Abstract: An optoelectronic component (1) is specified, with at least one radiation-emitting semiconductor chip generating electromagnetic radiation during operation, a coating surrounding the at least one semiconductor chip in lateral directions, a magnetic structure covered by the coating, wherein the magnetic structure enables the component to be identified. Furthermore, a process for the manufacture of such an optoelectronic component is given.

Abstract: Wafer level encapsulated packages includes a wafer, a glass substrate hermetically sealed to the wafer, and an electronic component. The glass substrate includes a glass cladding layer fused to a glass core layer and a cavity formed in the glass substrate. The electronic component is encapsulated within the cavity. In various embodiments, the floor of the cavity is planar and substantially parallel to a plane defined by a top surface of the glass cladding layer. The glass cladding layer has a higher etch rate in an etchant than the glass core layer. In various embodiments, the wafer level encapsulated package is substantially optically transparent. Methods for forming the wafer level encapsulated package and electronic devices formed from the wafer level encapsulated package are also described.

Abstract: Provided is an opto-electronic device including a semiconductor substrate doped with a first conductivity type impurity, a source region and a drain region provided on the semiconductor substrate spaced apart from each other and doped with a second conductivity type impurity which is electrically opposite to the first conductivity type impurity, a first electrode and a second electrode electrically connected to the source region and the drain region, respectively, a quantum dot layer provided between the source region and the drain region on the semiconductor substrate and including quantum dots, a first insulation layer configured to insulate the semiconductor substrate and the quantum dot layer from each other, and a transparent electrode layer provided on the quantum dot layer.

Abstract: Techniques for enhancing the absorption of photons in semiconductors with the use of microstructures are described. The microstructures, such as pillars and/or holes, effectively increase the effective absorption length resulting in a greater absorption of the photons. Using microstructures for absorption enhancement for silicon photodiodes and silicon avalanche photodiodes can result in bandwidths in excess of 10 Gb/s at photons with wavelengths of 850 nm, and with quantum efficiencies of approximately 90% or more.

Abstract: An infrared detector and a method for forming it are provided. The detector includes absorber, barrier, and contact regions. The absorber region includes a first semiconductor material, with a first lattice constant, that produces charge carriers in response to infrared light. The barrier region is disposed on the absorber region and comprises a superlatice that includes (i) first barrier region layers comprising the first semiconductor material, and (ii) second barrier region layers comprising a second semiconductor material, different from, but lattice matched to, the first semiconductor material. The first and second barrier region layers are alternatingly arranged. The contact region is disposed on the barrier region and comprises a superlattice that includes (i) first contact region layers comprising the first semiconductor material, and (ii) second contact region layers comprising the second semiconductor material layer. The first and second contact region layers are alternatingly arranged.

Abstract: A colored structure representing a back side-reflection color with metallic luster and high chroma when observed in a substrate incident mode greatly enhances light absorbance at a specific wavelength using a resonance structure in which a light absorbing material is inserted between a transparent substrate and an upper mirror layer. The colored structure controls metallic luster and texture of a high-chroma color from gloss-semi-gloss-matte texture in various aesthetic ways including introducing a haze surface structure in which light scattering occurs on at least one surface of the transparent substrate.

Abstract: An optoelectronic device includes a semiconductor substrate and a first stack of epitaxial layers, which are disposed over the semiconductor substrate and are configured to function as a photodetector, which emits a photocurrent in response to infrared radiation in a range of wavelengths greater than 940 nm. A second stack of epitaxial layers is disposed over the first stack and configured to function as an optical transmitter with an emission wavelength in the range of wavelengths greater than 940 nm.

Abstract: Provided is an opto-electronic device having low dark noise and a high signal-to-noise ratio. The opto-electronic device may include: a first semiconductor layer doped to have a first conductivity type; a second semiconductor layer disposed on an upper surface of the first semiconductor layer and doped to have a second conductivity type electrically opposite to the first conductivity type; a transparent matrix layer disposed on an upper surface of the second semiconductor layer; a plurality of quantum dots arranged to be in contact with the transparent matrix layer; and a first electrode provided on a first side of the transparent matrix layer and a second electrode provided on a second side of the transparent matrix layer opposite to the first side, wherein the first electrode and the second electrode are electrically connected to the second semiconductor layer.

Abstract: An electromagnetic wave detector includes: an insulating film having a first surface and a second surface facing the first surface; a first layer to perform photoelectric conversion by an incident electromagnetic wave and change in potential, the first layer being made of a first two-dimensional atomic layer material; and a second layer to receive the change in potential through the first insulating film and generate change in electrical quantity, the second layer being made of a second two-dimensional atomic layer material and provided on the first surface. In this manner, the sensitive electromagnetic wave detector detecting an incident electromagnetic wave as change in electrical quantity and having high response speed to an incident electromagnetic wave can be provided.

Abstract: A semiconductor device is provided. The semiconductor device includes a substrate having a photoelectric conversion element, a first light-shielding layer disposed on the substrate and having a first aperture, a light-transmitting layer disposed on the first light-shielding layer, at least one second light-shielding layer disposed in the light-transmitting layer and having a second aperture, and a light-condensing structure disposed on the light-transmitting layer. The orthogonal projection of the second aperture on the bottom surface of the substrate has a long axis of symmetry and a short axis of symmetry perpendicular to the long axis of symmetry.

Abstract: Techniques for growing, at least one of: (a) quantum dots and (b) nano-crystals, on a surface of a material are provided. One method comprises placing a precursor on the surface; adding an antisolvent to the precursor; and growing at least one of the quantum dots and the nanocrystals on the surface.

Abstract: Semiconductor optoelectronic devices having a dilute nitride active region are disclosed. In particular, the semiconductor devices have a dilute nitride active region with at least two bandgaps within a range from 0.7 eV and 1.4 eV. Photodetectors comprising a dilute nitride active region with at least two bandgaps have a reduced dark current when compared to photodetectors comprising a dilute nitride active region with a single bandgap equivalent to the smallest bandgap of the at least two bandgaps.

Abstract: Provided are an infrared detecting device and an infrared detecting system including the infrared detecting device. The infrared detecting device includes at least one infrared detector, and the at least one infrared detector includes a substrate, a buffer layer, and at least one light absorbing portion. The buffer layer includes a superlattice structure.

Abstract: A photosensitive field-effect transistor comprising a substrate with a source electrode, a drain electrode and a gate electrode. The transistor comprises a photoactive layer which at least partly covers the gate electrode, and a channel layer which covers the photoactive layer and at least partly covers both the source electrode and the drain electrode. The channel layer comprises a two-dimensional material whose conductivity is modulated by charge carriers transferred from the photoactive layer when electromagnetic radiation is absorbed in the photoactive layer.

Abstract: In various embodiments, a graphical plotter can create a transformation circle. An identification component can identify a center point, a radius from the center point, and a circular outer point set extended from the center point by the radius. A creation component can create a plot based, at least in part, on the center point, the radius, and the circular outer point set. An output component can cause the plot to be outputted, where the circular outer point set is dependent on trigonometry of an angle set from an x-axis pertaining to the center point and the radius.

Abstract: Lateral and vertical microstructure enhanced photodetectors and avalanche photodetectors are monolithically integrated with CMOS/BiCMOS ASICs and can also be integrated with laser devices using fluidic assembly techniques. Photodetectors can be configured in a vertical PIN arrangement or lateral metal-semiconductor-metal arrangement where electrodes are in an inter-digitated pattern. Microstructures, such as holes and protrusions, can improve quantum efficiency in silicon, germanium and III-V materials and can also reduce avalanche voltages for avalanche photodiodes. Applications include optical communications within and between datacenters, telecommunications, LIDAR, and free space data communication.

Abstract: An optical fiber temperature sensor includes a broadband light source, a first optical fiber patch cord, a first single-mode optical fiber, a single-hole twin-core eccentric core optical fiber, a second single-mode optical fiber, a second optical fiber patch cord, and an optical spectrum analyzer.

Abstract: The present technology relates to a light receiving element, an imaging element, and an imaging device. A light receiving element includes an on-chip lens, a wiring layer, and a semiconductor layer arranged between the on-chip lens and the wiring layer. The semiconductor layer includes a first voltage application unit to which a first voltage is applied, a second voltage application unit to which a second voltage is applied, a first charge detection unit, and a second charge detection unit. The wiring layer includes at least one layer including first voltage application wiring configured to supply the first voltage, second voltage application wiring configured to supply the second voltage, and a reflection member that overlaps the first charge detection unit or the second charge detection unit, in plan view. The present technology, for example, can be applied to a light receiving element configured to measure a distance.

Abstract: The present disclosure provides a light-emitting device and manufacturing method thereof. The light-emitting device comprising: a light-emitting stack; and a semiconductor layer having a first surface connecting to the light-emitting stack, a second surface opposite to the first surface, and a void; wherein the void comprises a bottom part near the first surface and an opening on the second surface, and a dimension of the bottom part is larger than the dimension of the opening.

Abstract: The present disclosure relates to an avalanche diode including at least one PN junction; at least one depletion structure located adjacent to the PN junction and configured to form a depletion region; and at least two electrodes to polarize the at least one PN junction.

Abstract: Disclosed is a plurality of metal chalcogenide nanocrystals coated with multiple organic and inorganic ligands; wherein the metal is selected from Hg, Pb, Sn, Cd, Bi, Sb or a mixture thereof; and the chalcogen is selected from S, Se, Te or a mixture thereof; wherein the multiple inorganic ligands includes at least one inorganic ligands are selected from S2?, HS?, Se2?, Te2?, OH?, BF4?, PF6?, Cl?, Br?, I?, As2Se3, Sb2S3, Sb2Te3, Sb2Se3, As2S3 or a mixture thereof; and wherein the absorption of the C—H bonds of the organic ligands relative to the absorption of metal chalcogenide nanocrystals is lower than 50%, preferably lower than 20%.

Abstract: A method for making a semiconductor device may include forming a hyper-abrupt junction region above a substrate and including a first semiconductor layer having a first conductivity type, a first superlattice layer on the first semiconductor layer, a second semiconductor layer on the first superlattice layer and having a second conductivity type different than the first conductivity type, and a second superlattice layer on the second semiconductor layer. The method may further include forming a first contact coupled to the hyper-abrupt junction region and a second contact coupled to the substrate to define a varactor. The first and second superlattices may each include stacked groups of layers, with each group of layers comprising stacked base semiconductor monolayers defining a base semiconductor portion, and at least one non-semiconductor monolayer constrained within a crystal lattice of adjacent base semiconductor portions.

Abstract: An electroabsorption modulator that operates based on electroabsorption of a surface plasmon polariton mode is improved by various structural changes and/or selection of different materials. For example, at least a portion of the waveguide may be made to be conductive, e.g., by doping. Also, layers that make up the modulator structure may be placed along sides of waveguides in addition to or instead of simply on the top thereof. High permittivity gate dielectric materials may be employed. Also, materials other than ITO may be employed as a transparent conductor. Such an improved plasmonic electroabsorption modulator can be fabricated using standard semiconductor processing techniques and may be integrated with standard photonic integrated circuits, including silicon photonics and compound semiconductor-based platforms. Advantageously, high-speed, low-voltage operation over a wide spectrum of wavelengths may be achieved.

Abstract: Shading correction is realized without sacrificing a noise characteristic and a sensitivity characteristic. A solid-state imaging element includes a plurality of pixels that are arranged two-dimensionally and each outputs analog voltage proportional to electron produced by photodiode and an AD conversion section that convert analog voltages output from the pixels into digital signals. First and second pixels included in the plurality of pixels differ in conversion efficiency with which a unit quantity of electrons output from the photodiodes are converted into the analog voltages.

Abstract: The present disclosure discloses a three-dimensional photodetector and a method of manufacturing the same. The three-dimensional photodetector according to an embodiment of the present disclosure includes a base part formed in the center region of the three-dimensional photodetector; a first bending part formed around the base part; at least one branch part connected to the base part through the first bending part; second bending parts formed on the at least one branch part; bonding parts connected to the at least one branch part through the second bending parts; at least one photoresistor formed on the surface of at least one of the base part and the branch parts; and a stretchable substrate to which the bonding parts are attached, wherein the bonding parts are attached to the stretchable substrate so that the base part has a gap in the thickness direction of the stretchable substrate; and the at least one photoresistor is responsible for tracking the traveling direction of light.

Abstract: A multi-color light detector includes a first photodiode. The light detector further includes a second photodiode stacked on the first photodiode and defining a via. The light detector further includes a first conductor extending through the via, contacting the first photodiode, and designed to transmit a first signal corresponding to a first light detected by the first photodiode. The light detector further includes a second conductor contacting the second photodiode and designed to transmit a second signal corresponding to a second light detected by the second photodiode.

Abstract: The invention relates to a radiation detector element (10) comprising a stack (15) of layers superimposed in a stacking direction (Z), the stack (15) having a first face (25) and a second face (30) and comprising a radiation-absorbing layer (35) consisting of a first semiconductor material (M1) having a first band gap value and at least one barrier layer (40) consisting of a second semiconductor material (M2) having a second band gap value, the second band gap value being strictly higher than the first band gap value. The second face (30) has at least one strip (105) defined in the stacking direction (Z) by the barrier layer (40), the strip (105) consisting of the second semiconductor material (M2) and having a doping of the first type and a free carrier density higher than or equal to 1.1017 cm?3.

Abstract: A method for making a semiconductor device may include forming a hyper-abrupt junction region on a substrate. The hyper-abrupt junction region may include a first semiconductor layer having a first conductivity type, a superlattice layer on the first semiconductor layer, and a second semiconductor layer on the superlattice layer and having a second conductivity type different than the first conductivity type. The superlattice may include stacked groups of layers, with each group of layers including stacked base semiconductor monolayers defining a base semiconductor portion, and at least one non-semiconductor monolayer constrained within a crystal lattice of adjacent base semiconductor portions. The method may further include forming a first contact coupled to the hyper-abrupt junction regions, and forming a second contact coupled to the substrate to define a varactor.

Abstract: A semiconductor substrate doped with a first doping type is positioned adjacent an insulated gate electrode that is biased by a gate voltage. A first region within the semiconductor substrate is doped with the first doping type and biased with a bias voltage. A second region within the semiconductor substrate is doped with a second doping type that is opposite the first doping type. Voltage application produces an electrostatic field within the semiconductor substrate causing the formation of a fully depleted region within the semiconductor substrate. The fully depleted region responds to absorption of a photon with an avalanche multiplication that produces charges that are collected at the first and second regions.

Abstract: A electronic method, includes receiving, by a graphene structure, a microwave signal. The microwave signal has a driving voltage level. The electronic method includes generating, by the graphene structure, optical photons based on the microvolts. The electronic method includes outputting, by the graphene structure, the optical photons.

Abstract: A ternary superlattice structure includes a substrate and periodic layer structure on the substrate and having alternating infrared absorbing semiconductor materials having a first layer of InAs[1-x]Sb[x] ternary alloy material, and a second layer of In[1-y]Z[y]As ternary alloy material, wherein Z is Ga or Al, wherein x is in a range of greater than zero and less than one, wherein y is in a range of greater than zero and less than one, and wherein a thickness of each of the first and second layers are substantially similar and configured to absorb light in a predetermined spectral band and prevent trapping of carriers in any particular layer. In examples, y is in a range from about 0.05 to about 0.35, and x is in a range of about 0.2 to about 0.8.

Abstract: The present invention relates to an optoelectronic apparatus comprising: —an optoelectronic device comprising: —a transport structure (T) comprising a 2-dimensional layer; —a photosensitizing structure (P) configured and arranged to absorb incident light and induce changes in the electrical conductivity of the transport structure (T); and —drain (D) and source (S) electrodes electrically connected to respective separate locations of the transport structure (T); —noise suppression means comprising a modulation unit including: —a control unit to generate and apply on the drain (D) or source (S) electrodes a voltage oscillating signal having a component with a frequency of ?m/2?; and —a signal extraction unit to extract a required electric signal, from an output signal, with no components below ?m/2?. The present invention also concerns to a method for suppressing noise for an optoelectronic apparatus according to the invention, and to the use of the apparatus as a light detector or as an image sensor.

Abstract: The invention relates to a method for manufacturing a photodetector able to operate for the photodetection of infrared electromagnetic waves, comprising a stack of thin layers placed on top of one another. The method includes obtaining a first assembly (E1) of stacked layers, forming a detection assembly, comprising a first substrate layer, a photoabsorbent layer, a barrier layer and at least one contact layer, and a second assembly (E2) of stacked layers forming a reading circuit, comprising at least one second substrate layer and a multiplexing layer. The first and second assemblies are glued between the contact layer of the first assembly and the multiplexing layer of the second assembly. Etching through the second assembly makes it possible to obtain a plurality of interconnect vias, then p or n doping of zones of the first contact layer of the first assembly through the interconnect vias.

Abstract: An infrared detecting semiconductor device comprises: an optical absorbing layer of type-II disposed between first conductivity-type and second conductivity-type semiconductor layers; and an optical filtering film of n-type InGaAs having an n-type dopant concentration larger than 8×1017 cm?3. The optical filtering film includes first to third semiconductor regions, which are sequentially arranged in a direction of a first axis on the optical filtering film. The first semiconductor region has an n-type dopant concentration of 2.0×1019 cm?3 or more. The third semiconductor region has a n-type concentration of 3.0×1018 cm?3 or less. The second semiconductor region has an n-type dopant profile monotonically changing from a first dopant concentration at a boundary between the first and second semiconductor regions to a second dopant concentration at a boundary between the second and third semiconductor regions. The first dopant concentration is greater than the second dopant concentration.

Abstract: This light-receiving element includes a plurality of photoelectric conversion layers, each of which includes a compound semiconductor, and absorbs a wavelength in an infrared region to generate an electric charge, and an insulating film that is provided to surround each of the plurality of photoelectric conversion layers.

Abstract: An optical/RF apparatus comprising a liquid crystal (LC) layer placed above or below a plasmon layer (e.g., a periodic array of graphene ribbons) to enable the tuning of the surface plasmons by varying the voltage applied to the LC to realize thereby devices such as tunable mid-IR, far-IR or THz modulators and filters.

Abstract: An AlSb lattice matched barrier infrared detector architecture with the AlSb binary barrier layer enables implementation of strain layer superlattice absorbers with higher absorption coefficients for improved quantum efficiency, presents a simplified structure for epitaxial growth, and enables the utilization of bulk InAs0.815Sb0.185 absorber material with a 5.0 ?m cutoff for both single and dual color devices. Such an infrared detector is formed by growing the detector material; bottom contact, 1st absorber layer, AlSb barrier, optional graded layer, 2nd absorber layer, top contact, on top of an AlSb lattice matched buffer layer. Epitaxial growth on the AlSb lattice enables the deposition of unstrained bulk InAs0.815Sb0.185 with a 5.0 ?m cutoff, as well as InAs/InAs(x)Sb(1-x) superlattice absorbers with a continuously tunable cutoff from mid-wavelength to long-wavelength infrared.

Abstract: A light-emitting device includes multiple transfer elements, multiple setting elements, multiple light-emitting elements, and a controller. The transfer elements sequentially enter an on state. The setting elements are connected to the transfer elements. In response to the transfer elements entering the on state, the setting elements are allowed to enter an on state. Each of the light-emitting elements is connected to a corresponding one of the setting elements. In response to each of the setting elements entering the on state, the corresponding one of the light-emitting elements enters an on state to emit light or increase a light emission intensity thereof. The light-emitting elements are maintained in the on state in parallel. The controller controls the setting elements to enter the on state in accordance with a received illumination control signal, and controls an illumination period of the light-emitting elements.

Abstract: Methods, systems, and devices are disclosed for implementing electro-optical modulators in which a resonating cavity structure is coupled to a transmission waveguide. In one example, the resonating structure includes a ring resonator whose coupling strength is controlled via an electrical control signal. The ring resonator is made of a capacitor comprising monolayer graphene sheets separated by a thick layer of dielectric material.

Abstract: A laser printing system includes a laser configured to produce a beam of light modulated according to image data input to the laser printing system, a photoreceptor drum including a photoconductive layer disposed along an outer peripheral surface of the photoreceptor drum, and a non-mechanical beam steerer configured for receiving the modulated light beam from the laser and steering the light beam in a scanning motion back and forth across the photoconductive layer of the photoreceptor drum. The laser printing system also includes a printer controller configured to structure the image data input to the laser printing system, and control an amount of electrical current flowing through portions of the non-mechanical beam steerer to change an effective index of refraction of the non-mechanical beam steerer and steer the modulated light beam in the scanning motion.

Abstract: The present disclosure provides a light-emitting device and manufacturing method thereof. The light-emitting device comprising: a light-emitting stack; and a semiconductor layer having a first surface connecting to the light-emitting stack, a second surface opposite to the first surface, and a void; wherein the void comprises a bottom part near the first surface and an opening on the second surface, and a dimension of the bottom part is larger than the dimension of the opening.

Abstract: A photovoltaic photodetector includes a substrate, a graphene layer, and a dielectric layer positioned between the substrate and the graphene layer. One or more first antenna electrodes includes a first metal in direct contact with the graphene layer. One or more second antenna electrodes includes a second metal in direct contact with the graphene layer. The first and second metals have different work functions. A drain electrode is electrically coupled to the one or more first antenna electrodes, and a source electrode is electrically coupled to the one or more second antenna electrodes. The photovoltaic photodetector can be configured to be operable over a wavelength region of 2 ?m to 24 ?m and has a response time of 10 ns or less.

Abstract: A type-II hybrid absorber photodetector (PD) is provided with ultrafast speed and high-power performance at terahertz (THz) regime. Through narrowed bandgap and enhanced absorption process at a type-II interface between absorption layers of gallium arsenic antimonide (GaAs0.5Sb0.5) and indium gallium arsenide (In0.53Ga0.47As), the incorporation of the type-II P+-GaAs0.5Sb0.5/i-In0.53Ga0.47As hybrid absorber in an indium phosphide (InP) UTC-PD obtains improvement in responsivity. Current blocking effect is minimized owing to the high-excess energy of photo-generated electrons injected from the GaAs0.5Sb0.5 layer to an InP-based collector layer. The flip-chip bonding packaged device shows a moderate responsivity along with a record wide optical-to-electrical bandwidth at 0.33 THz, among all the reported for long-wavelength ultrafast PDs. A saturation current exceeding 13 mA and a continuous-wave output power of ?3 decibel-milliwatts are demonstrated at an operating frequency of 0.

Abstract: A light converter (200) comprises: a solid-state light conversion material (201) that generates emission light from excitation light incident on its surface; a filler layer (230, 240) on the surface of the solid-state light conversion material (201); and an optical coating (220, 250) on the filler layer. The optical coating (220, 250) may be a thin film, such as an anti-reflective coating (220) and/or a high-reflective coating (250). A metallic coating (260) may additionally be provided. The light converter (200) may be used for an optical device, such as a phosphor wheel or automotive headlight.

Abstract: A photodiode having a reduced dark current includes a semiconductor layer, a first contact part, a second contact part, and an active region. The first contact part disposed in a first region of the semiconductor layer includes an interlayer and at least one metal layer. The second contact part disposed in a second region of the semiconductor layer includes at least one metal layer. The active region is disposed between the first contact part and the second contact part. The first contact part and the second contact part are arranged asymmetrical to each other.

Abstract: Optical computing devices may include capacitance-based nanomaterial detectors. For example, an optical computing device may include a light source that emits electromagnetic radiation into an optical train extending from the light source to a capacitance-based nanomaterial detector; a material positioned in the optical train to optically interact with the electromagnetic radiation and produce optically interacted light; and the capacitance-based nanomaterial detector comprising one or more nano-sized materials configured to have a resonantly-tuned absorption spectrum and being configured to receive the optically interacted light, apply a vector related to the characteristic of interest to the optically interacted light using the resonantly-tuned absorption spectrum, and generate an output signal indicative of the characteristic of interest.

Abstract: In one aspect, a composition of matter is disclosed, which comprises a photonic crystal comprising a plurality of 2D or 3D periodically repeating structures, where the structures are configured and arranged relative to one another such that the photonic crystal exhibits a Dirac cone at the center of the Brillouin zone of its reciprocal lattice, e.g., at one frequency in the optical regime. In some embodiments, the structures are formed of a dielectric material.

Abstract: A device for a gain medium for a semiconductor laser has an active region, a buffer layer, a substrate, and an etch stop between the buffer layer and the substrate. The device is bonded to a silicon platform having silicon devices, such as a waveguide and mirror. The substrate is removed, after bonding the device to the platform. The buffer layer is made of different material than the substrate to reduce undercut of the buffer layer during substrate removal compared to a buffer layer made of the same material as the substrate.

Abstract: Provided is a display device. The display device includes a circuit substrate, a light source electrically connected to the circuit substrate, the light source being disposed under the circuit substrate, and a light conversion member disposed on a light emitting surface of the light source and a side of the circuit substrate, the light conversion member converting a wavelength of light emitted from the light source. Here, the light conversion member is disposed also on a side surface of the circuit substrate and converts a wavelength of light emitted from the light source. Since the light conversion member is disposed on the side surface of the circuit substrate, the light conversion member may be aligned with the light source without interfering with the circuit substrate. Thus, the display device may effectively convert the wavelength of the light emitted from the light source to realize improved brightness and color impression.

Abstract: Provided is a display device. The display device includes a circuit substrate, a light source electrically connected to the circuit substrate, the light source being disposed under the circuit substrate, and a light conversion member disposed on a light emitting surface of the light source and a side of the circuit substrate, the light conversion member converting a wavelength of light emitted from the light source. Here, the light conversion member is disposed also on a side surface of the circuit substrate and converts a wavelength of light emitted from the light source. Since the light conversion member is disposed on the side surface of the circuit substrate, the light conversion member may be aligned with the light source without interfering with the circuit substrate. Thus, the display device may effectively convert the wavelength of the light emitted from the light source to realize improved brightness and color impression.