Utilizing Change Of State Patents (Class 165/104.21)
  • Publication number: 20130020054
    Abstract: The present invention is directed to a cooling system for removing heat from a Fischer-Tropsch (F-T) slurry reactor. The cooling system including a downcomer disposed within the F-T reactor to deliver a coolant downward through the F-T reactor at a predetermined velocity. The downcomer and the pressure of the introduced coolant cooperate to increase the coolant velocity, thereby maintaining the coolant in the substantially liquid phase in the downcomer. The cooling system further includes a plenum connected to the downcomer, wherein the coolant remains in the substantially liquid phase. Additionally, the cooling system includes at least one riser extending upward from the plenum, wherein a portion of the coolant vaporizes to provide a boiling heat transfer surface on the at least one riser.
    Type: Application
    Filed: September 5, 2012
    Publication date: January 24, 2013
    Inventors: H. Lynn Tomlinson, William Manning, William Schaefer, Tsungani Record
  • Publication number: 20130014916
    Abstract: A system and related method that provides, but is not limited thereto, a thin structure with unique combination of thermal management and stress supporting properties. An advantage associated with the system and method includes, but is not limited thereto, the concept providing a multifunctional design that it is able to spread, store, and dissipate intense thermal fluxes while also being able to carry very high structural loads. An aspect associated with an approach may include, but is not limited thereto, a large area system for isothermalizing a localized heating source that has many applications. For example it can be used to mitigate the thermal buckling of ship deck plates, landing pad structures, or any other structures subjected to localized heating and compressive forces.
    Type: Application
    Filed: January 13, 2011
    Publication date: January 17, 2013
    Applicant: UNIVERSITY OF VIRGINIA PATENT FOUNDATION
    Inventors: Haydn N.G. Wadley, Hossein Haj-Hariri, Frank Zok, Pamela M. Norris
  • Patent number: 8354040
    Abstract: Phase change materials that include oleochemical carbonates absorb and release latent heat upon changing phases from solid to liquid (melting) or from liquid to solid (solidifying). The oleochemical carbonates are prepared from oleochemical alcohols derived from animal fats and vegetable oils or other bio-based substances. These oleochemical carbonates have melting temperatures with a relatively high heat of fusion and are non-corrosive. Oleochemical carbonates can be mixed together in various proportions to adjust melting/solidification temperature ranges as required by a particular application.
    Type: Grant
    Filed: May 14, 2010
    Date of Patent: January 15, 2013
    Assignee: The United States of America as represented by the Secretary of Agriculture
    Inventor: James A. Kenar
  • Publication number: 20130009399
    Abstract: A method and apparatus for a vacuum tube configured to produce heat during operation. A boiler is configured to hold a fluid used to cool at least a portion of the vacuum tube during operation, wherein the fluid, when used to cool at least the portion of the vacuum tube, produces vapor. A turbine is configured to receive at least a first portion of the vapor produced when the fluid is used to cool at least the portion of the vacuum tube, wherein the turbine, when at least the first portion of the vapor produced when the fluid is used to cool at least the portion of the vacuum tube is received, is further configured to convert into electrical energy at least the first portion of the vapor produced when the fluid is used to cool at least the portion of the vacuum tube.
    Type: Application
    Filed: July 9, 2012
    Publication date: January 10, 2013
    Inventor: Kevin L. BROWN
  • Publication number: 20130008630
    Abstract: A cooling assembly for cooling of a heat generating component (5) is provided. The cooling assembly comprises a heat sink (1) and at least one thermally conductive plate (2) attached to one side of the heat sink, where the plate is adapted to be in direct thermal contact with the heat generating component. The cooling assembly comprises at least one elongated heat conductor (3), which at least partly is embedded into the heat sink. The cooling assembly also comprises a plurality of fins (4) protruding from the heat sink. In the cooling assembly, the plate is at least partly embedded into the heat sink, and at least one of the heat conductors is adapted to be in direct thermal contact with the heat generating component.
    Type: Application
    Filed: March 18, 2010
    Publication date: January 10, 2013
    Applicant: TELEFONAKTIEBOLAGET L M ERICSSON (PUBL)
    Inventor: Haibo Yuan
  • Publication number: 20130008629
    Abstract: A thermal module includes a base and at least one heat pipe. The base has at least one groove formed on one face thereof and a recess formed on another opposite face thereof, and the recess is communicable with the at least one groove. The at least one heat pipe is correspondingly fitted in the at least one groove with one surface of the heat pipe flushing with a bottom of the groove to direct contact with a heat source, so as to avoid thermal resistance and more securely locate the heat pipe in the groove, allowing the thermal module to provide largely increased heat dissipation performance. A method of manufacturing the above thermal module is also disclosed.
    Type: Application
    Filed: July 5, 2011
    Publication date: January 10, 2013
    Inventor: Chun-Ming Wu
  • Patent number: 8351207
    Abstract: A heat pipe includes a conductive hollow case, a conductive capillary layer, a piezoelectric component, and a flexible component. The conductive hollow case has a first end and a second end. The first end is connected to a heat-generating component. The second end is a heat-dissipating end. The conductive capillary layer is formed on an inner wall of the conductive hollow case. A liquid stored in the conductive capillary layer can be heated to evaporate by the heat-generating component and then move toward the second end. The piezoelectric component is connected to the conductive capillary layer. The flexible component is disposed at a side of the piezoelectric component for being driven by the evaporated liquid so as to exert force upon the piezoelectric component. Thus, the piezoelectric component can generate electric energy, which can be transmitted from the conductive capillary layer to the conductive hollow case.
    Type: Grant
    Filed: January 26, 2011
    Date of Patent: January 8, 2013
    Assignee: Wistron Corporation
    Inventors: Yung-Li Jang, Chia-Feng Huang, Ming-Chi Kao, Ming-Chih Chen
  • Patent number: 8349552
    Abstract: A new blood unit cooling system was designed to cool blood rapidly to about 22° C. and maintain it at about that temperature, even in ambient temperature extremes, for several hours. The system incorporating a preferred eutectic solution including 98% 1-dodecanol, 1.5% myristyl alcohol and 0.5% 1-decanol (having, a melting point of about 23° C.) contained in a sealed flexible polymer layer, was used to cool whole blood-filled bags. The preferred design uses inner and outer containers, each made of transparent polyethylene sheets, where the inner compartments are filled with the solution and sealed, and then placed into each compartment in an outer container, wherein two compartments in the outer container are separated by a flattened and sealed portion of the polyethylene.
    Type: Grant
    Filed: March 27, 2012
    Date of Patent: January 8, 2013
    Assignee: TCP Reliable, Inc.
    Inventors: Klaus H. Haarmann, Anthony Alleva, Thomas-Laurent Bingas
  • Publication number: 20120325436
    Abstract: Disclosed are methods and apparatuses for cooling a work piece surface using two-phase impingement, such as direct jet impingement. Preferred methods include flowing a coolant through a chamber comprising a surface to be cooled by projecting a jet stream of coolant against the surface while maintaining pressure in the chamber to permit at least a portion of coolant contacting the surface to boil. Preferred apparatuses include a chamber comprising the surface and tubular nozzles configured to project a stream of coolant against the surface, a pump for forcing coolant through the tubular nozzles, a pressurizer for maintaining an appropriate pressure in the chamber, and a heat exchanger for cooling the coolant exiting the chamber. The apparatuses may further include a pressure regulator for detecting changes in temperature of the coolant exiting the chamber and communicating with the pressurizer to adjust the maintained pressure accordingly.
    Type: Application
    Filed: June 27, 2011
    Publication date: December 27, 2012
    Inventor: Timothy A. Shedd
  • Publication number: 20120318355
    Abstract: A heat transfer device having a working fluid capable of circulating around a fluid flow path, the circulation around the fluid flow path bringing the working fluid in and out of thermal contact with a heat source, the heat transfer device comprising: a fluid containing portion internally defining a working fluid flow path; a heat source at least partially in thermal contact with the fluid containing portion; a gas substance generator at least partially within the fluid containing portion, and arranged to generate bubbles of vapor capable of driving the working fluid along a portion of the working fluid flow path in thermal contact with the heat source; wherein, in use, the driven working fluid absorbs heat from the heat source and transports the heat away from the heat source; and the driven working fluid returns to the gas substance generator to be recycled about the fluid flow path.
    Type: Application
    Filed: March 21, 2012
    Publication date: December 20, 2012
    Applicant: Naked Energy Ltd.
    Inventors: Richard Boyle, Christophe Williams, Norman Cottington
  • Publication number: 20120312505
    Abstract: The invention relates to a method implementing liquid CO2 as a cryogenic fluid for transferring negative calories to products, said method being of a so-called indirect injection type wherein the liquid CO2 is sent into a heat exchanger system where same evaporates, the method being characterized in that, prior to reaching the exchanger system, the liquid CO2 undergoes an expansion operation, at a pressure selected to obtain a gas/solid mixture at the output of the expansion operation.
    Type: Application
    Filed: January 27, 2011
    Publication date: December 13, 2012
    Inventors: Mohammed Youbi-Idrissi, Thierry Dubreuil
  • Publication number: 20120312504
    Abstract: A boiling refrigerant type cooling system to suppress overshoot upon start of heat generation and realize stable start of boiling. In the boiling refrigerant type cooling system, a metal boiling heat transfer unit has a base in thermal contact with a heat generating body. The boiling heat transfer unit is in contact with a liquid refrigerant. The boiling heat transfer unit has plural parallel tunnels communicating with the outside via holes or gaps under its surface, a groove deeper than a tunnel diameter formed through all the tunnels in an orthogonal direction to the tunnels, and a cover plate on the groove.
    Type: Application
    Filed: June 12, 2012
    Publication date: December 13, 2012
    Applicant: HITACHI, LTD.
    Inventors: Kazuaki Suzuki, Shigemasa Sato, Akio Idei
  • Publication number: 20120312506
    Abstract: A loop heat pipe includes an evaporator to vaporize a working fluid due to heat supplied from an external heat source; a condenser to cause the vaporized working fluid to condense; and connecting lines to connect the evaporator and the condenser in a loop, wherein the evaporator includes a first space defined by a set of walls including a contact wall that comes into contact with the external heat source, a second space provided adjacent to at least one of the walls other than the contact wall, and a through-hole formed in a dividing wall separating the first space and the second space to allow the first space and the second space to communicate with each other.
    Type: Application
    Filed: August 22, 2012
    Publication date: December 13, 2012
    Applicant: FUJITSU LIMITED
    Inventors: Hiroki UCHIDA, Takeshi SHIOGA, Shigenori AOKI, Susumu OGATA, Hideaki NAGAOKA
  • Patent number: 8327921
    Abstract: A fin assembly includes a plurality of fins interconnected together. Each of the fins includes a main body defining a plurality of openings and a plurality of locking units formed on the main body beside the plurality of openings, respectively. Each of the locking units includes an extension tab, a locking tab and a connecting tab. An engaging hole is defined in the extension tab. The locking tab forms an elastically deformable finger thereon. A locking tab of a fin is received in a corresponding opening of an adjacent fin. A free end of the locking tab of the fin resists on a connecting tab of the adjacent fin. A finger of the fin is engaged into an engaging hole of the adjacent fin.
    Type: Grant
    Filed: June 11, 2009
    Date of Patent: December 11, 2012
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventor: Xin-Xiang Zha
  • Publication number: 20120305830
    Abstract: The invention provides a heat transfer composition consisting essentially of from about 45 to about 58% by weight trans-1,3,3,3-tetrafluoropropene (R-1234ze(E)) and from about 42 to about 55% by weight of 1,1-difluoroethane (R-152a). The invention also provides a heat transfer composition comprising from about 40 to about 60% by weight R-152a, from about 5 to about 50% R-134a, and from about 5 to about 50% by weight R-1234ze(E).
    Type: Application
    Filed: February 14, 2011
    Publication date: December 6, 2012
    Applicant: Mexichem Amanco Holdings S.A. de C.V.
    Inventor: Robert E. Low
  • Patent number: 8322154
    Abstract: A cooling system and method are provided for facilitating two-phase heat transfer from an electronics system including a plurality of electronic devices to be cooled. The cooling system includes a plurality of evaporators coupled to the electronic devices, and a coolant loop for passing system coolant through the evaporators. The coolant loop includes a plurality of coolant branches coupled in parallel, with each coolant branch being coupled in fluid communication with a respective evaporator. The cooling system further includes a control unit for maintaining pressure of system coolant at a system coolant supply side of the coolant branches within a specific pressure range at or above saturation pressure of the system coolant for a given desired saturation temperature of system coolant into the evaporators to facilitate two-phase heat transfer in the plurality of evaporators from the electronic devices to the system coolant at the given desired saturation temperature.
    Type: Grant
    Filed: September 9, 2009
    Date of Patent: December 4, 2012
    Assignee: International Business Machines Corporation
    Inventors: Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons
  • Patent number: 8325321
    Abstract: The present invention relates to a lithography system for projecting an image or an image pattern on to a target such as a wafer. Energy that is accumulated in the target by the projection of the image or image pattern is removed from said target, such that expansion by local and/or overall heating is limited to a relevant pre-defined value, and wherein such heat removal is realised by the use of a phase transition in a heat absorbing material that is brought into thermal contact with said target. As a further elaboration, such material may be applied in combination with a further material having a superior coefficient of heat transport, and may be incorporated in an emulsion comprising a material having a superior coefficient of heat transfer. Said material may e.g. be adhered to a bottom face of the target, and may also be included in a frame.
    Type: Grant
    Filed: July 24, 2007
    Date of Patent: December 4, 2012
    Assignee: Mapper Lithography IP B.V.
    Inventors: Pieter Kruit, Michel Pieter Dansberg, Marco Jan-Jaco Wieland
  • Publication number: 20120301585
    Abstract: A system (1) and a method for cooling freshly baked bread under sub-pressure, which system includes: a sub-pressure chamber (2) which is adapted for receiving freshly baked bread for the cooling thereof; a sub-pressure source (3), such as a vacuum pump, which is connected to the sub-pressure chamber (2) for exhausting fluid from the sub-pressure chamber (2) and creating a sub-pressure inside it; a condenser (4) for cooling steam exhausted from the sub-pressure chamber and separate condensed water (19) from it. The system also includes a heating tank (5) with a first heat exchanger (6) in which the heat generated by the condenser (4) is used for heating water.
    Type: Application
    Filed: January 27, 2011
    Publication date: November 29, 2012
    Applicant: REVENT INTERNATIONAL AB
    Inventor: Kurt Spirig
  • Publication number: 20120298142
    Abstract: An appliance such as a dishwasher is configured to re-circulate air to reduce the amount of air with high moisture content that is expelled from the dishwasher. In one embodiment, the dishwasher comprises a wash zone in which objects are positioned to be washed and a door assembly, secured to the dishwasher in sealing engagement. Air from an upper region of the wash zone is drawn into a door cavity in the door assembly and re-circulated to a lower region of the wash zone. Inside of the door cavity is a thermal sink with a surface on which vapor in the air condenses, thereby lowering the relative humidity of the air that is ejected from the door assembly and into the lower region of the wash zone.
    Type: Application
    Filed: May 26, 2011
    Publication date: November 29, 2012
    Inventors: Brent Alden Junge, David Beers, Nicholas Okruch, JR., Richard Henderson, Ranjeet Patil
  • Publication number: 20120298909
    Abstract: The invention provides a heat transfer composition comprising (i) from about 45 to about 75% by weight 2,3,3,3-tetrafluoropropene (R-1234yf); and (ii) from about 25 to about 55% by weight 1,1,1,2-tetrafluoroethane (R-134a). A heat transfer composition comprising, optionally consisting essentially of, (i) from about 20 to about 90% by weight R-1234yf; (ii) from about 10 to about 60% by weight R-134a; and (iii) from about 1 to about 20% by weight R-32 is also provided.
    Type: Application
    Filed: April 16, 2010
    Publication date: November 29, 2012
    Applicant: MEXICHEM AMANCO HOLDING S.A. de C.V.
    Inventor: Robert E. Low
  • Patent number: 8320128
    Abstract: An exemplary server system includes a server cabinet, multiple racks arranged in the server cabinet, multiple servers mounted on the racks, and a heat dissipation device for cooling the servers. The heat dissipation device includes a fan module and a dissipating module. The fan module is arranged over the racks for generating downwards airflow across the servers to exchange heat with the servers. The dissipating module is arranged over the racks to exchange heat with the airflow after the airflow passes the servers.
    Type: Grant
    Filed: October 22, 2010
    Date of Patent: November 27, 2012
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Chao-Ke Wei
  • Patent number: 8316921
    Abstract: A heat sink includes a fin assembly including a plurality of fins and a plate type heat pipe attached to the fin assembly. The plate type heat pipe includes a sealed shell in which a working fluid is filled, a wick layer formed on an inner face of the shell and a supporting member disposed in the shell. The supporting member includes a plurality of supporting portions and a plurality of bodies connecting the supporting portions. Each supporting portion includes a plurality of convex portions contacting a top of the wick layer and a plurality of concave portions contacting a bottom of the wick layer. The convex portions and the concave portions of each supporting portion are alternately arranged. Each convex portion and an adjacent concave portion cooperatively enclose a first through hole for the working fluid flowing therethrough.
    Type: Grant
    Filed: September 4, 2009
    Date of Patent: November 27, 2012
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Chuen-Shu Hou, Jiang-Jun Hu, Min Lu, De-Yu Wang
  • Patent number: 8316927
    Abstract: A waste heat recovery device includes a heat pipe in which a working fluid for transporting heat is enclosed, and a mode-switching valve for switching a heat recovery mode and a heat insulation mode. The heat pipe has a heating part for heating and evaporating the working fluid and a cooling part for cooling and condensing the evaporated working fluid. The heating part is made of a steel through which hydrogen gas permeates about at 500° C. and higher. In the heat recovery mode, the waste heat recovery device recovers heat of exhaust gas by using the heat pipe. Furthermore, in the heat insulation mode, a heat transport from the heating part to the cooling part is stopped.
    Type: Grant
    Filed: June 5, 2007
    Date of Patent: November 27, 2012
    Assignee: Denso Corporation
    Inventors: Kimio Kohara, Seiji Inoue, Yuuki Mukoubara, Yasutoshi Yamanaka, Masashi Miyagawa
  • Patent number: 8319154
    Abstract: A self-heating fluid connector comprising a housing in which is provided exothermic phase change material and one or more fluid channels extending from one end of the housing to the other, in thermal communication with the exothermic phase change material, whereby fluid passing through the fluid conduits is heated by the exothermic phase change material. The self-heating connector is particularly suited for use with a fluid container and a fluid delivery port such as a baby's bottle and feeding teat.
    Type: Grant
    Filed: April 12, 2006
    Date of Patent: November 27, 2012
    Inventors: Jim Shaikh, David Hartwanger, Mike Watkinson
  • Publication number: 20120294737
    Abstract: An autonomous self-powered system for cooling radioactive materials comprising: a pool of liquid; a closed-loop fluid circuit comprising a working fluid having a boiling temperature that is less than a boiling temperature of the liquid of the pool, the closed-loop fluid circuit comprising, in operable fluid coupling, an evaporative heat exchanger at least partially immersed in the liquid of the pool, a turbogenerator, and a condenser; one or more forced flow units operably coupled to the closed-loop fluid circuit to induce flow of the working fluid through the closed-loop fluid circuit; and the closed-loop fluid circuit converting thermal energy extracted from the liquid of the pool into electrical energy in accordance with the Rankine Cycle, the electrical energy powering the one or more forced flow units.
    Type: Application
    Filed: April 18, 2012
    Publication date: November 22, 2012
    Inventors: Krishna P. Singh, Indresh Rampall, Joseph Rajkumar
  • Publication number: 20120291997
    Abstract: A liquid cooling device includes a heat absorbing part, a first transmitting tube, a second transmitting tube, and a heat dissipation part, wherein the heat absorbing part has a heat block, a first expansion pipe, and a second expansion pipe. The heat block is connected to an external heat-generating component, and includes a plurality of flow channels to facilitate the flow of a coolant for absorbing the heat generated from the external heat-generating component. The first expansion pipe and the second expansion pipe are connected to the heat block respectively. The first transmitting tube and the second transmitting tube are connected to the heat dissipation part respectively to form a cooling cycle among the heat absorbing part, the first transmitting tube, the second transmitting tube, and the heat dissipation part for allowing the cooling fluid to circulate in the cycle.
    Type: Application
    Filed: March 27, 2012
    Publication date: November 22, 2012
    Inventors: Chien-An Chen, Hsing-Yu Chiang
  • Publication number: 20120285190
    Abstract: A heat transfer pipe for a heat exchanger including high threads and low threads that are lower than the high threads. The high threads and the low threads are provided at respective prescribed heights in a helical manner in a pipe axial direction on an inner surface of a pipe, the high threads are formed with 11 to 19 threads, the low threads are formed with 3 to 6 threads between each pair of the high threads, the high threads before expansion of the pipe each have a trapezoidal shape in cross-section so that a crest before the expansion of the pipe is flat, and a ratio W1/D of a tip width W1 of the crest portion after the expansion of the pipe to an outer diameter of the heat transfer pipe is 0.011 to 0.040. Further, the high threads before the expansion of the pipe are higher by 0.04 mm or more than the low threads.
    Type: Application
    Filed: January 7, 2011
    Publication date: November 15, 2012
    Applicant: MITSUBISHI ELECTIRC CORPORATION
    Inventors: Sangmu Lee, Toru Onoda, Takuya Matsuda, Akira Ishibashi
  • Publication number: 20120285663
    Abstract: A condensing device and a thermal module using same are disclosed. The condensing device includes a hollow main body having a first inlet, a first outlet, and a flow-guiding zone. In the flow-guiding zone, there is provided a plurality of spaced flow-guiding members to define at least one flow passage therebetween. The at least one flow passage is communicable at two opposite ends with the first inlet and the first outlet. The thermal module is formed by connecting the first inlet and the first outlet of the condensing device to a second outlet and a second inlet of a heat-absorption unit, respectively, via two separate heat-transfer units. With the flow-guiding zone provided in the condensing device, it is able to accelerate the vapor-liquid circulation in the condensing device to thereby provide upgraded heat transfer efficiency.
    Type: Application
    Filed: May 10, 2011
    Publication date: November 15, 2012
    Inventor: Chun-Ming Wu
  • Publication number: 20120279686
    Abstract: Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.
    Type: Application
    Filed: May 6, 2011
    Publication date: November 8, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Timothy J. CHAINER, David P. GRAYBILL, Madhusudan K. IYENGAR, Vinod KAMATH, Bejoy J. KOCHUPARAMBIL, Roger R. SCHMIDT, Mark E. STEINKE
  • Publication number: 20120279685
    Abstract: A phase-change turbo-dissipation cooler comprises a heat extracting apparatus and a heat dissipating apparatus. The heat extracting apparatus includes a closed container having an outlet nozzle and an inlet, the closed container being filled with a liquid of low boiling point. The heat dissipating apparatus includes a chambered body, an air supply tube, a vapor tube, and a condensing tube. The chambered body is provided with a common shaft, a turbine, and a blower. The condensing tube is provided with multiple fins and an expansion valve and connected between the vapor tube and the closed container. The liquid can be vaporized in the closed container by a heat source to blow into the chambered body to rotate the turbine together with the blower and then flow back to the closed container. The blower can suck in ambient air to blow through the fins on the condensing tube to dissipate heat.
    Type: Application
    Filed: May 4, 2011
    Publication date: November 8, 2012
    Inventor: TE-LIN YU
  • Publication number: 20120280580
    Abstract: Cooling apparatus and methods for a fractional-horsepower motor. Motor cooling apparatus includes a heat shoe, a heat diffuser, and a heat pipe coupled therebetween. The heat shoe is configured to partially cover a portion of, and to receive motor thermal energy from, the motor. The heat pipe is coupled to the heat shoe, and is configured to convey the motor thermal energy from the heat shoe. Heat diffuser can be coupled to receive motor thermal energy from the heat pipe. It is configured to diffuse at least a portion of the motor thermal energy into an ambient atmosphere. A thermal sensor is coupled to the motor and configured to sense a motor thermal condition; and a fan can be coupled to the thermal sensor through a controller. The controller is configured to control the speed of the fan relative to the motor thermal condition sensed by the thermal sensor.
    Type: Application
    Filed: May 4, 2011
    Publication date: November 8, 2012
    Applicant: Aurora Office Equipment Co., Ltd. Shanghai
    Inventors: Yung Kang Tso, Guang Long Chen
  • Patent number: 8305754
    Abstract: A structure of heat dissipation of an electronic device includes at least one heat pipe and a cooler. The heat pipe has a condensation end and an evaporation end opposite to each other, and the evaporation end is disposed on a heat generating element of the electronic device. The cooler is disposed on a rack and has a chamber therein, and the chamber has an inner shell having a cooling fluid therein. When the electronic device is mounted in the rack, the condensation end of the heat pipe is inserted into the cooler and positioned into the inner shell. The evaporation end absorbs the heat energy of the heat generating element, and transfers the heat energy to the condensation end, such that the cooling fluid dissipates the heat energy of the condensation end.
    Type: Grant
    Filed: December 30, 2010
    Date of Patent: November 6, 2012
    Assignee: Industrial Technology Research Institute
    Inventors: Hsi-Sheng Wu, Hsu-Cheng Chiang, Kuo-Shu Hung, Neng-Tan Lin
  • Publication number: 20120274430
    Abstract: Exemplary embodiments are directed to a heat exchanger system for transformers or reactors having at least one coil being cooled by gaseous fluids circulating around the transformer. The system having an enclosure that houses the transformer and the at least one coil, where flow of cooling gaseous fluid passes over the coil and is heated by the heat of the transformer or reactor the heated gas is directed to pass over a thermosiphon heat exchanger which dissipates the heat to a cooling media.
    Type: Application
    Filed: May 24, 2012
    Publication date: November 1, 2012
    Applicant: ABB Technology AG
    Inventors: Benjamin Weber, Bruno Agostini, Jens Tepper, Marcos Bockholt, Stephane Schaal
  • Patent number: 8297343
    Abstract: A heat absorbing or dissipating device has a multi-pipe arrangement for flowing thermal conductive fluids having a temperature difference. The thermal conductive fluids are reversely transported by a first fluid piping and second fluid piping of the multi-pipe arrangement and configured in way such that the piping has a parallel arrangement on a same end side of a heat dissipation or absorption receiving article or space.
    Type: Grant
    Filed: October 15, 2008
    Date of Patent: October 30, 2012
    Inventor: Tai-Her Yang
  • Publication number: 20120267077
    Abstract: Cooling apparatuses and power electronics modules with cooling apparatuses are disclosed. In one embodiment, a cooling apparatus includes a heat transfer plate having a heat output surface and a periodic fractal pattern formed in the heat output surface. The periodic fractal pattern increases the surface area of the heat output surface and provides vapor bubble nucleation sites. An enclosure encloses the heat transfer plate and forms a fluid chamber between the enclosure and the heat transfer plate. A fluid source is fluidly coupled to the fluid chamber and provides cooling fluid to the fluid chamber. When the heat transfer plate is thermally coupled to the heat source, the heat source heats the transfer plate which vaporizes the cooling fluid in the fluid chamber thereby dissipating the heat of the heat source.
    Type: Application
    Filed: April 21, 2011
    Publication date: October 25, 2012
    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventor: Ercan Mehmet Dede
  • Publication number: 20120268877
    Abstract: A thermosiphon system includes a condenser and an evaporator fluidically coupled to the condenser by a condensate line.
    Type: Application
    Filed: April 25, 2011
    Publication date: October 25, 2012
    Inventors: Jeremy Rice, Bill Dailey, Jeffrey Spaulding
  • Publication number: 20120267550
    Abstract: A conditioning system for conditioning a part of a lithographic apparatus, includes an evaporator positioned in thermal contact with the part for extracting heat from the part by evaporation of a fluid inside the evaporator; a condenser for removing heat from the fluid inside the condenser; fluid lines arranged between the evaporator and the condenser to form a fluid circuit; a pump arranged in the circuit to circulate the fluid in the circuit; an accumulator to hold fluid, wherein the accumulator is in fluid communication with the circuit and comprises a heat exchanger to transfer heat from or to fluid inside the accumulator; a temperature sensor to provide a signal representative of the fluid temperature; and a controller to maintain a substantially constant temperature of the fluid inside the circuit by regulating the amount of heat transferred by the heat exchanger based on the signal.
    Type: Application
    Filed: April 17, 2012
    Publication date: October 25, 2012
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Sjoerd Nicolaas Lambertus DONDERS, Vadim Yevgenyevich Banine, Johannes Hubertus Josephina Moors, Martinus Cornelis Maria Verhagen, Olav Waldemar Vladimir Frijns, Gerrit Van Donk, Henk Jan Van Gerner
  • Patent number: 8291967
    Abstract: A heat sink includes a plurality of fins. The fins are formed to serve as partition walls of flow paths of a coolant. The fins are formed such that the coolant flows along a surface thereof. A merge space is formed to allow the coolant in the flow paths separated by the fins to merge. The merge space is formed in the flow paths formed by the fins.
    Type: Grant
    Filed: June 12, 2007
    Date of Patent: October 23, 2012
    Assignee: Toyota Jidosha Kabushiki Kaisha
    Inventors: Tadafumi Yoshida, Hiroshi Osada, Yutaka Yokoi
  • Publication number: 20120261093
    Abstract: A heat pipe comprises a housing that has a heating section that is made of metal and is contacted by a heating element, a cooling section that is made of metal and is cooled by a cooling element, and a plurality of refrigerant flow channels formed inside the housing from the heating section to the cooling section; refrigerant that is enclosed inside the plurality of refrigerant flow channels; and heat-insulating layers that are disposed between the plurality of refrigerant flow channels located at least at the heating section in the housing.
    Type: Application
    Filed: November 14, 2011
    Publication date: October 18, 2012
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Yukio Miyachi, Hiroshi Osada, Norifumi Furuta
  • Patent number: 8286693
    Abstract: A heat sink assembly includes a base plate having a top surface provided with cooling fins, and a bottom surface with an open channel, the channel having remote regions and a central region with a rectangular cross-section. A heat pipe arrangement including at least two sections is nested in the channel, each section having at least one evaporator section and a condenser section, wherein the evaporator sections are juxtaposed side by side in the central region, and the condenser sections are in respective remote regions. The arrangement is preferably a single S-shaped heat pipe with a pair of hooked ends and a center section which form the evaporator sections, the evaporator sections each having a rectangular profile and an exposed surface which is flush with the bottom surface of the base plate, the condenser sections connecting the evaporator sections and being recessed below the bottom surface.
    Type: Grant
    Filed: April 17, 2008
    Date of Patent: October 16, 2012
    Assignee: Aavid Thermalloy, LLC
    Inventors: Bradley R. Whitney, Sukhvinder S. Kang
  • Patent number: 8289699
    Abstract: A heat dissipation module includes a centrifugal fan, a fin group, a first heat pipe and a second heat pipe. The centrifugal fan includes a housing and an impeller rotatably mounted in the housing. The housing defines an air inlet and an air outlet therein. The fin group is disposed at the air outlet of the centrifugal fan. The fin group includes a plurality of spaced fins. The first heat pipe includes a condensing section thermally contacting the fin group and an evaporating section for thermally contacting a heat source. The second heat pipe includes a condensing section thermally contacting the condensing section of the first heat pipe and an evaporating section for thermally contacting another heat source.
    Type: Grant
    Filed: October 24, 2010
    Date of Patent: October 16, 2012
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Ching-Bai Hwang, Jui-Wen Hung
  • Patent number: 8286694
    Abstract: The present invention provides an apparatus including aluminum alloy vessel, the vessel including aluminum in combination with a gettering metal and a method for making such apparatus.
    Type: Grant
    Filed: June 29, 2010
    Date of Patent: October 16, 2012
    Assignee: Thermal Corp.
    Inventors: John H. Rosenfeld, G. Yale Eastman
  • Publication number: 20120255288
    Abstract: A heat exchanger plate for an evaporator includes a flow transverse distribution device. Disks of the flow transverse distribution device conduct the medium to be evaporated to the flow channel extending in the direction of the longitudinal axis. The disks include openings allowing a flow of the medium in the direction of the longitudinal axis with comparatively higher flow resistance than in the direction of the transverse axis. The number of disks arranged one behind the other in the direction of the longitudinal axis varies over the width of the heat exchanger plate in the direction of the transverse axis. On each width section, in which the entry of the medium into the disks arranged one behind the other is intended, the comparatively largest number of disks is provided one behind the other. As the distance from the entrance increases, the number decreases in the direction of the transverse axis.
    Type: Application
    Filed: April 23, 2012
    Publication date: October 11, 2012
    Inventors: Jürgen Berger, Peter Ambros, Axel Fezer, Jochen Orso, Harald Necker
  • Publication number: 20120247734
    Abstract: A design and manufacturing technique for a “Long Heat Exchanger”, a counter-flow heat exchanger sizeable to transfer up to 100% of heat and temperature between two fluids (gas or liquid). Inner “Core” capable of manufacture in continuous lengths, may be coiled, cut and formed to shape multiple applications, ranging from engine exhaust, to recycling steam turbine, to building furnaces. Core costs are comparable to metal tubing costs, and outer or “Main” channel housing may be existing exhaust channels being retrofitted or new housing injection molded in sections. Applies anywhere waste heat is exhausted. As waste heat represents fuel waste directly, recovering up to 100% of wasted heat, while maintaining temperature and pressure of the working fluid, can equate to recovering up to 100% of wasted fuel. Practical, economical designs may readily yield over 90% fuel efficiency in applications currently yielding 10% to 60% fuel efficiency.
    Type: Application
    Filed: March 28, 2011
    Publication date: October 4, 2012
    Inventor: William A. Kelley
  • Publication number: 20120247735
    Abstract: The heat sink has a first heat transfer plate member that has one surface thermally connected to a heat generating component and is thermally connected to a first heat dissipating fin section having thin plate fins; a second heat transfer plate member that has one surface thermally connected to a second heat dissipating fin section having thin plate fins; a heat pipe section that is provided between an opposite surface of the first heat transfer plate member and an opposite surface of the second heat transfer plate member to be thermally connected thereto; and a heat transfer block that is thermally connected to a side surface and an upper surface of the heat pipe section and arranged to sandwich the heat pipe section between the heat transfer block and the second heat transfer plate member.
    Type: Application
    Filed: April 25, 2012
    Publication date: October 4, 2012
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Shinichi ITO, Kenya Kawabata, Shinichi Furumoto
  • Publication number: 20120241122
    Abstract: In various embodiments, phase change and heat exchange methods between heat collection, heat transfer, heat exchange, heat storage, and heat utility systems are described. In certain embodiments, the heat transfer fluids/heat exchange fluids, heat storage media, and working media in the system are all phase change materials with transition temperatures close to each other and in decreasing order and perform their respective function through phase changes within a relatively narrow temperature range. Methods to control heat transfer rate, heat exchange and/or heat charging/discharging rate between heat collection, thermal energy storage and heat utility apparatus at will are provided. Methods of controlling such systems are also provided.
    Type: Application
    Filed: February 24, 2012
    Publication date: September 27, 2012
    Applicant: BlueLagoon Energy Technologies Ltd
    Inventors: Xiaodong Xiang, Rong Zhang
  • Publication number: 20120234517
    Abstract: An intermediate heat exchanger 10 includes a double tube 11 and a liquid reservoir 14. The double tube 11 has an outer tube 15 and an inner tube 16 disposed inside the outer tube 15 with a clearance formed therebetween. The clearance between the outer tube 15 and the inner tube serves as a high-temperature-side refrigerant passage 12, through which refrigerant of high pressure flowing out of a condenser flows, and the interior of the inner tube 16 serves as a low-temperature-side refrigerant passage 13, through which refrigerant of low pressure flowing out of an evaporator flows. The liquid reservoir 14, which communicates with the high-temperature-side refrigerant passage 12 of the double tube 11, stores the refrigerant of high pressure flowing out of the condenser before the pressure of the refrigerant is reduced by a pressure reducer, and separate liquid-phase refrigerant and gas-phase refrigerant.
    Type: Application
    Filed: October 12, 2010
    Publication date: September 20, 2012
    Applicant: SHOWA DENKO K.K.
    Inventors: Noboru Ogasawara, Tatsuya Hanafusa, Makoto Numasawa
  • Patent number: 8267159
    Abstract: An exemplary thermal module includes a heat absorbing member, a heat sink, a heat conducting member connecting the heat absorbing member with the heat sink, and centrifugal fan. The heat absorbing member has four fixing portions for fixing the thermal module. The heat sink includes a base and a fin assembly disposed on the base. The centrifugal fan includes a housing defining a lateral air outlet therein and an impeller rotatably received in the housing. The housing engages with the engaging portion and is detachably mounted to the heat absorbing member, with the air outlet facing the fin assembly. One of the fixing portions of heat absorbing member is shaded by the housing. The housing and the engaging portion cooperatively provide a sliding mechanism therebetween to allow the centrifugal blower to be slidable relative to the base after the lateral side of the housing detached from the heat absorbing member.
    Type: Grant
    Filed: April 12, 2010
    Date of Patent: September 18, 2012
    Assignees: Fu Zhun Precision Industry (ShenZhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Jian Yang, Jing Zhang
  • Publication number: 20120230657
    Abstract: A heating device includes a loop heat pipe and a plurality of heat sources. The loop heat pipe has an evaporation part, and a heat transferred by the loop heat pipe is used for a heating. The plurality of heat sources that heats a liquid phase working fluid is arranged in the evaporation part of the loop heat pipe.
    Type: Application
    Filed: March 6, 2012
    Publication date: September 13, 2012
    Applicant: DENSO CORPORATION
    Inventor: Keiichi Uno
  • Publication number: 20120227933
    Abstract: The present invention provides a flat heat pipe with sectional differences and a method for manufacturing the same. The heat pipe has a flat hollow pipe body. A working fluid is sealed in the pipe body. The pipe body is provided along its length with a plurality of flat sectional difference portions having different widths. A connecting portion is formed between the sectional difference portions. The inner wall of the pipe body is formed with a plurality of grooves. The pitch between the grooves in the sectional difference portion of a relatively large width is larger than the pitch between the grooves in the sectional difference portion of a relatively small width.
    Type: Application
    Filed: March 8, 2012
    Publication date: September 13, 2012
    Inventors: Chang-Yin CHEN, Lei-Lei LIU, Lin-Chuan YEN