Abstract: A system for automatically inspecting and trimming a ceramic patch antenna includes an inspection apparatus electrically connected to a radio frequency component testing fixture. The inspection apparatus is inputted standard parameters of electrical characteristics of the ceramic patch antenna. The ceramic patch antenna is arranged on the radio frequency component testing fixture. Then, the inspection apparatus is configured to measure electrical characteristics of the ceramic patch antenna and to judge whether the electrical characteristics of the ceramic patch antenna are the same as the standard parameters or not. The inspection apparatus is configured to drive a trimming machine for trimming a radiation metal surface of the ceramic patch antenna if the electrical characteristics of the ceramic patch antenna are different from the stand parameters.

Abstract: A laser-machining system and method is disclosed for forming retainers on a suture thread. The laser system is preferably a femtosecond laser system which is capable of creating submicron features on the suture thread while preserving strength of the suture thread. The laser-machining system enables creation of retainers and self-retaining suture systems in configurations which are difficult and/or impossible to achieve using mechanical cutting technology.

Abstract: A laser beam irradiation apparatus includes a laser beam oscillation unit including a pulse laser beam oscillator for oscillating a pulse laser beam and a cycle frequency setting unit for setting the cycle frequency, an acousto-optic deflection unit for deflecting the optical axis of the pulse laser beam oscillated from the laser beam oscillation section, and a control unit for controlling the acousto-optic deflection unit. The control unit outputs a driving pulse signal having a predetermined time width including a pulse width of the pulse laser beam oscillated from the pulse laser beam oscillator to the acousto-optic deflection unit based on the cycle frequency setting signal from the cycle frequency setting section.

Abstract: The present invention provides a method of and apparatus for marking or inscribing a workpiece (3) with high-energy radiation, more particularly with a laser beam (1), the workpiece (3) having a light-scattering surface (9) and the material of the workpiece (3) being transparent for the radiation wavelength, and a polymer matrix (7) being disposed on the workpiece (3) in such a way that the radiation passes through the workpiece (3) and its light-scattering surface (9) before impinging on the polymer matrix (7), characterized in that the light-scattering surface (9) of the workpiece (3) is wetted with a liquid or viscoelastic medium (11).

Abstract: In one embodiment, a method includes receiving a touch sensor substrate associated with a plurality of electrodes and a plurality of connection pads. The plurality of electrodes is configured to detect a touch. The plurality of connection pads are configured to be electrically coupled with a touch controller. The method further includes laser etching a plurality of paths. The method also includes filling the plurality of paths with an electrically conductive material to form a plurality of tracks. Each track is configured to electrically couple at least one connection pad of the plurality of connection pads with at least one electrode of the plurality of electrodes.

Abstract: A laser scanner system for removing a coating from a surface.

Abstract: Systems and methods for preparing solid samples for analysis, such as microscopic examination in cross section or planimetric orientation. The sample preparation systems may include a sample support configured to secure a solid sample, an excitation beam source that generates an excitation beam configured to remove material from a surface of the sample, a beam shield configured to at least partially protect the sample from the excitation beam, and a beam shield holder configured to secure the beam shield, where the adjustment of the relative positions of the beam shield and sample holder permits the excitation beam to selectively expose a series of substantially planar surfaces of the sample.

Abstract: A method of dividing a workpiece includes: forming a pre-machining alteration region in the inside of a region in which no device is formed; detecting the position of the pre-machining alteration region through infrared imaging by imaging means, to thereby recognize a deviation between the pre-machining alteration region and a planned dividing line as machining position correction information; and forming a main machining alteration region by utilizing the machining position correction information, whereby the workpiece can be accurately divided along the planned dividing lines into individual devices.

Abstract: Because of extreme hardness, diamonds have a number of important industrial applications. Generally experts work on it. Experts do marking after examining each rough diamond to decide how it should be cut to yield the greatest value. But in this process, there can be lots of wastage as it is only an image of the stone in the mind of the person. The present invention comprises Laser planner which scans each and every point of diamond by rotating it 360° and thus gives individual coordinate of that diamond. It shows us the wire frame image on the computer monitor. is a machine to scan the stone and to plan and mark for the best-fit diamond from that stone. All the data of the diamond is stored in the computer. It is material saving, time saving, mass processing increase in productivity.

Abstract: A method of selectively eliminating electrical shorts and other electrical defects from specific layers of a multilayer electronic device without damaging underlying layers. The method is based on a combination of an automated detection of the defects and selective laser ablation patterning (SLAP).

Abstract: A laser machining equipment for etching grooves in a wall of a mechanical part, or in a connecting rod for a spark ignition engine, includes a fiber optic laser device arranged to supply laser pulses. The fiber optic laser device is controlled so that laser pulses have a peak power of more than 400 W and at least two times greater than maximum mean power of the laser device, and duration of the laser pulses is below or within the nanosecond range of 1 ns to 1000 ns. The fiber optic laser device can be controlled in a quasi continuous wave (QCW) mode, or can be controlled in a Q-switch mode. The selected operating modes increase machining efficiency and produce a groove with an optimum transverse profile, particularly with a small mean radius of curvature at a bottom of the groove which then allows precise subsequent fracturing of the mechanical part with less force.

Abstract: A scribing apparatus having a function to analyze distribution of a material forming a semiconductor or solar cell in real-time in a process producing the semiconductor or solar cell of is disclosed. The scribing apparatus having the analysis function of material distribution comprises: a laser irradiation unit, which conducts scribing by irradiating laser to a position to be scribed of an analysis subject; a spectrum detection optical unit, which detects a spectrum generated from plasma, which is produced by the irradiated laser; a spectrum information storage, which stores spectrum state information of each material forming the analysis subject; and a spectrum analysis unit, which analyzes distribution state information of the material by comparing the spectrum state information and the detected spectrum.

Abstract: Apparatus for interference patterning of a planar sample including a laser and a focusing arrangement positioned in a beam path of the laser so that the laser beam is imaged in a first spatial direction in a focused manner into a sample volume in which the planar sample is positioned. An expanding and splitting arrangement is positioned downstream of the focusing arrangement for the laser beam, whilst maintaining the focused imaging in a first spatial direction which can be expanded in a second spatial direction, and which can be split into two partial beams. These two partial beams can be directed onto the sample volume.

Abstract: The present invention relates to laser ablation microlithography. In particular, we disclose a new SLM design and patterning method that uses multiple mirrors per pixel to concentrate energy to an energy density that facilitates laser ablation, while keeping the energy density on the SLM mirror surface at a level that does not damage the mirrors. Multiple micro-mirrors can be reset at a very high frequency, far beyond current DMD devices.

Abstract: A method and apparatus is disclosed for producing precision marks (28) for a metrological scale in the form of a stainless steel ribbon (10). A laser (21) is used to produce ultra-short pulses, which have a fluence at the ribbon such that ablation takes place. The laser light can be scanned via scanner (25) and the pitch of the marks (28) can be controlled. The ablative technique causes little thermal input and improves the accuracy of the scale.

Abstract: A staggered laser-etch line graphic system, method, and articles of manufacture are provided. One described method includes the steps of laser engraving a first plurality of lines associated with a first component section of a graphic on a surface of an article; laser engraving a second plurality of lines associated with a second component section of the graphic on the surface of the article; and controlling said laser engraving of the first plurality of lines and said laser engraving of second plurality of lines to reduce the visual impact of a demarcation line separating the first component section of the graphic and the second component section of the graphic.

Abstract: An apparatus and method for processing a plurality of semiconductor parts in a laser-based system adjusts a default recipe to account for work to be performed on at least one part of the plurality of parts. The work to be performed on a part is analyzed using the default recipe and a part-specific recipe including a modified parameter of the default recipe. The default or part-specific recipe is selected based on a desired processing result, and the selected recipe replaces the default recipe to perform the work using the laser-based system.

Abstract: The present disclosure relates to laser processing and a laser processing apparatus for processing materials using laser. Processing performed after loading a wafer on a work stage and a laser processing apparatus for implementing such processing, among others, are disclosed. The laser processing includes loading a wafer on a work stage; determining the number of chips formed on the wafer loaded on the work stage, performing chip defect inspection and aligning the wafer while moving the work stage; measuring a height of a surface of the wafer loaded on the work stage using a displacement sensor; monitoring output power of a processing laser using a power meter; and shifting the work stage while irradiating a laser beam on the wafer to process the wafer.

Abstract: A system and method for precision cutting using multiple laser beams is described, The system and method includes a combination of optical components that split the output of a single laser into multiple beams, with the power, polarization status and spot size of each split beam being individually controllable, while providing a circularly polarized beam at the surface of a work piece to be cut by the laser beam. A system and method for tracking manufacture of individual stents is also provided.

Abstract: The present invention relates to a laser processing method and the like provided with a structure for enabling realization of both preferable processing of locations not easily reached by laser light and effective inhibition of damage caused to locations easily reached by laser light during laser processing. Radiation optics scan locations irradiated with laser light from a laser light source while radiating laser light onto a plurality of objects arranged on a stage and the periphery thereof from a direction perpendicular to the stage. On the stage reflecting members are respectively arranged adjacent to the plurality of objects. The reflecting members reflect laser light radiated from the radiation optics towards lateral surfaces of the objects. Since laser light reflected by the reflecting members is radiated onto the lateral surfaces of the objects, laser light also reaches the lateral surfaces of the objects not easily reached by laser light without having to increase the intensity of the laser light.

Abstract: To form a deeper scribed groove with less energy or to improve the scribing speed, without making the apparatus configuration complicated is intended. The present invention relates to a laser scribing method which includes: forming on a workpiece a plurality of beam spots arranged in a state being separated from one another along the scribing direction, and forming a linear scribed groove on the workpiece by moving the plurality of beam spots in the scribing direction. The plurality of beam spots are obtained from a laser beam of a single ray bundle.

Abstract: A laser cleaning apparatus for removing a surface pollutant on a large-area mask uniformly over an entire surface thereof is disclosed. The laser cleaning apparatus includes a laser generator; and a laser scanner for receiving a laser beam from the laser generator and scanning a surface of the mask with the laser beam using a movable end scanning mirror. The laser scanner includes a distance compensation device for maintaining a constant transmission distance of the laser beam between the lager generator and the surface of the mask.

Abstract: A substrate cutting apparatus includes a stage configured to support a substrate to be cut along a virtual cutting line, a laser generator configured to emit an ultraviolet (UV)-based laser beam for cutting the substrate by removing part of the substrate along the cutting line, and a beam oscillator disposed on a beam path of the laser beam and configured to perform a beam swing on the laser beam in a direction parallel to the length direction of the cutting line by oscillating a tilt angle of the laser beam toward the cutting line.

Abstract: A method of forming a vent in a glass substrate includes forming a defect in the glass substrate on a scribe line. A beam spot of a laser may be directed onto the defect and advanced along the scribe line. A cooling jet may be directed onto the defect such that the surface of the glass substrate is cooled from a maximum temperature. Thereafter, the cooling spot may be advanced along the scribe line with the beam spot to form the vent in the glass substrate.

Abstract: A method and apparatus for processing substrate edges is disclosed that overcomes the limitations of conventional edge processing methods and systems used in semiconductor manufacturing. The edge processing method and apparatus of this invention includes a laser and fiber-optic system to direct laser radiation onto a rotating substrate supported by a chuck. A laser beam is transmitted into a bundle of optical fibers, and the fibers accurately and precisely direct the beam to remove or transform organic or inorganic films, film stacks, residues, or particles, in atmosphere, from the top edge, top bevel, apex, bottom bevel, and bottom edge of the substrate in a single process step. Reaction by-products are removed by means of an exhaust tube enveloping the reaction site. This invention permits precise control of an edge exclusion width, resulting in an increase in the number of usable die on a wafer.

Abstract: A method and apparatus for processing substrate edges is disclosed that overcomes the limitations of conventional edge processing methods and systems used in semiconductor manufacturing. The edge processing method and apparatus of this invention includes a laser and optical system to direct a beam of radiation onto a rotating substrate supported by a chuck. The optical system accurately and precisely directs the beam to remove or transform organic or inorganic films, film stacks, residues, or particles, in atmosphere, from the top edge, top bevel, apex, bottom bevel, and bottom edge of the substrate in a single process step. An optional gas injector system directs gas onto the substrate edge to aid in the reaction. Reaction by-products are removed by means of an exhaust tube enveloping the reaction site. This invention permits precise control of an edge exclusion width, resulting in an increase in the number of usable die on a wafer.

Abstract: A relief printing plate manufacturing method includes: generating binary image data based on multivalued image data representing a printing image; generating, from the binary image data, target stereoscopic shape data; calculating, based on the target stereoscopic shape data, exposure amount data; providing a predetermined exposure amount to an outside image adjacent pixel in a range of predetermined pixels adjacent to an ON pixel; and applying laser light to an area of OFF pixels based on the exposure amount data to engrave a portion outside of an area, and applying laser light to the outside image adjacent pixel based on the predetermined exposure amount to form a relief having a projecting shape with a corner part of a flange part of a top face of the relief at least partially chamfered.

Abstract: A compound laser working machine comprises a machine body, an engraving module, a cutting module and a control module. The engraving module is disposed on the machine body and it comprises a metal tube laser for output of engraving operations; the cutting module is disposed on the machine body and it comprises a glass tube laser for output of cutting operations; the control module is disposed on the machine body and it is connected to the engraving module and the cutting module individually, so that the output operations of the engraving module and the cutting module can be controlled by the control module simultaneously or individually.

Abstract: The invention relates to a method for incorporating a structure into a surface of a workpiece that is transparent in a certain wavelength range. For this purpose the surface to be structured is brought into contact with a target surface containing a target material by means of a laser beam, the wavelength of which is within the certain wavelength range, energy is introduced at least at one position through the workpiece and into the boundary region of the surface to be structured and the target surface such that target material is deposited at the respective position in and/or on the surface to be structured. For this purpose a pulsed laser beam having a pulse repetition rate of more than 10 kHz is used, which is focused such that the focus is positioned on or under the target surface, wherein the laser beam has a power density in the focus of more than 2000 W/mm2. The invention further relates to a device for introducing a structure into a surface of a workpiece transparent in a certain wavelength range.

Abstract: A solid-state laser lift-off apparatus comprises: a solid-state laser (1), a light beam shaping lens (3), motors of oscillating mirrors (5,7), oscillating mirrors (4,6), a field lens (9), a movable platform (10), an industrial control computer and control software (8). The light beam shaping lens (3) is behind the solid-state laser (1), shaping the laser beam from the solid-state laser (1) into required shape. The motors of oscillating mirrors (5,7) are in front of the field lens (9), controlling the movement of the oscillating mirrors (4,6) according to the instruction of the control software (8) to implement different light beam scanning paths. A lift-off method for applying the solid-state laser lift-off apparatus uses a small laser spot to perform scanning, and enables damage-free separation of GaN from a sapphire substrate.

Abstract: A method for laser drilling of holes in a substrate (44) with varying simultaneity including operating a laser (22) to produce a single output beam (24) whose pulses have a total energy, dividing the single output beam into plural beams (41) to an extent which varies over time and applying the plural beams to plural hole drilling locations (209, 210, 212, 214, 216, 218, 220, 222) on the substrate including simultaneously drilling first parts of multiple holes using corresponding ones of the plural beams having a pulse energy which is a first fraction of the total energy and thereafter drilling at least one second part of at least one of the multiple holes using at least one of the plural beams each having a pulse energy which is at least a second fraction of the total energy, the second fraction being different from the first fraction.

Abstract: An object to be processed 1 comprising a substrate 4 and a plurality of functional devices 15 formed on a front face 3 of the substrate 4 is irradiated with laser light L while locating a converging point P within the substrate 4, so as to form at least one row of a divided modified region 72, at least one row of a quality modified region 71 positioned between the divided modified region 72 and the front face 3 of the substrate 4, and at least one row of an HC modified region 73 positioned between the divided modified region 72 and a rear face 21 of the substrate 4 for one line to cut 5. Here, in a direction along the line to cut, a forming density of the divided modified region 72 is made lower than that of the quality modified region 71 and that of the HC modified region 73.

Abstract: A substrate cutting apparatus including: a stage to support a substrate; a laser generator to emit a laser beam; a beam oscillator to oscillate the laser beam onto a cutting line of the substrate, to heat the substrate; and a cooling unit to cool the heated substrate.

Abstract: A system for generating a laser machined tool from a substantially cylindrical work piece. The system includes a laser producing a laser beam, a mask positioned within the laser beam for shaping the laser beam into an image, and an optical system for imaging the laser beam image onto the outer surface of the work piece. The system coordinates rotational and translation movements of the work piece with activation of the laser in order to use the laser image for ablating the outer surface of the work piece, creating microstructures within the surface of the work piece to form the cylindrical tool.

Abstract: In a manufacturing process of a semiconductor device, a manufacturing technique and a manufacturing apparatus of a semiconductor device which simplify a lithography step using a photoresist is provided, so that the manufacturing cost is reduced, and the throughput is improved. An irradiated object, in which a light absorbing layer and an insulating layer are stacked over a substrate, is irradiated with a multi-mode laser beam and a single-mode laser beam so that both the laser beams overlap with each other, and an opening is formed by ablation in part of the irradiated object the irradiation of which is performed so that both the laser beams overlap with each other.

Abstract: Processing a workpiece with a laser includes generating laser pulses at a first pulse repetition frequency. The first pulse repetition frequency provides reference timing for coordination of a beam positioning system and one or more cooperating beam position compensation elements to align beam delivery coordinates relative to the workpiece. The method also includes, at a second pulse repetition frequency that is lower than the first pulse repetition frequency, selectively amplifying a subset of the laser pulses. The selection of the laser pulses included in the subset is based on the first pulse repetition frequency and position data received from the beam positioning system. The method further includes adjusting the beam delivery coordinates using the one or more cooperating beam position compensation elements so as to direct the amplified laser pulses to selected targets on the workpiece.

Abstract: A substrate dividing method which can thin and divide a substrate while preventing chipping and cracking from occurring. This substrate dividing method comprises the steps of irradiating a semiconductor substrate 1 having a front face 3 formed with functional devices 19 with laser light while positioning a light-converging point within the substrate, so as to form a modified region including a molten processed region due to multiphoton absorption within the semiconductor substrate 1, and causing the modified region including the molten processed region to form a starting point region for cutting; and grinding a rear face 21 of the semiconductor substrate 1 after the step of forming the starting point region for cutting such that the semiconductor substrate 1 attains a predetermined thickness.

Abstract: A method is provided for separating or dividing strengthened glass articles, particularly strengthened glass sheets, into at least two pieces, one of which has a predetermined shape and/or dimension. A flaw is initiated in the glass at a depth that is greater than the depth of the strengthened surface layer of the glass, and a vent extending from the flaw is created at a vent depth that is greater than the depth of and outside the strengthened surface layer to at least partially separate the glass. In one embodiment, the vent is generated by treating the glass with a laser to heat the glass to a temperature in a range from about 50° C. below the strain point of the glass up to a temperature between the strain point and the anneal point of the glass. A glass article having at least one strengthened surface and at least one edge having an average edge strength of at least 200 MPa is also described.

Abstract: The invention firstly comprises a method of ablation processing including a step of ablating a region of a substrate (1) by way of a laser beam (3) characterized by a further step of removing debris ablated from the region (1) by way of a flow of a fluid (7), namely a gas or vapour, a liquid or a combination of these, wherein the flow of fluid (7) is directed to flow over the region so as to entrap debris and thereafter to remove the entrapped debris from the region by directing the flow of fluid with any entrapped debris away from region along a predetermined path (6) avoiding subsequent deposition of entrapped debris on the substrate.

Abstract: A method of enhancing the quality of laser ablation by controlling the laser repetition rate during the ablation process, wherein the method enhances the quality of laser ablation of a photomask in order to improve the optical quality thereof. Also provided is a system employing the method of enhancing the quality of laser ablation.

Abstract: Numerous embodiments of methods and apparatus for machining workpieces using one or more optical pulses are disclosed. One embodiment of a method of machining a Workpiece includes directing an optical pulse to impinge upon a surface of the workpiece. The optical pulse can be configured to initiate a vaporization process within a first period of time after impinging upon the workpiece surface. After the first period of time, a characteristic of the optical pulse is changed while maintaining the initiated vaporization process and, after a second period of time, the optical pulse is terminated to terminate the maintained vaporization process. Exemplary articles that may be produced by machining workpieces are also disclosed.

Abstract: A method for removing coating from a substrate may include: locating an edge of a substrate; directing a laser beam along a first path to a first position on a surface of the substrate proximate to an edge of the substrate at an angle of incidence suitable to redirect the laser beam along a second path, through the substrate, to a second position on a second surface of the substrate corresponding to the located edge of the substrate, where the second surface can include a coating; and ablating at least a portion of coating at the second position on the second surface of the substrate.

Abstract: Disclosed are a laser processing apparatus and method that can effectively remove a low-k material formed on a wafer. A laser processing apparatus of the invention is a laser processing apparatus that processes a subject on which a low-k material is formed. The laser processing apparatus includes a laser generating unit that emits a laser beam; and an optical system that splits the laser beam emitted from the laser generating unit into two and irradiates the split laser beams onto the subject In this case, the optical system includes a pair of condensing lenses in which cut surfaces that are cut at a predetermined distance from central axes to be parallel to the central axes contact with each other, and the interval between the two split laser beams is the same as the interval between two edges of the low-k material in a removal subject region.

Abstract: An apparatus and method for verifying a laser etch on a rubber sample. In one embodiment, the apparatus includes a tire production line, a sample holding device, a laser having a diode, and a servo-assembly. The laser of the apparatus is configured to etch indicia on a sidewall of a tire on the tire production line and is further configured to etch at least one line in a rubber sample on the sample holding device. In one embodiment, the method includes etching a production tire with a laser, interrupting the laser, moving the laser to a laser diode testing location, loading a rubber sample in a holding device, etching at least one line into the rubber sample with the laser, manually or automatically measuring a depth of the at least one line, and comparing the depth of the at least one line to an acceptable line depth range.

Abstract: The invention concerns a method for laser ablation of a surface coating from a wall, such as a painted wall finish, for example in a nuclear plant to be decontaminated, and a device for implementing said method. The inventive ablation method includes sweeping shots on the coating of at least one pulsed laser beam with a laser beam quality factor M2 less than 20, and characterized in that it comprises a direct control of said shots by optical deflection, such that the impact zones (I1, I2, I3,) of said shots on said coating are disjointed or substantially adjacent with minimized overlapping.

Abstract: A laser machining device 1 includes a laser light source 10, a spatial light modulator 20, a controller 22, a converging optical system 30, and a shielding member 40. The phase-modulating spatial light modulator 20 inputs a laser beam outputted from the laser light source 10, displays a hologram modulating a phase of the laser beam at each of a plurality of pixels arranged two-dimensionally, and outputs the phase-modulated laser beam. The controller 22 causes the spatial light modulator 20 to display a plurality of holograms sequentially, lets the converging optical system 30 converge the laser beam outputted from the spatial light modulator 20 at converging positions having a fixed number of M, selectively places N converging positions out of the M converging positions into a machining region 91, and machines an object to be machined 90.

Abstract: A gemstone micro-inscription system, comprising an energy source, a spatial light modulator, and a control, the control controlling a spatial light pattern modulation of the spatial light modulator, wherein the spatial light modulator exposes a photoresist on the gemstone, which selectively impedes an etching process to produce a pattern on the gemstone corresponding to the spatial light modulation pattern.

Abstract: A system for producing at least one trench to improve film cooling in a sample is provided. The system includes at least one laser source outputting at least one pulsed laser beam. The pulsed laser beam includes a pulse duration including a range less than about 50 ?s, an energy per pulse having a range less than about 0.1 Joule, and a repetition rate with a range greater than about 1000 Hz. The system also includes a control subsystem coupled to the laser source, the control subsystem configured to synchronize a position of the sample with the pulse duration and energy level in order to selectively remove at least one of a thermal barrier coating, a bondcoat and a substrate metal in the sample to form the at least one trench.

Abstract: A method, comprises drilling a set of one or more microvias in a semiconductor package with an aperture, wherein drilling the set of microvias comprises to use an aperture that has a phase shift region to reduce a spot size of a drilling beam that is used to form the set of microvias.

Abstract: A method of using Joule heating to regenerate nanowire based biosensors. The nanowire based biosensor contains various detection molecules, such as nucleic acids, bound to the surface of the nanowire. Binding of analyte nucleic acids to the detection molecules alters the electrical properties of the nanowire, producing a detectable signal. By passing a Joule heating effective amount of electrical current through the nanowire, the nanowire may be heated to a temperature sufficient to dissociate the bound analyte from the detection molecule, without damaging the detection molecules or the bond between the detection molecules and the nanowire surface. The Joule heated nanowires may thus be regenerated to an analyte-free “fresh” state and used for further sensing. In alternate embodiments, the specificity of the nanowire for a particular analyte may be modulated by using Joule heating to heat the nanowire to an intermediate temperature where some analytes bind and some do not.