Abstract: A passive cooling system for an aircraft includes a rotor assembly and a closed heat pipe. The closed heat pipe is carried by the rotor assembly and configured to extract heat energy from a heat source positioned away from the rotor assembly and configured to dissipate the heat energy through the rotor assembly.

Abstract: A loop thermosyphon cooling device includes an evaporator, a condenser and a communication assembly. The evaporator includes a heat conducting element and evaporation pipes, and the heat conducting element has through holes, and each evaporation pipe is passed and positioned into each respective through hole. The condenser includes a condensation pipe. The communication assembly includes a first barrel and a second barrel, and both ends of each evaporation pipe are communicated with the first and second barrels, and both ends of the condensation pipe are communicated with the first and second barrels, so that the evaporation pipe, condensation pipe, first barrel and second barrel jointly define a loop. A communication assembly is coupled between the evaporation pipe and the condensation pipe, and the quantity of evaporation pipes and condensation pipes can be increased or decreased as needed, and the thermosyphon cooling device is compact and high heat dissipation efficiency.

Abstract: A condenser in a gravity loop heat pipe heat sink and a method for producing the condenser are disclosed. The production method includes the following steps: squeezing a base material of a condenser to form a condenser substrate and several longitudinal channels of the condenser, where the longitudinal channels of the condenser are parallel to and thread through the condenser substrate; drilling holes at the two ends of the condenser substrate to form transverse channels of the condenser, where the transverse channels of the condenser are connected to the longitudinal channels of the condenser; and sealing ends of the longitudinal channels of the condenser and ends of the transverse channels of the condenser according to determined holes on the condenser that are connected to the outside.

Abstract: A hybrid pin-fin micro heat pipe heat sink consists of a plurality of heat pipes secured to a base. The heat pipes have a generally hollow cross-section which transitions from a first cross-sectional shape (e.g., circular) to a second cross-sectional shape (e.g., triangular). A heat transfer medium (e.g., saturated steam) is sealed within the heat pipes. Cooling plates may be disposed over the base with the heat pipes in physical contact with and passing through the cooling plates. The method of manufacturing the heat pipes consists of passing a heat transfer medium through a pipe section having a first cross-sectional shape while transitioning to a second cross-sectional shape (e.g., by way of a rolling die press), then crimping the ends closed to seal the heat transfer medium therein.

Abstract: A heat spreading apparatus includes a body defining a void. A fluid is positioned within the void for distributing heat by vaporizing the fluid. The body defines a void with a heat accumulation surface geometry to disrupt the thermodynamic cycle of vaporizing the fluid and thereby diminish heat spreading activity by the heat spreading apparatus.

Abstract: The invention relates to a cooling system and an electronic apparatus using the same, and particularly aims to use a thermosiphon as the cooling system and derives an optimum shape (inter-fin gap, fin height, and fin upper-end hole diameter) of a boiling heat transfer surface for different coolants. In a cooling system using a thermosiphon according to the invention, an optimum shape (inter-fin gap, fin height, and fin upper-end hole diameter) of a boiling heat transfer surface of a heat receiving jacket that forms the cooling system is identified based on a critical radius of a steam bubble produced in an overheated liquid and the diameter of an air bubble departing from the heat transfer surface for a variety of coolants.

Abstract: A monolithic mechanical-thermal structure which is suitable for a space environment is provided, in which the structure contains at least one hole. The walls of the hole are lined with filaments. The monolithic mechanical-thermal structure may be made of metal. And a process for manufacturing the structure is also provided.

Abstract: A vapor-based heat transfer apparatus comprising a hollow structure and a working liquid within the hollow structure, wherein the structure is made of a thermally conductive polymer. In some embodiments the apparatus comprises a vapor chamber. In some other embodiments, the apparatus comprises a vapor chamber, heat pipe and a heat sink.

Abstract: A system for storing and dispensing fuel and a ballast fluid is disclosed. The system may be employed in a vehicle or facility having a power plant. Fuel and ballast fluid may be stored cryogenically in a liquid phase and dispensed to the vapor phase. The system may employ a thermal and volumetric compensatory arrangement wherein fuel dispensed from storage for use in a power plant is used as a heat exchange medium (refrigerant) for ballast fluid received for storage; during refueling, ballast fluid stored in the vehicle or facility may be dispensed and used as a refrigerant for fuel being stored in the vehicle in space made available by the dispensed ballast fluid. The fuel may be natural gas with a main component of methane; the ballast fluid may be a fluid obtainable from ambient environmental air, such as nitrogen or oxygen. The fuel and ballast fluid may be conditioned so that the respective boiling points are approximately equal.

Abstract: A sealed casing includes a container provided with a plurality of opening and houses at least one heat-generating body, and a plurality of top boards sealing the openings respectively, and is characterized in that at least one of the openings is disposed in a heat-generating area where the heat-generating body is disposed, and that a cooling unit is disposed on the top board sealing the opening in the heat-generating area.

Abstract: Phase change materials that include oleochemical carbonates absorb and release latent heat upon changing phases from solid to liquid (melting) or from liquid to solid (solidifying). The oleochemical carbonates are prepared from oleochemical alcohols derived from animal fats and vegetable oils or other bio-based substances. These oleochemical carbonates have melting temperatures with a relatively high heat of fusion and are non-corrosive. Oleochemical carbonates can be mixed together in various proportions to adjust melting/solidification temperature ranges as required by a particular application.

Abstract: Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

Abstract: Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

Abstract: A cooling system for a power module (or some other power electronics device) is described, the cooling system having a closed flow path for circulating a cooling fluid, the flow path having a pressure that is reduced to below atmospheric pressure. The cooling fluid is circulated along the flow path to provide cooling of the power module. The flow path is delimited from the exterior environment by a space provided between the flow path and the exterior environment, said space being sealed off from the cooling flow path, and said space being sealed off towards the exterior environment. The flow path has a pressure below atmospheric pressure and the space between the flow path and the exterior environment is evacuated and typically has a pressure lower than the pressure in the flow path.

Abstract: The invention relates to a heat exchanger arrangement for heating of air, with a heat exchanger (8) which is integrated into a refrigerant circuit (60), configured to be able to have refrigerant flow through it and able to be impinged on by air. The heat is transferred from the refrigerant to the air. The heat exchanger (8) exhibits two components (8a, 8b) configured to be segregated from each other. The first component (8a) is configured with a condensation surface and a heat-removal surface. The second component (8b) exhibits a supercooling surface. Between the components (8a, 8b) on the refrigerant side, a refrigerant phase separation element is placed. The heat exchanger is configured as a tubular heat exchanger with tubes situated in rows, wherein the first component (8a) is configured with at least two rows and the second component (8b) with at least one row.

Abstract: A bidirectional heat dissipation structure includes a base, a plurality of heat pipes and a heat sink having a plurality of cooling fins. The cooling fins are installed with an interval apart on the heat pipes and stacked onto the base, and each cooling fin includes at least one guide slat. When assembled, a horizontal diversion channel is formed between the cooling fins, and the guide slats form a downward diversion channel. When used, a portion of the wind current dissipates the heat of the heat sink through the horizontal diversion channel, and the other portion of the wind current blows downwardly through the downward diversion channel to dissipate the heat around the electronic device directly, so as to enhance the heat dissipation efficiency significantly.

Abstract: Cooling apparatus and methods are provided for partial immersion-cooling of multiple electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a compartment about the components, and a fluid disposed within the compartment. First and second electronic components are at least partially non-immersed within the fluid, with the first component being a different type of electronic component with different configuration than the second component. A vapor condenser is provided with a vapor-condensing surface disposed within the compartment for condensing fluid vapor, and a condensate redirect structure is disposed within the compartment between the vapor condenser and the first and second components. The redirect structure is differently configured over the first electronic component compared with over the second electronic component, and provides a different pattern of condensate drip over the first component compared with over the second component.

Abstract: The present disclosure relates to a flat heat pipe in which a plurality of minute wires is inserted and a fabrication method thereof. A flat heat pipe according to an exemplary embodiment of the present disclosure includes a through hole which is formed in a flat panel shaped body in a longitudinal direction one or more grooves which are formed above an inner wall of the through hole, and a plurality of wires which is inserted below the inner wall of the through hole in the longitudinal direction.

Abstract: A condenser for condensing vapor to liquid for cooling a switchgear having a heat generating component inside an enclosure and tubing structure associated with the heat generating component. A working fluid is disposed within an end portion of the tubing structure. The condenser includes a hollow tubular base defining a volume and having first and second opposing opened ends. A plurality of fins extends from a periphery of the base. The fins are in spaced relation and disposed about the entire circumference of the base. A first end cap is coupled to the base so as to close the first opened end. A second end cap is coupled to the base to close the second opened end. The second end cap has port structure constructed and arranged to fluidly communicate the tubing structure with the volume.

Abstract: A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).

Abstract: Illustrative embodiments of the present invention are directed to a computer that has a housing with walls that form a substantially sealed interior cavity from an exterior environment. The computer includes a plurality of computer components within the interior cavity. The computer also includes at least one heat sink for dissipating thermal energy into the exterior environment. A cooling element is thermally coupled to the heat sink and at least one of the computer components to transfer thermal energy from the computer component into the heat sink and the exterior environment.

Abstract: A cooling system for a heat-generating structure includes a heating device, a cooling loop, and one or more reservoirs. The heating device is configured to heat fluid coolant comprising a mixture of water and antifreeze and vaporize a portion of the water into vapor while leaving a portion of the antifreeze as liquid in the fluid coolant. The cooling loop has a portion that splits the fluid coolant received from the heating device into a first path configured to receive at least some of the portion of the water as vapor and a second path configured to receive at least some of the portion of the antifreeze as liquid. The one or more reservoirs are configured to receive one of the at least some of the portion of the water as vapor from the first path or the at least some of the portion of the antifreeze as liquid from the second path.

Abstract: A heat dissipation device includes a heat pipe, a first fin unit, a second fin unit, and a fan arranged on the first fin unit for drawing air from the first fin unit to the second fin unit. The heat pipe includes an evaporation section, a first condensing section and a second condensing section. The first fin unit includes a plurality of stacked first fins with a first channel defined between adjacent first fins. A notch is defined in the first fin unit receiving the evaporation section, and a canal is defined in the first fin unit receiving the first condensing section of the heat pipe. The second fin unit includes a plurality of stacked second fins. A second channel is defined between adjacent second fins perpendicular to the first channels. A passage is defined in the second fin unit receiving the second condensing section of the heat pipe.

Abstract: A heat pipe assembly includes a number of heat pipes and a fixing seat. Each of the heat pipes includes an evaporating section and at least a condensing section. A bottom of the evaporating section of each of the heat pipes is flat and has a flat heat absorbing surface. The evaporating sections of each of the heat pipes are parallel to and adjoin with each other, whereby the flat heat absorbing surfaces of the evaporating sections of the heat pipes being coplanar and adjoining with each other. A top surface of the evaporating section of each of the heat pipes has a top edge. The fixing seat, as a molded one-piece member, combines with the top edge of the evaporating section of each of the heat pipes, whereby the heat absorbing surfaces of the evaporating sections of the heat pipes are coplanar and adjoin with each other.

Abstract: An evaporator for a heat recovery steam generator has two horizontal steam drums of moderate size, one located slightly higher than the other. It also includes a coil having tubes located in the flow of a hot gas. The lower drum communicates with the inlets of the tubes for the coil. The outlets of the tubes communicate with the upper drum. A drain line connects the bottom of the upper drum with the lower region of the lower drum, so that water will flow from the upper drum to the lower drum. Water, which is primarily in the liquid phase, enters the lower drum through an inlet line and mixes with water from the upper drum. The mixture flows through into the coil. Here some of it transforms into saturated steam while the rest remains as saturated water. The saturated steam and saturated water flow into the upper drum where the steam escapes and the water flows back into the lower drum to recirculate through the coil.

Abstract: A geo-cooled photovoltaic power conversion apparatus including a cooling system having liquid-to-earth sub-grade heat exchanger, multiple cooling loops, and a coolant reservoir which provides thermal storage for the cooling system.

Abstract: A heat sink for cooling a heat generating member, provided with a first cooling part which cools the peripheral edge part of the heat generating member and a second cooling part which cools the center part of the neat generating member, the first cooling part is equipped with a first base member having first fins on the top surface thereof and a recess at the bottom surface thereof, the second cooling part is equipped with a second base member which can be accommodated in the recess, a slide member which is provided on the top surface of the second base member and which is inserted in a through hole which is provided in the recess, second fins which are provided on the free end of the slide member, and a cooling water passage which is provided inside of the second base member and which is supplied with cooling water.

Abstract: An apparatus using a phase-change material for thermal management in portable applications is described. In one aspect, the apparatus includes a phase-change material, a thermal reservoir, and a heat transport element. The thermal reservoir has a cavity therein to contain the phase-change material in the cavity. The heat transport element is made of a thermally conductive material. A first portion of the heat transport element traverses through the thermal reservoir and in contact with the phase-change material. A second portion of the heat transport element extends outside the thermal reservoir. Accordingly, at least part of the thermal energy from an object in contact with the heat transport element can be transported to the phase-change material via the heat transport element and be absorbed by the phase-change material as latent heat. The phase-change material may release at least part of the absorbed thermal energy at a later time.

Abstract: A cooling system for a memory module comprises a heat conduction assembly for conducting heat from the memory module to liquid-cooled mounting blocks. In one embodiment, each heat conduction assembly includes a frame having opposing first and second supports, first and second heat spreader plates each extending from the first support to the second support, and a pair of flattened heat pipes each extending along a respective one of the heat spreader plates from the first support to the second support. The liquid-cooled mounting blocks releasably support the heat conduction assembly over a memory module socket with the memory module between the heat spreader plates.

Abstract: A heat dissipation module includes a centrifugal fan and a heat dissipation fin array. The centrifugal fan includes at least one axial air inlet and a radial air outlet, wherein the radial air outlet is defined between a first sidewall and an opposite second sidewall with a tongue potion. The heat dissipation fin array is located at the radial air outlet of the centrifugal fan. The heat dissipation fin array and the radial air outlet substantially share an equal length L. The heat dissipation fin array has a middle wind stop section which is closer to the second sidewall than the first sidewall. The wind stop section has a length ranging from about 0.1 L to about 0.42 L.

Abstract: Apparatus and methods for removing unwanted heat generated by apparatus such as personal computer systems and other appliances. The apparatus comprising a thermally conductive surface to which heat from heat-generating components is communicated via a heat transmitting means such as a heatpipe. The apparatus can then be cooled by contacting cooling apparatus to the thermally conductive surface. Also described are liquid cooling apparatus suitable for contacting to apparatus having thermally conductive surfaces and a method for cooling a plurality of computer systems.

Abstract: A thermosiphon system includes a condenser, an evaporator, and a condensate line fluidically coupling the condenser to the evaporator. The condensate line can be a tube with parallel passages can be used to carry the liquid condensate from the condenser to the evaporator and to carry the vapor from the evaporator to the condenser. The evaporator can be integrated into the tube. The condenser can be constructed with an angled core. The entire assembly can be constructed using a single material, e.g., aluminum, and can be brazed together in a single brazing operation.

Abstract: A capillary assisted loop thermosiphon apparatus (100) has at least one evaporator (102) connected by a vapor line (104) to a condenser (106); a liquid line (108) connects the condenser (106) and the evaporator (102), the evaporator (102) is in the direction of gravity from the condenser (106) for the condenser (106) to supply liquid under gravity induced pressure to the evaporator (102), and the evaporator (102) has a vertical capillary wick (102a) in which liquid wicks in the direction of gravity.

Abstract: An apparatus and method is provided for conveying heat away from an electronic component. In one embodiment, a method positions a conformable thermal interface element in heat conducting contact with an electronic component. A heat conducting member is disposed within the conformable thermal interface element. The heat conducting member is coupled with a manifold so that the heat conducting member is in heat conducting contact with the manifold. The electronic component may be installed or removed without disassembly of the apparatus.

Abstract: Disclosed is an integrated thermosiphon reboiler-condensate pot which integrates a condensate collection volume into a thermosiphon reboiler and avoids the need for an external condensate pot or steam trap. Also disclosed are a method for operating the integrated thermosiphon reboiler-condensate pot, a system including the integrated thermosiphon reboiler-condensate pot and a method for retrofitting an existing thermosiphon reboiler.

Abstract: A method of removing heat from a heat generating component. A geometrically reoriented heat pipe is formed including an evaporator section and a condenser section geometrically reoriented relative to the evaporator section. The evaporator section is positioned proximate to the heat generating component. A thermoelectric element is positioned between the at least one heat generating component and the evaporator section. Heat is transferred, via the thermoelectric element, from the heat generating component to a heat transfer fluid contained within the evaporator section. The heated fluid migrates to the condenser section. The fluid is cooled within the condenser section and the fluid is returned to the evaporator section.

Abstract: An exemplary loop heat pipe includes an evaporator, a condenser, a vapor line and a liquid line each connecting the evaporator with the condenser to form a closed loop. A working medium is contained in the closed loop. A wick structure is received in the evaporator, and includes a bottom wall contacting the bottom plate, a support wall extending up from the bottom wall and contacting the cover plate, and guide walls extending out laterally from the support wall. The support wall separates an interior of the evaporator into a liquid chamber adjacent to the liquid line and a vapor chamber adjacent to the vapor line. The guide walls are located in the vapor chamber. Guide channels are defined between the guide walls for guiding the working medium in a vapor state to flow from the vapor chamber through the vapor line to the condenser.

Abstract: A low profile heat removal system suitable for removing excess heat generated by an integrated circuit operating in a compact computing environment is disclosed.

Abstract: A two-phase heat exchanger for cooling at least one electronic and/or electric component includes an evaporator and a condenser. The evaporator transfers heat from the electronic and/or electric component to a working fluid. The condenser includes a roll-bonded panel, which has a first channel which has a first connection port and a second connection port. The evaporator has a second channel and first connection openings and second connection openings. The first connection port of the first channel is connected to one first connection opening of the evaporator and the second connection port of the first channel is connected to one second connection opening of the evaporator and the working fluid is provided to convey heat by convection from the evaporator to the condenser by flowing from the second channel through the first connection opening or the second connection opening of the evaporator towards the first channel.

Abstract: A heat sink for use in a computer system may include a first heat sink body including a first plurality of heat dissipation structures; a second heat sink body including a second plurality of heat dissipation structures, the second heat sink body being physically spaced apart from the first heat sink body; and a heat pipe having a first portion coupled to the first heat sink body, a second portion coupled to the second heat sink body, and a third portion extending between the first and second heat sink bodies such that the heat pipe provides a physical coupling between the spaced apart first and second heat sink bodies.

Abstract: A dishwashing appliance is provided having features that allow for the recovery, storage, and use of heat energy present in fluids that have been used in a cycle of the appliance such as for washing or rinsing. Before or during the draining of such fluid from the appliance, the heat is captured as latent heat using a heat transfer pipe containing a phase change material. This heat can be transferred to another phase change material and stored as latent heat. The stored heat is then transferred to air or a clean fluid such as e.g., fresh water for use in another cycle of the appliance.

Abstract: A heat pipe for cooling an exothermic body by the vaporization and condensation of an enclosed cooling medium is disclosed. The heat pipe comprises a flat plate-like upper plate, a flat plate-like lower plate opposed to the upper plate, and a plurality of flat plate-like intermediate plates overlaid on each other between the upper plate and the lower plate and having internal through-holes. The internal through-holes formed in each of a plurality of the intermediate plates are adapted such that only part of each through-hole is overlapped on each other to form capillary tube paths, each having a cross-sectional area smaller than the cross-sectional area of the through-hole in the flat surface direction.

Abstract: The invention relates to a exchanger for a phase changing refrigerant including a horizontal distributor tube; a horizontal collector tube; and at least one refrigerant carrying heat exchanger tube connected there between, wherein a refrigerant gas inlet into the at least one heat exchanger tube is arranged in an upper portion of a cross section of the horizontal distributor tube, and wherein a refrigerant outlet from the at least one heat exchanger tube is arranged in an upper portion of a cross section of the horizontal collector tube for condenser operation of the multi channel heat exchanger so that oil separation is provided in a lower portion of the cross section of the horizontal distributor tube and liquid refrigerant separation is provided in a lower portion of the cross section of the horizontal collector tube.

Abstract: The disclosed embodiments provide a component for a portable electronic device. The component includes a gasket containing a rigid portion disposed around a bottom of a heat pipe, wherein the rigid portion forms a duct between a fan and an exhaust vent of the electronic device. The gasket also includes a first flexible portion bonded to the rigid portion, wherein the first flexible portion comprises a flap that is open during assembly of the heat pipe in the electronic device and closed over the heat pipe and the rigid portion to seal the duct around the heat pipe after the assembly.

Abstract: A phase change type heat dissipating device for dissipating heat from a heat generating component includes a casing, a working medium received in the casing and a heat pipe connected to the casing. The heat pipe includes an evaporator section and a condenser section. The working medium is electrically insulated and phase change material, and represents solid state at normal temperature. The heat generating component is received in the casing, and the evaporator section of the heat pipe extends into the casing and contacts the working medium.

Abstract: A dishwasher is provided that allows the dishes that are to be cleaned that have been placed in a cleaning container to be washed and dried efficiently from an economic perspective while keeping the energy consumption associated therewith as low as possible. The dishwasher includes a washing container and a conduit system that is connected in an air-conveying manner to the washing container. A heat tube of the conduit system is used for both cooling, and thus drying, and heating air penetrating the washing container and both ends of the heat tube protrude into the washing container.

Abstract: A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat.

Abstract: The described embodiment relates generally to the field of thermal management. More specifically an apparatus for cooling a unibody computing device with obscured inlet and outlet vents is disclosed. Inlet vents are arranged on a bottom surface of the unibody computing device and then exhaust air is vented out from a rear surface of the computing device. The rear vents can be obscured by a stand designed to support the weight of the computing device. By venting exhaust air to either side of the support stand exhaust air can be prevented from being drawn back into the inlet vents, thereby avoiding an overheating condition.

Abstract: A cooling apparatus for a printed circuit board assembly is disclosed. The cooling apparatus comprises a main printed circuit (PC) board 202. The main PC board 202 has a plurality of connectors 210 mounted, in a parallel row, onto the top side of the main PC board 202. A first liquid cooling manifold 204 is positioned along one end of the parallel row of connectors 210 and a second liquid cooling manifold 206 is positioned along the other end of the parallel row of connectors 210. A plurality of heat sink devices 208, each having an elongated shape, run parallel to, and on each side of, the plurality of connectors 210. The plurality of heat sink devices 208 are coupled to the first and second liquid cooling manifolds.

Abstract: According to one embodiment, a natural circulation type cooling apparatus includes a heat receiver with a heat receiving surface on which an exothermic body is mounted, and containing therein a coolant, a condenser on a horizontally lateral side of the heat receiver, a radiator on a horizontally lateral side of the heat receiver and on a vertically downward side of the condenser, a vapor conduit configured to feed vapor of the coolant to an inlet of the condenser, a condensed liquid conduit configured to feed a condensed coolant from an outlet of the condenser to an inlet of the heat receiver, a coolant conduit configured to feed the coolant to an inlet of the radiator, and a circulation conduit configured to feed the coolant from an outlet of the radiator to the inlet of the heat receiver.