Abstract: A structured surface is formed with the method of the present invention. The method of making this structured surface includes the steps of applying an ablatable radiation sensitive coating on the major surface of the substrate, and exposing the ablatable radiation sensitive coating to radiation such that exposed portions of the ablatable radiation sensitive coating ablate from the substrate to form a structured surface. The structured surface then includes a substrate and a pattern of structures framed by at least one separation bank. The method may also include the steps of depositing a flowable material on to the structures and the separation bank to form a pattern of flowable material in the structures.

Abstract: A method of radiatively scribing a substantially planar semiconductor substrate using a laser scribing apparatus, uses a laser scribing head configured and arranged to produce a two-dimensional array of laser beam spots to effect the scribing. In an embodiment, the spots of the array extend substantially parallel to X and Y directions in the plane of the substrate. In an embodiment, spots at a periphery in one or both directions of the array have a lower intensity than laser beams in a central portion of the array.

Abstract: The invention relates to a marking apparatus for marking an object with laser light, which apparatus comprises at least one gas laser for emitting at least one laser beam for marking the object. The at least one gas laser comprises a plurality of resonator tubes (12) for receiving a laser gas, a plurality of heat dissipaters (20) for dissipating heat from the resonator tubes (12) is provided, each resonator tube (12) is thermally connected to one of the heat dissipaters (20), and each heat dissipater (20) comprises microchannels for receiving a cooling fluid.

Abstract: A light concentrator or distributor is provided, which includes a plurality of light conducting cells that are lined up in a transparent light conducting body. The light conducting cells are defined by boundary faces, which are produced within the light conducting body using laser radiation.

Abstract: Various embodiments may be used for laser-based modification of target material of a workpiece while advantageously achieving improvements in processing throughput and/or quality. Embodiments of a method of processing may include focusing and directing laser pulses to a region of the workpiece at a pulse repetition rate sufficiently high so that material is efficiently removed from the region and a quantity of unwanted material within the region, proximate to the region, or both is reduced relative to a quantity obtainable at a lower repetition rate. Embodiments of an ultrashort pulse laser system may include a fiber amplifier or fiber laser. Various embodiments are suitable for at least one of dicing, cutting, scribing, and forming features on or within a semiconductor substrate. Workpiece materials may include metals, inorganic or organic dielectrics, or any material to be micromachined with femtosecond, picosecond, and/or nanosecond pulses.

Abstract: The present invention aims to rapidly and easily create processed data for scan controlling a laser light beam, and to create the processed data for the laser processing apparatus at high precision. A setting plane corresponding to a scanning region of a laser marker is displayed on a processed data generating device. A user operates the processed data generating device to arrange the processing pattern on the setting plane. Here, a marker head coincides an optical axis of the laser light beam L on a position corresponding to the reference point of the processing pattern, and photographs a work W with a camera which light receiving axis is coaxial with the optical axis of the laser light beam L. A photographed image monitor displays the photographed image along with a symbol indicating the position of the light receiving axis of the camera.

Abstract: An optical transmitting unit transmits a pulsed laser beam oscillated by a pulsed laser beam oscillator to a focusing unit in a laser processing apparatus. A wavelength band expanding unit expands the wavelength band of the pulsed laser beam, and a pulse width expanding unit increases the pulse width of the expanded pulsed laser beam. A focusing lens focuses the expanded pulsed laser beam. An optical fiber transmits the focused pulsed laser beam through a collimating lens and a pulse width compressing unit compresses the pulse width of the collimated pulsed laser beam to restore the original pulse width for transmission.

Abstract: A system and method is provided where a coated work piece is welded at high speeds with minimal porosity and spatter. The coating on the work piece is removed or ablated by a high energy heat source prior to being welded in a welding operation, such that high welding speeds are attained. The high energy heat source is positioned upstream of the welding operation to vaporize any surface coatings on a work piece.

Abstract: A glass substrate laser cutting device according to the invention includes: a working table that has a plurality of vacuum absorbing grooves; a laser cutter; a pressure sensor that measures a pressure sensor when suctioning the glass substrate in a vacuum state; a calculation processing unit that compares the vacuum pressure measured by the pressure sensor with a predetermined threshold pressure and determines whether the glass substrate is broken; a laser cutter that includes a leaser head moving along the cutting direction of the glass substrate and emitting a laser beam; and an optical sensor that is attached to the laser head so as to move together and is disposed at a point in front of the laser beam emitted to the outside so as to detect the breakage of the glass substrate.

Abstract: A method and apparatus are described for forming a pattern including one or more markings on a substrate. The method includes the step of forming each marking by locally heating the substrate, for example using a fibre laser. A step is also performed of monitoring the temperature of the substrate, e.g. using a temperature sensor, whilst each marking is being formed. The method may be used to form a magnetic encoder scale on a stainless steel substrate having a high content of martensitic material. The local heating causes the martensitic material to be transformed into austenitic material. An encoder scale made using the method is also described.

Abstract: An object to be processed 1 comprising a substrate 4 and a plurality of functional devices 15 formed on a front face 3 of the substrate 4 is irradiated with laser light L while locating a converging point P within the substrate 4, so as to form at least one row of a divided modified region 72, at least one row of a quality modified region 71 positioned between the divided modified region 72 and the front face 3 of the substrate 4, and at least one row of an HC modified region 73 positioned between the divided modified region 72 and a rear face 21 of the substrate 4 for one line to cut 5. Here, in a direction along the line to cut, a forming density of the divided modified region 72 is made lower than that of the quality modified region 71 and that of the HC modified region 73.

Abstract: A switchable compound laser working machine comprises a machine body, a first output module, a second output module, a switch module, and a control module. The first and second output modules are respectively provided with a laser tube. The switch module has at least one lens. It is able to change the output direction of laser beams by moving the lens. The control module is used for controlling the laser tubes of the first and second output modules to perform output operation respectively and used for moving the lens of the switch module into output pathway of the laser beams from the first or the second output module to alter the output direction of the laser beams.

Abstract: In different embodiments, a method is provided for processing at least one crystalline Silicon-wafer or a Solar-cell wafer. The method may include: a movement of the wafer with respect to a laser producing a laser beam; and therefore the formation of a laser channel in the wafer by means of a laser beam, wherein a thermal budget applied on the wafer by means of the laser beam is reduced in the peripheral region of the wafer, wherein the peripheral region includes a wafer edge, through which the laser beam exits the wafer after formation of the laser channel.

Abstract: This robot system includes a robot, a laser emitting portion moved by the robot, emitting a laser beam to a target workpiece, and a control portion controlling the laser emitting portion to emit the laser beam on the basis of information regarding an arbitrarily-shaped work locus and movement information of the laser emitting portion.

Abstract: The present invention relates to laser ablation microlithography. In particular, we disclose a new SLM design and patterning method that uses multiple mirrors per pixel to concentrate energy to an energy density that facilitates laser ablation, while keeping the energy density on the SLM mirror surface at a level that does not damage the mirrors. Multiple micro-mirrors can be reset at a very high frequency, far beyond current DMD devices.

Abstract: A method and a device for engraving a flexible strip, the device including a drive device for moving a flexible strip in a longitudinal direction of the flexible strip; a support device for supporting the strip in a circumferential direction of a cylinder on a surface segment of the cylinder acting as a support surface; a processing head oriented towards the support surface for engraving the strip with at least one tool oriented towards the support surface; and a drive device for moving the processing head, wherein the processing head is pivotable through the drive device about a longitudinal axis of the cylinder. In order to engrave a closed loop with a single processing head it is proposed that the processing head is pivotable through a drive device about a longitudinal axis of the cylinder.

Abstract: An engraving laser assembly comprises a tubular rail defining a plenum in an interior of the rail. A carriage is operatively associated with to the tubular rail for axial movement along the rail. A focusing optic is mounted to the carriage for focusing a laser beam to a focal point on an engraving plane operatively with the carriage. A gas inlet is operatively associated with the tubular rail and the inlet is configured for attachment to a source of pressurized gas to provide pressurized gas to the plenum. A plurality of holes are provided in the tubular rail in fluid communication with the plenum. The holes are configured so that, with a source of pressurized gas attached to the gas inlet, a stream of pressurized gas is directed from each hole toward the engraving plane.

Abstract: The method uses a common optical, system and sequentially creates structures of different sizes in a polymer substrate by means of different laser processes is described. One process uses a laser beam that is tightly focussed on the substrate surface and is used for creating fine groove structures by semi-continuous direct write type beam movement. The second process uses a second laser beam that is used to form a larger size image on the substrate surface and is used to create blind pads and contact holes in the substrate in step and drill mode. A third optional process uses the second laser beam operating in direct writing mode to remove layers of the substrate over larger continuous areas or in a mesh type pattern.

Abstract: An apparatus for etching a pattern in an etching zone laid out on a substrate includes a pen that can be freely moved manually relative to the etching zone, the pen being equipped with an etching head able to etch the substrate at an etching point when etching is triggered, a measuring unit for measuring position and orientation of the etching head relative to the substrate, a control unit configured to calculate coordinates of the etching point as a function of the measured position and orientation of the etching head relative to the substrate, to trigger etching at the etching point if the calculated coordinates of the etching point correspond to coordinates of a point to be etched, the coordinates of the point to be etched being encoded in a prerecorded drawing of the pattern, and to automatically prevent etching otherwise.

Abstract: Systems and methods cut trenches of multiple widths in a material using a single pass of a laser beam. A first series of laser pulses cut a work surface of the material at a first cutting speed using a first spot size. In a transition region from a first trench width to a second trench width, a second series of laser pulses sequentially change spot sizes while gradually changing from the first cutting speed to a second cutting speed. Then, a third series of laser pulses continue to cut the work surface at the second cutting speed using a second spot size. The method provides for increased depth control in the transition region. A system uses a selectively adjustable optical component in the laser beam path to rapidly change spot size by adjusting a position of a focal plane with respect to the work surface.

Abstract: Laser machining fired ceramic and other hard and/or thick materials includes scribing a workpiece with a laser beam along a sequence of parallel laser paths within a cutout region of the workpiece. The scribing creates a kerf in the cutout region that widens as the laser beam advances along the sequence. The sequence may begin with an inner portion of the cutout region and end with an outer edge thereof such that debris is directed away from the laser paths to increase throughput and create a high quality opening in the workpiece. High quality structures may also be cut out from the workpiece. The method includes directing a high velocity stream of gas to an interlace of the laser beam and the workpiece to redirect the flow of debris and cool the interface. The method may also adjust a focus depth of the laser beam as it deepens the kerf.

Abstract: A method and system for pre-marking a substrate to provide a visual reference enabling repetitive and accurate component placement on one or more substrates. The method for marking includes determining a first location on a substrate for placing a component relative to a cut outline of the substrate. The method includes placing a fiducial at a second location on the substrate to provide a known dimensional reference to the first location, such that the fiducial and the first location are configured to be in a field-of-view of a component placement machine.

Abstract: A laser processing machine includes a cavity, a laser system, at least one processing platform, and at least one upper motion platform. The laser system is disposed at a lower part inside the cavity, and used for outputting a laser beam. A traveling direction of the laser beam is opposite to the gravity direction. The processing platform is disposed at an upper part inside the cavity, and includes an adsorption surface and a connection surface facing each other. The adsorption surface is located below the connection surface, and is used for adsorbing a workpiece. The upper motion platform is disposed at the upper part inside the cavity, and is correspondingly connected to the connection surface of the processing platform, in order to cause the processing platform to move.

Abstract: The invention is a method and an apparatus for marking an article and the article thus marked. It includes providing the article. Generating a plurality of groups of laser pulses. At least one of the plurality of groups is generated by modulating a beam of laser pulses to form a plurality of beamlets. Each, of the plurality of beamlets, include at least one laser pulse. It also includes directing the plurality of groups of laser pulses onto the article such that laser pulses within the at least one of the plurality of groups impinge upon the article at spot areas that do not overlap one another, wherein laser pulses within the plurality of groups are configured to produce a visible mark on the article.

Abstract: A laser beam machining apparatus includes laser beam irradiation unit for irradiating a wafer held on a chuck table with a laser beam, and control unit. The laser beam irradiation unit includes a laser beam oscillator for oscillating a laser beam with such a wavelength as to be transmitted through said wafer, repetition frequency setting section for setting a repetition frequency of pulses in the laser beam oscillated from the laser beam oscillator.

Abstract: Temporal focusing of spatially chirped femtosecond laser pulses overcomes previous limitations for ablating high aspect ratio features with low numerical aperture (NA) beams. Simultaneous spatial and temporal focusing reduces nonlinear interactions, such as self-focusing, prior to the focal plane so that deep (˜1 mm) features with parallel sidewalls are ablated at high material removal rates.

Abstract: Disclosed herein is a cutter frame including a plurality of cutters for cutting one or more kinds of rectangular unit pieces having a relatively small size from a rectangular base material at a predetermined inclination, the cutters being mounted or formed in the cutter frame such that the cutters correspond to the rectangular unit pieces, two of the rectangular unit pieces being arranged mainly in the inclination direction such that the rectangular unit pieces are in contact with each other at one side of each rectangular unit piece, wherein, on the assumption that imaginary vertex coordinates of a leftmost end are (Ax, Ay), and imaginary vertex coordinates of a rightmost end are (Bx, By), when the rectangular unit pieces coincide with each other at a left or right side of each rectangular unit piece, vertex coordinates (B?x, B?y) of the rightmost end are greater than the imaginary vertex coordinates (Bx, By) of the rightmost end based on the imaginary vertex coordinates (Ax, Ay) of the leftmost end in an ar

Abstract: A laser processing apparatus using a laser. The laser processing apparatus includes a light source for generating a hollow laser beam in a first direction; a reflection member for changing a path of the hollow laser beam toward the first direction into a second direction toward the substrate; a lens for collecting the hollow laser beam reflected by the reflection member; and an air supply unit for supplying air toward particles generated while the substrate is processed by the hollow laser beam, wherein the lens has a first hole passing through the lens, the reflection member has a second hole passing through the reflection member, and the first and second holes form a discharge path of the particles.

Abstract: The present invention is a method for separating a workpiece from a common substrate. It includes the steps of providing the workpiece, generating, within a beam source, a beam of laser pulses configured to modify a portion of the workpiece, determining a depth for creating a modified region based upon a characteristic of the workpiece and modifying a plurality of regions within the workpiece to form a plurality of modified regions. Modifying the plurality of regions includes directing the beam of laser pulses from an output of the beam source onto the workpiece, causing relative motion between the workpiece and the output of the beam source while directing the beam of laser pulses onto workpiece, and modifying a characteristic of the pulses of the beam upon generating a number of pulses which generally correspond to creating the modified regions to the determined depth.

Abstract: The invention is method, and an apparatus for performing the method having the steps of providing a workpiece, generating a plurality of free electrons at a region of the exterior surface, and machining a portion of the workpiece adjoining the first region by directing laser energy onto the workpiece.

Abstract: A method for production of safety/rupture discs comprises the steps providing a foil element, selecting a wavelength for a laser beam of a pulse laser within a range of between 800 nanometers and 1800 nanometers, selecting a pulse repetition rate for the laser beam within a range of between 15 KHz and 800 KHz, selecting a pulse duration for the laser beam less than 10 nanosecond and ablating at least one non-through cut in the foil element by directly applying said laser beam to the foil element to remove material from the foil element thereby obtaining a safety/rupture disc.

Abstract: A coating removal apparatus utilizing a common optics path to provide laser pulses to a coated surface and to direct a light illumination reflected from the coated surface to a photosensitive detector and analyzer. The apparatus is an integrated device including a laser source, a beam splitter, scanning optics, a waste removal apparatus, one or more light illuminators, a photosensitive detector, a comparator, and a control logic circuit. Alternatively, the laser source is external to the integrated device and a fiber optic cable is used to connect the laser source to the integrated device.

Abstract: An aspect of the present embodiment, there is provided a method of fabricating a semiconductor device, including grinding a second surface of a wafer, the second surface opposite to a first surface of the wafer being stuck with a surface protection material, forming a protective film on the first surface, irradiating a portion including an outside edge of the wafer with laser light to remove the portion including the outside edge in a state that the wafer is rotating and an irradiation position of the laser light is approaching to a rotation axis of the wafer, an absorption ratio of the wafer to the laser light being higher than an absorption ratio of the surface protection material to the laser light, and removing the protective film.

Abstract: Temporal focusing of spatially chirped femtosecond laser pulses overcomes previous limitations for ablating high aspect ratio features with low numerical aperture (NA) beams. Simultaneous spatial and temporal focusing reduces nonlinear interactions, such as self-focusing, prior to the focal plane so that deep (˜1 mm) features with parallel sidewalls are ablated at high material removal rates.

Abstract: A laser engraving device which can adjust its machining position is disclosed. The device includes a laser machine for supplying laser beam, a guide rod adjacent to and parallel to the laser machine, a galvanometric scanner coupled to the guide rod and being movable with the guide rod, and a driver disposed at an end of the guide rod for driving the guide rod.

Abstract: A method of scoring a multi-layer film structure, wherein the multi-layer film structure comprises a metal layer and polymer layer bonded to each other, the method comprises using a single laser beam incident to the polymer layer to produce a score line in the polymer layer, wherein the laser energy is absorbed only by the metal layer.

Abstract: A method of forming patterns on transparent substrates using a pulsed laser is disclosed. Various embodiments include an ultrashort pulsed laser, a substrate that is transparent to the laser wavelength, and a target plate. The laser beam is guided through the transparent substrate and focused on the target surface. The target material is ablated by the laser and is deposited on the opposite substrate surface. A pattern, for example a gray scale image, is formed by scanning the laser beam relative to the target. Variations of the laser beam scan speed and scan line density control the material deposition and change the optical properties of the deposited patterns, creating a visual effect of gray scale. In some embodiments patterns may be formed on a portion of a microelectronic device during a fabrication process. In some embodiments high repetition rate picoseconds and nanosecond sources are configured to produce the patterns.

Abstract: A method and apparatus for processing substrate edges is disclosed that overcomes the limitations of conventional edge processing methods and systems used in semiconductor manufacturing. The edge processing method and apparatus of this invention includes a laser and optical system to direct a beam of radiation onto a rotating substrate supported by a chuck, in atmosphere. The optical system accurately and precisely directs the beam to remove or transform organic or inorganic films, film stacks, residues, or particles from the top edge, top bevel, apex, bottom bevel, and bottom edge of the substrate. An optional gas injector system directs gas onto the substrate edge to aid in the reaction. Process by-products are removed via an exhaust tube enveloping the reaction site. This invention permits precise control of an edge exclusion zone, resulting in an increase in the number of usable die on a wafer.

Abstract: A laser processing apparatus including a processing head for applying a laser beam to a workpiece. The processing head includes a focusing lens and a collecting unit provided between the focusing lens and the workpiece for collecting debris generated by the application of the laser beam focused by the focusing lens to the workpiece. The collecting unit includes a suction source for sucking the debris and a suction line having one end connected to the suction source and the other end opening to the front side of the workpiece. The laser processing apparatus further includes a cleaning liquid supplying unit for supplying a cleaning liquid to the suction line.

Abstract: A system, method, and device for etching an indicia onto a substrate includes a compact laser etching device having a delivery head, an emitter housing, a RF cable, and a communication cable. The delivery head has a beam steering mechanism and a hood assembly positioned between the beam steering mechanism and the substrate. The emitter housing has a laser for generating a laser beam, and a fold mirror positioned in an optical path of the laser beam for redirecting the laser beam into the beam steering mechanism. A remote RF electronics package drives the laser. Control electronics cause the beam steering mechanism to steer the laser beam into a pattern of the indicia. The delivery head may further include a plurality of suction cups for holding the compact laser etching device in engagement with the substrate.

Abstract: A system for creating marked can tabs may include an isolation mechanism located in the path of the tab material strip between a tab material dereeler and a tab forming press and a system suitable for marking the tab material strip. The isolation mechanism may be configured to convert discontinuous motion of the tab material strip proximate the tab forming press into continuous motion of the tab material strip at the dereeler. The system may be suitable for marking the tab material strip. The marking system may be located between the dereeler and the isolation mechanism such that the laser system acts on the tab material strip while it is moving at a relatively constant speed.

Abstract: Laser direct ablation (LDA) produces patterns cut into a dielectric layer for the formation of electrically conductive traces with controlled signal propagation characteristics. LDA processing includes selecting a dose fluence for removing a desired depth of material along a scribe line on a surface of a workpiece, selecting a temporal pulsewidth for each laser pulse in a series of laser pulses, and selecting a pulse repetition frequency for the series of laser pulse. The pulse repetition frequency is based at least in part on the selected temporal pulsewidth to maintain the selected dose fluence along the scribe line. The selected pulse repetition frequency provides a predetermined minimum overlap of laser spots along the scribe line. The LDA process further includes generating a laser beam including the series of laser pulses according to the selected dose fluence, temporal pulsewidth, and pulse repetition frequency.

Abstract: The present invention relates to a process for producing a substrate provided with a metal pattern by forming a pattern of a metal layer on a substrate using a laser light, the process including: a step of preparing a substrate in which the metal layer is formed on a surface thereof; a step of forming on the metal layer an assist layer which comprises a metal material different from that of the metal layer and which has a light absorptivity for the laser light different from that of the metal layer, thereby forming a metal laminate on the substrate; and a step of patterning the metal layer by irradiating the metal laminate with the laser light to remove a laser light-irradiated portion of the metal laminate, thereby forming a metal pattern on the substrate.

Abstract: A laser processing apparatus has an optical transmitting unit for guiding a laser beam to a focusing unit. The optical transmitting unit includes a focusing lens for focusing the laser beam, an optical fiber unit for inputting the focused laser beam and guiding it to the focusing unit. The optical fiber unit includes an LMA fiber for inputting the focused laser beam. The LMA fiber has a large-diameter core covered with a cladding, a transmitting fiber provided by an SM fiber or a PM fiber. The transmitting fiber has a small-diameter core covered with a cladding, the small-diameter core having a diameter corresponding to the wavelength of the laser beam oscillated by the laser oscillator. A connector connects the LMA fiber and the transmitting fiber so that these fibers are axially aligned with each other.

Abstract: An optical scanning device includes: a light projector configured to radiate light while causing the light to make angular movement at a constant speed; and a light reflector configured to reflect the light radiated from the light projector to guide the light to an intended irradiated point on a predetermined scanning line. The light reflector includes a plurality of reflecting portions and reflects, at least twice, the light radiated from the light projector to guide the light to the intended irradiated point. The reflecting portions each include a plurality of reflecting surfaces. A length of an optical path from the light projector to the irradiated point is substantially constant for all of irradiated points on the scanning line, and a scanning speed, on the scanning line, of the light radiated from the light projector is substantially constant.

Abstract: A laser processing system quickly and flexibly modifies a processing beam to determine and implement an improved or optimum beam profile for a particular application (or a subset of the application). The system reduces the sensitivity of beam shaping subsystems to variations in the laser processing system, including those due to manufacturing tolerances, thermal drift, variations in component performance, and other sources of system variation. Certain embodiments also manipulate lower quality laser beams (higher M2 values) to provide acceptable shaped beam profiles.

Abstract: Methods and systems for forming a scribe line in a thin film stack on an inner surface of a thin film photovoltaic superstrate are provided via the use of a cleaning laser beam and a scribing laser beam. The cleaning laser beam is focused directly onto the exposed surface of the superstrate such that the cleaning laser beam removes debris from the exposed surface of the superstrate, and the scribing laser beam is focused through the exposed surface of the superstrate and onto the thin film stack such that the scribing laser beam passes through the superstrate to form a scribe within the thin film stack on the inner surface of the superstrate. The method and system can further utilize a conveyor to transport the superstrate in a machine direction to move the superstrate past the cleaning laser source and the scribing laser source.

Abstract: Methods for separating glass articles from glass substrate sheets are described herein. In one embodiment, a method includes focusing a laser beam on at least one surface of the glass substrate sheet such that the laser beam has an asymmetrical intensity distribution at the at least one surface of the glass substrate sheet. The method further includes translating the laser beam on the at least one surface of the glass substrate sheet along a desired groove line to form at least one groove on the at least one surface of the glass substrate sheet. The at least one groove extends partially through a thickness of the glass substrate sheet along the desired groove line and has bevelled or chamfered walls. The glass article may be separated from the glass substrate sheet along the at least one groove.

Abstract: Laser machining systems and methods may include debris removal systems to remove debris generated by the machining process and/or outgassing or filtration systems to remove harmful gases and filter and recycle air within the system. The laser machining systems and methods may be used to scribe one or more lines in large flat workpieces such as solar panels. In particular, laser machining systems and methods may be used to scribe lines in thin film photovoltaic (PV) solar panels with accuracy, high speed and reduced cost.

Abstract: A laser material processing system comprises: a housing defining an engraving chamber, an xy laser beam steering system, and a non-telescoping sliding focus mechanism. The housing includes a removable bottom panel that allows processing of workpieces that exceed dimensions of the engraving chamber and allows stacking of the system on modular attachments for specialized functions. The focus mechanism includes a carriage mirror subassembly attached to the x-axis carriage, a sliding member moveably attached to the carriage mirror subassembly, and a focusing lens subassembly attached perpendicularly to the lower end of the sliding member. The carriage mirror subassembly and the focusing lens subassembly are configured to receive and focus a laser beam to a focal point. The focusing lens subassembly is adjusted along a z-axis by disengaging the locking component and vertically sliding the sliding member and is locked into a position by engaging the locking component with the sliding member.