Abstract: A method and assembly for preserving solder connections of components mounted on a thin laminate circuit board during wave soldering of leaded components to the circuit board. The method generally entails supporting the circuit board on a pallet with pedestals that contact the surface of the circuit board directly opposite surface-mount components on the board. The pallet also includes an access directly opposite leaded components assembled to the board so that their leads are exposed. The pallet and board assembly are then placed on a wave soldering apparatus and wave soldered while applying and maintaining a force to the circuit board that ensures contact between the pedestals and the surface of the board opposite the surface-mount components, so that the leads of the leaded components are soldered to the circuit board.

Abstract: A method and arrangement are disclosed for attaching one or more electrical bayonet-type blades to a circuit board. The arrangement comprises a circuit board with at least one opening adapted to receive one blade. A solder pad disposed on at least one surface of board surrounds the opening. A plurality of vias surround the opening. The vias are disposed such that they pass through the solder pad. Solder is applied around the electrically conducting bayonet on one surface of the circuit board, through the vias, and around the electrically conducting bayonet of the surface of the circuit board opposite to the solder pad.

Abstract: A new apparatus and process for soldering surface-mount and through-hole type electronic components into a printed circuit board (PCB) in an automated fashion utilizing localized electromagnetic induction heating. Current manufacture technology for packaging electronic components depends exclusively on the reflow and wave soldering processes. Both processes heat up to relatively high temperature the entire assembly, namely its PCB and all the electronic components been soldered into it. Such high temperature environment frequently causes components damage resulting in rejects and/or demanding rework. With this invention however, during a soldering operation only the leads and pads, or joints, being soldered are heated but neither the body, or casing, of said electronic components nor the dielectric material forming said PCB are heated. Because of this selectively localized heating, the invention permits to reduce cost and improve the quality and reliability of manufactured products.

Abstract: In a printed circuit board, electronic components such as a component having a pair of leading portions, a chip component having a pair of electrodes, and the like, are connected to circuit patterns; and a resist layer covering a copper foil portion formed as a ground pattern is removed in vicinity of the high-impedance side leading portion of the current leading component and the high-impedance side electrode of the chip component to thereby form removed portions so that discharge paths are formed between the copper foil portion exposed through the removed portions and the leading portion and the electrode.

Abstract: A method for making electronic circuit component having improved mechanical properties and thermal conductivity comprises steps of providing NiAl and/or Ni3Al, and forming an alumina layer thereupon prior to applying the conductive elements. Additional layers of copper-aluminum alloy or copper further improve mechanical strength and thermal conductivity.