Abstract: In one aspect, a cooling device for an LED chip mounted on a heat sink includes an enclosed tube in contact with the heat sink. The tube includes a vacuum section surrounded by a plurality of cooling fins and a liquid-filled section surrounded by a plurality of cooling fins. The liquid-filled section is in contact with the heat sink. In another aspect, an apparatus includes a heat sink, an LED chip mounted on the heat sink, and an enclosed tube in contact with the heat sink. The tube includes a vacuum section surrounded by a plurality of cooling fins and a liquid-filled section surrounded by a plurality of cooling fins. The liquid-filled section is in contact with the heat sink.

Abstract: A heat dissipation apparatus includes a heat sink and a pair of first heat pipes. The heat sink includes a pair of first fin assemblies staggered with a pair of second fin assemblies. The first and second fin assemblies each define a receiving groove therein. The second fin assemblies each further defines an opening communicating with the receiving groove of a corresponding second fin assembly. The first heat pipes each include an evaporation section and a condensation section. A portion of the condensation section of each of the first heat pipes is inserted into the receiving groove of each of the first fin assemblies. The other portion of the condensation section of each of the first heat pipes is received in the receiving groove of each of the second fin assemblies through the opening.

Abstract: A plate-type heat transport device and electronic instrument are provided. The plate-type heat transport device includes a heat absorbing plane absorbing heat because of the evaporation of a working fluid, a heat emission plane opposing the heat absorbing plane and emitting heat because of the condensation of the working fluid, and a flow path two-dimensionally arranged between the heat absorbing plane and the heat emission plane to align with the heat absorbing plane and the heat emission plane, the flow path allowing the working fluid to flow therethrough for changing the phase of the working fluid, and the flow path being capable of two-dimensionally diffusing the working fluid by generating a capillary force in the condensed working fluid.

Abstract: A heat pipe and thermo-conductive body assembling structure and a method for manufacturing the same are disclosed. The thermo-conductive body is provided a trough with two pressing arms at the opening thereof. The heat pipe is accommodated in the trough and pressed by the pressing arms. An exposed portion of the heat pipe and outer surfaces of the pressing arms are coplanar.

Abstract: The invention provides methods, apparatus and systems in which there is partial boiling of a liquid in a mini-channel or microchannel. The partial boiling removes heat from an exothermic process.

Abstract: A heat sink assembly includes a base, a fin group and a heat pipe connecting with the base and the fin group. The fin group includes a plurality of fins. Each of the fins defines a recess at a lower portion thereof. The heat pipe includes an evaporating portion extending through the base and a condensing portion extending through the fin group. The base is interferentially fitted into the recesses of the fins. The base, the fin group and the heat pipe directly and intimately connect with each other. The recess and the base have correspondingly T-shaped profiles. Each fin forms a bended flange defining the recess. The bended flange intimately contacts with the base and the evaporating portion of the heat pipe.

Abstract: A cooling element for a heat source, especially LED modules with many components, includes a base body in thermal and mechanical contact with a body of the heat source, at least one heat pipe having an end section inserted into the base body in a form-fitting and thermoconducting manner, and at least one cooling body having cooling body lamellae on the other end section of the heat pipe. The heat pipes extend over the entire length of the base body such that a hot zone of the heat source lies on a contact surface of the base body, the heat pipes extend parallel to each other and to the contact surface of the heat source. The base body is fixed to the body of the heat source, base body lamellae being provided on the outer side of the base body, formed as a single component thereon or connected thereto.

Abstract: The present invention relates to a smart junction box for a solar cell module, and provides a smart junction box for a solar cell module which enables an operator to easily connect and separate ribbon cables using the operation of the levers of pressing units, thereby being able to improve the contact stability of ribbon cables, and which has a heat sink structure, thereby effectively emitting the heat generated by the ribbon cables and the diodes to the outside. For this purpose, the smart junction box for a solar cell module of the present invention includes bus bars for transmitting electricity flowing from ribbon cables; and pressing units for selectively fastening and separating the ribbon cables located on contact portions of the bus bars depending on whether both ends of the lever projected by the manipulation of an operator are inserted into recesses formed in a body.

Abstract: The invention relates to a method for recovering heat from intermittently and instantaneously released blow-off steam charges. The method is carried out using a container (6) with an internal volume (2), provided with an inlet (7) and an outlet (10). The method comprises the steps of supplying a blow-off steam charge (Sh) via the inlet (7) to the container (6) and collecting the latter in the internal volume (2) of the container. In this case, the charge (Sh) may be held in a gravitational field. It is possible to recover energy from a portion of the blow-off steam charge (Sh) by condensation thereof. The condensation results in a stream from said portion to an outlet (10) which is at a lower gravitational potential. Via the outlet (10), it is possible to discharge a portion of the charge (Sh) from the internal volume (2) of the container (6) at a lower gravitational potential.

Abstract: An evacuated tube solar thermal collector uses a set of evacuated solar thermal collector tubes in heat exchanging contact with a fluid flowing through a header tube. Two heat pipes are provided in each evacuated thermal collector tube, and the condenser ends of the heat pipes are positioned in the header tube with a spacing that provides improved heat transfer from the heat pipes to the header tube. When 14 mm heat pipes contained in 58 mm collector tubes are used in a header tube having a capacity of about 0.5 gallons with a heat transfer liquid that is flowing at a rate of about 0.3 gpm, the spacing between heat pipes in each collector tube is about 24 mm, center to center, and the spacing between corresponding heat pipes of immediately-adjacent collector tubes is about 80 mm.

Abstract: A heat-transporting device includes a working fluid, a vessel, a vapor-phase flow path, and a liquid-phase flow path. The working fluid transports heat using a phase change. The vessel seals in the working fluid. The vapor-phase flow path includes a first mesh member and causes the working fluid in a vapor phase to circulate inside the vessel, the first mesh member including a through-hole larger than a mesh thereof. The liquid-phase flow path causes the working fluid in a liquid phase to circulate inside the vessel.

Abstract: A device including a phase-change heat-transfer fluid cooling mechanism to cool a sheath in which is placed switchgear such as a circuit breaker. An evaporator is thus created which is connected to condensers that are placed on a roof of the sheath. The device can be for application to a medium-voltage high-current electrical installation. The device requires little maintenance and only consumes a reduced amount of energy, or even no energy.

Abstract: A metal plate that forms a heat-absorbing surface has a center portion which protrudes so as to correspond to the ehoofuocmmionnductordcnncni. A fixing support point of a plate spring is provided at a center of this protruding surface, and the plate spring is fixed on all sides. Grounding pressure is applied via the single point provided by the fixing support point. As a result, any tilting of the heat-absorbing surface relative to the surface of the heat-generating element is kept to a minimum. Heat pipes are provided around the periphery such that they enclose the protruding area from the outside.

Abstract: In various embodiments of the present invention, a thermoelectric cooling device with a thermoelectric device, heat pipe and a heat sink is provided. The thermoelectric device is connected to a chamber through a metal standoff. The chamber contains a fluid that needs to be cooled. The metal standoff has a shape, e.g. a bevel shape, to minimize heat leakage into the fluid. The heat pipes are preferably connected to the thermoelectric device with a Thermal Interface Material (TIM). In one embodiment, the heat pipes are attached to the thermoelectric device through screws which have an insulating standoff so as to minimize heat leakage into the fluid. In another embodiment of the present invention, two stage thermoelectric cooling devices with multiple heat pipes and common heat sink are provided to cool the fluid.

Abstract: A heat transfer system is adapted for transferring heat between two different ducts in a ventilation system. The system has a heat pipe having a plurality of conduits. Each conduit including an evaporator section extending laterally from a first open end of the respective conduit, a condenser section extending laterally from a second open end of the respective conduit, and a liquid return section. The liquid return section of at least one conduit being distinct from the liquid return section of another of the conduits. A common vapor manifold is in fluid communication with and extends between the first and second open ends of each of said plurality of conduits so vapors produced in the evaporator sections can flow from the first open ends through the common vapor manifold to the second open ends without flowing through the conduits.

Abstract: A micro vapor chamber includes a first plate and a second plate. The first plate has a condensing region constituted of a plurality of protrusions. The second plate has a plurality of liquid-collecting regions and an evaporating region. The condensing region is located to correspond to the liquid-collecting regions and the evaporating region. The first plate is arranged to cover the second plate. The condensed working fluid are quickly collected on the protrusions to flow back to the evaporating region, thereby improving the liquid-vapor phase circulation of the working fluid in the micro vapor chamber greatly.

Abstract: A heat conveying structure for an electronic device according to the present invention includes: an evaporating section that has a chamber structure with first fins erected therein, is thermally connected to the electronic device, evaporates a liquid coolant on the surfaces of the first fins to thereby change the liquid coolant to a vapor coolant, and sends out liquid coolant present near the first fins along with the vapor coolant as a gas-liquid two-phase flow coolant; a condensing section that has a chamber structure with second fins erected therein, is thermally connected to a radiator provided outside the electronic device, and changes the gas-liquid two-phase flow coolant in contact with the second fins to a liquid coolant; a vapor pipe that connects the evaporating section and the condensing section, and moves the gas-liquid two-phase flow coolant sent out from the evaporating section to the condensing section; and a liquid pipe that connects the evaporating section and the condensing section, and move

Abstract: Systems and methods described herein are directed to rotary heat exchangers configured to transfer heat to a heat transfer medium flowing in substantially axial direction within the heat exchangers. Exemplary heat exchangers include a heat conducting structure which is configured to be in thermal contact with a thermal load or a thermal sink, and a heat transfer structure rotatably coupled to the heat conducting structure to form a gap region between the heat conducting structure and the heat transfer structure, the heat transfer structure being configured to rotate during operation of the device. In example devices heat may be transferred across the gap region from a heated axial flow of the heat transfer medium to a cool stationary heat conducting structure, or from a heated stationary conducting structure to a cool axial flow of the heat transfer medium.

Abstract: A heat dissipation device includes a heat spreader for thermally engaging with a heat generating electronic device, a heat sink assembly located above the heat spreader, and first and second heat pipes connecting with the heat spreader and the heat sink assembly. Each of the first and second heat pipes comprises an evaporation section engaged in the heat spreader, two arc-shaped condensation sections thermally inserted in the heat sink assembly, and two connecting sections interconnecting corresponding condensation sections and the evaporation section. The condensation sections are coplanar with each other and located in a same circle. The condensation sections of the first heat pipe extend in a clockwise direction, while the condensation sections of the second heat pipe extend in an anticlockwise direction.

Abstract: A heat transfer device that allows high-accuracy temperature management of an entire piping system. The heat transfer device transferring heat to the piping system through which a fluid flows includes: a high heat conductive heat transfer block surrounding the piping system; a heat pipe embedded in the heat transfer block along an extension direction of the piping system; and a heater applying heat to the heat pipe. The heat transfer block includes a plurality of divided blocks dividable along the extension direction of the piping system.

Abstract: This invention relates to the process of collecting heat and removing heat from a heat pipe for solar energy applications. More specifically, this invention is a solar energy system that elegantly couples a heat pipe and a single header heat transfer assembly that has the capability of interchangeable operational designs using solar collector panel, solar vacuum tube, or integrated solar thermal and photovoltaic array configurations. The header assembly is structurally and thermally connected to the heat pipe by a heat pipe receiver which surrounds the condenser end of the heat pipe and plugs into the interior of the header assembly.

Abstract: According to one embodiment, an electronic apparatus includes a printed circuit board, a heat pipe, a fan unit and a fixing unit. The heat pipe has a first end physically fixed to and thermally connected to a first circuit component, and a second end opposite to the first end. The fan unit is provided in the vicinity of the second end of the heat pipe, and cools the second end. The fixing unit fixes the position of the heat pipe at a position different from the position of the first circuit component.

Abstract: A heat transfer device generally includes a flexible cooling layer for use in heat pipe technology for example. The flexible layer has outer and inner surfaces. A backing layer has an outer surface and an inner surface facing the inner surface of the flexible layer. A rigid separator portion is disposed between the inner surfaces of the flexible and backing layers, and has inner and outer surfaces. The inner surfaces of the flexible and backing layers and the rigid separator portion define a sealed chamber. An evaporable working liquid is contained within the sealed chamber. The working liquid expands when heated to expand a volume within the sealed chamber, such that the flexible layer extends away from the sealed chamber. The flexible layer, when extended transfers heat through the sealed chamber to a cooler area of the device.

Abstract: An adaptive heat dissipating device includes a heat-transfer element and a heat-dissipation element. An end of the heat-transfer element is a spherical body, and an end of the heat-dissipation element is a semispherical socket for correspondingly receiving the spherical body therein, such that the spherical body is rotatably connected to the semispherical socket. Therefore, the heat-transfer element has enough degrees of freedom to rotate in different directions and pitch at different angles relative to the heat-dissipation element. With these arrangements, the adaptive heat dissipating device can have largely upgraded heat dissipation efficiency and increased flexibility in application.

Abstract: An apparatus includes a supporting member, a cooling stage and a translating member. The cooling stage has a surface for contacting an electronic device. The cooling stage is translatably coupled to the supporting member. The translating member is coupled to the supporting member and attached to the cooling stage. The translating member is operable to translate the cooling stage relative to the supporting member to urge the cooling stage surface against the electronic device.

Abstract: A heat sink includes a first plate having a first surface with a heat source contact region, and a second surface has a looped peripheral groove, and first to nth evaporation/condensation grooved sections arranged sequentially within the looped peripheral groove. Each grooved section has parallel grooves. The first grooved section is disposed in an area corresponding to the contact region, and each groove therein has a leading end connected to the looped peripheral groove. Every two grooves in each of the second to nth grooved sections have leading ends connected to a trailing end of one groove in the preceding grooved section. The grooves in the nth grooved section having trailing ends connected to the looped peripheral groove.

Abstract: The invention relates to a cooling apparatus (101) for a sample in an ion beam etching process, including, a sample stage (102) for arranging the sample, a coolant receptacle (120) containing a coolant, at least one thermal conduction element (106a, 106b) that connects the sample stage (102) to the coolant, a cooling finger (105) connected to the thermal conduction element (106a, 106b), the cooling finger (105) comprising a conduit (130, 131) through which coolant can flow and which is connectable to the coolant receptacle (120). The invention further relates to a method of adjusting the temperature of a sample in an ion beam etching process, including mounting a sample on a coolable sample stage (102), aligning the sample on the sample stage (102), and cooling the sample by coolant directed through a conduit (130, 131) of a cooling finger.

Abstract: A heat dissipation apparatus is arranged in a housing of an electronic device. The electronic device includes a motherboard mounted in the housing. The heat dissipation apparatus includes a heat dissipation block mounted to an electronic element of the motherboard, a heat sink, a number of pipes connecting the heat sink to the heat dissipation block, and a plate plugged in a socket of the motherboard. The heat sink is mounted to the plate.

Abstract: A heat exchanger for installation in a motor vehicle includes a cooling channel, a heating channel, and heat pipes to thermally couple the cooling channel with the heating channel. A thermoelectrical generator is arranged on a cold side of at least one of the heat pipes and coupled with the heat pipe by a material joint. The material joint is realized by a liquid metal.

Abstract: According to an embodiment of the present invention, there is provided a system for cooling. The system comprises an equipment rack installable in a facility and for accommodating a plurality of electronic equipment. The system further comprises an exhaust duct into which the electronic equipment, when installed in the rack, exhausts gas drawn from a first section of a facility. The system further comprises a gas flow meter for measuring gas flow in the exhaust duct, and a controller for generating control signals to control, based on the measured gas flow, the output of a cooling unit arranged to provide cooled gas to the first section of the facility.

Abstract: An electronic device has a ventilation system with an inlet section that receives inlet air that travels past components of the computing device to be cooled and exits at an outlet section. The air carries heat away from the components. A liquid heat transfer system captures heat generated by the components and transfers the captured heat to the inlet section of the ventilation system to warm the inlet air before it travels past the components to be cooled.

Abstract: The present invention relates to azeotrope and azeotrope-like compositions comprised of 1-chloro-3,3,3-trifluoropropene (HCFO-1233zd) and 1,1,1,2,3-pentafluoropropane (HFC-245eb), and uses thereof.

Abstract: A new blood unit cooling system was designed to cool blood rapidly to about 22° C. and maintain it at about that temperature, even in ambient temperature extremes, for several hours. The system incorporating a preferred eutectic solution including 98% 1-dodecanol, 1.5% myristyl alcohol and 0.5% 1-decanol (having a melting point of about 23° C.) contained in a sealed flexible polymer layer, was used to cool whole blood-filled bags. The preferred design used double-layered transparent polyethylene, with two sealed compartments filled with the solution, separated by a flattened and sealed portion between them. One of the two sealed compartments contacts one side of the blood bag and the other compartment is folded over to contact the other side of the blood bag. The transparent compartments allows an operator to verify at any time whether the solution is in a solid state, and the flexibility of the compartments eases the proper positioning of them around a blood bag.

Abstract: A light, compact, non-bottom panel type cooler module includes a plurality of radiation fins arranged in a stack, and a plurality of U-shaped heat pipes fastened to the radiation fins to hold the radiation fins in parallel, each U-shaped heat pipe having one or two opposite end pipe sections thereof press-fitted into respective through holes on the radiation fins and a flat bottom surface portion exposed to the outside of the radiation fins for bonding to a semiconductor device for enabling the heat pipes to transport heat from the semiconductor device to the radiation fins for dissipation.

Abstract: The present invention relates to a multi-cooling module for a vehicle, and more particularly to a multi-cooling module adapted to simultaneously cool an engine, electric parts, and a condenser through one or more heat pipes. In the multi-cooling module for a vehicle, one or more heat pipes are mounted to pass through two or more refrigerant passage pipes which go through with the same cooling system core unit.

Abstract: A loop heat pipe includes: a first evaporator and a second evaporator each of which vaporizes a liquid-phase working fluid and converts the liquid-phase working fluid to a vapor-phase working fluid; a first condenser and a second condenser each of which condenses the vapor-phase working fluid and converts the vapor-phase working fluid back to the liquid-phase working fluid; a first vapor line through which the working fluid converted to the vapor phase is transported to the first condenser; a first liquid line through which the working fluid converted to the liquid phase is transported to the second evaporator; a second vapor line through which the working fluid converted to the vapor phase is transported to the second condenser; and a second liquid line through which the working fluid converted to the liquid phase is transported to the first evaporator.

Abstract: A heat dissipating device is disclosed, which includes a fan body, an upper fan cover, and a lower fan cover. The upper fan cover and the lower fan cover are assembled on the fan body. The fan body has an airflow outlet. The upper fan cover includes an upper cover front portion, and plural upper cover recessions disposed at the upper cover front portion. The upper cover recessions are located in front of the airflow outlet.

Abstract: The invention provides a heat transfer composition comprising: (i) 1,3,3,3-tetrafluoroprop-1-ene (R1234ze, CF3CH?CHF) (ii) a second component comprising R-1243zf, (3,3,3 trifluoropropene) or a difluoropropene (R-1252) selected from R-1252zf, R-1252yf, R-1252ye R-1252ze and R-1252zc, and mixtures thereof; and (iii) a third component selected from R32 (difluoromethane), R744 (CO2), R41 (fluoromethane), R1270 (propene), R290 (propane), R161 (fluoroethane) and mixtures thereof.

Abstract: A device for dissipating heat, for a space-based satellite, includes at least one dissipating panel, the dissipating panel having at least one skin formed from a composite structure comprising an organic resin and carbon fibers, wherein the organic resin is filled with carbon nanotubes. The heat-dissipating device may also comprise a network of heat pipes. The heat pipes may be made from an aluminum alloy incorporating elements having low coefficients of thermal expansion. The present invention is notably applicable to fixed dissipating panels or those that may be used in telecommunications, observation or scientific satellites, or else on racks assembled to dissipating panels.

Abstract: An azeotrope-like mixture consisting essentially of a binary azeotrope-like mixture consisting essentially of trans-1-chloro-3,3,3-trifluoropropene (trans-HFO-1233zd) and a second component selected from the group consisting of 2,3,3,3-tetrafluoropropene (HFO-1234yf) and trans-1,3,3,3-tetrafluoropropene (trans-HFO-1234ze), and combinations of these and various uses thereof.

Abstract: Liquid-cooled electronics racks are provided which include: immersion-cooled electronic subsystems; a vapor-condensing heat exchanger to condense dielectric fluid vapor egressing from the immersion-cooled electronic subsystems; a dielectric fluid vapor return coupling in fluid communication the vapor outlets of the immersion-cooled electronic subsystems and the vapor-condensing heat exchanger; a reservoir for holding dielectric fluid; a gravity drain line coupled to drain dielectric fluid condensate from the vapor-condensing heat exchanger to the reservoir; an immersed, sub-cooling heat exchanger disposed within the reservoir; a dielectric fluid supply manifold coupling in fluid communication the reservoir and the dielectric fluid inlets of the immersion-cooled electronic subsystems; and a pump for supplying under pressure dielectric fluid from the reservoir to the dielectric fluid supply manifold for maintaining dielectric fluid in a liquid state within the immersion-cooled electronic subsystems.

Abstract: A heat dissipation device is provided in the present disclosure, where the heat dissipation device includes a hollow heat-sink base and a set of fluid tube. The fluid tube is inserted in the heat-sink base, and a cooling medium circulates in the fluid tube. The heat-sink base includes a heat absorption area configured to absorb heat. A cooling fluid, received in the heat-sink base, may be vaporized at the heat absorption area to absorb the heat taken by the heat absorption area, and condensed at a position that is inside the heat-sink base and away from the heat absorption area and on the fluid tube to release the absorbed heat.

Abstract: A flexible heat dissipation module comprises at least one first heat pipe, one second heat pipe, and one flexible component. The first heat pipe includes a first heat absorbing end and a first heat dissipating end; the second heat pipe includes a second heat absorbing end and a second heat dissipating end. The flexible component includes a first joining part, a second joining part, and a flexible area formed in between the first and the second joining part, wherein the first and the second joining parts are attached respectively to the first heat dissipating end of the first heat pipe and the second heat absorbing end of the second heat pipe. With the disposition of flexible components, the flexible heat module according to the present invention has wider installation applicability and more flexible programmability to adapt to existing narrow device space.

Abstract: A heat dissipation structure mounted onto an electronic element to dissipate heat. The heat dissipation structure includes a heat absorber connected with the electronic element and a heat sink. The heat absorber has a hollow first chamber to hold a working fluid. The heat absorber and heat sink are interposed by a plurality of first conduits. When the heat absorber absorbs heat generated by the electronic element through a contact surface, the working fluid held therein is vaporized into vapor. The vapor enters a second chamber of the heat sink through the first conduits and performs heat exchange with a cooling surface of the heat sink to be converted into the working fluid again. The working fluid is conveyed via a capillary structure in the second conduit to the first chamber to form a thermal cycle. The structure of the invention is simpler and can rapidly absorb and dissipate heat.

Abstract: A system for condensing steam includes a steam supply duct, a supply riser, a supply manifold, a pair of condensing panels, a return manifold, and a condensate return. The steam supply duct is configured to convey steam from a steam generator. The supply riser is configured to convey steam from the steam supply duct. The supply manifold is configured to convey steam from the supply riser. The pair of condensing panels is configured to receive steam from the supply manifold. The supply manifold bifurcates with each bifurcation being configured to supply a respective condensing panel of the pair of condensing panels. The return manifold is configured to receive condensate from the pair of condensing panels. The condensate return duct is configured to convey condensate from the return manifold to the steam generator.

Abstract: A heat exchange chamber for liquid state cooling fluid is provided, which comprises a casing and a thermal dissipation device, the casing has a cavity and the thermal dissipation device is sited in the cavity. A cooling fluid flows through the cavity along a flow direction. The cross-sectional area of the cavity whose direction is perpendicular to the flow direction shows linear increase or non-linear increase gradually along the flow direction, and a part of the cooling fluid vaporizes after flowing through the thermal dissipation device. The chamber along the flow direction shows different pressures, and two phase fluid flows automatically due to the pressure difference. The heat exchange chamber for liquid state cooling fluid could lighten the loading of the pump which is for circulating the cooling fluid, and it also achieve the efficacy of saving energy and raising efficiency.

Abstract: The disclosure relates to a heat exchanger including at least a first group and a second group of channels arranged to provide fluid paths between a first end and a second end of the heat exchanger. Connecting parts are arranged at the first end and at the second end of the heat exchanger. A first heat transfer element transfers a heat load to fluid, and a second heat transfer element transfers a heat load from the fluid. The channels have capillary dimensions.

Abstract: A cooling system distributes fluid to a plurality of docking bays within a server rack. The server rack includes docking bays for housing electronics devices. A two-phase fluid-based heat exchanging system is coupled to each docking bay, which functions to remove heat from the electronics server. The docking bays are conceptually divided into one or more sections, and a dynamic fluid flow regulator is included within a section input line that supplies a liquid-phase fluid to each section. The section input line branches into a plurality of parallel fluid paths, one parallel fluid path coupled to each docking bay in the section. A fixed fluid flow regulator is included within each branching fluid pathway. The combination of the dynamic and fixed fluid flow regulators provides balanced fluid flow to each two-phase heat exchanging system.

Abstract: A pulsed magnetic field is generated by a device having a magnet to be operated in pulse operation which contains at least one superconductive refrigerant-free winding that is disk-shaped or saddle-shaped. Also included is a refrigerating unit which has at least one cold head. A line system, having a refrigerant circulating in it according to a thermosiphon effect, thermally couples the winding to the cold head. The line system has a plurality of separate pipes lying next to one another. The pipes, open onto a common refrigerant distributor and closed at the other end, are thermally coupled to the surface of the disk-shaped or saddle-shaped winding.

Abstract: An efficient method of heat removal from rack mounted computer equipment, network gear and other electronic equipment, consisting of solid heat conducting components in direct contact with the heat generating sources. In particular, this invention is primarily focused on the ability to efficiently and effectively cool computer equipment in standard computer rack cabinets. This invention utilizes a design that retains the general existing form factor of the rack mounted computer equipment, but uses direct contact heat transfer to a metal heat transfer conduit (Copper, Aluminum or other metal or efficient heat conducting material) contained within the computer equipment chassis. Furthermore, it is thermally coupled to an external rack mounted solid-to-fluid heat exchanger as an efficient method of heat transfer and removal. This is much more efficient than air as heat transfer medium which it the common method of heat removal from existing standardized rack mounted computer equipment.