Abstract: A thin-film scribing apparatus employing an optical device converts a low M2, Gaussian or pseudo-Gaussian beam into an inverted Gaussian beam. The all refractive optical device is such that it is not susceptible to either beam size or angular variations and exhibits very little loss of energy for the transformation process. The output can be configured for either single or dual-axis operation where the geometric shape of the beam is rectangular or square with steep edge intensity. The resulting rectangular beam requires less beam overlap and has very little shoulder in the intensity profile, providing high uniformity scribe features with greatly improved processing speeds.

Abstract: A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided.

Abstract: The present invention is directed to a laser marking device, system and method for its use.

Abstract: A manipulation system controllably moves a head relative to a surface of an inhabitable structure for irradiating the surface with energy waves from the head. The manipulation system includes a positioning mechanism coupled to the head. The positioning mechanism includes a first-axis position system adapted to move the head along a first direction substantially parallel to the surface. The positioning mechanism further includes a second-axis position system coupled to the first-axis position system and adapted to move the head along a second direction substantially parallel to the surface. The manipulation system further includes an anchoring mechanism coupled to the positioning mechanism and releasably coupled to the structure.

Abstract: Providing a glass assembly cutting method capable of improving yield by cutting a glass assembly into a predetermined size, providing a package manufacturing method, a package and a piezoelectric vibrator manufactured by the manufacturing method, and an oscillator, an electronic device, and a radio-controlled timepiece. Providing a wafer assembly cutting method of cutting a wafer assembly 60 along a scribe line M?, the method including: a scribing step of irradiating a laser beam having an absorption wavelength of the wafer assembly 60 along the contour line to form the scribe line M? on a lid board wafer 50; and a breaking step of applying a breaking stress along the scribe line M? using a cutting blade to cut the wafer assembly along the scribe line M?, wherein the scribing step involves forming the scribe line M? so that the ratio of a depth dimension D of the scribe line M? to a width dimension W thereof is 0.8 or larger and 6.0 or smaller.

Abstract: In accordance with some embodiments, a method for using SSLE to create one or more wafers from a material is provided, the method comprising: using a laser light beam to etch pits in the material to create one or more layers of etch pits in a subsurface of the material; and dividing the material into one or more individual wafers with an etch. In accordance with some embodiments, a system for using SSLE to create one or more wafers from a material is provided, the system comprising: a controller for controlling the position of a focal point of a laser light beam with respect to the material and causing an irradiation of the laser light beam at a plurality of focal points; and an etch for splitting the material into the one or more wafers based on the plurality of focal points.

Abstract: A coating removal apparatus utilizing a common optics path to provide laser pulses to a coated surface and to direct a light illumination reflected from the coated surface to a photosensitive detector and analyzer. The apparatus is an integrated device including a laser source, a beam splitter, scanning optics, a waste removal apparatus, one or more light illuminators, a photosensitive detector, a comparator, and a control logic circuit. Alternatively, the laser source is external to the integrated device and a fiber optic cable is used to connect the laser source to the integrated device.

Abstract: A laser-markable, acrylic resin-based laminate having a thickness of 100 to 200 ?m and including (A3) a pigmented layer made of a crosslinked acrylic resin obtained by crosslinking an acrylic resin composition having a hydroxyl value of 10 to 100 mg KOH/g, (B3) a base layer made of a crosslinked acrylic resin obtained by crosslinking an acrylic resin composition having a hydroxyl value of 18 to 40 mg KOH/g, and (C3) a destructible layer made of a crosslinked acrylic resin obtained by crosslinking a mixture of an acrylic resin composition having a hydroxyl value of 20 to 35 mg KOH/g and polymer beads.

Abstract: A laser machine tool for the machining of workpieces by laser ablation comprising a moveable dual laser head (4). The laser machine tool has a dual laser head (4) intended for the emission of laser beams, whereby the laser head (4) incorporates in its housing two or more laser sources (8), each laser source emitting a different type of laser beams and whereby the two or more laser sources (8) incorporated in the laser head (4) cannot operate simultaneously for the machining of the workpiece.

Abstract: A system, method, and device for etching an indicia onto a piece of glass or other inorganic oxide includes a compact laser etching device having a delivery head, an emitter housing, a RF cable, and a communication cable. The delivery head has a beam steering mechanism and a hood assembly positioned between the beam steering mechanism and the piece of glass. The emitter housing has a laser for generating a laser beam, and a fold mirror positioned in an optical path of the laser beam for redirecting the laser beam into the beam steering mechanism. A remote RF electronics package drives the laser. Control electronics cause the beam steering mechanism to steer the laser beam into a pattern of the indicia. The delivery head may further include a plurality of suction cups for holding the compact laser etching device in engagement with the piece of glass.

Abstract: A system and method for precision cutting using multiple laser beams is described, The system and method includes a combination of optical components that split the output of a single laser into multiple beams, with the power, polarization status and spot size of each split beam being individually controllable, while providing a circularly polarized beam at the surface of a work piece to be cut by the laser beam. A system and method for tracking manufacture of individual stents is also provided.

Abstract: A workpiece dividing method for dividing a platelike workpiece into a plurality of individual chips. The workpiece dividing method includes a workpiece preparing step of preparing the platelike workpiece, at least one side of the workpiece being formed as a mat surface, a holding step of holding the workpiece on a holding surface of a chuck table in the condition where the mat surface of the workpiece is exposed, a cut groove forming step of cutting the mat surface of the workpiece held on the holding surface of the chuck table by using a cutting blade to thereby form a cut groove with a remaining portion, and a laser cutting step of applying a laser beam to the workpiece along the cut groove to thereby cut the remaining portion.

Abstract: The present invention includes methods for treating laser-processed materials having an odor generated during the laser processing. The present method includes treating the laser-processed materials with heat to dissipate the odor from the material. The laser processed material may be secured to avoid curling during the heating process. The method can also include a cooling step after heating of the laser-processed material. Multiple cycles of heating and cooling may also be performed to substantially reduce or eliminate the odor from the laser-processed material. The invention also includes articles made according to the method and apparatus for producing laser processed materials having substantially reduced odor.

Abstract: An apparatus for transferring images to a wooden support includes a component for acquiring and/or creating an image, at least one source of a laser beam, and a component for moving, either in rotation and/or translation, the laser beam relative to the wooden support, or vice versa, as well as focusing the laser beam relative to the support. At least one adjustment unit is provided for the emission of the laser beam, and at least one control unit controls the moving and focusing components. The information of the image is converted to be transferred into instructions for the adjustment unit and control unit. The adjustment unit adjusts the emission of the laser beam by directly varying the pumping of the active material and/or by varying the operation of a modulator placed within the resonant cavity of the laser source.

Abstract: A laser processing apparatus is provided. The laser processing apparatus includes a laser processing head having a transmission window, an opening portion, an outlet hole, a first vent hole and a second vent hole. The transmission window transmits laser light by which a processing object is irradiated. The opening portion passes the transmitted laser light to a bottom portion of the laser processing head. The outlet hole discharges an atmosphere in the vicinity of a laser light irradiation region of the processing object to the outside. The first vent hole directs gas into the vicinity of the laser light irradiation region. The second vent hole discharges the atmosphere in the vicinity of the laser light irradiation region. Debris generated from the processing object is discharged from the outlet hole and the second vent hole that are continuous with the opening portion provided at the bottom portion of the laser processing head.

Abstract: A laser machining apparatus comprising jet liquid, a laser beam, and a laminar flow forming channel for supplying jet liquid to a nozzle. The channel includes a distribution channel formed by a cavity, an interconnecting channel disposed to communicate with said channel downstream in an axial direction of the nozzle and formed by an annular cavity around the axis of the nozzle to provide a narrower flow passage, and a liquid reservoir chamber. Said chamber has an outer peripheral edge communicating with the interconnecting channel over an entire circumference of the annular shape. An outer peripheral surface and an outer peripheral surface of the chamber form a continuous surface and an inner peripheral wall surface and an inner peripheral surface of the channel are both formed as an inclined inward surface that is downstream, the inner peripheral surface and the inner peripheral wall surface forming a planar continuous surface.

Abstract: A light irradiation device and method for irradiating converged light with an object include a light source configured to output a light, a phase-modulating spatial light modulator, a controller, and a converging optical system. The phase-modulating spatial light modulator is configured to input the light outputted from the light source and to display a hologram modulating a phase of the light at each of a plurality of pixels arranged two-dimensionally, and outputs the phase-modulated light. The controller is configured to cause the spatial light modulator to display a hologram such that the light outputted from the spatial light modulator is converged at a plurality of converging positions. The controller causes the spatial light modulator to display a first hologram and performs a feedback of the first hologram so as to modify the first hologram. The modifying of the first hologram is performed by measuring intensity of the light converged.

Abstract: A system for narrowing the spectral output of diode lasers through the use of dielectric stacks in the laser cavity comprising an alternating sequence of layers of dielectric material and air, which dielectric stacks are fabricated through the controlled laser ablation of the dielectric material.

Abstract: Embodiments of the present invention generally provide methods and apparatus for material removal using lasers in the fabrication of solar cells. In one embodiment, an apparatus is provided that removes portions of a dielectric layer deposited on a solar cell substrate according to a desired pattern. In certain embodiments, methods for removing a portion of a material via a laser without damaging the underlying substrate are provided. In one embodiment, the intensity profile of the beam is adjusted so that the difference between the maximum and minimum intensity within a spot formed on a substrate surface is reduced to an optimum range. In one example, the substrate is positioned such that the peak intensity at the center versus the periphery of the substrate is lowered. In one embodiment, the pulse energy is improved to provide thermal stress and physical lift-off of a desired portion of a dielectric layer.

Abstract: A printing plate making apparatus which scans a recording medium by light beam in a predetermined pixel pitch, thereby engraving a surface of the recording medium to make a printing plate, wherein an upper surface of a convex portion of light power of the light beam engraving all or part of an adjacent region which is adjacent to a convex portion which is to be left in a convex shape on a surface of the recording medium is set to an threshold engraving energy or less, and light power of light beam in a vicinity region in vicinity of outer side of a region defined as the adjacent region is brought higher than light power in the adjacent region.

Abstract: A laser processing apparatus comprises a converging lens 31 for converging processing laser light and rangefinding laser light L2 toward a wafer 1, an actuator for actuating the lens 31, a shaping optical system 49 for adding astigmatism to reflected light L3 of the rangefinding laser light, a quadrant photodiode 42 for receiving the reflected light L3 and outputting voltage values corresponding to its light quantities, and a controller for regulating the actuator, and positions a converging point P2 of the rangefinding laser light L2 between a focal point P0 of the lens and the lens 31, so as to make it possible to form a modified region at a position deeper from the front face 3, thereby suppressing adverse effects due to the reflected light L3. The control is based on an arithmetic value subjected to a division by a sum of the voltage values, so as to prevent the arithmetic value from being changed by the quantity of reflected light.

Abstract: The invention is directed to an apparatus and a method for generating separating fissures in a substrate through action of a laser beam having an elliptical beam cross section with a beam spot length in a movement direction along a separating fissure to be generated in the substrate. The apparatus and method are particularly suitable for separating fissures which start or end on the substrate surface. A suitable diaphragm prevents radiation from impinging on the substrate before the start and after the end of the fissure.

Abstract: A method for manufacturing a thin-film solar cell includes providing a first conducting layer on a substrate that has an area at least 0.75 m2. The first conducting layer is located in a deposition portion of the area. An ultraviolet laser beam is applied through a lens to the first conducting layer. Portions of the first conducting layer are scribed form a trench through the layer. The lens focuses the beam and has a focal length at least 100 mm. The focused beam includes an effective portion effective for the scribing and an ineffective portion ineffective for the scribing. The substrate sags and the first conducting layer remains in the effective portion of the focused beam across the area during the step of applying. One or more active layers are provided on the first conducting layer. A second conducting layer is provided on the one or more active layers.

Abstract: A system for engraving a flexographic relief member includes a laser scanning apparatus providing a focused radiation beam. The flexographic relief member includes a laser engravable flexographic member; a thing engravable control layer on top of the flexographic member; and wherein the engravable control layer has an engraving sensitivity lower than the flexographic member.

Abstract: A structural body has an inner layer formed of a resin which does not transmit light with a specific wavelength, an outer layer stacked on the inner layer and formed of a resin which transmits the light with the specific wavelength, and a fine periodic structure provided on at least part of a surface of the inner layer facing the outer layer and having a plurality of photodecomposition generated convex and concave portions. The plurality of convex and concave portions of the fine periodic structure is formed alternatively, and horizontally and vertically with substantially equal intervals in between along the surface of the inner layer facing the outer layer.

Abstract: The invention relates to a method for producing a swaging in a workpiece, wherein a laser beam is guided through a beam guide over the surface of the workpiece in order to produce said swaging. The focal position of the laser beam is controlled in such a way that it can be varied at least temporarily in depth direction of the swaging. A device for the production of a swaging (6) in a workpiece (5) has a laser light source (1) for producing a laser beam for removing material, a focus adjustment device (3) for adjusting the focal position of the laser beam, a beam guide (4) for guiding the laser beam (20) over the surface of the workpiece and a control device (7) for controlling the focus adjustment device (3) and the beam guide (4). The control device is designed to control the focal position of the laser beam by means of the focus adjustment device (3) at least temporarily to variable values in depth direction of the swaging.

Abstract: A method includes covering ostai of branch vessels emanating from a main vessel and an aneurysm with an integrated mesh high metal to vessel ratio stent. The integrated mesh high metal to vessel ratio stent includes serpentine rings integrated with an integrated mesh having holes formed therein. A metal to vessel ratio of the integrated mesh high metal to vessel ratio stent is sufficiently high to encourage tissue ingrowth around the integrated mesh high metal to vessel ratio stent yet is sufficiently low to ensure perfusion of the branch vessels through the integrated mesh high metal to vessel ratio stent.

Abstract: A laser wire stripping apparatus having a collet having a passageway for receiving a wire therein along an axis of insertion. The collet being fixed in position relative to the axis of insertion. A laser source for producing a laser beam. An optical assembly, the optical assembly moving relative to the collet and the axis of insertion for directing a laser beam along an axis of insertion of said wire.

Abstract: A method and system for laser processing targets of different types on a workpiece are provided. The method includes setting a laser pulse width of one or more laser pulses to selectively provide one or more laser output pulses having one or more set pulse widths based on a first type of target to be processed. The method further includes setting a pulse shape of the one or more output pulses to selectively provide the one or more output pulses having the set pulse shape based on the types of targets to be processed. The method still further includes delivering the one or more output pulses having the one or more set pulse widths and the set pulse shape to at least one target of the first type. The method finally includes resetting the laser pulse width of one or more laser pulses to selectively provide one or more laser output pulses having one or more reset pulse widths based on a second type of target to be processed.

Abstract: A method of singulating a semiconductor wafer having two surfaces separated by a thickness T<200 ?m includes partitioning it along a network of scribelines on one side. The other side is secured to an elastic foil, which is clamped to a wafer table. A radiative scribing tool is used to produce at least one laser beam having a pulse duration P?75 ps, and causing the laser beam to scan along each of the scribelines so as to create a scribe with a depth D<T, thereby leaving the second surface intact. The foil is laterally stretched to sever the second major surface along the path of the scribes. In an embodiment, P<CPP, the Time Constant of phonon-phonon coupling in the wafer at the location of incidence of the laser beam.

Abstract: A coating removal apparatus removes a coating from a surface. The apparatus has a movable scanning head and scanning optics. The scanning head is movable in one dimension, and the scanning optics adjust in two dimensions to compensate for movement of the scanning head to implement long range scanning with a uniform scanning pattern. Further, a surface roughness is determined by measuring specular and scattered reflections at various angles. For composite surfaces, the apparatus utilizes UV laser radiation and a controlled atmosphere to remove coating and alter the chemical characteristics at the surface.

Abstract: Laser engravers with a masking mechanism comprise a machine body, a laser-engraving mechanism inside the machine body, a working platform, and an exhauster. The laser-engraving mechanism includes a lens-cart rail that moves back and forth along a working track. The exhauster includes air outlets behind the working platform. The masking mechanism, which includes a reelable curtain-sheet, is installed above the air outlets so that while processing, the curtain-sheet is reeled out above the working platform and an air induction channel is formed to increase the working efficiency of the exhauster.

Abstract: Provided are a processing method for forming division originating points in a workpiece and a laser processing apparatus performing the method, which are capable of reducing light absorption in a processing trail, increasing light extraction efficiency from sapphire, and performing high speed processing. A pulsed laser beam is irradiated to a workpiece so that irradiation regions for each of unit pulsed beams of the pulsed laser beam of ultra-short pulse are formed discretely in the workpiece, and cleavage or parting of the workpiece is sequentially generated between the irradiation regions by a shock or a stress when each of unit pulsed beam is irradiated at an irradiation point, to thereby form originating points for division in the workpiece.

Abstract: Methods and systems for masking interior surfaces of a part from exposure to a subsequent process. In some embodiments the interior surfaces are threaded. Methods include forming a plugged insert by overmolding a masking plug material into an opening in the insert, the plug being substantially impervious to exposure to a subsequent process. The plugged insert can then be assembled in the part and the part is exposed to the process. Processes can include anodizing, cleaning, machining and laser etch processes. After the process is complete, the plug is removed from the insert, leaving the insert in the part without the plug. The described embodiments describe methods for optimizing masking methods in a production setting. More specifically, embodiments describe methods for automatic insertion and removal of plugs in a part before and after exposure of the part to a process such as anodization.

Abstract: A microstructure manufacturing method includes (a) generating first light including an interference fringe by crossing two laser beams, (b) forming a denatured region and a non-denatured region on an object having thermal non-linearity by applying the first light onto the object, so that the denatured region and the non-denatured region are disposed so as to correspond to a period of the interference fringe of the first light, and (c) etching the object so that the denatured region or the non-denatured region is selectively eliminated.

Abstract: Some embodiments include methods, and systems of machining using a beam of photons. In some embodiments, a machining method to remove material in a machined region may include reducing transparency of the region to at least a predefined wavelength by irradiating the region with a first beam of photons to induce generation of free electrons in the region; and machining the region with a second beam of photons having the predefined wavelength. Other embodiments are described and claimed.

Abstract: Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials.

Abstract: An processing apparatus comprises a laser oscillator, an overall control device which controls an operation of the laser oscillator, and a plurality of processing units. The processing unit comprises a holding part which movably holds a processed object, an optical system which guides the laser beam, oscillated from the laser oscillator, toward the processed object, a shutter which selectively prevents the laser beam from reaching the processed object, and an individual control device which controls an operation of the holding part, and transmits a laser request signal to the overall control device. When at least one of the plurality of individual control devices transmits the request signal, the overall control device controls the shutter of the processing unit, which has transmitted the laser request signal, to enable the laser beam to reach the processed object, and drives the laser oscillator to allow the laser oscillator to oscillate the laser beam.

Abstract: In an aberration-correcting method according to an embodiment of the present invention, in an aberration-correcting method for a laser irradiation device 1 which focuses a laser beam on the inside of a transparent medium 60, aberration of a laser beam is corrected so that a focal point of the laser beam is positioned within a range of aberration occurring inside the medium. This aberration range is not less than n×d and not more than n×d+?s from an incidence plane of the medium 60, provided that the refractive index of the medium 60 is defined as n, a depth from an incidence plane of the medium 60 to the focus of the lens 50 is defined as d, and aberration caused by the medium 60 is defined as ?s.

Abstract: A system comprises a working laser beam, a sensing laser beam, first and second optical elements, an optical sensor, an aperture and a controller. The first optical element generates a coaxial beam from the working laser beam and the sensing laser beam. The second optical element focuses the coaxial beam onto a workpiece, such that the working laser beam machines the workpiece and the sensing laser beam reflects from the workpiece. The optical sensor senses an intensity of the reflected sensing beam. The aperture determines a focus position by translating along the reflected sensing beam, such that the reflected intensity is maximized. The controller determining a machining parameter of the working laser beam, based on the focus position.

Abstract: Processing workpieces such as semiconductor wafers or other materials with a laser includes selecting a target to process that corresponds to a target class associated with a predefined temporal pulse profile. The temporal pulse profile includes a first portion that defines a first time duration, and a second portion that defines a second time duration. A method includes generating a laser pulse based on laser system input parameters configured to shape the laser pulse according to the temporal pulse profile, detecting the generated laser pulse, comparing the generated laser pulse to the temporal pulse profile, and adjusting the laser system input parameters based on the comparison.

Abstract: A laser-based method of removing a coating from a surface comprises directing a laser pulse to a first position on the surface, removing the coating from the first position by rapidly elevating a surface temperature of the first position using the laser pulse and thereby disassociating the coating from the surface and collecting the disassociated coating. In some embodiments, the coating comprises an environmentally harmful substance such as Hexavalent Chromium. In some embodiments, the coating comprises Diamond-Like Carbon (DLC), Vitrified Contaminant Material (CMAS). The disassociated coating is collected by a waste collector.

Abstract: A dual-beam laser cutting system uses laser beam polarization to output two identical laser beams. The dual identical laser beams are spaced appropriately to simultaneously cut a water thus increasing the laser cutting system's throughput as compared to a single-laser cutting system. In one implementation, the dual-beam laser cutting system 100 utilizes a beam expander 220, two half-wave plates 224, 238, a polarizing beam splitter 228, a mirror 236, and two lenses 234, 242 to provide two identical laser beams 202, 204 from a single laser source 214. The identical laser beams 202, 204 are tuned to have the same power, cross-sectional diameter, and polarization direction. One of the half-wave plates 224 is rotated to yield laser beams with the same power. The other half-wave plate 238 is rotated to yield laser beams with the same polarization direction.

Abstract: A trimmer for trimming a book has a support for supporting a book, at least one laser for scoring an edge of the book so as to produce a score, and a trimming station for trimming the book at the score.

Abstract: In the field of photolithography systems designed to produce electronic components using the technique known as “lift-off” on a plane substrate comprising one or more plane photosensitive layers, a system uses a laser direct-write technique. It comprises optical or mechanical means configured such that the useful part of the optical beam is inclined on the plane of the photosensitive layers in order to create profiles with an inverted slope within said layers, the useful part of the optical beam being the part of the optical beam which effectively contributes to creating said profiles. In one preferred embodiment, the system comprises means for partial shuttering of the optical beam situated in the neighborhood of the focusing optics.

Abstract: Real time monitoring and detection of the depths of laser scribes used during pulsed laser ablation processes. During a laser scribing process, sensors are used to determine in real time an amount of ablated material from a substrate undergoing the process. Laser scribing can be terminated when the amount of ablated material as detected by the sensors corresponds to a desired scribe depth.

Abstract: The present application relates to a method and system thereof for performing laser cutting on a mail piece during processing on a document processing device such as a sorter. Laser cutting is performed to effectively cut mail pieces during transport on the document processing equipment to ensure cut accuracy and to promote readability. The present teachings allow for selection of a cut profile based on mail piece attributes or markings and adaptive adjustment of the cut profile in accord with the positioning of the mail piece to achieve a desired cut pattern while the document processing device is running at high transport speed.

Abstract: A method, an apparatus and/or a system of laser marking of an interior cavity of a securing means of a substance container is disclosed. In one embodiment, a solid-state laser marking system to mark a securing means of a substance container includes a semiconductor laser to emit a pumping laser beam. The solid-state laser marking system also includes a resonator to create the laser beam that is then focused through a lens to mark the securing means of the substance container having a maximum diameter of 5 cm. Further, the solid-state laser marking system includes a solid-state laser crystal doped with a rare-earth element, to produce a laser beam in response to being pumped by the pumping laser beam and a laser resonator. The laser resonator is configured to focus the laser beam of a spot size of less than 150 microns and a beam quality of M2 less than 1.3.

Abstract: A laser-based workpiece processing system includes sensors connected to a sensor controller that converts sensor signals into focused spot motion commands for actuating a beam steering device, such as a two-axis steering mirror. The sensors may include a beam position sensor for correcting errors detected in the optical path, such as thermally-induced beam wandering in response to laser or acousto-optic modulator pointing stability, or optical mount dynamics.

Abstract: The present disclosure provides three-dimensional structures and related methods. The three-dimensional structures may define patterns of positive and negative spaces on opposing surfaces that combine to form the three-dimensional structures. The negative spaces of the patterns may intersect to form apertures through the three-dimensional structures, which may define linear or non-linear paths therethrough. The apertures may be configured to provide desirable characteristics with respect to light, sound, and fluid travel therethrough. Further, the three-dimensional structures may be configured to define desired stiffness, weight, and/or flexibility. The three-dimensional structures may be employed in embodiments including heat sinks, housings, speaker or vent covers, springs, etc.