielectric blank sheet with a pattern of through-holes on a supporting film, (c) filling each of the through-holes in the dielectric blank sheet with a conductive paste, (d) drying the conductive paste in the through-holes, (e) overlaying the dielectric blank sheet on the circuit layer on the ceramic substrate in such a manner that the through-holes are registered respectively with the contacts, and (f) pressing and heating the ceramic substrate and the dielectric blank sheet.

Abstract: A green laminated body is subjected to heat treatment in a pressurized atmosphere at a gauge pressure exceeding 0.1 MPa to thereby remove binder. The resulting green laminated body is fired and thereby yields an laminated body including internal electrodes made of a metal film.

Abstract: Very thin cast ceramic tape, preferably approximately 12 &mgr;m in thickness, is wrapped, preferably in a reversing spiral or helix, around a mandrel, preferably a mandrel made of steel and coated with a wax releasing agent, for so many times, preferably five or greater, as achieves a desired thickness of a tube wall, preferably about 100 &mgr;m. The green ceramic tube is then laminated in a pressure laminator, preferably a hydrostatic laminator at 3000 to 5000 psi, linking polymer chains between each ceramic layer, cross-linking polymer chains within each ceramic layer, and densifying the produced ceramic laminate tube by reducing porosity.

Abstract: A ceramic green sheet having good surface roughness and few pinhole defects even when producing a thin ceramic green sheet is stably produced, to permit efficiently and securely manufacturing a multilayer ceramic electronic part in which deterioration of its life due to unevenness of interfaces between internal electrodes and ceramic layers and the occurrence of structural defects, such as delamination, bending of an electrode portion, etc., in a multilayer thin film to be suppressed. A dry sheet obtained by forming ceramic slurry to a sheet on a carrier film is smoothed by pressing using a plate press, a hydrostatic press or a calender roll under predetermined temperature and pressure conditions to improve the surface smoothness of the ceramic green sheet independently of the particle diameter of the ceramic and its dispersibility. An electrode paste is coated in a predetermine pattern on the thus-produced ceramic green sheet to form a sheet provided with an electrode.

Abstract: A method of forming a novel high temperature superconducting Josephson junction which is capable of achieving a formation of a Josephson junction having high characteristic conveniently and quickly without necessitating costly micromachining facilities. Two high temperature superconducting whisker crystals are crossed with each other on a substrate and subjected to thermal treatment to form a Josephson junction between the two high temperature superconducting whisker crystals.

Abstract: A process for the manufacture of a multilayer ceramic substrate includes fabricating the multilayer ceramic substrate from a monolith fabricated from universal layers and a monolith fabricated from custom layers. The universal layer monolith and the custom layer monolith are then joined to form the complete structure of the MLC substrate.

Abstract: A fabrication process for ferrite toroids which utilizes ferrite ceramic tape having an improved elongation characteristic. The process utilizes a set of rigid mandrels which are employed in the final lamination to support the rectangular cross section of the internal cavity of a respective ferrite tube, thereby reducing stress concentration and permitting the highest lamination pressure to be used in the final step. The mandrels are removed prior to panel densification. The tape and mandrels operate together to minimize cracks and pores in the toroids and provide an added advantage of maintaining high tolerances in the internal cavity dimensions as well as the cavity-to-cavity alignment.

Abstract: A green sheet stack having a cavity is produced, and a shrinkage-reducing sheet containing inorganic powder material, which is not fired in a step of firing the green sheet stack, is prepared. The shrinkage-reducing sheet is placed so as to close an aperture of the cavity and to cover an end face in the sheet-stacking direction of the green sheet stack. The green sheet stack is pressed via an elastic member in the sheet-stacking direction so that the shrinkage-reducing sheet is cut and a shrinkage-reducing sheet piece formed of a cut portion of the shrinkage-reducing sheet is placed on a bottom surface of the cavity. The green sheet stack is fired in such a state in which the shrinkage-reducing sheet piece is placed on the bottom surface of the cavity.

Abstract: In a method for manufacturing a laminated ceramic electronic component, a first transfer member and a second transfer member are prepared on a lamination stage to produce the laminated ceramic electronic component. The first transfer member includes a conductor-attached composite green sheet having a conductor on a portion of the surface thereof, including a non-magnetic ceramic region and a magnetic ceramic region, and a first carrier film that carries the conductor-attached composite green sheet. The second transfer member includes a ceramic green sheet and a carrier film that carries the ceramic green sheet. The laminated ceramic electronic component is thus produced through a first transfer step in which the ceramic green sheets are successively transferred, through a second transfer step in which the conductor-attached composite green sheet is transferred, and through a third transfer step in which the ceramic green sheet of the second transfer member is transferred.