Feedthrough Patents (Class 174/262)
  • Patent number: 12295094
    Abstract: A printed circuit board (PCB) is provided herein, including signal and ground pads on a surface of the PCB. The signal pads are grouped into differential signal pad pairs, where each differential signal pad pair has a midpoint located halfway between the centers of the signal pads of the differential signal pad pair. A first differential signal pad pair is positioned on a first line, which intersects with both centers of the signal pads of the first differential signal pad pair. A second differential signal pad pair is positioned on a second line, which intersects with the centers of the signal pads of the second differential signal pad pair, parallel to the first line. Additionally, at least one ground pad is positioned along a line drawn from a midpoint of the first differential signal pad pair and a midpoint of the second differential signal pad pair.
    Type: Grant
    Filed: July 13, 2022
    Date of Patent: May 6, 2025
    Assignee: Marvell Israel (M.I.S.L) Ltd.
    Inventors: Dan Azeroual, Liav Ben Artsi, David Katz
  • Patent number: 12266598
    Abstract: An enhanced integrated circuit interconnect package, method and multiple-layer integrated circuit laminate structure enable increased routing density per layer and maintains signal integrity performance. A differential signal via pair of vertical interconnect vias provide differential signaling. The vias of the differential signal via pair are positioned closely spaced together with each via offset from a center axis of an associated LGA contact, minimizing space between the differential signal vias and maintaining signal integrity performance, and providing increased available wiring signal channel.
    Type: Grant
    Filed: October 24, 2022
    Date of Patent: April 1, 2025
    Assignee: International Business Machines Corporation
    Inventors: Francesco Preda, Sungjun Chun, Jose A. Hejase, Junyan Tang, Pavel Roy Paladhi, Nam Huu Pham, Wiren Dale Becker, Daniel Mark Dreps
  • Patent number: 12262464
    Abstract: A method for forming a thermal and electrical path in a PCB may include forming a first removable layer over a top surface of a PCB and a second removable layer over a bottom surface of the PCB. The method may also include milling or laser drilling the PCB from the top surface to form a first cavity extending into the PCB, plating the first side panel plating the first side with a second metal to partially fill the first cavity; and milling or laser drilling from the bottom surface to form a second cavity extending into the PCB, the first cavity in a thermal communication and/or an electrical communication with the second cavity. The method may also include panel plating the first side with a second metal to fill the first cavity and the second side with the second metal to fill the second cavity, and removing the first and second removable layers from the PCB to form the PCB with a thermal and/or an electrical path comprising the first cavity and the second cavity filled with the second metal.
    Type: Grant
    Filed: December 6, 2021
    Date of Patent: March 25, 2025
    Inventors: Matthew D. Neely, Michael Len, King Yip Leung
  • Patent number: 12256501
    Abstract: The present disclosure relates to a printed circuit board including a first insulating layer including a non-photosensitive insulating material, a first wiring layer embedded in the first insulating layer, where an upper surface thereof is exposed from the upper surface of the first insulating layer, includes a first metal layer, and a second metal layer covering at least a portion of each of the lower surface and side surface of the first metal layer with a thickness thinner than the first metal layer, and a second insulating layer disposed under the lower surface of the first insulating layer to cover at least a portion of a lower surface of the first wiring layer, and including the non-photosensitive insulating material.
    Type: Grant
    Filed: April 14, 2023
    Date of Patent: March 18, 2025
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventor: In Gun Kim
  • Patent number: 12256487
    Abstract: The present disclosure is directed to a hybrid dielectric interconnect stack for a printed circuit board having a first dielectric layer with a first dielectric constant and a first dielectric loss tangent positioned over an intermediate layer, which includes a first dielectric sublayer with a first sublayer dielectric constant and a first sublayer dielectric loss tangent, an embedded conductive layer, and a second dielectric sublayer with a second sublayer dielectric constant and a second sublayer dielectric loss tangent, in which the embedded conductive layer is positioned between the first and second dielectric sublayers, and a second dielectric layer with a second dielectric constant and a second dielectric loss tangent, in which the intermediate layer is positioned between the first and second dielectric layers.
    Type: Grant
    Filed: July 6, 2021
    Date of Patent: March 18, 2025
    Assignee: Intel Corporation
    Inventors: Jackson Chung Peng Kong, Bok Eng Cheah, Jenny Shio Yin Ong, Seok Ling Lim, Chin Lee Kuan, Tin Poay Chuah
  • Patent number: 12248570
    Abstract: The present disclosure is directed to systems and methods for detecting side-channel exploit attacks such as Spectre and Meltdown. Performance monitoring circuitry includes first counter circuitry to monitor CPU cache misses and second counter circuitry to monitor DTLB load misses. Upon detecting an excessive number of cache misses and/or load misses, the performance monitoring circuitry transfers the first and second counter circuitry data to control circuitry. The control circuitry determines a CPU cache miss to DTLB load miss ratio for each of a plurality of temporal intervals. The control circuitry the identifies, determines, and/or detects a pattern or trend in the CPU cache miss to DTLB load miss ratio. Upon detecting a deviation from the identified CPU cache miss to DTLB load miss ratio pattern or trend indicative of a potential side-channel exploit attack, the control circuitry generates an output to alert a system user or system administrator.
    Type: Grant
    Filed: May 9, 2022
    Date of Patent: March 11, 2025
    Assignee: Intel Corporation
    Inventors: Paul Carlson, Rahuldeva Ghosh, Baiju Patel, Zhong Chen
  • Patent number: 12244265
    Abstract: One or more solar cells are connected to a flex circuit, wherein: the flex circuit is comprised of a flexible substrate having one or more conducting layers for making electrical connections to the solar cells; the flex circuit is attached to a panel; and the solar cells are attached to the panel. The flex circuit can be attached to the panel so that the conducting layers are adjacent the solar cells, or the flex circuit can be attached to the panel so that the conducting layers run underneath the solar cells. The conducting layers can be deposited on the flexible substrate and/or the conducting layers can be embedded in the flex circuit, wherein the conducting layers are sandwiched between insulating layers of the flex circuit.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: March 4, 2025
    Assignee: THE BOEING COMPANY
    Inventor: Eric M. Rehder
  • Patent number: 12230423
    Abstract: In a transmission line, a signal conductor layer extends in a front-back direction orthogonal to an up-down direction. A ground conductor layer is above the signal conductor layer. When viewed in a first orthogonal direction, first hollow portions are arranged in the front-back direction in a first direction of the signal conductor layer, and second hollow portions are arranged in the front-back direction in a second direction of the signal conductor layer. Each of regions between adjacent first hollow portions in the front-back direction is a first region. Each of regions between adjacent second hollow portions in the front-back direction is a second region. Each of the first hollow portions overlaps with a corresponding one of the second regions when viewed in a second orthogonal direction. Each of the second hollow portions overlaps with a corresponding one of the first regions when viewed in the second orthogonal direction.
    Type: Grant
    Filed: May 17, 2023
    Date of Patent: February 18, 2025
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Nobuo Ikemoto, Noriaki Okuda, Kosuke Nishio, Masanori Okamoto
  • Patent number: 12211523
    Abstract: A first terminal provided on a tail pad portion includes a base portion, a bent portion and an overlapping portion. The base portion includes a first surface fixed to a base insulating layer and a second surface on an opposite side to the first surface. The bent portion is reversed in a thickness direction of the base portion from an end of the base portion towards the second surface. The overlapping portion extends from the bent portion in a direction along the second surface. An anisotropic conductive film (ACF) is disposed between the overlapping portion and the second terminal. The overlapping portion and the second terminal are connected to each other via the ACF.
    Type: Grant
    Filed: January 5, 2023
    Date of Patent: January 28, 2025
    Assignee: NHK SPRING CO., LTD.
    Inventor: Yukie Yamada
  • Patent number: 12212033
    Abstract: The disclosure discloses a low-loss transmission line structure, which belongs to the field of radio frequency transmission lines and includes at least two metal layers stacked in a vertical manner. A dielectric layer is filled between the metal layers. The metal layers include a signal transmission strip in a middle portion. Ground strips are provided on both sides of the signal transmission strip. Through holes are evenly distributed on the dielectric layer, and the signal transmission strips on each of the metal layers are connected through the through holes to form a signal transmission line. The ground strips on each metal layer are connected through the through holes.
    Type: Grant
    Filed: December 26, 2023
    Date of Patent: January 28, 2025
    Assignee: HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Xiaojun Bi, Jian Li, Ziang Xu, Zixuan Wei
  • Patent number: 12207410
    Abstract: Provided is a wiring circuit board that allows the electrical connection between the elements and the terminals to be easy and sure. The wiring circuit board includes an insulating base layer, a plurality of wires with different thicknesses from each other, and an insulating cover layer sequentially toward an upper side. The wires include a first wire having the greatest thickness. The wiring circuit board further includes a plurality of terminals disposed on an upper surface of the insulating base layer. The terminals are electrically connected with the wires, respectively. The upper surfaces and of the terminals are each located at an upper side as compared to an upper surface of the insulating cover layer (a wire covering portion) covering the first wire.
    Type: Grant
    Filed: October 25, 2022
    Date of Patent: January 21, 2025
    Assignee: NITTO DENKO CORPORATION
    Inventors: Hayato Takakura, Naoki Shibata, Ryosuke Sasaoka
  • Patent number: 12199070
    Abstract: A microelectronic device comprises a memory array region, a control logic region, and an additional control logic region. The memory array region comprises a stack structure comprising vertically alternating conductive structures and insulating structures, and vertically extending strings of memory cells within the stack structure. The control logic region underlies the stack structure and comprises control logic devices configured to effectuate a portion of control operations for the vertically extending strings of memory cells. The additional control logic region overlies the stack structure and comprises additional control logic devices configured to effectuate an additional portion of the control operations for the vertically extending strings of memory cells. Methods of forming a microelectronic device, and additional microelectronic devices and electronic systems are also described.
    Type: Grant
    Filed: July 12, 2023
    Date of Patent: January 14, 2025
    Assignee: Lodestar Licensing Group LLC
    Inventors: Kunal R. Parekh, Paolo Tessariol, Akira Goda
  • Patent number: 12193151
    Abstract: A high-frequency circuit board includes: a first insulating layer having a first dielectric constant; a first metal layer provided to stack over the first insulating layer; a second insulating layer provided to stack over the first metal layer, and having a second dielectric constant lower than the first dielectric constant; a second metal layer provided to stack over the second insulating layer, on which a compound semiconductor device is mounted; and first vias penetrating the second insulating layer and connecting the first metal layer with the second metal layer.
    Type: Grant
    Filed: January 20, 2023
    Date of Patent: January 7, 2025
    Assignee: Fujitsu Limited
    Inventors: Shirou Ozaki, Naoya Okamoto, Yoshihiro Nakata, Yusuke Kumazaki, Toshihiro Ohki, Naoki Hara
  • Patent number: 12185479
    Abstract: A flexible circuit board and a manufacturing method thereof are provided. The flexible circuit board includes a circuit structure, a first cover layer, and a second cover layer. The circuit structure has a top surface and a bottom surface opposite to the top surface. The circuit structure includes multiple circuit layers and multiple insulating layers stacked alternately. A material of the insulating layers is a photosensitive dielectric material and a Young's modulus of the insulating layers is between 0.36 GPa and 8 GPa. The first cover layer is disposed on the top surface of the circuit structure. The second cover layer is disposed on the bottom surface of the circuit structure.
    Type: Grant
    Filed: September 15, 2022
    Date of Patent: December 31, 2024
    Assignee: Unimicron Technology Corp.
    Inventors: Cheng-Ta Ko, Pu-Ju Lin, Shih-Chieh Chen, Chi-Hai Kuo, Jeng-Ting Li
  • Patent number: 12183661
    Abstract: A through electrode substrate includes a substrate having a through hole extending through between a first face and a second face, a diameter of the through hole not having a minimum value inside the through hole; and a conductor arranged inside the through hole, wherein the through hole has a shape having a value obtained by summing a first to an eighth inclination angle at a first to an eighth position, respectively, of an inner face of the through hole of 8.0° or more, each of the first to the eighth inclination angle is an angle of the inner face with respect to a center axis of the through hole, and the first to the eighth position correspond to positions at distances of 6.25%, 18.75%, 31.25%, 43.75%, 56.25%, 68.75%, 81.25%, and 93.75%, respectively, from the first face in a section from the first face to the second face.
    Type: Grant
    Filed: June 26, 2023
    Date of Patent: December 31, 2024
    Assignee: DAI NIPPON PRINTING CO., LTD.
    Inventor: Satoru Kuramochi
  • Patent number: 12183601
    Abstract: A structural body (2, 2A to 2E) according to the present disclosure includes a base (10, 10D, 10E), a first electrode layer (111), a second electrode layer (112), a first via conductor (131), a second via conductor (132), and a connection conductor (133). The base (10, 10D, 10E) is composed of a ceramic. The first electrode layer (111) and the second electrode layer (112) are located inside the base (10, 10D, 10E). The first via conductor (131) and the second via conductor (132) are located inside the base (10, 10D, 10E) and connect the first electrode layer (111) and the second electrode layer (112). The connection conductor is located inside the base (10, 10D, 10E), and connects the first via conductor and the second via conductor.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: December 31, 2024
    Inventors: Yasunori Kawanabe, Takeshi Muneishi, Yoshihiro Okawa
  • Patent number: 12165920
    Abstract: A semiconductor structure includes a first metallization feature, a first dielectric structure over the first metallization feature, a second metallization feature embedded in the first dielectric structure, a via structure between the first metallization feature and the second metallization feature, and a first insulating layer between the first dielectric structure and the first metallization feature, and between the first dielectric structure and the via structure. The first metallization feature extends along a first direction, and the second metallization feature extends along a second direction different from the first direction. The first insulating layer covers first sidewalls of the via structure along the second direction.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: December 10, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Hwei-Jay Chu, Chieh-Han Wu, Cheng-Hsiung Tsai, Chung-Ju Lee
  • Patent number: 12154888
    Abstract: A semiconductor package includes a semiconductor die, a redistribution circuit structure, a supporting structure and a protective layer. The redistribution circuit structure is located on and electrically coupled to the semiconductor die. The supporting structure is located on an outer surface of the redistribution circuit structure, wherein the supporting structure is overlapped with at least a part of the semiconductor die or has a sidewall substantially aligned with a sidewall of the semiconductor die in a vertical projection on the redistribution circuit structure along a stacking direction of the redistribution circuit structure and the supporting structure. The protective layer is located on the supporting structure, wherein the supporting structure is sandwiched between the protective layer and the redistribution circuit structure.
    Type: Grant
    Filed: July 27, 2022
    Date of Patent: November 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Kuei Hsu, Feng-Cheng Hsu, Ming-Chih Yew, Po-Yao Lin, Shuo-Mao Chen, Shin-Puu Jeng
  • Patent number: 12148719
    Abstract: A method includes performing a first light-exposure and a second a second light-exposure on a photo resist. The first light-exposure is performed using a first lithograph mask, which covers a first portion of the photo resist. The first portion of the photo resist has a first strip portion exposed in the first light-exposure. The second light-exposure is performed using a second lithograph mask, which covers a second portion of the photo resist. The second portion of the photo resist has a second strip portion exposed in the second light-exposure. The first strip portion and the second strip portion have an overlapping portion that is double exposed. The method further includes developing the photo resist to remove the first strip portion and the second strip portion, etching a dielectric layer underlying the photo resist to form a trench, and filling the trench with a conductive feature.
    Type: Grant
    Filed: July 20, 2022
    Date of Patent: November 19, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wen Hsin Wei, Hsien-Pin Hu, Shang-Yun Hou, Weiming Chris Chen
  • Patent number: 12144105
    Abstract: A wiring board according to the present disclosure includes a core layer including core electrical conductor layers on upper and lower surfaces of a core insulating layer, a first build-up portion, a second build-up portion, a first mounting region, and a second mounting region. The first build-up portion includes a first build-up insulating layer and a first build-up electrical conductor layer connected to the first mounting region. The second build-up portion includes a second build-up insulating layer and a second build-up electrical conductor layer connected to the second mounting region. The second build-up insulating layer includes a margin for adhesion between the second build-up insulating layers or between the second build-up insulating layer and the core insulating layer. The second build-up electrical conductor layer includes an electrical conductor layer for grounding, a first opening, and a signal pad located inside the first opening.
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: November 12, 2024
    Assignee: KYOCERA CORPORATION
    Inventor: Toshihiro Hiwatashi
  • Patent number: 12142579
    Abstract: A package structure includes a redistribution circuit structure, a wiring substrate, an insulating encapsulation, and a reinforcement structure. The redistribution circuit structure has dielectric layers. The wiring substrate is disposed on the redistribution circuit structure. The insulating encapsulation laterally encapsulates the wiring substrate. The reinforcement structure includes reinforcement pattern layers and reinforcement vias. The reinforcement pattern layers and the dielectric layers are stacked alternately. The reinforcement vias penetrate through the dielectric layers to connect the reinforcement pattern layers. At least one of the reinforcement pattern layers is embedded in the insulating encapsulation. The reinforcement structure is electrically floating.
    Type: Grant
    Filed: July 18, 2023
    Date of Patent: November 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tsung-Fu Tsai, Shih-Ting Lin, Szu-Wei Lu, Chen-Hsuan Tsai, I-Ting Huang
  • Patent number: 12142807
    Abstract: A pseudo coaxial line is connected to a first coplanar line at a first connecting portion and connected to a second coplanar line at a second connecting portion. The first coplanar line and the second coplanar line are, for example, differential coplanar lines. Also, a back surface concave portion in which the second connecting portion of the pseudo coaxial line is exposed is provided. The back surface concave portion is formed into an almost semicircular shape, an almost semielliptical shape, or a rectangular shape in a planar view.
    Type: Grant
    Filed: July 22, 2020
    Date of Patent: November 12, 2024
    Assignee: Nippon Telegraph and Telephone Corporation
    Inventor: Hiromasa Tanobe
  • Patent number: 12142560
    Abstract: An embodiment semiconductor package includes a bare semiconductor chip, a packaged semiconductor chip adjacent the bare semiconductor chip, and a redistribution structure bonded to the bare semiconductor chip and the packaged semiconductor chip. The redistribution structure includes a first redistribution layer having a first thickness; a second redistribution layer having a second thickness; and a third redistribution layer between the first redistribution layer and the second redistribution layer. The third redistribution layer has a third thickness greater than the first thickness and the second thickness. The package further includes an underfill disposed between the bare semiconductor chip and the redistribution structure and a molding compound encapsulating the bare semiconductor chip, the packaged semiconductor chip, and the underfill.
    Type: Grant
    Filed: August 23, 2021
    Date of Patent: November 12, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chung-Shi Liu, Chien-Hsun Lee, Jiun Yi Wu, Hao-Cheng Hou, Hung-Jen Lin, Jung Wei Cheng, Tsung-Ding Wang, Yu-Min Liang, Li-Wei Chou
  • Patent number: 12133330
    Abstract: A wiring substrate includes an insulating layer, a pad in a via hole piercing through the insulating layer and exposed at a first surface of the insulating layer, a via conductor on the pad in the via hole, and a wiring part on a second surface of the insulating layer facing away from the first surface. The wiring part is connected to the pad through the via conductor in the via hole.
    Type: Grant
    Filed: October 18, 2022
    Date of Patent: October 29, 2024
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Akihiro Takeuchi
  • Patent number: 12127353
    Abstract: Provided is a display apparatus. The display apparatus includes: a display panel; a chassis supporting the display panel; a printed circuit board on which an electronic component is mounted; and a supporter inserted in the printed circuit board, wherein the printed circuit board includes a first surface facing the chassis, a second surface facing a direction opposite to the first surface, and a through hole penetrating the first surface and the second surface. The supporter includes: a head fixed on the second surface of the printed circuit board; a first body positioned inside the through hole, and extending from the head toward the chassis; and a second body extending from the first body, and protruding from the through hole toward the chassis.
    Type: Grant
    Filed: March 7, 2022
    Date of Patent: October 22, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jiwon Lee, Sungyong Joo, Junhyun Won, Taejun You
  • Patent number: 12114472
    Abstract: A Radio Frequency, “RF”, component and a method of making the same. The component includes a first electrically conductive signal member for conveying an RF signal and a second electrically conductive signal member for conveying an RF signal. The component also includes a barrier located between the first signal member and the second signal member electromagnetically to shield the first and second signal members from each other. The barrier includes a first row of electrically conductive shielding members spaced apart along a longitudinal axis of the first row, and a second row of electrically conductive shielding members spaced apart along a longitudinal axis of the second row. Each shielding member includes a polyhedron. The shielding members of the first row are offset with respect to the shielding members of the second row to prevent a direct line of sight between the first signal member and the second signal member.
    Type: Grant
    Filed: November 29, 2022
    Date of Patent: October 8, 2024
    Assignee: NXP B.V.
    Inventors: Philipp Franz Freidl, Mustafa Acar, Antonius Hendrikus Jozef Kamphuis, Jan Willem Bergman
  • Patent number: 12114425
    Abstract: A signal transmission structure includes a circuit board, a chip, and a cable assembly. The chip is assembled on one side of the circuit board, and the cable assembly is assembled on the other side of the circuit board. The cable assembly includes a cable, and the circuit board includes a plurality of conductive holes. The chip is electrically connected to the cable of the cable assembly using the conductive hole to transmit a signal of the chip using the cable.
    Type: Grant
    Filed: September 12, 2022
    Date of Patent: October 8, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Guodong Zhang, Chong Chen, Jian Zhang, Shaoyong Xiang, Zhijun Qu, Changxing Sun
  • Patent number: 12114436
    Abstract: A composite circuit board includes a flexible board, rigid boards, adhesive layers, and protection glue; the adhesive layers are sandwiched between the rigid boards and the flexible board and used for bonding the rigid boards and the flexible board; the rigid boards are provided with step slots passing through the rigid boards; the adhesive layers are provided with through slots passing through the adhesive layers; the step slots and the through slots are communicated with each other to form a thinning recess; the thinning recess exposes the flexible board; and the protection glue covers steps of the thinning recess and at least a portion of the exposed area of the flexible board.
    Type: Grant
    Filed: November 10, 2022
    Date of Patent: October 8, 2024
    Assignee: SHENNAN CIRCUITS CO., LTD.
    Inventors: Zhicheng Yang, Xianyou Deng, Jinfeng Liu, Hegen Zhang, Tao Luo, Zhishen Wang
  • Patent number: 12108523
    Abstract: An electronic device according to an example embodiment includes a printed circuit board (PCB) configured to connect a first electronic component and a second electronic component and block power noise in a target frequency band. The PCB may include a first signal layer including a first signal plate having a length pattern with a length corresponding to a first parameter of the target frequency band, a first ground layer including a first ground plate with a first area, a second signal layer including a second signal plate, a first dielectric having a first thickness and a first permittivity, a second ground layer including a second ground plate with a second area corresponding to a second parameter of the target frequency band, and a second dielectric having a second thickness and a second permittivity corresponding to the second parameter.
    Type: Grant
    Filed: September 20, 2022
    Date of Patent: October 1, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kwangmo Yang, Bumhee Bae, Younho Kim, Changwon Jang, Jeongnam Cheon
  • Patent number: 12108528
    Abstract: Provided is an insulating circuit board including: an insulating resin layer; and a circuit layer made of metal pieces, each of which is in a circuit pattern and provided on one surface of the insulating resin layer, wherein thickness of each of the metal pieces constituting the circuit layer is 0.5 mm or more, the insulating resin layer is made of a thermosetting resin, and a void ratio in regions between the metal pieces is 0.8% or less.
    Type: Grant
    Filed: March 26, 2020
    Date of Patent: October 1, 2024
    Assignee: MITSUBISHI MATERIALS CORPORATION
    Inventors: Yoshiaki Sakaniwa, Toyo Ohashi
  • Patent number: 12089347
    Abstract: A circuit board, comprising a multi-layer circuit board, a first conductive circuit, a first circuit layer, an adhesion promoter layer, a second conductive circuit, and a second circuit layer. The multi-layer circuit board comprises an inner circuit and an opening. The opening exposes the inner circuit. The first conductive circuit is disposed in the opening and on the inner circuit. The first circuit layer is disposed on the first conductive circuit in the opening and lower than the depth of the opening. The adhesion promoter layer is disposed in the opening and on the surface of the multi-layer circuit board and connected to the first conductive circuit. The second conductive circuit is disposed on the adhesion promoter layer and on the first circuit layer in the opening. The second circuit layer is disposed on the second conductive circuit in the opening and on the second conductive circuit.
    Type: Grant
    Filed: October 14, 2021
    Date of Patent: September 10, 2024
    Assignee: UNIMICRON TECHNOLOGY CORP.
    Inventors: Chun Yi Kuo, Jia Hao Liang, Ching Ku Lin
  • Patent number: 12082338
    Abstract: A printed wiring board includes a resin insulating layer, pads formed on the resin insulating layer, an uppermost resin insulating layer formed on the resin insulating layer such that the uppermost resin insulating layer is covering the pads and has openings exposing the pads, respectively, via conductors formed in the uppermost resin insulating layer such that the via conductors are formed on the pads exposed from the openings in the uppermost resin insulating layer, respectively, and metal posts formed on the via conductors such that each of the metal posts has a portion on a surface of the uppermost resin insulating layer around the via conductors and a side surface having a flared bottom extending toward the uppermost resin insulating layer.
    Type: Grant
    Filed: May 13, 2022
    Date of Patent: September 3, 2024
    Assignee: IBIDEN CO., LTD.
    Inventor: Satoru Kawai
  • Patent number: 12076948
    Abstract: A composite material structure that prevents a decrease in strength while interposing insulating resin portions between a conductive reinforced resin and a conductor, is provided. The composite material structure includes a conductive resin portion formed of an electrically conductive reinforced resin in which conductive fibers are contained in an insulating base material, a conductor which is formed of an electrically conductive material and a part of which is embedded in the conductive resin portion, and a plurality of layers of insulating resin portions which is layers of resin portions each including insulating fibers contained in an insulating base material, the plurality of layers of the insulating resin portions being embedded in the conductive resin portion so as to sandwich therebetween the at least the part of the conductor and so as to be interposed between the conductive fibers and the conductor.
    Type: Grant
    Filed: June 21, 2021
    Date of Patent: September 3, 2024
    Assignee: YAZAKI CORPORATION
    Inventor: Terukazu Kosako
  • Patent number: 12074130
    Abstract: An electronic circuit device includes a plane-shaped shield member having conductivity, at least one electronic circuit element having a first surface opposed to a second surface on which a connecting part is formed, the first surface arranged on the plane-shaped shield member, a rewiring layer comprises an insulating photosensitive resin layer enclosing the electronic circuit element on the plane-shaped shield member, a plurality of wiring photo vias having a plurality of first conductors electrically connected to a connecting part of the electronic element, a wiring having a second conductor electrically connected to each of the plurality of wiring photo vias on the same surface parallel to the plane-shaped shield member, and a wall-shaped shield groove having a third conductor for a sealing arranged to surround a thickness direction of the electronic circuit element.
    Type: Grant
    Filed: November 23, 2021
    Date of Patent: August 27, 2024
    Assignee: RISING TECHNOLOGIES CO., LTD.
    Inventor: Shuzo Akejima
  • Patent number: 12063752
    Abstract: A circuit board includes first circuit substrate and second circuit substrate; first circuit substrate includes: a first base layer arranged on the first circuit layer and a plurality of first conductive bodies on the substrate layer; the first circuit layer includes a hot pressing area and a non-hot pressing area except the hot pressing area. One end of the first conductive body is electrically connected to the hot pressing area and the other end is exposed to the first base layer; second circuit substrate includes: a second base layer, a second base layer arranged on the second circuit layer and a plurality of second conductive bodies; one end of the second conductive body is electrically connected to the second circuit layer, and the other end is exposed on the second base layer; The body is electrically connected to the second conductive body.
    Type: Grant
    Filed: May 29, 2020
    Date of Patent: August 13, 2024
    Assignees: Avary Holding (Shenzhen) Co., Limited., QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
    Inventors: Wen-Zhu Wei, Ming-Jaan Ho, Fu-Yun Shen, Hong-Yan Guo
  • Patent number: 12057520
    Abstract: A method for manufacturing a display substrate includes: fabricating a first functional structure on a first side of a common substrate, and fabricating a second functional structure on a second side of the common substrate; fabricating a via hole in an edge region of the common substrate; and fabricating a conductive connection portion in the via hole, a first end of the conductive connection portion on the first side extending out of the via hole and coupled to a first functional pattern in the first functional structure, and a second end of the conductive connection portion on the second side extending out of the via hole and coupled to a second functional pattern in the second functional structure. The method provided in embodiments of the present disclosure is applied to the manufacturing of a display substrate.
    Type: Grant
    Filed: July 1, 2020
    Date of Patent: August 6, 2024
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Yingwei Liu, Zhiwei Liang, Ke Wang, Zhanfeng Cao, Shuang Liang
  • Patent number: 12052815
    Abstract: Provided is a manufacturing method of circuit board, including a first substrate, a second substrate, a third substrate, a fourth substrate, multiple conductive structures, and a conductive via structure. The third substrate has an opening and includes a first dielectric layer. The opening penetrates the third substrate, and the first dielectric layer fills the opening. Multiple conductive structures are formed so that the first substrate, the second substrate, the third substrate, and the fourth substrate are electrically connected through the conductive structures to define a ground path. A conductive via structure is formed to penetrate the first substrate, the second substrate, the first dielectric layer of the third substrate, and the fourth substrate. The conductive via structure is electrically connected to the first substrate and the fourth substrate to define a signal path, and the ground path surrounds the signal path.
    Type: Grant
    Filed: August 9, 2023
    Date of Patent: July 30, 2024
    Assignee: Unimicron Technology Corp.
    Inventors: Chih-Chiang Lu, Heng-Ming Nien, Ching-Sheng Chen, Ching Chang, Ming-Ting Chang, Chi-Min Chang, Shao-Chien Lee, Jun-Rui Huang, Shih-Lian Cheng
  • Patent number: 12052814
    Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.
    Type: Grant
    Filed: October 31, 2022
    Date of Patent: July 30, 2024
    Assignee: CelLink Corporation
    Inventors: Kevin Michael Coakley, Malcom Parker Brown, Jose Juarez, Emily Hernandez, Joseph Pratt, Peter Stone, Vidya Viswanath, Will Findlay
  • Patent number: 12048086
    Abstract: A circuit board module relates to the field of touch technologies. The above circuit board module includes a touch chip, a first circuit board, a second circuit board and at least one conductive connection portion. The touch chip includes at least one ground pin and a plurality of signal pins. The first circuit board includes a first ground portion and a plurality of signal pads; the signal pads are electrically connected to the signal pins; the first ground is electrically connected to the at least one ground pin. The second circuit board includes a second ground portion. The at least one conductive connection portion is electrically connected to the first ground portion and the second ground portion.
    Type: Grant
    Filed: March 19, 2021
    Date of Patent: July 23, 2024
    Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Xianfeng Yang, Xianlei Bi, Chuanyan Lan, Qian Ma
  • Patent number: 12027492
    Abstract: Connection terminals of a semiconductor module are disposed appropriately in accordance with the connection destination of the semiconductor module. A semiconductor module which includes at least one semiconductor element is mounted on a first surface of a main substrate, which has the first surface on which a first circuit element is mounted and a second surface on which a second circuit element is mounted. A plurality of connection terminals include a first connection terminal group composed of a plurality of first connection terminals to be connected to the first circuit element via the main substrate, and a second connection terminal group composed of a plurality of second connection terminals to be connected to the second circuit element via the main substrate. The first connection terminal group is disposed on the outer peripheral side with respect to the second connection terminal group.
    Type: Grant
    Filed: September 12, 2019
    Date of Patent: July 2, 2024
    Assignee: AISIN CORPORATION
    Inventor: Takanobu Naruse
  • Patent number: 12028966
    Abstract: A printed circuit board (PCB) and a method of manufacturing the same is described. The PCB includes a substrate defining a major plane and an integrated electromagnetic interference and compatibility (EMC/EMI) shielding enclosure configured to enclose the substrate. The shielding enclosure includes a metallic top layer deposited on top of the major plane of the substrate so as to envelop an uppermost layer of the substrate, a metallic bottom layer deposited on bottom of the major plane of the substrate so as to envelop a bottommost layer of the substrate, and a metallic side layer formed along a length of one or more edges of the substrate to electrically connect the metallic top layer and the metallic bottom layer.
    Type: Grant
    Filed: December 1, 2022
    Date of Patent: July 2, 2024
    Assignee: Marvell Asia Pte, Ltd.
    Inventors: Shaowu Huang, Dance Wu
  • Patent number: 12022613
    Abstract: A printed circuit board includes: a first insulating layer having a recess portion in one surface of the first insulating layer; a first circuit pattern embedded in the first insulating layer and being in contact with a lower surface of the recess portion; a second insulating layer disposed on the one surface of the first insulating layer to be disposed in at least a portion of the recess portion; and a via penetrating through at least a portion of the second insulating layer, disposed in the recess portion, and connected to the first circuit pattern.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: June 25, 2024
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Yong Wan Ji, Jin Uk Lee, Eun Sun Kim, Young Hun You
  • Patent number: 12016117
    Abstract: An extensible and contractible mounting board that includes an extensible and contractible substrate; an extensible and contractible wiring line on one main surface of the extensible and contractible substrate; an electronic component electrically connected to the extensible and contractible wiring line; and a resin portion in contact with the extensible and contractible wiring line and overlapping an end portion of a connection region between the extensible and contractible wiring line and the electronic component in a plan view of the extensible and contractible mounting board, the resin portion having a cutout portion that overlaps the extensible and contractible wiring line. A Young's modulus of the resin portion is higher than a Young's modulus of the extensible and contractible substrate.
    Type: Grant
    Filed: September 1, 2021
    Date of Patent: June 18, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Takahito Tomoda
  • Patent number: 12016133
    Abstract: A circuit board and a method of manufacturing the same are provided. The method includes the following steps of providing a first conductive layer; providing an adhesive material and at least one conductive bump, in which the adhesive material is electrically conductive; adhering at least one conductive bump to a surface of the first conductive layer using the adhesive material; providing an insulation layer; disposing the insulation layer on the surface of the first conductive layer and at least one conductive bump; and disposing a second conductive layer on the insulation layer.
    Type: Grant
    Filed: October 28, 2020
    Date of Patent: June 18, 2024
    Assignee: Unimicron Technology Corp.
    Inventors: Ming-Hao Wu, Hsuan-Wei Chen
  • Patent number: 12004296
    Abstract: A printed circuit board includes: an insulating member; a first wiring layer disposed in the insulating member, and including first and second pattern layers spaced apart from each other based on a thickness direction of the printed circuit board; and a second wiring layer disposed in the insulating member, and spaced apart from the first pattern layer over the first pattern layer based on the thickness direction. Based on the thickness direction, an insulation distance between the first pattern layer and the second pattern layer is smaller than an insulation distance between the first pattern layer and the second wiring layer, and each of the first and second pattern layers is thinner than the second wiring layer.
    Type: Grant
    Filed: April 4, 2022
    Date of Patent: June 4, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Uk Lee, Chi Won Hwang, Eun Sun Kim, Yong Wan Ji, Young Hun You
  • Patent number: 11997799
    Abstract: The present application provides a method for manufacturing a printed circuit board and a printed circuit board. The method for manufacturing a printed circuit board includes: providing a core board, wherein the core board includes an insulating baseplate, and a first surface and/or a second surface opposite to the first surface of the insulating baseplate is provided with a plurality of pads; and laminating a medium layer on a side of the insulating baseplate provided with the plurality of pads to form a laminated layer at least partially embedded among the plurality of pads.
    Type: Grant
    Filed: December 30, 2021
    Date of Patent: May 28, 2024
    Assignee: SHENNAN CIRCUITS CO., LTD.
    Inventor: Changsheng Tang
  • Patent number: 11990442
    Abstract: A semiconductor die is mounted at a die area of a ball grid array package that includes an array of electrically-conductive ball. A power channel conveys a power supply current to the semiconductor die. The power channel is formed by an electrically-conductive connection plane layers extending in a longitudinal direction between a distal end at a periphery of the package and a proximal end at the die area. A distribution of said electrically-conductive balls is made along the longitudinal direction. The electrically-conductive connection plane layer includes subsequent portions in the longitudinal direction between adjacent electrically-conductive balls of the distribution. Respective electrical resistance values of the subsequent portions monotonously decrease from the distal end to the proximal end. A uniform distribution of power supply current over the length of the power channel is thus facilitated.
    Type: Grant
    Filed: November 29, 2021
    Date of Patent: May 21, 2024
    Assignee: STMicroelectron S.r.l.
    Inventors: Cristina Somma, Aurora Sanna, Damian Halicki
  • Patent number: 11991826
    Abstract: A flexible printed circuit board includes a power wiring layer transmitting power and a signal wiring layer insulated and stacked over or under the power wiring layer. The flexible printed circuit board may also include an upper wiring layer and a lower wiring layer insulated and stacked each other, and the power wiring layer and the signal wiring layer are provided between the upper wiring layer and the lower wiring layer.
    Type: Grant
    Filed: April 10, 2020
    Date of Patent: May 21, 2024
    Assignee: DONGWOO FINE-CHEM CO., LTD.
    Inventors: Jongmin Kim, Dong Pil Park, Yoonho Huh
  • Patent number: 11984403
    Abstract: An integrated substrate structure includes a redistribution film, a circuit substrate, and a plurality of conductive features. The redistribution film includes a fine redistribution circuitry, a circuit substrate is disposed over the redistribution film and includes a core layer and a coarse redistribution circuitry disposed in and on the core layer. The circuit substrate is thicker and more rigid than the redistribution film, and a layout density of the fine redistribution circuitry is denser than that of the coarse redistribution circuitry. The conductive features are interposed between the circuit substrate and the redistribution film to be connected to the fine redistribution circuitry and the coarse redistribution circuitry. A redistribution structure and manufacturing methods are also provided.
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: May 14, 2024
    Inventor: Dyi-Chung Hu
  • Patent number: 11973034
    Abstract: Exemplary methods of electroplating a metal with a nanotwin crystal structure are described. The methods may include plating a metal material into at least one opening on a patterned substrate, where at least a portion of the metal material is characterized by a nanotwin crystal structure. The methods may further include polishing an exposed surface of the metal material in the opening to reduce an average surface roughness of the exposed surface to less than or about 1 nm. The polished exposed surface may include at least a portion of the metal material characterized by the nanotwin crystal structure. In additional examples, the nanotwin-phased metal may be nanotwin-phased copper.
    Type: Grant
    Filed: August 25, 2021
    Date of Patent: April 30, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Eric J. Bergman, John L. Klocke, Marvin L. Bernt, Jing Xu, Kwan Wook Roh