Abstract: The flash memory cell comprises a sense transistor that has a pair of source/drain lines and a control gate. A coupling metal-insulator-metal capacitor is created between the control gate and a read wordline. A tunneling metal-insulator-metal capacitor is created between the control gate and a write/erase bit line. In one embodiment, the insulator is a metal oxide.

Abstract: An EEPROM flash memory device having a floating gate electrode enabling a reduced erase voltage and method for forming the same, the floating gate electrode including an outer edge portion including multiple charge transfer pointed tips.

Abstract: A method of fabricating a non-volatile memory device according to example embodiments may include forming a semiconductor layer on a substrate. A plurality of lower charge storing layers may be formed on a bottom surface of the semiconductor layer. A plurality of lower control gate electrodes may be formed on the plurality of lower charge storing layers. A plurality of upper charge storing layers may be formed on a top surface of the semiconductor layer. A plurality of upper control gate electrodes may be formed on the plurality of upper charge storing layers, wherein the plurality of lower and upper control gate electrodes may be arranged alternately.

Abstract: In one embodiment, a semiconductor device includes a semiconductor substrate having a first junction region and a second junction region. An insulated floating gate is disposed on the substrate. The floating gate at least partially overlaps the first junction region. An insulated program gate is disposed on the floating gate. The program gate has a curved upper surface. The semiconductor device further includes an insulated erase gate disposed on the substrate and adjacent the floating gate. The erase gate partially overlaps the second junction region.

Abstract: A nonvolatile semiconductor memory device includes a floating gate; an erasing gat; and a control gate. The floating gate is provided on a channel region of a semiconductor substrate through a first insulating layer. The erasing gate is provided on the floating gate through a second insulating layer. The control gate is provided beside the floating gate and the erasing gate through a third insulating layer. The floating gate is U-shaped.

Abstract: A nonvolatile semiconductor memory of an aspect of the present invention includes a memory cell including, a charge storage layer on a gate insulating film, a multilayer insulator on the charge storage layer, and a control gate electrode on the multilayer insulator, the gate insulating film including a first tunnel film, a first high-dielectric-constant film on the first tunnel film and offering a greater dielectric constant than the first tunnel film, and a second tunnel film on the first high-dielectric-constant film and having the same configuration as that of the first tunnel film, the multilayer insulator including a first insulating film, a second high-dielectric-constant film on the first insulating film and offering a greater dielectric constant than the first insulating film, and a second insulating film on the second high-dielectric-constant film and having the same configuration as that of the first insulating film.

Abstract: Non-volatile memory devices according to embodiments of the present invention include an EEPROM transistor in a first portion of a semiconductor substrate, an access transistor in a second portion of the semiconductor substrate and an erase transistor in a third portion of the semiconductor substrate. The second portion of the semiconductor substrate extends adjacent a first side of the first portion of the semiconductor substrate and the third portion of the semiconductor substrate extends adjacent a second side of the first portion of the semiconductor substrate. The first and second sides of the first portion of the semiconductor substrate may be opposite sides of the first portion of the semiconductor substrate. The access transistor has a first source/drain terminal electrically connected to a first source/drain terminal of the EEPROM transistor and the erase transistor has a first source/drain terminal electrically connected to a second source/drain terminal of the access transistor.

Abstract: A NAND non-volatile two-bit memory cell comprises a cell stack and two select stacks disposed on an active area of a substrate. Each select stack is respectively disposed on a side of the cell stack with a sidewall between the cell stack and a respective select stack. The cell stack has four components: a first dielectric layer disposed over the substrate; a charge accumulation layer capable of holding charge in a portion thereof to store information and disposed over the first dielectric layer; a second dielectric layer disposed over the charge accumulation layer; and a control gate disposed over the second dielectric layer. The select stack has two components: a third dielectric layer disposed over the substrate and a select gate, capable of inverting an underneath channel region to function as a source or a drain of the memory cell, disposed over the third dielectric layer.

Abstract: A flash memory device and programming and erasing methods therewith is disclosed, to secure the programming and erasing characteristics by changing a structure of a floating gate, in which the flash memory device includes a first conductive type semiconductor substrate defined as a field area and an active area; a tunnel oxide layer on the active area of the first conductive type semiconductor substrate; a floating gate on the tunnel oxide layer, having at least first and second floating gates having different levels of energy band gap; a dielectric layer on the floating gate; a control gate on the dielectric layer; and second conductive type source/drain regions in the active area of the first conductive type semiconductor substrate at both sides of the floating gate.

Abstract: An array of nonvolatile memory cells comprises a substantially single crystalline semiconductor substrate of a first conductivity type, having a planar surface. A plurality of non-volatile memory cell units are arranged in a plurality of rows and columns in the substrate. Each cell unit comprises a first region of a second conductivity type in the substrate along the planar surface. A second region of the second conductivity type is in the substrate along the planar surface, spaced apart from the first region. A channel region is between the first region and the second region. The channel region is characterized by three portions: a first portion, a second portion and a third portion, with the second portion between the first portion and the third portion, and the first portion adjacent to the first region, and the third portion adjacent to the second region. A first floating gate is over the first portion of the channel region, and is insulated therefrom.

Abstract: A memory cell (110) has a plurality of floating gates (120L, 120R). The channel region (170) comprises a plurality of sub-regions (220L, 220R) adjacent to the respective floating gates, and a connection region (210) between the floating gates. The connection region has the same conductivity type as the source/drain regions (160) to increase the channel conductivity. Therefore, the floating gates can be brought closer together even though the inter-gate dielectric (144) becomes thick between the floating gates, weakening the control gate's (104) electrical field in the channel.

Abstract: The invention relates to a single-poly EPROM comprising a source, a drain, a control gate, a floating gate and an additional gate. The control gate is positioned laterally of a channel between the source and the drain. The floating gate is positioned above the channel above the control gate. The additional gate is positioned above the floating gate, wherein the additional gate is electrically connected to the control gate.

Abstract: A non-volatile memory device includes a floating gate formed on a substrate with a gate insulation layer interposed therebetween, a tunnel insulation layer formed on the floating gate, a select gate electrode inducing charge introduction through the gate insulation layer, and a control gate electrode inducing charge tunneling occurring through the tunnel insulation layer. The select gate electrode is insulated from the control gate electrode. According to the non-volatile memory device, a select gate electrode and a control gate electrode are formed on a floating gate, and thus a voltage is applied to the respective gate electrodes to write and erase data.

Abstract: An improved split gate non-volatile memory cell is made in a substantially single crystalline substrate of a first conductivity type, having a first region of a second conductivity type, a second region of the second conductivity type, with a channel region between the first region and the second region in the substrate. The cell has a select gate above a portion of the channel region, a floating gate over another portion of the channel region, a control gate above the floating gate and an erase gate adjacent to the floating gate. The erase gate has an overhang extending over the floating gate. The ratio of the dimension of the overhang to the dimension of the vertical separation between the floating gate and the erase gate is between approximately 1.0 and 2.5, which improves erase efficiency.

Abstract: A nonvolatile memory cell has a charge trapping layer for the storage of charges thereon. The cell is a bidirectional cell in a substrate of a first conductivity. The cell has two spaced apart trenches. Within each trench, at the bottom thereof is a region of a second conductivity. A channel extends from one of the region at the bottom of one of the trenches along the side wall of that trench to the top planar surface of the substrate, and along the sidewall of the adjacent trench to the region at the bottom of the adjacent trench. The trapping layer is along the sidewall of each of the two trenches. A control gate is in each of the trenches capacitively coupled to the trapping layer along the sidewall and to the region at the bottom of the trench. Each of the trenches can stored a plurality of bits.

Abstract: The present memory device includes first and second electrodes, a passive layer between the first and second electrodes; and an active layer between the first and second electrodes, the active layer being of dendrimeric material which provides passages through the active layer.

Abstract: Flash memory is rapidly decreasing in price. There is a demand for a new memory system that permits size reduction and suits multiple-value memory. A flash memory of AND type suitable for multiple-value memory with multiple-level threshold values can be made small in area if the inversion layer is utilized as the wiring; however, it suffers the disadvantage of greatly varying in writing characteristics from cell to cell. Another promising method of realizing multiple-value memory is to change the storage locations. This method, however, poses a problem with disturbance at the time of operation. The present invention provides one way to realize a semiconductor memory device with reduced cell-to-cell variation in writing characteristics.

Abstract: This invention is intended to improve reliability of a nonvolatile semiconductor memory device and reduces a memory cell size of the nonvolatile semiconductor memory device. A memory cell which includes source/drain diffusion layers in a p-type well formed in a silicon substrate, silicon nitride dots which are located between silicon oxide films and into which charges are injected, a control gate 212, and assist gates is formed. Programming is conducted to the memory cell by injecting electrons into the drain-side silicon nitride dots or the source-side silicon nitride dots. Since silicon nitride serving as a charge injected section is in the form of dots, it is possible to suppress movement of the charges in a channel direction, to prevent the charges on a source end portion and those on a drain end portion from being mixed together, and to improve charge holding characteristic of the memory cell. Even in the case where a gate length is shortened, the charge holding characteristic can be secured.

Abstract: The flash memory cell comprises a sense transistor that has a pair of source/drain lines and a control gate. A coupling metal-insulator-metal capacitor is created between the control gate and a read wordline. A tunneling metal-insulator-metal capacitor is created between the control gate and a write/erase bit line. In one embodiment, the insulator is a metal oxide.

Abstract: A flash memory cell structure has a substrate, a select gate, a first-type doped region, a shallow second-type doped region, a deep second-type doped region, and a doped source region. The substrate has a stacked gate. The select gate is formed on the substrate and adjacent to the stacked gate. The first-type ion formed region is doped in the substrate and adjacent to the select gate as a drain. The shallow second-type doped region is formed on one side of the first-type doped region below the stacked gate. The deep second-type doped region, which serves as a well, is formed underneath the first-type doped region with one side bordering on the shallow second-type doped region. The doped source region is formed on a side of the shallow second-type doped region as a source.

Abstract: The invention includes methods of forming memory circuitry. In one implementation, a semiconductor substrate includes a pair of word lines having a bit node received therebetween. A bit node contact opening is formed within insulative material over the bit node. Sacrificial plugging material is formed within the bit node contact opening between the pair of word lines. Sacrificial plugging material is removed from the bit node contact opening between the pair of word lines, and it is replaced with conductive material that is in electrical connection with the bit node. Thereafter, the conductive material is formed into a bit line.

Abstract: The present invention provides a non-volatile memory device and a method for manufacturing such a device. The device comprises a floating gate (16), a control gate (19) and a separate erase gate (10). The erase gate (10) is provided in or on isolation zones (2) provided in the substrate (1). Because of that, the erase gates (10) do not add to the cell size. The capacitance between the erase gate (10) and the floating gate (16) is small compared with the capacitance between the control gate (19) and the floating gate (16), and the charged floating gate (16) is erased by Fowler-Nordheim tunneling through the oxide layer between the erase gate (10) and the floating gate (16).

Abstract: A nonvolatile semiconductor memory device includes a first insulating film provided on a surface of a semiconductor substrate, a charge accumulation layer provided on the first insulating film, a second insulating film provided above the charge accumulation layer and contains silicon and nitrogen, a third insulating film provided on the second insulating film, and composed of a single-layer insulating film containing oxygen or a plural-layer stacked insulating film at least whose films on a top layer and a bottom layer contain oxygen, relative dielectric constant thereof being larger than it of a silicon oxide film, a fourth insulating film provided on the third insulating film and contains silicon and nitrogen, a control gate provided above the fourth insulating film, and a fifth insulating film provided between the charge accumulation layer and the second insulating film or between the fourth insulating film and the control gate, and contains silicon and oxygen.

Abstract: A semiconductor device includes a plurality of nonvolatile memory cells (1). Each of the nonvolatile memory cells comprises a MOS type first transistor section (3) used for information storage, and a MOS type second transistor section (4) which selects the first transistor section. The second transistor section has a bit line electrode (16) connected to a bit line, and a control gate electrode (18) connected to a control gate control line. The first transistor section has a source line electrode (10) connected to a source line, a memory gate electrode (14) connected to a memory gate control line, and a charge storage region (11) disposed directly below the memory gate electrode. A gate withstand voltage of the second transistor section is lower than that of the first transistor section.

Abstract: A non-volatile memory including at least a substrate, a memory cell and source/drain regions is provided. The memory cell is disposed on the substrate and includes at least a first memory unit and a second memory unit. Wherein, the first memory unit, from the substrate up, includes a floating gate and a first control gate. The second memory unit is disposed on a sidewall of the first memory unit and includes a charge trapping layer and a second control gate. The two source/drain regions are disposed in the substrate at both sides of the memory cell.

Abstract: A non-volatile memory is provided. A substrate having a plurality of trenches and a plurality of select gates is provided. The trenches are arranged in parallel and extend in a first direction. Each of the select gates is disposed on the substrate between two adjacent trenches respectively. A plurality of select gate dielectric layers are disposed between the select gates and the substrate. A plurality of composite layers are disposed over the surface of the trenches and each composite layer has a charge trapping layer. A plurality of word lines are arranged in parallel in a second direction, wherein each of the word lines fills the trenches between adjacent select gates and is disposed over the composite layers.

Abstract: The memory system is comprised of a plurality of memory arrays that are coupled to a processor. The memory arrays are comprised of non-volatile memory cells that have read/write speeds and charge retention times that are different from the other memory arrays of the system. Each of the memory cells of each array has a tunnel layer under an embedded trap layer. Each array has memory cells with a different tunnel layer thickness to change the read/write speeds and charge retention times for that array.

Abstract: A non-volatile semiconductor memory device, which is intended to prevent data destruction by movements of electric charges between floating gates and thereby improve the reliability, includes element isolation/insulation films buried into a silicon substrate to isolate stripe-shaped element-forming regions. Formed on the substrate are a floating gate via a first gate insulating film and further a control gate via a second gate insulating film. Source and drain diffusion layers are formed in self-alignment with control gates. The second gate insulating film on the floating gate is divided and separated together with the floating gate by slits above the element isolation/insulation films into discrete portions of individual memory cells.

Abstract: An EPROM cell in a printhead control circuit for an inkjet printer, having exactly one polysilicon layer and a conductive layer disposed above the polysilicon layer, includes a control transistor and an EPROM transistor. The control and EPROM transistors each have floating gates comprising a portion of the polysilicon layer, and an electrical interconnection, comprising a portion of the conductive layer, interconnects the floating gate of the control transistor and the floating gate of the EPROM transistor.

Abstract: A memory system is disclosed that includes a set of non-volatile storage elements. Each of said non-volatile storage elements includes source/drain regions at opposite sides of a channel in a substrate and a floating gate stack above the channel. The memory system also includes a set of shield plates positioned between adjacent floating gate stacks and electrically connected to the source/drain regions for reducing coupling between adjacent floating gates. The shield plates are selectively grown on the active areas of the memory without being grown on the inactive areas. In one embodiment, the shield plates are epitaxially grown silicon positioned above the source/drain regions.

Abstract: Embodiments herein present a structure, method, etc. for making high density MOSFET circuits with different height contact lines. The MOSFET circuits include a contact line, a first gate layer situated proximate the contact line, and at least one subsequent gate layer situated over the first gate layer. The contact line includes a height that is less than a combined height of the first gate layer and the subsequent gate layer(s). The MOSFET circuits further include gate spacers situated proximate the gate layers and a single contact line spacer situated proximate the contact line. The gate spacers are taller and thicker than the contact line spacer.

Abstract: A method for manufacturing flash memory is provided. A tunneling dielectric layer, a conductive layer and a patterned mask layer that exposes a portion of the conductive layer are formed on a substrate. An oxide layer is formed on the exposed conductive layer so that the conductive layer is partitioned through the oxide layer into blocks. The oxide layer is removed and an inter-gate dielectric layer is formed in the opening. A control gate that completely fills the opening is formed. A cap layer is formed over the control gate. The mask layer is then removed. Using the cap layer as a mask, a portion of the conductive layer is removed to form two floating gates under the control gate. An insulating layer is formed on the substrate. Source/drain regions are formed in the substrate on the respective sides of the control gate.

Abstract: In a memory cell (110) having multiple floating gates (160), the select gate (140) is formed before the floating gates. In some embodiments, the memory cell also has control gates (170) formed after the select gate. Substrate isolation regions (220) are formed in a semiconductor substrate (120). The substrate isolation regions protrude above the substrate. Then select gate lines (140) are formed. Then a floating gate layer (160) is deposited. The floating gate layer is etched until the substrate isolation regions are exposed. A dielectric (164) is formed over the floating gate layer, and a control gate layer (170) is deposited. The control gate layer protrudes upward over each select gate line. These the control gates and the floating gates are defined independently of photolithographic alignment. In another aspect, a nonvolatile memory cell has at least two conductive floating gates (160).

Abstract: A device is described comprising a substrate of a first conductivity type having a first dopant concentration, a first well formed in the substrate, a second well of the first conductivity type formed in the substrate and being deeper than the first well, the second well having a higher dopant concentration than the first dopant concentration, and a nonvolatile memory cell formed on the second well. A device is described comprising four wells of various conductivity types with a nonvolatile memory cell formed on the second well. A device is described comprising a plurality of wells for isolating transistors of a plurality of voltage ranges, wherein each one of the plurality of wells contains at least one transistor of a particular voltage range, and wherein transistors of only one of the plurality of voltage ranges are within each of the plurality of wells.

Abstract: A semiconductor device includes a semiconductor substrate, word lines, global bit lines, and inversion gates that form inversion layers serving as local bit lines in the semiconductor substrate. The inversion layers are electrically connected to the global bit lines and a memory cell uses the inversion layers as a source and a drain.

Abstract: A multi-bit memory cell (200) with a control gate (220) for controlling a middle portion of a channel region (208) provides improved operation including faster programming at smaller voltages and currents. The memory cell (200) includes a source (204) and a drain (206) diffused into a substrate (202) forming a channel region (208) therebetween. A first charge storing layer (214), a second charge storing layer (216) and the control gate (220) are formed on the substrate (202) over the channel region (208) and a gate (218) is formed over the source (204), the drain (206), the first and second charge storing layers (214, 216) and the control gate (220). Dielectric material (210, 212, 224, 226, 228) separates the source (204) and the drain (206) from the gate (218), and the control gate (220) from the first charge storing layer (214), the second charge storing layer (216) and the gate (218).

Abstract: A semiconductor memory is achieved which allows a reduction in the area of a memory array block without reducing the gate widths of floating gates. A plurality of select gates extend in straight lines in the X direction. Between the upper- and lower-side select gates, two rows' worth of floating gates are arranged. The plurality of floating gates are placed in a staggered arrangement (in other words, in a zigzag pattern). That is, looking at one floating gate in a specific column and another floating gate in a column adjacent to that specific column, those floating gates deviate from each other in the Y direction.

Abstract: An information memory device capable of reading and writing of information by mechanical operation of a floating gate layer, in which a gate insulation film has a cavity (6), and a floating gate layer (5) having two stable deflection states in the cavity (6), the state stabilized by deflecting toward the channel side of transistor, and the state stabilized by deflecting toward the gate (7) side, writing and reading of information can be made by changing the stable deflection state of the floating gate layer (5) by Coulomb interactive force between the electrons (or positive holes 8) accumulated in the floating gate layer (5) and external electric field, and by reading the channel current change based on the state of the floating gate layer (5).

Abstract: A non-volatile memory having a gate structure, a pair of storage units and two assist gates is provided. The gate structure is disposed on the substrate. The storage units are disposed on the sidewalls of the gate structure. The assist gates are disposed on the respective sides of the gate structure and adjacent to the storage units. Each assist gate is shared between two adjacent memory cells. The gate structure, the storage units and the assist gates are electrically isolated from one another.

Abstract: A floating gate is formed on a semiconductor substrate via a gate insulating film. Diffused layers are formed as sources or drain regions on opposite sides of the floating gate in the semiconductor substrate. First and second control gates are formed opposite to both of the diffused layers on the opposite sides of the floating gate via an inter-gate insulating film to drive the floating gate.

Abstract: The memory system is comprised of a plurality of memory arrays that are coupled to a processor. The memory arrays are comprised of non-volatile memory cells that have read/write speeds and charge retention times that are different from the other memory arrays of the system. Each of the memory cells of each array has a tunnel layer under an embedded trap layer. Each array has memory cells with a different tunnel layer thickness to change the read/write speeds and charge retention times for that array.

Abstract: In one embodiment, a semiconductor device comprises an insulated floating gate disposed on a semiconductor substrate, an insulated program gate formed at least on a side surface of the floating gate, and an insulated erase gate disposed adjacent the floating gate.

Abstract: A memory cell includes first and second data holding portions for holding stored data and its inverted data. First and second p channel TFT compensate for charges leaked from first and second capacitors, respectively. A first (second) access transistor has first and second gate electrodes connected to a first (second) word line and to a second (first) node, respectively. The first (second) access transistor discharges the charges leaked from a power supply node via the first (second) p channel TFT in the OFF state in the leakage mode where the first (second) word line is inactivated and the second (first) node is at an H level.

Abstract: Flash memory and methods of fabricating the same are disclosed. An illustrated example flash memory includes a first source formed within a semiconductor substrate; an epitaxial layer formed on an upper surface of the semiconductor substrate; an opening formed within the epitaxial layer to expose the first source; a floating gate device formed inside the opening; and a select gate device formed on the epitaxial layer at a distance from the floating gate device.

Abstract: A nonvolatile semiconductor memory device includes a substrate, a central structure, a second gate insulating film, a floating gate, and a control gate. The substrate has a trench. The central structure is formed so as to be embedded in the trench and protruded from the substrate. The second gate insulating film is formed on the substrate so as to be contact with the central structure. The floating gate is formed on the second gate insulating film. The control gate is formed so as to cover the floating gate through a insulating film;. The central structure includes an assistant gate and a first gate insulating film which is formed such that the assistance gate is surrounded with the first gate insulating film. The floating gate is formed in a side wall shape on the side surface of the central structure.

Abstract: A storage device structure (10) has two bits of storage per control gate (34) and uses source side injection (SSI) to provide lower programming current. A control gate (34) overlies a drain electrode formed by a doped region (22) that is positioned in a semiconductor substrate (12). Two select gates (49 and 50) are implemented with conductive sidewall spacers adjacent to and lateral to the control gate (34). A source doped region (60) is positioned in the semiconductor substrate (12) adjacent to one of the select gates for providing a source of electrons to be injected into a storage layer (42) underlying the control gate. Lower programming results from the SSI method of programming and a compact memory cell size exists.

Abstract: In a memory cell (110) having multiple floating gates (160), the select gate (140) is formed before the floating gates. In some embodiments, the memory cell also has control gates (170) formed after the select gate. Substrate isolation regions (220) are formed in a semiconductor substrate (120). The substrate isolation regions protrude above the substrate. Then select gate lines (140) are formed. Then a floating gate layer (160) is deposited. The floating gate layer is etched until the substrate isolation regions are exposed. A dielectric (164) is formed over the floating gate layer, and a control gate layer (170) is deposited. The control gate layer protrudes upward over each select gate line. These the control gates and the floating gates are defined independently of photolithographic alignment. In another aspect, a nonvolatile memory cell has at least two conductive floating gates (160).

Abstract: Self-aligned split-gate NAND flash memory cell array and process of fabrication in which rows of self-aligned split-gate cells are formed between a bit line diffusion and a common source diffusion in the active area of a substrate. Each cell has control and floating gates which are stacked and self-aligned with each other, and erase and select gates which are split from and self-aligned with the stacked gates, with select gates at both ends of each row which partially overlap the bit line the source diffusions. The channel regions beneath the erase gates are heavily doped to reduce the resistance of the channel between the bit line and source diffusions, and the floating gates are surrounded by the other gates in a manner which provides significantly enhanced high voltage coupling to the floating gates from the other gates.

Abstract: This invention provides a semiconductor memory device and a corresponding method of operation. The semiconductor memory device comprises a semiconductor substrate having a first conductivity; a plurality of gate structures for storing charge in a non-volatile manner regularly arranged in above the surface of the semiconductor substrate and electrically isolated therefrom; a plurality of wordlines, each of the gate structures being connected to one of the wordlines and a group of the gate structures being connected to a common wordline; and a plurality of active regions, each of the active regions being individually connectable to at least one of the gate structures.

Abstract: Disclosed is a self-aligned non-volatile memory cell including a small sidewall spacer electrically coupled and being located next to a main floating gate region. Both the small sidewall spacer and the main floating gate region are formed on a substrate and both form the floating gate of the non-volatile memory cell. Both are isolated electrically from the substrate by an oxide layer which is thinner between the small sidewall spacer and the substrate; and is thicker between the main floating gate region and the substrate. The small sidewall spacer can be made small; therefore, the thin oxide layer area can also be made small to create a small pathway for electrons to tunnel into the floating gate.