Utilizing Organic Compound-containing Bath Patents (Class 205/296)
  • Patent number: 10494732
    Abstract: The present invention relates to a method for monitoring the total amount of brighteners in an acidic copper/copper alloy plating bath during a copper/copper alloy plating process, the use of such a method for controlling a plating process, a controlled process for electrolytically depositing copper/copper alloy onto a substrate utilizing the method for monitoring according to the present invention, and the use of one or more than one redox active compound for monitoring and/or determining the total amount of brighteners in the acidic copper/copper alloy plating bath.
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: December 3, 2019
    Assignee: Atotech Deutschland GmbH
    Inventors: Mutlu-Iskender Muglali, Torsten Voss, Andreas Kirbs
  • Patent number: 10294574
    Abstract: A composition for electrolytic plating in microelectronics which contains a leveler that comprises the reaction product of an aliphatic di(t-amine) with an alkylating agent. Electrolytic plating methods employing the leveler, a method for making the leveler, and the leveler compound.
    Type: Grant
    Filed: September 15, 2015
    Date of Patent: May 21, 2019
    Assignee: MacDermid Enthone Inc.
    Inventors: Kyle Whitten, Vincent Paneccasio, Jr., Thomas Richardson, Eric Rouya
  • Patent number: 10270073
    Abstract: There is provided an organic/inorganic complex coating porous separator including a porous substrate, and an organic/inorganic complex coating layer formed in a single layer or multiple layers on a single surface or both surfaces of the porous substrate or at least a part of a pore portion of the porous substrate using a coating solution comprising a binder dispersed or suspended in a certain size and selectively comprising inorganic particles, and a secondary battery including the same. According to the present invention, since the coating solution comprising the binder dispersed in a certain size or less in a solvent is coated/dried on the porous substrate, a organic/inorganic complex coating porous separator having excellent air permeability and adhesive strength and a secondary battery including the organic/inorganic complex coating porous separator are provided.
    Type: Grant
    Filed: August 18, 2016
    Date of Patent: April 23, 2019
    Assignee: Hanwha Total Petrochemical Co., Ltd.
    Inventors: Jae Yong Hyun, Jin A. Yoo, Do Hoon Lee, Chang Hyun Choi
  • Patent number: 10239996
    Abstract: A process for preparing non-naturally-occurring defined monomer sequence polymers is provided, and in which a high degree of synthetic control is obtained by the use of solvent resistant diafiltration membranes. Also provided is a process for separating non-naturally-occurring defined monomer sequence polymers from synthetic by-products or excess reagents using solvent resistant diafiltration membranes, and a use of a solvent resistant diafiltration membrane in processes for preparing and separating non-naturally-occurring defined monomer sequence polymers.
    Type: Grant
    Filed: August 6, 2015
    Date of Patent: March 26, 2019
    Assignee: IMPERIAL INNOVATIONS LIMITED
    Inventors: Marc Shaepertoens, Piers Robert James Gaffney, Gyorgy Szekely, Andrew Guy Livingston
  • Patent number: 9922874
    Abstract: A method of processing a semiconductor substrate includes: immersing a substrate in a first bath, wherein the substrate comprises a barrier layer, a conductive seed layer, and a patterned photoresist layer defining an opening; providing a first electric current between the conductive seed layer and a first anode disposed in electrical contact with the first bath to deposit a conductive material within the opening; stripping the patterned photoresist layer; immersing the substrate in a second bath; providing a second electric current that is a reverse of the first electric current between the conductive seed layer plus the conductive material and a second anode disposed in electrical contact with the second bath; etching the conductive seed layer from atop a field region of the barrier layer; and etching the barrier layer from atop a field region of the substrate.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: March 20, 2018
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Prayudi Lianto, Sam Lee, Charles Sharbono, Marvin Louis Bernt, Guan Huei See, Arvind Sundarrajan
  • Patent number: 9512530
    Abstract: A molten salt bath includes at least two types selected from the group consisting of lithium, sodium, potassium, rubidium, cesium, beryllium, magnesium, calcium, strontium, and barium; at least one type selected from the group consisting of fluorine, chlorine, bromine, and iodine; at least one element selected from the group consisting of scandium, yttrium, titanium, zirconium, hafnium, vanadium, niobium, tantalum, chromium, molybdenum, tungsten, manganese, technetium, rhenium, and lanthanoid; and an organic polymer having at least one type of a bond of carbon-oxygen-carbon and a bond of carbon-nitrogen-carbon. A deposit obtained using the molten salt bath, and a method of producing a metal deposit using the molten salt bath are provided.
    Type: Grant
    Filed: November 22, 2005
    Date of Patent: December 6, 2016
    Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., KYOTO UNIVERSITY
    Inventors: Shinji Inazawa, Koji Nitta, Kazunori Okada, Toshiyuki Nohira
  • Patent number: 9243339
    Abstract: A copper electroplating bath for producing copper electrodeposits is described. The copper electroplating bath comprises (a) a soluble copper salt, (b) an electrolyte comprising one or more acids, and (c) a grain refining additive comprising an alkyl, aryl or alkylaryl diamine. The copper electroplating bath can be used for producing electroformed copper deposits having low oxygen content.
    Type: Grant
    Filed: May 25, 2012
    Date of Patent: January 26, 2016
    Inventor: Trevor Pearson
  • Publication number: 20150136611
    Abstract: Reaction products of guanidine compounds or salts thereof, polyepoxide compounds and polyhalogen compounds may be used as levelers in metal electroplating baths, such as copper electroplating baths, to provide good throwing power. Such reaction products may plate with good surface properties of the metal deposits and good physical reliability.
    Type: Application
    Filed: November 21, 2013
    Publication date: May 21, 2015
    Inventors: Julia KOZHUKH, Zuhra I. NIAZIMBETOVA, Maria Anna RZEZNIK
  • Patent number: 9028668
    Abstract: For use for a circuit board where a through hole and a blind via hole co-exist, an electrolytic copper plating bath in which the covering power for the through hole and the plugging performance for the blind via hole are sufficient, and an electroplating method that uses the electrolytic copper plating bath, are disclosed. The electrolytic copper plating bath is mainly composed of a water-soluble copper salt, sulfuric acid and chloride ions. A polyamide polyamine, obtained on processing by heating of an epichlorohydrin modified product of a polycondensation product of diethylene triamine, adipic acid and ?-caprolactam, is contained in the bath as a leveler.
    Type: Grant
    Filed: July 21, 2010
    Date of Patent: May 12, 2015
    Assignee: C. Uyemura & Co., Ltd
    Inventors: Toshihisa Isono, Naoyuki Omura, Koji Shimizu, Shinji Tachibana
  • Patent number: 9011666
    Abstract: A composition comprising a source of metal ions and at least one leveling agent obtainable by condensing at least one trialkanolamine of the general formula N(R1—OH)3 (Ia) and/or at least one dialkanolamine of the general formula R2—N(R1—OH)2 (Ib) to give a polyalkanolamine(II), wherein the R1 radicals are each independently selected from a divalent, linear or branched aliphatic hydrocarbon radical having from 2 to 6 carbon atoms, and the R2 radicals are each selected from hydrogen and linear or branched aliphatic, cycloaliphatic and aromatic hydrocarbon radicals having from 1 to 30 carbon atoms, or derivatives obtainable by alkoxylation, substitution or alkoxylation and substitution of said polyalkanolamine(II).
    Type: Grant
    Filed: December 8, 2009
    Date of Patent: April 21, 2015
    Assignee: BASF SE
    Inventors: Cornelia Roeger-Goepfert, Roman Benedikt Raether, Sophia Ebert, Charlotte Emnet, Alexandra Haag, Dieter Mayer
  • Patent number: 8992757
    Abstract: A method for electrofilling large, high aspect ratio recessed features with copper without depositing substantial amounts of copper in the field region is provided. The method allows completely filling recessed features having aspect ratios of at least about 5:1 such as at least about 10:1, and widths of at least about 1 ?m in a substantially void-free manner without depositing more than 5% of copper in the field region (relative to the thickness deposited in the recessed feature). The method involves contacting the substrate having one or more large, high aspect ratio recessed features (such as a TSVs) with an electrolyte comprising copper ions and an organic dual state inhibitor (DSI) configured for inhibiting copper deposition in the field region, and electrodepositing copper under potential-controlled conditions, where the potential is controlled not exceed the critical potential of the DSI.
    Type: Grant
    Filed: May 18, 2011
    Date of Patent: March 31, 2015
    Assignee: Novellus Systems, Inc.
    Inventors: Mark J. Willey, Steven T. Mayer
  • Patent number: 8991050
    Abstract: The present invention describes a method for manufacturing rotogravure cylinders with a cylinder base made of a light weight material like aluminum. The method involves the surface treatment of the cylinder with mechanical means, the copper plating in an appropriate solution, the engraving of the cylinder, and the hardening of the cylinder by chromium plating. The advantage of this method is that the chemical treatment for the preparation of the cylinder surface which generates hazardous waste is replaced by a mechanical process. In addition, the reduction of the cylinder weight considerably (e.g. for aluminum base cylinder the weight reduction is two thirds of the weight of a steel base cylinder) reduces significantly the transportation costs. Moreover, the adhesion of the copper layer to be engraved is improved and the cost and time of manufacturing reduced.
    Type: Grant
    Filed: November 9, 2010
    Date of Patent: March 31, 2015
    Assignee: Artio SARL
    Inventor: Ioannis Ioannou
  • Patent number: 8961771
    Abstract: Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit deposit properties (e.g., resistivity) within desired ranges.
    Type: Grant
    Filed: July 26, 2012
    Date of Patent: February 24, 2015
    Assignee: APPLIED Materials, Inc.
    Inventors: Rajesh Baskaran, Robert W. Batz, Jr., Bioh Kim, Tom L. Ritzdorf, John L. Klocke, Kyle M. Hanson
  • Publication number: 20140262800
    Abstract: Presented herein is a method of processing a device, comprising providing an electroplating bath having a leveler, the leveler having a total nitrogen-to-total carbon (TN/TOC) ratio of about 15% or less, bringing a substrate into contact with the electroplating bath, the substrate having a recess formed therein and electroplating the substrate to create a feature substantially free of voids in the substrate recess. Electroplating the substrate is performed for a time period about as long as an electrical response peak of the leveler, and optionally for at least 30 seconds. The leveler may optionally have at least one ingredient free of nitrogen and having a leveling functionality. One ingredient may be a benzene ring free of nitrogen. The leveler TN/TOC ratio is between about 3% and about 15%.
    Type: Application
    Filed: March 27, 2013
    Publication date: September 18, 2014
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Yuan Kao, Hung-Wen Su, Minghsing Tsai
  • Publication number: 20140238868
    Abstract: Compositions suitable for the electrodeposition of copper on substrates, such as electronic device substrates, are provided. Methods of depositing copper layers on surfaces and filling apertures with copper are also provided.
    Type: Application
    Filed: February 25, 2013
    Publication date: August 28, 2014
    Applicants: DOW GLOBAL TECHNOLOGIES LLC, ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: Tina C. LI, Robert D. MIKKOLA, David S. LAITAR, Duane R. ROMER
  • Patent number: 8808525
    Abstract: A cyanide-free electrolyte composition for the galvanic deposition of a copper layer on substrate surfaces and a method for the deposition of such layers. The electrolyte composition comprises at least copper(II) ions, a hydantoin and/or hydantoin derivative, a di- and/or tricarboxylic acid or salts thereof, and a metalate of an element of the group consisting of molybdenum, tungsten and vanadium and/or a cerium compound.
    Type: Grant
    Filed: July 15, 2009
    Date of Patent: August 19, 2014
    Assignee: Enthone Inc.
    Inventor: Stefan Schäfer
  • Patent number: 8801912
    Abstract: Disclosed is a method for a repeated electroplating of a workpiece to be plated as a cathode by using an insoluble anode in a plating vessel accommodating a copper sulfate plating bath, wherein a copper dissolution vessel different from the plating vessel is provided, the plating bath is transferred to the copper dissolution vessel and is returned from the copper dissolution vessel to the plating vessel for circulating the plating bath between the plating vessel and the copper dissolution vessel, copper ion supplying salt is charged into the copper dissolution vessel and dissolved in the plating bath so that copper ions consumed by the plating can be replenished, and the workpiece to be plated is continuously electroplated, characterized in that the plating bath is permitted to transfer between the anode side and the cathode side, and the plating bath is returned to vicinity of the anode in the return of the plating bath from the copper dissolution vessel to the plating vessel.
    Type: Grant
    Filed: March 10, 2009
    Date of Patent: August 12, 2014
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Naoyuki Omura, Toshihisa Isono, Koji Shimizu, Shinji Tachibana, Tomohiro Kawase, Shunsaku Hoshi
  • Patent number: 8795505
    Abstract: A copper electroplating method including dipping a substrate in a copper electroplating solution, the substrate including a seed layer; and forming a copper electroplating layer on the seed layer, wherein the copper electroplating solution includes water, a copper supply source, an electrolytic material, and a first additive, the first additive includes a compound represented by Formula 1, below:
    Type: Grant
    Filed: November 7, 2011
    Date of Patent: August 5, 2014
    Assignees: Samsung Electronics Co., Ltd., Adeka Corporation
    Inventors: Myung-Beom Park, Jung-Sik Choi, Ki-Hyeon Kim, Yuji Morishima, Shin-ichi Tanaka, Takashi Yamada, Takehiro Zushi
  • Publication number: 20140199588
    Abstract: The present invention provides an electrodeposited copper foil having a tensile strength of at least 300 MPa and elongation rate of at least 3.0% after heat treatment at 350° C. for 1 hour and provides a copper foil which prevents the breakage of a current collector (copper foil) while maintaining adhesiveness between the current collector (copper foil) and the active material in response to substantial expansion and contraction of a Si or Sn alloy-based active material. The foil is an electrodeposited copper foil having a roughened surface, the tensile strength of the copper foil being at least 300 MPa after heating at 350° C. for 1 hour, the elongation rate being at least 3.0% after heating at 350° C. for 1 hour, and respective surface area ratios (actual surface area/geometric surface area) of both sides of the copper foil (the side that is roughened and the side that is not roughened) being from 1.6 to 2.2.
    Type: Application
    Filed: June 27, 2012
    Publication date: July 17, 2014
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Kensaku Shinozaki, Akitoshi Suzuki
  • Publication number: 20140197038
    Abstract: An electroplating solution includes an aqueous electrolyte solution including water soluble copper salts, sulfide ions and chloride ions, an accelerator including an organic material having sulfur (S), the accelerator accelerating copper (Cu) reduction, a suppressor including a polyether compound, the suppressor selectively suppressing the copper reduction, and a leveler including a water soluble polymer having nitrogen that is dissolved into positive ions in the aqueous electrolyte solution.
    Type: Application
    Filed: January 15, 2014
    Publication date: July 17, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Myung-Beom PARK, Yun-Deok KANG, Ki-Hyeon KIM, Youn-Joung CHO, Jung-Sik CHOI
  • Patent number: 8771495
    Abstract: A method and composition for metallizing a via feature in a semiconductor integrated circuit device substrate, using a leveler compound which is a dipyridyl compound.
    Type: Grant
    Filed: March 5, 2013
    Date of Patent: July 8, 2014
    Assignee: Enthone Inc.
    Inventors: Vincent Paneccasio, Jr., Xuan Lin, Richard Hurtubise, Qingyun Chen
  • Publication number: 20140174937
    Abstract: A copper plating solution which contains compounds with the structure —X—S—Y— where X and Y are, independently of each other, atoms selected from a group consisting of hydrogen, carbon, sulfur, nitrogen, and oxygen, and X and Y can be the same only if they are carbon atoms and aliphatic semialdehydes. By using this copper electroplating solution it is possible to form good filled vias without worsening the appearance of the plating.
    Type: Application
    Filed: December 24, 2012
    Publication date: June 26, 2014
    Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: Matsuko Saito, Makoto Sakai, Shinjiro Hayashi
  • Patent number: 8747643
    Abstract: Copper plating baths containing a leveling agent that is a reaction product of one or more of certain cyclodiaza-compounds with one or more epoxide-containing compounds that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.
    Type: Grant
    Filed: August 22, 2011
    Date of Patent: June 10, 2014
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Zukhra I. Niazimbetova, Maria Anna Rzeznik
  • Publication number: 20140097092
    Abstract: A composition comprising a source of metal ions and at least one polyaminoamide, said polyaminoamide comprising amide and amine functional groups in the polymeric backbone and aromatic moieties attached to or located within said polymeric backbone.
    Type: Application
    Filed: May 31, 2012
    Publication date: April 10, 2014
    Applicant: BASF SE
    Inventors: Cornelia Roeger-Goepfert, Marco Arnold, Alexander Fluegel, Charlotte Emnet, Roman Benedikt Raether, Dieter Mayer
  • Patent number: 8679316
    Abstract: An aqueous, acid bath for the electrolytic deposition of copper contains at least one copper ion source, at least one acid ion source, at least one brightener compound, and at least one leveler compound, and generates a very uniform copper deposit in particular in blind micro vias (BMVs) and trenches. The leveler compound is selected from among synthetically produced non-functionalized peptides, synthetically produced functionalized peptides, and synthetically produced functionalized amino acids.
    Type: Grant
    Filed: April 27, 2009
    Date of Patent: March 25, 2014
    Assignee: Atotech Deutschland GmbH
    Inventors: Heiko Brunner, Bernd Roelfs, Dirk Rohde, Thomas Pliet
  • Patent number: 8679317
    Abstract: A copper electroplating bath useful in filling non-through holes formed on a substrate which contains a water-soluble copper salt, sulfuric acid, and chloride ions and further contains a brightener, a carrier, and a leveler as additives, wherein the leveler contains at least one water-soluble polymer containing quaternary nitrogen, tertiary nitrogen, or both which are cationizable in a solution. In the copper electroplating bath, the filling power for non-through holes formed on a substrate can be easily controlled so as to fit to the size of the holes only by changing the quaternary nitrogen to tertiary nitrogen ratio of the water-soluble polymer to be used as the leveler, which enables copper electroplating of non-through holes of various sizes with a good fit to the sizes.
    Type: Grant
    Filed: May 21, 2007
    Date of Patent: March 25, 2014
    Assignee: C. Uyemura & Co., Ltd.
    Inventors: Toshihisa Isono, Shinji Tachibana, Tomohiro Kawase, Naoyuki Omura
  • Publication number: 20130341199
    Abstract: Provided are an additive for electro copper plating and an electro copper plating bath containing the additive, wherein the additive forms a plating film uniformly in a range of from a low current density portion to a high current density portion and thereby gives good glossiness, and is not consumed at the time of non-usage thereof. In the present invention, an additive for electro copper plating including a block polymer compound expressed by the following general formula (1) is added to an electro copper plating bath. (Here, in the formula, R represents an alkyl group or an alkenyl group having a linear-chain or branched-chain structure and having a carbon number of 1 to 15, m is an integer of from 1 to 30, and n is an integer of from 1 to 40.
    Type: Application
    Filed: March 23, 2012
    Publication date: December 26, 2013
    Applicant: C. UYEMURA & CO., LTD.
    Inventors: Hiroki Uchida, Hironori Sugiura
  • Publication number: 20130334057
    Abstract: This electrolytic refining method of high-purity electrolytic copper includes: performing electrolysis by using an electrolyte which includes a copper nitrate solution, a cathode made of stainless steel, and an anode made of copper so as to deposit high-purity electrolytic copper on the cathode. (a) The electrolyte includes a mixture of polyethylene glycol and polyvinyl alcohol at a content of 20 ppm or more as an additive. (b) When a molecular weight of the polyethylene glycol is given as Z and a, current density during the electrolysis is given as X (A/dm2), the electrolysis is performed under conditions that fulfill the following relational expressions, 1000?Z?2000 1.2?(Z?1000)×0.0008?X?2.2?(Z?1000)×0.001.
    Type: Application
    Filed: June 11, 2013
    Publication date: December 19, 2013
    Inventors: Mami Watanabe, Kiyotaka Nakaya, Naoki Kato
  • Patent number: 8591715
    Abstract: The present invention relates to an electrodeposition composition intended particularly for coating a semiconductor substrate in order to fabricate structures of the “through via” type for the production of interconnects in integrated circuits. According to the invention, the said solution comprises copper ions in a concentration of between 14 and 120 mM and ethylenediamine, the molar ratio between ethylenediamine and copper being between 1.80 and 2.03 and the pH of the electrodeposition solution being between 6.6 and 7.5. The present invention also relates to the use of the said electrodeposition solution for the deposition of a copper seed layer, and to the method for depositing a copper a seed layer with the aid of the electrodeposition solution according to the invention.
    Type: Grant
    Filed: May 4, 2009
    Date of Patent: November 26, 2013
    Assignee: Alchimer
    Inventors: Saïd Zahraoui, Frédéric Raynal
  • Patent number: 8589084
    Abstract: Ethanol emissions from a direct ignition spark ignition are measured using mass spectrometry. The method exploits specific fragment ions from ethanol. Ethanol contributes ions of mass number 31, and no other gas species produces ions at this mass number. The method and a device for implementing the method can be used for online detection of ethanol in emissions from engines burning E85 or other ethanol/gasoline mixtures.
    Type: Grant
    Filed: October 8, 2010
    Date of Patent: November 19, 2013
    Assignee: Massachusetts Institute of Technology
    Inventors: Kenneth Kar, Wai K. Cheng
  • Patent number: 8574418
    Abstract: The object of the present invention is a method of coating a surface of a substrate with copper by electroplating. According to the invention, this method comprises: a step during which the surface to be coated is brought into contact with an electroplating bath while the surface is not under electrical bias; a step of forming the coating during which the surface is biased; a step during which the surface is separated from the electroplating bath while it is under electrical bias; the aforementioned electroplating bath comprising, in solution in a solvent: a source of copper ions, with a concentration of between 0.4 and 40mM; and at least one copper complexing agent.
    Type: Grant
    Filed: September 20, 2006
    Date of Patent: November 5, 2013
    Assignee: Alchimer
    Inventors: Hervé Monchoix, Frédéric Raynal, Jérôme Daviot, José Gonzalez
  • Publication number: 20130264213
    Abstract: Disclosed is a composition comprising a source of metal ions, one or more suppressing agents and at least one additive comprising a linear or branched, polymeric biguanide compound comprising the structural unit of formula L1 or the corresponding salt thereof, wherein R1 is independently selected from H or an organic radical having 1-20 carbon atoms; R2 is an divalent organic radical having 1-20 carbon atoms, optionally comprising 20 polymeric biguanide side branches; and n is an integer of 2 or more.
    Type: Application
    Filed: December 19, 2011
    Publication date: October 10, 2013
    Applicant: BASF SE
    Inventors: Cornelia Roeger-Goepfert, Roman Benedikt Raether, Harald Hoerhammer, Arnold Marco, Charlotte Emnet, Dieter Mayer
  • Publication number: 20130168255
    Abstract: The subject-matter of the present invention is a composition especially intended for filling, by the electroplating of copper, a cavity in a semiconductor substrate such as a “through-via” structure for the production of interconnects in three-dimensional integrated circuits. According to the invention, this composition comprises in solution in a solvent: copper ions in a concentration lying between 45 and 1500 mM; a complexing agent for the copper consisting of at least one compound chosen from aliphatic polyamines having 2 to 4 amino groups, preferably ethylenediamine, in a concentration lying between 45 and 3000 mM; the molar ratio between the copper and said complexing agent lying between 0.1 and 5; thiodiglycolic acid in a concentration lying between 1 and 500 mg/l; and optionally a buffer system, in particular ammonium sulfate, in a concentration lying between 0.1 and 3M.
    Type: Application
    Filed: June 9, 2011
    Publication date: July 4, 2013
    Applicant: ALCHIMER
    Inventors: Nadia Frederich, Frédéric Raynal, José Gonzalez
  • Publication number: 20130122326
    Abstract: An electrodeposited nano-twins copper layer, a method of fabricating the same, and a substrate comprising the same are disclosed. According to the present invention, at least 50% in volume of the electrodeposited nano-twins copper layer comprises plural grains adjacent to each other, wherein the said grains are made of stacked twins, the angle of the stacking directions of the nano-twins between one grain and the neighboring grain is between 0 to 20 degrees. The electrodeposited nano-twins copper layer of the present invention is highly reliable with excellent electro-migration resistance, hardness, and Young's modulus. Its manufacturing method is also fully compatible to semiconductor process.
    Type: Application
    Filed: November 16, 2012
    Publication date: May 16, 2013
    Applicant: NATIONAL CHIAO TUNG UNIVERSITY
    Inventor: NATIONAL CHIAO TUNG UNIVERSITY
  • Patent number: 8419920
    Abstract: An object of the present invention is to provide a method for preparing a sulfuric acid base copper electrolytic solution used for formation of an electro-deposited copper film comprising a surface excellent in smoothness and gloss when formed by using the solution just after preparation and is prepared by using mono-sulfides. To achieve the object, a sulfuric acid base copper electrolytic solution is made to contain a sulfonated active sulfur compound, the bis(3-sulfopropyl)disulfide which is recommended for formation of a glossy electro-deposited copper film. And the bis(3-sulfopropyl)disulfide contained is obtained by converting a 3-mercapto-1-propanesulfonic acid into the bis(3-sulfopropyl)disulfide in an aqueous solution of the 3-mercapto-1-propanesulfonic acid by an oxidation reaction. In the oxidation reaction, an air bubbling method is preferably used to prevent oxidative decomposition of the 3-mercapto-1-propanesulfonic acid.
    Type: Grant
    Filed: October 2, 2007
    Date of Patent: April 16, 2013
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Sakiko Tomonaga, Makoto Dobashi, Junshi Yoshioka, Ayumu Tateoka, Mitsuyoshi Matsuda, Hisao Sakai
  • Publication number: 20130081855
    Abstract: A composite material includes a metal matrix of a metal and a reducing agent. The reducing agent is dispersed in the metal matrix and is capable of reducing an oxide of the metal at room temperature.
    Type: Application
    Filed: September 28, 2012
    Publication date: April 4, 2013
    Applicant: DENSO CORPORATION
    Inventor: Denso Corporation
  • Patent number: 8388824
    Abstract: A method for metallizing a via feature in a semiconductor integrated circuit device substrate, wherein the semiconductor integrated circuit device substrate comprises a front surface, a back surface, and the via feature and wherein the via feature comprises an opening in the front surface of the substrate, a sidewall extending from the front surface of the substrate inward, and a bottom. The method comprises contacting the semiconductor integrated circuit device substrate with an electrolytic copper deposition chemistry comprising (a) a source of copper ions and (b) a leveler compound, wherein the leveler compound is a reaction product of a dipyridyl compound and an alkylating agent; and supplying electrical current to the electrolytic deposition chemistry to deposit copper metal onto the bottom and sidewall of the via feature, thereby yielding a copper filled via feature.
    Type: Grant
    Filed: November 26, 2008
    Date of Patent: March 5, 2013
    Assignee: Enthone Inc.
    Inventors: Vincent Paneccasio, Jr., Xuan Lin, Richard Hurtubise, Qingyun Chen
  • Publication number: 20130020203
    Abstract: A composition comprising a source of metal ions and at least one additive comprising a polyalkyleneimine backbone, said polyalkyleneimine backbone having a molecular weight Mw of from 300 g/mol to 1000000 g/mol, wherein the N hydrogen atoms in the backbone are substituted by a polyoxyalkylene radical and wherein the average number of oxyalkylene units in said polyoxyalkylene radical is from 1.5 to 10 per N—H unit.
    Type: Application
    Filed: March 17, 2011
    Publication date: January 24, 2013
    Applicant: BASF SE
    Inventors: Cornelia Roeger-Goepfert, Roman Benedikt Raether, Marco Arnold, Charlotte Emnet, Dieter Mayer
  • Patent number: 8349149
    Abstract: One embodiment of the invention is an apparatus for electrochemical deposition (ECD) of a metal or an alloy inside at least one opening located at a front surface of a substrate, said apparatus including: (a) an electrochemical deposition (ECD) cell adapted to contain an electrolyte, the electrolyte including plating metallic ions and at least one inhibitor additive; (b) a cathode including at least a portion of said front surface of the substrate, wherein at least one surface inside said at least one opening includes an exposed metallic surface, and wherein at least a portion of said cathode is immersed in said electrolyte; (c) at least one anode, wherein at least a portion of the at least one anode is immersed in said electrolyte; (d) a power supply adapted to generate an electroplating current through the electrolyte between said cathode and said at least one anode; and (e) means for producing a turbulent flow of the electrolyte across the front surface of the substrate, wherein the turbulent flow is capab
    Type: Grant
    Filed: July 13, 2007
    Date of Patent: January 8, 2013
    Inventor: Uri Cohen
  • Patent number: 8337688
    Abstract: Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.
    Type: Grant
    Filed: August 15, 2011
    Date of Patent: December 25, 2012
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Erik Reddington, Gonzalo U. Desmaison, Zukra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
  • Publication number: 20120318676
    Abstract: Electroplating methods provide substantially uniform deposits of copper on the edges and walls of through-holes of printed circuit boards. The electroplating methods provide copper deposits which have high throwing power.
    Type: Application
    Filed: December 15, 2011
    Publication date: December 20, 2012
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Elie H. NAJJAR, Mark LEFEBVRE, Leon R. BARSTAD, Michael P. TOBEN
  • Patent number: 8329018
    Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.
    Type: Grant
    Filed: September 6, 2011
    Date of Patent: December 11, 2012
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Erik Reddington, Gonzalo U. Desmaison, Zukra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
  • Publication number: 20120298519
    Abstract: An electrolytic composition for the deposition of a matt metal layer onto a substrate and deposition process where the composition comprises a source of metal from the group consisting of Cr, Mn, Fe, Co, Ni, Cu, Zn, Ru, Rh, Pd, Ag, In, Sn, Sb, Re, Pt, Au, Bi, and combinations thereof; a substituted or unsubstituted polyalkylene oxide or its derivative as an emulsion and/or dispersion former; and a compound comprising fluorated or perfluorated hydrophobic chains or which is a polyalkylene oxide substituted quaternary ammonium compound as wetting agent; wherein the electrolytic composition forms a microemulsion and/or dispersion.
    Type: Application
    Filed: June 4, 2012
    Publication date: November 29, 2012
    Applicant: ENTHONE INC.
    Inventors: Andreas Königshofen, Danica Elbick, Christoph Werner, Wolfgang Clauberg, Peter Pies, Andreas Möbius
  • Publication number: 20120292193
    Abstract: A composition comprising a source of metal ions and at least one additive comprising at least one polyaminoamide represented by formula (I) or derivatives of a polyaminoamide of formula (I) obtainable by complete or partial protonation, N-quarternisation or acylation.
    Type: Application
    Filed: November 22, 2010
    Publication date: November 22, 2012
    Applicant: BASF SE
    Inventors: Cornelia Roeger-Goepfert, Roman Benedikt Raether, Dieter Mayer, Charlotte Emnet, Marco Arnold
  • Patent number: 8262891
    Abstract: Leveling agents for metal plating baths are provided. Plating baths containing such leveling agents provide metal deposits having substantially level surfaces. Such leveling agents may be selected to selectively incorporate desired levels of impurities into the metal deposit.
    Type: Grant
    Filed: October 2, 2006
    Date of Patent: September 11, 2012
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Deyan Wang, Robert D. Mikkola, George G. Barclay
  • Patent number: 8262894
    Abstract: A copper electroplating bath that includes an aqueous solution that comprises a copper salt and at least one acid and a container that comprises a copper salt in solid form, is disclosed. The container supplies copper ions to the aqueous solution to maintain the copper ion concentration of the aqueous solution at saturation levels while retaining the copper salt in solid form within the container.
    Type: Grant
    Filed: April 30, 2009
    Date of Patent: September 11, 2012
    Assignee: Moses Lake Industries, Inc.
    Inventors: Xingling Xu, Eric Webb
  • Publication number: 20120211369
    Abstract: A copper electroplating method including dipping a substrate in a copper electroplating solution, the substrate including a seed layer; and forming a copper electroplating layer on the seed layer, wherein the copper electroplating solution includes water, a copper supply source, an electrolytic material, and a first additive, the first additive includes a compound represented by Formula 1, below:
    Type: Application
    Filed: November 7, 2011
    Publication date: August 23, 2012
    Inventors: Myung-Beom Park, Jung-Sik Choi, Ki-Hyeon Kim, Yuji Morishima, Shin-ichi Tanaka, Takashi Yamada, Takehiro Zushi
  • Publication number: 20120205250
    Abstract: Disclosed is an electrolytic copper plating solution composition, which includes a copper salt, an acidic solution, and a PEG-PPG-PEG copolymer, and in which the PEG-PPG-PEG copolymer which is a non-ionic surfactant is added, thus decreasing the surface tension of the electrolytic copper plating solution, thereby enhancing plating wettability.
    Type: Application
    Filed: April 8, 2011
    Publication date: August 16, 2012
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hee Jin Lee, Dong Hyun Cho, Ji Eun Jeon
  • Patent number: 8236159
    Abstract: Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit deposit properties (e.g., resistivity) within desired ranges.
    Type: Grant
    Filed: April 28, 2006
    Date of Patent: August 7, 2012
    Assignee: Applied Materials Inc.
    Inventors: Rajesh Baskaran, Robert W. Batz, Jr., Bioh Kim, Tom L. Ritzdorf, John L. Klocke, Kyle M. Hanson
  • Publication number: 20120175744
    Abstract: The present invention relates to a copper electroplating composition comprising a copper alkanesulfonate salt, a free alkanesulfonic acid, and one or more organic compounds selected from the group consisting of suppressors, accelerators, levelers, and mixtures thereof, in which the concentration of free acid is from 0 M to about 0.25 M and the composition is free of halide ions. The present invention also relates to a process of metalizing micro-sized trenches or vias in a substrate using the composition.
    Type: Application
    Filed: September 15, 2010
    Publication date: July 12, 2012
    Applicant: BASF SE
    Inventors: Chien-Hsun Lai, Tzu-Tsang Huang, Shao-Min Yang, ChiaoHao Chan