Abstract: A portable engraving system comprises an enclosure adapted to operably accommodate an engraving device, wherein the enclosure comprises an adjustment system. The adjustment system comprises one or more adjustable devices, and the adjustable devices are adapted to adjust a distance between the enclosure and a work surface thereby allowing adjustment of the distance between the enclosure and the work surface, whereby the enclosure is adjustable with respect to the work surface. The enclosure further comprises an opening wherein the engraving device is operably positioned thereto, whereby the work surface is accessible to the engraving device therethrough. The enclosure is positionable adjacent the work surface and operably disposed thereto.

Abstract: The present invention discloses a coating layer removing apparatus and a method for the same. The apparatus of the present invention comprises a transport device displacing an electrode plate; a laser device having a laser head arranged above the displacement path of the electrode plate; and a control center electrically connected to the transport device and the laser device. The method of the present invention comprises mounting an electrode plate on the transport device; using the control center to set the speed of displacing the electrode plate, and program the time interval, count and penetration depths of the laser beams; and using the device of the present invention to form exposed areas equidistantly on the electrode plate. The apparatus of the present invention automatically removes a coating layer with a laser beam without directly contacting the electrode plate. Therefore, the present invention can fast form exposed areas of high quality.

Abstract: A laser mold removing method of the invention is for processing a composite material composed of a plurality of materials having different reflectances to a laser beam, and includes emitting laser beam in which a processing laser beam for processing the processing object and a measurement laser beam adapted to irradiate the processing object and having an output smaller than that of the processing laser beam are emitted, measuring a reflected light quantity of the measurement laser beam reflected by the processing object, and controlling based on the reflected light quantity.

Abstract: An apparatus processes a surface of an inhabitable structure. The apparatus includes a laser base unit adapted to provide laser light to an interaction region, the laser light removing material from the structure. The laser base unit includes a laser generator and a laser head coupled to the laser generator. The laser head is adapted to remove the material from the interaction region, thereby providing reduced disruption to activities within the structure. The apparatus further includes an anchoring mechanism adapted to be releasably coupled to the structure and releasably coupled to the laser head. The apparatus further includes a controller electrically coupled to the laser base unit. The controller is adapted to transmit control signals to the laser base unit in response to user input.

Abstract: A method and device for ablation of thin layers on the rim region of the surface of a plane substrate coated with a thin film. The rim region runs along the edge or edges of the substrate, and the thin layers should be ablated in at least two, not necessarily unconnected areas of the rim region along edge pieces not parallel to one another. A laser beam is pointed toward an ablation area. The areas of the rim region to be ablated are guided through the area so that in a plane of the surface of the substrate, during the whole ablation process, there is basically a constant distance in the space that lies partly in the ablation area and has its starting point outside the substrate surface and its end point within the substrate surface.

Abstract: A laser marking machine includes a support portion, a laser marking device fixed on the support portion, a control chip and a fixing mechanism fixed on the support portion. The fixing mechanism includes a support board configured for supporting a workpiece, and four positioning blocks moved, and four motors being able to control the four positioning blocks to slide in the support board. The fixing mechanism further includes at least two position detectors. The two position detectors are able to position detector a distance data of the workpiece deviating from a center of the support board along X and Y axes, and transmit the distance data to the control chip. The control chip analyzes the distance data to control the four motors to respectively drive the four positioning blocks to slide in the support board until the workpiece is centered on the support board.

Abstract: The invention relates to a method and apparatus for forming an anilox roll. The method includes supplying a cylinder of the anilox roll that has an outer surface to be tooled, supplying at least a laser source and laser engraving the outer surface of the anilox roll with a laser spot that is formed by a laser source for obtaining a tooled anilox roll, and applying an optical guide in the light path of the laser for enabling the laser spot to move reciprocally on the outer surface to be tooled.

Abstract: An apparatus for removing heavy metals from a thin film stack. A glass or plastic substrate has a front surface and a back surface and a heavy metal thin film is deposited on the back surface. A laser is provided for generating high density radiation. A scanning means directs the high density radiation through the substrate so that the high density radiation impinges upon the heavy metal thin film. The substrate is disposed in contacting relation to a flowing liquid and a liquid bath is provided for containing the flowing liquid and collecting heavy metal that is ablated by the high density radiation. The heavy metals are filtered from the liquid bath. The same parts can also remove heavy metals from both sides of a substrate or may be used to remove only peripheral edges of a thin film stack.

Abstract: A laser processing apparatus is provided for patterning with laser light a resin film or a metal film formed on a substrate. The apparatus includes a laser light source; and a debris collection device having a transmission window through which the laser light is transmitted, a vortex generation mechanism generating a vortex gas flow by allowing gas to flow into a region near a laser light-irradiated area of the resin film or the metal film, and a screening device having an opening through which the incident laser light passes and screening a flow of debris. The mechanism is placed close to the resin film or the metal film on the substrate. Debris generated by laser light irradiation and before and after being stacked on the object film is entrained in the vortex gas flow generated by the vortex generation mechanism and is exhausted to outside through the screening device.

Abstract: There is provided a method for manufacturing a grain-oriented electromagnetic steel sheet whose iron losses are reduced by laser beam irradiation, capable of improving the iron losses in both the L-direction and the C-direction while easily ensuring high productivity. The method for manufacturing a grain-oriented electromagnetic steel sheet reduces iron losses by scanning and irradiating a grain-oriented electromagnetic steel sheet with a continuous-wave laser beam condensed into a circular or elliptical shape at constant intervals in a direction substantially perpendicular to a rolling direction of the grain-oriented electromagnetic steel sheet, wherein when an average irradiation energy density Ua is defined as Ua=P/(Vc×PL) (mJ/mm2), where P (W) is average power of the laser beam, Vc (m/s) is a beam scanning velocity, and PL (mm) is an irradiation interval in a rolling direction, PL and Ua are in the following ranges: 1.0 mm?PL?3.0 mm, 0.8 mJ/mm2?Ua?2.0 mJ/mm2.

Abstract: Embodiments of the invention relate to methods and apparatus for laser drilling holes in a silicon substrate during the fabrication of back contact solar cells, such as emitter-wrap-through (EWT) solar cells. In one embodiment, the method and apparatus use a short focal length flat field lens and a dynamic scanning technique to accomplish single pulse drilling in the silicon substrate. The method and apparatus result in increased speed and quality of holes in an EWT solar cell substrate as compared to conventional apparatus and processes.

Abstract: Systems and methods for laser scribing provide extended depth affectation into a substrate or workpiece by focusing a laser beam such that the beam passes into the workpiece using a waveguide, self-focusing effect to cause internal crystal damage along a channel extending into the workpiece. Different optical effects may be used to facilitate the waveguide, self-focusing effect, such as multi-photon absorption in the material of the workpiece, transparency of the material of the workpiece, and aberrations of the focused laser. The laser beam may have a wavelength, pulse duration, and pulse energy, for example, to provide transmission through the material and multi-photon absorption in the material. An aberrated, focused laser beam may also be used to provide a longitudinal spherical aberration range sufficient to extend the effective depth of field (DOF) into the workpiece.

Abstract: A coating removal apparatus utilizing a common optics path to provide laser pulses to a coated surface and to direct a light illumination reflected from the coated surface to a photosensitive detector and analyzer. The apparatus is an integrated device including a laser source, a beam splitter, scanning optics, a waste removal apparatus, one or more light illuminators, a photosensitive detector, a comparator, and a control logic circuit. Alternatively, the laser source is external to the integrated device and a fiber optic cable is used to connect the laser source to the integrated device.

Abstract: A processing method of forming a through-hole in a workpiece by means of a pulsed laser beam includes the steps of providing a removable sacrifice layer on the workpiece, forming a through-hole in the workpiece by the laser beam in a state where the sacrifice layer is provided, and removing the sacrifice layer from the workpiece after the step of forming the through-hole.

Abstract: The invention relates to a laser scribing system (10) for structuring substrates, said system being characterized in that the planar rotor (56) together with the laser device (60) has a mass that is essentially less than the mass of the table (20) and the substrate (30) such that the machining speed is increased, and the substrate arranged on the table (20) is still during the machining, or moves in a direction at a constant speed vSubstrat such that vibrations are reduced and the precision of the scribing traces increased. Furthermore, other planar rotors (56) can be mounted with a laser device (60) without changing the structure of the machine such that the productivity is easily increased. The laser light (65) is also guided, by means of optical fibers, as close as possible to the machining point, reducing the free length of the light beam (65) such that the adjustment requirements for the optical-mechanical components are reduced and the system is more robust.

Abstract: A solar cell is formed using a solar cell ablation system. The ablation system includes a single laser source and several laser scanners. The laser scanners include a master laser scanner, with the rest of the laser scanners being slaved to the master laser scanner. A laser beam from the laser source is split into several laser beams, with the laser beams being scanned onto corresponding wafers using the laser scanners in accordance with one or more patterns. The laser beams may be scanned on the wafers using the same or different power levels of the laser source.

Abstract: Embodiments of the present invention generally provide methods and apparatus for material removal using lasers in the fabrication of solar cells. In one embodiment, an apparatus is provided that precisely removes portions of a dielectric layer deposited on a solar cell substrate according to a desired pattern and deposits a conductive layer over the patterned dielectric layer. In one embodiment, the apparatus also removes portions of the conductive layer in a desired pattern. In certain embodiments, methods for removing a portion of a material via a laser without damaging the underlying substrate are provided. In one embodiment, the intensity profile of the beam is adjusted so that the difference between the maximum and minimum intensity within a spot formed on a substrate surface is reduced to an optimum range. In one example, the substrate is positioned such that the peak intensity at the center versus the periphery of the substrate is lowered.

Abstract: A laser head for irradiating an interaction region of a structure with laser light to remove material from the structure. The laser head includes a housing, an anchoring mechanism, and a connector coupled to the housing and optically coupled to a laser generator. The anchoring mechanism is reversably coupled to the housing and releasably affixed to the structure by vacuum pressure. The anchoring mechanism releasably holds the laser head at a selected position in relation to the structure. The connector transmits laser light from the laser generator. The laser head further includes a plurality of optical elements contained in the housing. The laser head further includes a containment plenum coupled to the housing. The containment plenum is optically coupled to the plurality of optical elements to receive the laser light. The containment plenum confines the material and removes the material from the interaction region resulting from irradiating the structure with the laser light.

Abstract: Laser-based methods and systems for removing one or more target link structures of a circuit fabricated on a substrate includes generating a pulsed laser output at a predetermined wavelength less than an absorption edge of the substrate are provided. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target link structure to reduce the reflectivity of the target link structure and efficiently couple the focused laser output into the target link structure to remove the target link structure without damaging the substrate.

Abstract: A substrate cleaning apparatus includes a supporting plate supporting a substrate and a shielding unit that is disposed above the substrate to protect the substrate. A portion of the shielding unit, which is adjacent to a focal point where light for generating shock waves is focused, is switched. Therefore, the substrate cleaning apparatus prevents the concentration of plumes and residence beams, which are generated together with the shock waves, on a specific region of the shielding unit and further prevents the recontamination of the substrate by the damage of the shielding unit.

Abstract: A laser engraving system (10) for engraving a unengraved workpiece (20) and an engraving method are provided. The laser engraving system includes an image processor (12), an engraving controller (13), a mechanical arm (14), and a laser (15). The image processor is configured for building a workpiece model (22) corresponding to an unengraved workpiece, partitioning the workpiece model into at least one section (224), generating at least one two-dimensional pattern (223). The engraving controller receives the signals of the relative position values and the at least one two-dimensional pattern. The mechanical arm is electronically coupled to the engraving controller and controlled by the engraving controller. The laser is electronically coupled to the engraving controller and controlled by the engraving controller in such a manner that the laser engraves an unegraved workpiece according to the at least one two-dimensional pattern.

Abstract: Disclosed are laser scribing systems for laser scribing semiconductor substrates with backside coatings. In particular these laser scribing systems laser scribe opto-electric semiconductor wafers with reflective backside coatings so as to avoid damage to the opto-electric device while maintaining efficient manufacturing. In more particular these laser scribing systems employ ultrafast pulsed lasers at wavelength in the visible region and below in multiple passes to remove the backside coatings and scribe the wafer.

Abstract: The invention relates to an installation that is used to perform operations for forming glass or crystal pieces (21), comprising: at least one drive wheel and at least one idler wheel (3); a support element which is driven by the drive wheel; main mandrels (7) which are supported by the support element and which, in turn, each support a first end of a glass or crystal piece (21); and work stations. According to the invention, at least one wheel takes the form of a carousel (2) which comprises secondary mandrels (8), numbering fewer than the main mandrels (7), and which co-operates with the moving support element. Each secondary mandrel (8) opposes a main mandrel (7) along a common axis (23) and supports the second end of the glass or crystal piece.

Abstract: For forming the separating lines, (5, 6, 7) which are produced in the functional layers (2, 3, 4) deposited on a transparent substrate (1) during manufacture of a photovoltaic module with series-connected cells (C1, C2, . . . ), there are used laser scanners (8) whose laser beam (14) produces in the field (17) scanned thereby a plurality of adjacent separating line sections (18) in the functional layer (2, 3, 4). The laser scanners (8) are then moved relative to the coated substrate (1) in the direction (Y) of the separating lines (5, 6, 7) by a distance corresponding at the most to the length (L) of the scanned field (17) to thereby form continuous separating lines (5, 6, 7) through mutually flush separating line sections (18).

Abstract: A laser method of printing a pattern on works which is read at a high read rate by optical readers and a system for implementing the laser processing method are described. Print pattern data is generated based on printing conditions including at least an original print pattern such as a character string that are specified by users and then converted into data representing an actual print pattern to be actually printed on works according to a three dimensional profile of the works so that an orthogonal projection of that actual print pattern is identical with the original print pattern.

Abstract: Laser engravers with a masking mechanism comprise a machine body, a laser-engraving mechanism inside the machine body, a working platform, and an exhauster. The laser-engraving mechanism includes a lens-cart rail that moves back and forth along a working track. The exhauster includes air outlets behind the working platform. The masking mechanism, which includes a reelable curtain-sheet, is installed above the air outlets so that while processing, the curtain-sheet is reeled out above the working platform and an air induction channel is formed to increase the working efficiency of the exhauster.

Abstract: A laser engraver capable of automatic defocusing is provided, which includes a control end and a device end. The control end includes a data processing module, in which the data processing module is used for a user to set a defocusing distance and select a processing mode by a user, so as to define and set parameters, and form an operation signal. The device end includes a control module and a laser output module, in which the control module is used for receiving the operation signal and controlling the laser output module to change a focal distance according to the operation signal, so as to form the automatic defocusing.

Abstract: Mastering tools and systems and methods for forming a plurality of cells on the mastering tools are provided. In particular, the systems vary the geometry of the cells or the placement of the cells, or both, for forming a textured surface on a mastering tool.

Abstract: A method of forming an aperture in a substrate having a first side and a second side opposite the first side includes irradiating the substrate with a laser beam to form a laser-machined feature within the substrate and having a sidewall. The sidewall is etched with an etchant to change at least one characteristic of the laser-machined feature. The etching can include introducing the etchant into the laser-machined feature from the first side and the second side of the substrate. An apparatus and system for forming an aperture are also disclosed.

Abstract: A laser marking system for marking a length of material includes a laser device for emitting a marking beam. A motor moves the length of material relative to the laser device. A sensing system detects a predetermined movement of the length of the material and provides a speed signal and a distance signal, and a controller is provided in operative communication with the sensing system and the laser device for receiving the speed signal and the distance signal and responsively directing the marking beam of the laser system onto the length of material in a predetermined pattern.

Abstract: A variable focus laser machining system is disclosed. The machining system may have a laser emitter configured to emit a laser beam. Additionally, the machining system may have a focusing element configured to focus the laser beam. The machining system may also have a controller. The controller may be configured to focus the laser beam at a first focal point. The first focal point may be approximately positioned on a first machining surface of a work piece. The controller may also be configured to determine that the first machining surface has moved relative to the first focal point. Additionally, the controller may be configured to re-focus the laser beam at a second focal point. The second focal point may be positioned between a second machining surface and a predetermined surface spaced apart from the second machining surface.

Abstract: To provide a manufacturing apparatus of a semiconductor device, which does not use a stepper in a manufacturing process in the case where mass production of semiconductor devices is carried out by using a large-sized substrate. A thin film formed over a substrate having an insulating surface is selectively irradiated with a laser beam through light control means, specifically through an electro-optical device to cause ablation; accordingly, the thin film is partially removed, thereby processing the thin film in a remaining region into a desired shape. The electro-optical device functions as a variable mask by inputting an electrical signal based on design CAD data of the semiconductor device.

Abstract: A method for irradiating a plate (104) using multiple co-located radiation sources (108-1,108-2,108-3,108-4) includes that each of the multiple co-located radiation sources (108-1,108-2,108-3,108-4) is responsible for irradiating one of a plurality of bounded sub-regions (110-1,110-2,110-3,110-4) in the plate (104). As a result, sub-regions of the plate (104) that are to be irradiated receive relatively even, relatively well-defined radiation from the multiple co-located radiation sources (108-1,108-2,108-3,108-4). An apparatus performs the method, and a solar cell is produced using the method. The method and the apparatus can be applied in laser doping and laser cutting.

Abstract: Laser output including at least one laser pulse having a wavelength greater than 1.1 ?m and shorter than 5 ?m (preferably at about 1.1 ?m) and having a pulsewidth shorter than 100 ps (preferably shorter than 10 ps) permits low-k dielectric material, such as SRO or SiCOH, to be removed without damaging the substrate. An oscillator module in cooperation with an amplification module are used to generate the laser output.

Abstract: A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.

Abstract: In six rows of molten processed regions 131, 132, the molten processed region 131 closest to a front face 17a of a metal film 17 opposing a front face 3 of an object to be processed 1 acting as a laser light entrance surface is formed by irradiating a silicon wafer 11 with a reflected light component of laser light L reflected by the front face 17a of the metal film 17. This can form the molten processed region 131 very close to the front face 17a of the metal film 17.

Abstract: A method and apparatus for processing substrate edges is disclosed that overcomes the limitations of conventional edge processing methods and systems used in semiconductor manufacturing. The edge processing method and apparatus of this invention includes a laser and optical system to direct a beam of radiation onto a rotating substrate supported by a chuck, in atmosphere. The optical system accurately and precisely directs the beam to remove or transform organic or inorganic films, film stacks, residues, or particles from the top edge, top bevel, apex, bottom bevel, and bottom edge of the substrate in a single process step. Reaction by-products are removed by means of an exhaust tube enveloping the reaction site. This invention permits precise control of an edge exclusion width, resulting in an increase in the number of usable die on a wafer.

Abstract: A method of making a drawing on a chocolate by causing a pulsed laser to irradiate the surface of a solid chocolate under limited operation conditions, and a chocolate manufactured by said method are provided. The irradiation energy per pulse and the irradiation energy per sweeping unit line length of the pulsed laser are limited to a certain range. The trace of the laser irradiation remains circular or arc-shaped on the surface of the chocolate manufactured under the above conditions. Further, the method makes a drawing on the surface of the chocolate, using the phenomenon that chocolate changes color when being irradiated by a pulsed laser under the above operation conditions.

Abstract: Laser machining fired ceramic and other hard and/or thick materials includes scribing a workpiece with a laser beam along a sequence of parallel laser paths within a cutout region of the workpiece. The scribing creates a kerf in the cutout region that widens as the laser beam advances along the sequence. The sequence may begin with an inner portion of the cutout region and end with an outer edge thereof such that debris is directed away from the laser paths to increase throughput and create a high quality opening in the workpiece. High quality structures may also be cut out from the workpiece. The method includes directing a high velocity stream of gas to an interlace of the laser beam and the workpiece to redirect the flow of debris and cool the interface. The method may also adjust a focus depth of the laser beam as it deepens the kerf.

Abstract: A laser marking system for marking a length of material includes a laser device for emitting a marking beam. A motor moves the length of material relative to the laser device. A sensing system detects a predetermined movement of the length of the material and provides a speed signal and a distance signal, and a controller is provided in operative communication with the sensing system and the laser device for receiving the speed signal and the distance signal and responsively directing the marking beam of the laser system onto the length of material in a predetermined pattern.

Abstract: In a method and an apparatus for cleaning a substrate using a laser beam, an inner chamber is disposed in a process chamber to define a space in which a laser-induced shock wave is generated. The laser beam is focused on a laser focus positioned in the inner chamber, and thus the laser-induced plasma shock wave is generated around the laser focus. The plasma shock wave is reflected from inner surfaces of the inner chamber and is irradiated on the substrate through a lower portion of the inner chamber. As a result, the intensity of the plasma shock wave irradiated on the substrate is increased, and thus the contaminants on the substrate may be effectively removed.

Abstract: A laser marking system for marking a length of material includes a laser device for emitting a marking beam. A motor moves the length of material relative to the laser device. A sensing system detects a predetermined movement of the length of the material and provides a speed signal and a distance signal, and a controller is provided in operative communication with the sensing system and the laser device for receiving the speed signal and the distance signal and responsively directing the marking beam of the laser system onto the length of material in a predetermined pattern.

Abstract: A boring cutter body (5) is inserted into a circular hole (3) and is rotated and moved in an axial direction, whereby screw-shaped groove parts (11) are formed by using a tool bit (9) provided on a tip end of an outer peripheral portion, and broken surfaces (15) are formed by breaking tips of ridge parts generated by formation of the groove parts (11). Moreover, the groove parts (11) are processed through electric discharge machining using a wire electrode (17) provided to the boring cutter body (5) behind the tool bit (9) in the rotating direction, thereby forming finely roughened portions (41) having more finely roughened shapes than the broken surfaces (15).

Abstract: Various embodiments may be used for laser-based modification of target material of a workpiece while advantageously achieving improvements in processing throughput and/or quality. Embodiments of a method of processing may include focusing and directing laser pulses to a region of the workpiece at a pulse repetition rate sufficiently high so that material is efficiently removed from the region and a quantity of unwanted material within the region, proximate to the region, or both is reduced relative to a quantity obtainable at a lower repetition rate. Embodiments of an ultrashort pulse laser system may include at least one of a fiber amplifier or fiber laser. Various embodiments are suitable for at least one of dicing, cutting, scribing, and forming features on or within a semiconductor substrate. Workpiece materials may also include metals, inorganic or organic dielectrics, or any material to be micromachined with femtosecond, picosecond, and/or nanosecond pulses.

Abstract: In various embodiments, a chip may include a substrate; a coating, the coating covering the substrate at least partially and the coating being designed for being stripped at least partially by means of laser ablation; wherein between the substrate and the coating, a laser detector layer is arranged at least partially, the laser detector layer being designed for generating a detector signal for ending the laser ablation.

Abstract: The present invention concerns a system for the calibration of at least one parameter of a laser engraver, the laser engraver comprising on one hand an engraving system with a focusing lens positioned at a distance of the surface of an substrate intended to be engraved and on the other hand a vision system for at least the positioning and the verification of the engraving, the vision system including a camera associated with an appropriate illumination and, wherein the engraving device of the laser is arranged in such way that the engraving device works to engrave a substrate with specific engraved layout corresponding to variation of at least one parameter and wherein the vision system is connected to a comparison device of at least one measured engraved parameter with the template value of at least one stored data in a memorisation device connected to a engraving correction device.

Abstract: A laser machining apparatus comprises a nozzle for ejecting a jet liquid to a workpiece and a liquid supply unit for supplying the jet liquid to the nozzle, while a laser beam is introduced into a jet liquid column ejected from the nozzle. The laser machining apparatus further comprises a laminar flow forming channel for supplying the jet liquid to the nozzle in a laminar state.

Abstract: Methods and related systems for fabricating a solar-cell assembly are provided. An example method comprises forming a series of layers and scribing a series of aligned interconnect lines in the layers prior to forming any isolation line related features. The example method provides for the use of contiguously-scribed interconnect lines as compared to an existing method where at least one interconnect line is segmented to avoid scribing through a previously-formed isolation line related feature located where an isolation line is to be scribed. The ability to use contiguously-scribed interconnect lines may improve the throughput of the fabrication process.

Abstract: Provided is an apparatus for laser scribing. The laser scribing apparatus may include: a first laser emitter to emit a laser for a thickness measurement while moving towards a first axial direction of a substrate where a plurality of light emitting devices is formed; a laser receiver to receive a reflected laser when the laser emitted from the first laser emitter is reflected from the substrate; a thickness measurement unit to measure a thickness of the substrate based on a strength of the leaser received by the laser receiver; and a second laser emitter to generate a scribing line on the substrate by emitting a laser towards a first axial direction and a second axial direction of the substrate while adjusting a laser emission location based on the measured thickness.

Abstract: A method for removing and modifying a protrusion by using a short pulse laser is provided for modifying a color filter. In a color filter modifying method, a transparent substrate (2) is scanned with a beam in a parallel direction, while irradiating a protrusion (8) generated on the color filters (3-1, 3-2, 3-3) formed on a transparent substrate (2) with a beam collected by a high NA condensing lens (18), and a protrusion (8) is removed or modified.