Abstract: A complementary metal-oxide semiconductor (CMOS) structure for a battery protection circuit and a battery protection circuit therewith. A tri-well technique or a buried layer technique is used for such CMOS structure to allow the battery protection circuit therewith to operate at different low voltage levels. Thereby, low voltage process can be realized to effectively reduce the cost of the chip and simplify the design.

Abstract: The present invention discloses a resistor supported on a metal plate composed of a low temperature coefficient of resistance (TCR) metallic material. The resistor includes at least two electrode columns composed of the low TCR metallic material disposed on the metal plate. The resistor further includes at least an electrode layer disposed on each of the electrode columns to form an electrode for each of the electrode columns. In a preferred embodiment, the low TCR metallic material composed of the metal plate further comprises a nickel-copper alloy. In another preferred embodiment, the electrode layer disposed on each of the electrode columns further comprises a copper layer and a tin-lead alloy layer on each of the electrode columns. In another preferred embodiment, the electrode columns disposed on the metal plate having a precisely defined position for providing precisely defined resistance for the resistor ranging between one milli-ohm to one ohm.

Abstract: An electrostatic discharge (ESD) protection device having high holding current for latch-up immunity. The ESD protection circuit is formed in a semiconductor integrated circuit (IC) having protected circuitry. The ESD protection device includes a silicon controlled rectifier (SCR) coupled between a protected supply line of the IC and ground. A trigger device is coupled from the supply line to a first gate of the SCR, and a first substrate resistor is coupled between the first gate and ground. A first shunt resistor is coupled between the first gate and ground, wherein the shunt resistor has a resistance value lower than the substrate resistor.

Abstract: A silicon controlled rectifier electrostatic discharge protection circuit with external on-chip triggering and compact internal dimensions for fast triggering. The ESD protection circuit includes a silicon controlled rectifier (SCR) having an anode coupled to the protected circuitry and a cathode coupled to ground, where the cathode has at least one high-doped region. At least one trigger-tap is disposed proximate to the at least one high-doped region and an external on-chip triggering device is coupled to the trigger-tap and the protected circuitry.

Abstract: A semiconductor integrated circuit device includes a semiconductor region of a first conductivity type. A first insulated-gate field effect transistor having a source/drain region of a second conductivity type connected to an output terminal is formed on the semiconductor region. Further, a semiconductor region of a second conductivity type connected to the gate of the transistor is formed adjacent to the source/drain region of the transistor on the semiconductor region.

Abstract: An electrostatic discharge (ESD) structure for use in an integrated circuit (IC). The ESD structure comprises a metallic resistor and a metallic capacitor that are electrically coupled in series to form a resistor-capacitor (RC) component having an appropriate RC time constant. The RC component maintains a level of charge between ground and a shunt node to ensure that, during an ESD event, electrostatic charge on a power supply, VDD, associated with the ESD structure is shunted via a shunt path from said power supply VDD to said ground. By using metal to create the metal resistor and capacitor, charge leakage problems that result from parasitic capacitance associated with using an RC component comprised of either a poly, active, or nwell resistor in combination a diode are eliminated. By eliminating such charge leakage problems, a more reliable RC component, and thus a more reliable RC time constant, are obtained.

Abstract: In a power management semiconductor device or analog semiconductor device having a CMOS and a resistor, a conductivity type of a gate electrode of the CMOS is P-type as to both an NMOS and a PMOS, a short channel and a low threshold voltage are possible since an E-type PMOS is surface channel type, the short channel and the low threshold voltage are possible since a buried channel type NMOS is extremely shallow for the reason that arsenic having a small diffusion coefficient can be used as an impurity for threshold control, and the resistor used in a voltage dividing circuit or CR circuit is formed of polycrystalline silicon thinner than the polycrystalline silicon of the same layer as the gate electrode or a thin film metal.

Abstract: A semiconductor integrated circuit device includes an external connection pad, an electrostatic discharge protection circuit, an output circuit, an output pre-buffer circuit, an output-signal-fixing circuit and an internal circuit. The output-signal-fixing circuit includes a first capacitor and a second capacitor and fixes an output signal from a second pre-buffer circuit at an “L” level (low voltage) even when an output from the internal circuit is in a floating state. During an ESD test, since an output signal from the second pre-buffer circuit is fixed at an “L” level (low voltage) by the output-signal-fixing circuit, the NMIS transistor is in an OFF state. In this manner, a surge current is prevented from flowing locally into the NMIS transistor.

Abstract: A device for adjusting an integrated circuit before encapsulation includes a first MOS transistor having a gate and a source connected together, and a body connected to a voltage reference. A first resistor is connected in parallel with the first MOS transistor. A second MOS transistor is connected in series with the first MOS transistor. The second MOS transistor has a gate and a source connected together, and a body connected to the voltage reference. A second resistor is connected in parallel with the second MOS transistor. A first terminal is connected to the source of the first MOS transistor, and a second terminal is connected to the source of the second MOS transistor. The first terminal is acessible externally after the integrated circuit has been encapsulated.

Abstract: An ESD protection device is provided for an integrated circuit. The ESD protection device includes a power supply clamp device formed from a diode and coupled between a first power supply VCC and a second power supply VSS. An input protection device is also provided which is formed from a diode coupled between an input pad and the first power supply and a second diode coupled between the input pad and a second power supply. The diodes have an adjusted reverse breakdown voltage that is higher than the voltage supply VCC used to power the peripheral circuitry that drives circuitry within a core of the integrated circuit. The adjusted reverse breakdown voltage is also lower than the breakdown voltage of gate oxide layers used within the peripheral circuitry.

Abstract: An electrostatic discharge (ESD) protection device having a silicon controlled rectifier (SCR) for protecting circuitry of an integrated circuit (IC). The SCR includes a N-doped layer disposed over a substrate and a first P doped region disposed over the N-doped layer. At least one first N+ doped region forming a cathode is disposed over the P-doped region and coupled to ground. The at least one first N+ doped region, first P-doped region, and N-doped layer form a vertical NPN transistor of the SCR. A second P doped region forming an anode is coupled to a protected pad. The second P doped region is disposed over the N-doped layer, and is laterally positioned and electrically isolated with respect to the first P doped region. The second P doped region, N-doped layer, and first P doped region form a lateral PNP transistor of the SCR.

Abstract: A semiconductor circuit for multi-voltage operation having built-in electrostatic discharge (ESD) protection is described, comprising a drain extended nMOS transistor and a pnpn silicon controlled rectifier (SCR) merged with the transistor so that a dual npn structure is created and both the source of the transistor and the cathode of the SCR are connected to electrical ground potential, forming a dual cathode, whereby the ESD protection is enhanced. The rectifier has a diffusion region, forming an abrupt junction, resistively coupled to the drain, whereby the electrical breakdown-to-substrate of the SCR can be triggered prior to the breakdown of the nMOS transistor drain. The SCR has anode and cathode regions spaced apart by semiconductor surface regions and insulating layers positioned over the surface regions with a thickness suitable for high voltage operation and ESD protection.

Abstract: A protection circuit including a power supply terminal supplied with a power supply potential, a reference terminal supplied with a reference potential, and a first p-channel MOS transistor having a first gate, a first source, a first drain and a first back gate. The first gate, the first source and the first back gate are connected to the power supply terminal. Also included is a second p-channel MOS transistor having a second gate, a second source, a second drain and the first back gate, in which the second source of the second p-channel MOS transistor is connected to the first drain of the first p-channel MOS transistor, and the second gate and the second drain of the second p-channel MOS transistor is connected to the reference terminal.

Abstract: A semiconductor device includes first, second, third and fourth resistor elements. The first to fourth resistor elements have first ends commonly connected to a first node, and operate in one of first and second operation modes which are switchable. The first and second resistor elements have second ends connected to a second node and a third node, respectively. The third and fourth resistor elements have second ends connected to a fourth node and a fifth node via a first switch and a second switch, respectively. The first and second switches are opened in the first operation mode, and are closed in the second operation mode.

Abstract: A transistor with ballast resistor formed between the transistor drain and the drain contact is formed by masking regions of the ballast resistor to increase resistivity and thus reduce required area. The invention achieves this without introducing any additional process or masking steps. Thus the invention allows a reduction in IC die size for the same ESD requirement or allows better ESD protection for a given die size.

Abstract: Disclosed are structures and a method to increase the power dissipation of an output pad of an integrated circuit during electrostatic discharge (ESD) by preventing ESD current from flowing through resistive means between that output pad and an internal circuit. By splitting the active region and thereby creating a bipolar transistor which connects directly to the output pad, the resistive means is shunted when the bipolar transistor together with an already existing parasitic bipolar transistor conduct during ESD. Current flow in the resistive means is therefore eliminated and with it damaging power dissipation.

Abstract: Methods of forming field effect transistors and resultant field effect transistor circuitry are described. In one embodiment, a semiconductive substrate includes a field effect transistor having a body. A first resistive element is received by the substrate and connected between the transistor's gate and the body. A second resistive element is received by the substrate and connected between the body and a reference voltage node. The first and second resistive elements form a voltage divider which is configured to selectively change threshold voltages of the field effect transistor with state changes in the gate voltage. In a preferred embodiment, first and second diode assemblies are positioned over the substrate and connected between the gate and body, and the body and a reference voltage node to provide the voltage divider.

Abstract: A semiconductor device has a semiconductor element formed on a semiconductor substrate and a first insulating film having contact holes. The semiconductor element has a gate electrode, a source region and a drain region. The semiconductor element also has metal wirings each for connecting a respective one of the contact holes to the gate electrode, the source region and the drain region of the semiconductor element. A second insulating film is formed on the first insulating film and the metal wirings. The second insulating film has a chemical-mechanical polished portion defining a flattened upper surface of the second insulating film. Resistors are formed on and are disposed directly in contact with the flattened upper surface of the second insulating film and are connected in series to form a bleeder resistor circuit or a ladder circuit.

Abstract: The invention describes the fabrication and structure of an ESD protection device for integrated circuit semiconductor devices with improved ESD protection and resiliency. A vertical bipolar npn transistor forms the basis of the protection device. To handle the large current requirements of an ESD incident, the bipolar transistor has multiple base and emitter elements formed in an npn bipolar array. To assure turn-on of the multiple elements of the array the emitter fingers are continuously or contiguously connected with an unique emitter design layout. The contiguous emitter design provides an improved electrical emitter connection for the device, minimizing any unbalance that can potentially occur when using separate emitter fingers and improving the ability for the simultaneous turn on of the multiple emitter-base elements.

Abstract: A semiconductor device having resistance to static electricity damage under the CDM is disclosed. The semiconductor device may include a plurality of input/output terminals (102), a first reference electric potential connection (101) electrically connected to the terminals, an input/output protection element (103) electrically connected between the terminals and the first reference electric potential connection (101). A board electric potential generator (104) may provide a potential to a board electric potential connection. A clamp element (105) may be electrically connected between the first reference electric potential and the board electric potential connection.

Abstract: In order to divert damaging currents into an electrostatic discharge (ESD) protection device during an ESD event, a tungsten wire resistor is incorporated into a current path connected in parallel with the ESD protection circuitry. The tungsten wire resistor has linear current-voltage (IV) characteristics at low currents, and non-linear IV characteristics at high current levels. The width and length of the resistor is chosen so that the resistor experiences significant self-heating caused by the higher currents generated by the ESD event. At a higher current level, the resistor becomes hot and its resistance increases dramatically. As a result the voltage drop across it increases thus diverting excess current into the parallel connected ESD protection circuitry. This limits the current through the resistor and thereby protects circuit elements in series with the resistor.

Abstract: A non-ablative structure and method for forming a variable resistor includes providing a programmable resistive element including two or more different conductive materials, and changing a resistance of the programmable resistive element to a finite value by heating the programmable element by either providing a current flow through the programmable element, or directing a laser beam onto the programmable element. The conductive materials are interdiffused to form an alloy of the conductive materials. A resistance value of the variable resistor is determined, at least in part, by the degree to which the conductive materials are alloyed or interdiffused. The method and structure of the variable resistor prevents ablative damage to adjoining circuit structure, allowing tighter pitch, and has application to digital programmable elements, and to resistance trimming for impedance matching in RF integrated circuits.

Abstract: The present invention reveals an electrostatic discharge protection apparatus including a silicon controlled rectifier, a triggering voltage adapter network and a holding voltage adapter network. Additionally, the triggering voltage adapter network and the holding voltage adapter network are coupled to the silicon controlled rectifier. The present invention can change the characteristic of current vs. voltage by adjusting the triggering voltage and the holding voltage of the silicon controlled rectifier to meet the special requirement of various chips, and effectively prevent the chips from being damaged caused by the electrostatic discharging.

Abstract: An ESD diode protects a circuit against electrostatic discharge (ESD). The ESD diode has four adjacent regions. The first and third regions are formed by doping a semiconductor substrate so that it has a P-type conductivity. The second and fourth regions are formed by doping the semiconductor substrate so that it has an N-type conductivity. The first region is for connection to a signal terminal of the circuit being protected when the fourth region is connected to a positive power line of the circuit. The fourth region is for connection to the signal terminal when the first region is connected to the ground line or a negative power line of the circuit.

Abstract: A semiconductor device includes a grounded-gate n-channel field effect transistor (FET) between an I/O pad and ground (Vss) and/or Vcc for providing ESD protection. The FET includes a tap region of grounded p-type semiconductor material in the vicinity of the n+-type source region of the FET, which is also tied to ground, to make the ESD protection device less sensitive to substrate noise. The p-type tap region comprises either (i) a plurality of generally bar shaped subregions disposed in parallel relation to n+ source subregions, or, (ii) a region that is generally annular in shape and surrounds the n+ source region. The p-type tap region functions to inhibit or prevent snapback of the ESD device, particularly inadvertent conduction of a parasitic lateral npn bipolar transistor, resulting from substrate noise during programming operations on an EPROM device or in general used in situations where high voltages close to but lower than the snapback voltage are required in the pin.

Abstract: A semiconductor device comprises a MOS transistor and a resistor. The resistor has a P-type resistor formed from a P-type semiconductor, an N-type resistor formed from an N-type semiconductor and disposed adjacent the P-type resistor, and an insulating film disposed between the P-type and N-type resistors. The P-type resistor is arranged at the low potential side of the semiconductor device and the N-type resistor is arranged at the high potential side thereof. A portion of the insulating film between the P-type and N-type resistors is made electrically conductive by irradiating the portion with a laser beam to destroy the insulating property thereof to thereby achieve conductivity between the P-type and N-type resistors. A gate electrode of the MOS transistor is formed of a P-type polysilicon thin film having the same high concentration impurity as that of the region where the P-type resistor is in contact with a metal wiring, thereby enhancing the current driving capacity of a driver MOS.

Abstract: Employing an electrostatic discharge (ESD) trigger to trigger the MOS transistors (i.e., the ESD fingers) within a CMOS device to provide substantially more uniform turn-on voltages for the MOS transistors, resulting in better ESD device performance without employing selective salicide blocking, is disclosed. A semiconductor device has an ESD trigger and a number of ESD fingers. The turn on voltage of the ESD trigger is less than the turn on voltage of the ESD fingers, such that the ESD fingers turn on substantially uniformly after the ESD trigger turns on during an ESD event. The semiconductor device is substantially fabricated without employing salicide blocking.

Abstract: A semiconductor device with substrate-triggered ESD protection technique includes a guard ring, a first MOS transistor array, a second MOS transistor array and a substrate-triggered portion. The first MOS transistor array, the second MOS transistor array and the substrate-triggered portion are formed in a region surrounded by the guard ring, and the substrate-triggered portion is located between the first MOS transistor array and the second MOS transistor array. Therefore, when the ESD event occurs, the substrate-triggered portion can be used for biasing a base of at least one parasitic BJT in the first MOS transistor array and a base of at least one parasitic BJT in the second MOS transistor array to achieve uniform turn-on among the multiple fingers of MOS transistor array. By using this layout design, the MOS transistor array can have a high ESD robustness.

Abstract: A protective circuit for limiting a voltage at a pad of an integrated circuit includes a threshold selector connected between the pad and ground. The input voltage to the threshold selector is the pad voltage. The threshold detector includes a first transistor where load path is connected to the pad. The central terminal of the first transistor is maintained at a threshold voltage derived from the pad voltage. A second transistor has its control terminal connected to a second terminal of the load path of the first transistor. The load path of this second transistor is connected between the pad and ground.

Abstract: A dynamic source coupled ESD protection circuit that dissipates an ESD voltage coupled to an electrical contact pad to protect internal circuits on an integrated circuits chip is described. The ESD protection circuit lowers the snapback voltage of the ESD protection circuit to allow a thinner gate oxide within the internal circuits of the integrated circuit chip. The dynamic substrate coupled electrostatic discharge protection circuit consists of a gated MOS transistor, a capacitor, and a resistor. The gated MOS transistor has a drain region connected to the electrical contact pad. The gate and source are connected to a power supply voltage source. The power supply voltage source will either be a substrate biasing voltage or ground reference point for a gated NMOS transistor. The power supply voltage source will be the power supply voltage source VDD for the gated PMOS transistor.

Abstract: An electrostatic discharge (ESD) protection structure is disclosed. The ESD protection structure of the present invention uses a resistance capacitance (RC) circuit to distinguish an overshoot phenomenon caused by the instantaneous power-on from an ESD event, so as to prevent the ESD protection device, such as a P-type modified lateral silicon controlled rectifier (MLSCR), from being triggered unexpectedly by an overshoot phenomenon which results from the power-on under normal operation, and thereby the efficiency of the ESD protection device is promoted.

Abstract: An NMOS transistor circuit has a surge protection circuit connected in parallel with the NMOS transistor. A resistor is connected between a back gate of the NMOS transistor and ground. As a result, an input impedance higher than the input impedance of the surge protection circuit is applied to a semiconductor terminal at the electrode pad side of the NMOS transistor.

Abstract: An integrated static random access memory device includes four transistors and two resistors defining a memory cell. The four transistors are in a semiconductor substrate and are mutually interconnected by a local interconnect layer. The local interconnect layer is under a first metal level and a portion of the local interconnect layer defines above the substrate a base metal level. The two resistors extend in contact with a portion of the local interconnect layer between the base metal level and the first metal level.

Abstract: A semiconductor circuit for multi-voltage operation having built-in electrostatic discharge (ESD) protection is described, comprising a drain extended nMOS transistor and a pnpn silicon controlled rectifier (SCR) merged with the transistor so that a dual npn structure is created and both the source of the transistor and the cathode of the SCR are connected to electrical ground potential, forming a dual cathode, whereby the ESD protection is enhanced. The rectifier has a diffusion region, forming an abrupt junction, resistively coupled to the drain, whereby the electrical breakdown-to-substrate of the SCR can be triggered prior to the breakdown of the nMOS transistor drain. The SCR has anode and cathode regions spaced apart by semiconductor surface regions and insulating layers positioned over the surface regions with a thickness suitable for high voltage operation and ESD protection.

Abstract: An embodiment of the invention is a doped region within the silicon substrate 20 of an integrated circuit where the silicon substrate 10 separates the doped region into at least two sub-regions 40, 50. Another embodiment of the invention is a method of manufacturing an integrated circuit where any logic element is formed in a doped region. The doped region containing the logic element is separated into at least two sub-regions 40, 50 by the silicon substrate 10 of the integrated circuit.

Abstract: An input protection circuit comprising a MOS transistor which has a P− type semiconductor layer provided with an N+ type drain region of rectangular shape and a P+ type backgate contact region surrounding the same, the P+ type backgate contact region having the shape of a frame parallel to each side of the drain region. In the input protection circuit, negative-level static electricity applied to an electrode pad is discharged by means of a forward bias to the PN junction between the semiconductor layer and the drain region. Here, N− type diffusion layers of U shape are formed between the drain region and the backgate contact region in the semiconductor layer at a predetermined distance from the drain region, so as to surround the vicinities of both longitudinal ends of the drain region. Thereby, the current path through the forward-biased PN junction is partially increased in resistance to avoid local current concentration for improved breakdown voltage.

Abstract: An n-well resistor device and its method of fabrication. The n-well resistor device of the present invention comprises a first n-type region and a second n-type region formed in an n-type silicon region. A gate dielectric layer formed on said n-type silicon region. A polysilicon gate formed on said gate dielectric.

Abstract: An electrostatic discharge protection device according to the present invention is provided at an input or an output of a semiconductor integrated circuit for protecting an internal circuit of the semiconductor integrated circuit from an electrostatic surge flowing into or out of the semiconductor integrated circuit. The electrostatic discharge protection device includes: a thyristor; and a trigger diode for triggering the thyristor with a low voltage. The trigger diode includes: an n-type cathode high impurity concentration region; a p-type anode high impurity concentration region; and an insulator section for electrically insulating a silicide layer formed on a surface of the n-type cathode high impurity concentration region from another silicide layer formed on a surface of the p-type anode high impurity concentration region.

Abstract: A gate electrode has a relatively long gate length of e.g., about 10 &mgr;m. In a region immediately above the gate electrode which is sandwiched between first-layer metals provided is a metal dummy pattern having a width in the first direction and extending in the second direction perpendicular to a direction of gate length (direction of current flow). Moreover, a geometric center of the metal dummy pattern in the second direction is equal to a geometric center of the gate electrode in the second direction. This maintains the symmetry in shape of the metal dummy pattern as viewed from the gate electrode. Such a structure can make deterioration in characteristics of a plurality of elements uniform while maintaining the essential effect of a metal CMP.

Abstract: An input protection circuit capable of precisely bypassing a surge current to a power source terminal and protecting the gate of a protective transistor from an electrostatic surge. The input protection circuit has an input terminal which receives an input signal, a first power source terminal which receives a first power source electric potential, and a first protective power source potential line connected to the first power source terminal for supplying the first power source electric potential to an input protection circuit. The input protection circuit has a first input protection transistor of a first conductive type having a drain connected to the input terminal, a gate and a source connected to the first protective power source potential line.

Abstract: Electrostatic discharge protection device comprising a first highly p-doped region with a base contact, a first highly n-doped region with a collector contact, a second highly n-doped region with an emitter contact and located between the first highly p-doped region and the second highly n-doped region, the first highly p-doped region and the second highly n-doped region being applied in a weakly p-doped region which a has a lateral overlap extending towards the first highly n-doped region, the lateral overlap having a width, the first highly n-doped region being applied in a weakly n-doped region, the weakly p-doped region and the weakly n-doped region being applied in a more weakly n-doped region, and a highly n-doped buried layer located underneath the more weakly n-doped region and extending below at least a portion of the weakly n-doped region and at least a portion of the weakly p-doped region.

Abstract: A protective circuit includes a floating gate MOSFET having a source-drain path connected between an I/O line and a source line or a ground line, a control gate connected to the I/O line and a floating gate connected to the source line or the ground line.

Abstract: In a driving power IC including a starter circuit comprising a main-switch (MS) transistor, a starter switch (SS) for starting the MS transistor and a start resistor (or a resistor element) SR, the start resistor is created on a field insulation film. In a periphery area of a chip for integrating the driving power IC, that is, on a semiconductor substrate's surface beneath the field insulation film, field limiting rings (FLRS) are created, enclosing an active area in a multiplexed state. The resistor element is extended from a start edge on the inner side of a group of said field limiting rings to an end edge on the outer side of the group, having a zigzag shape.

Abstract: A electrostatic discharge (ESD) device with salicide layers isolated by a shallow trench isolation in order to save one salicide block photomask. A shallow trench isolation is formed in drain region to isolate a portion of the drain region, so that the drain region is partitioned into two parts. A salicide layer is formed on the drain region. Since the salicide layer is not formed on the shallow trench isolation, without using an additional photomask, the salicide layer on the drain region is partitioned into two parts. The effect of the local thermal energy occurring to drain junction upon the contact metal of the drain region is eliminated.

Abstract: A dynamic source coupled ESD protection circuit that dissipates an ESD voltage coupled to an electrical contact pad to protect internal circuits on an integrated circuits chip is described. The ESD protection circuit lowers the snapback voltage of the ESD protection circuit to allow a thinner gate oxide within the internal circuits of the integrated circuit chip. The dynamic substrate coupled electrostatic discharge protection circuit consists of a gated MOS transistor, a capacitor, and a resistor. The gated MOS transistor has a drain region connected to the electrical contact pad. The gate and source are connected to a power supply voltage source. The power supply voltage source will either be a substrate biasing voltage or ground reference point for a gated NMOS transistor. The power supply voltage source will be the power supply voltage source VDD for the gated PMOS transistor.

Abstract: An ESD protection circuit based on a modification of conventional silicon controlled rectifier (SCR) for preventing integrated circuits from ESD damage. A first N-well, which has a second N-type doped region and third P-type doped region, is formed in a P-type substrate. A fourth N-type doped region and fifth doped region are formed adjacent to the first N-well in the substrate. A first conducting structure is formed on the second N-type doped region and connected to an anode. A second conducting structure is formed on the fourth N-type doped region and fifth P-tape doped region and connected to a reference potential.

Abstract: A semiconductor device includes a protective circuit at an input/output port thereof, wherein the protective circuit includes a plurality of protective MOS transistors. A diffused region is disposed between the n-type source/drain regions and a guard ring formed in a p-well for encircling the source/drain regions of the protective transistors. The diffused region is of lightly doped p-type or of an n-type and increases the resistance of a parasitic bipolar transistor formed in association with the protective transistors. The increase of the resistance assists protective function of the protective device against an ESD failure of the internal circuit of the semiconductor device.

Abstract: A semiconductor device, including an electrostatic discharge protection circuit capable of preventing current from being concentrated in a hot spot through a silicide layer, includes an N-type MOS transistor having a first diffusion region on a semiconductor substrate. This N-type MOS transistor is isolated from another MOS transistor by a first element isolation region. A second diffusion region is formed between the first diffusion region and first element isolation region. The first and second diffusion regions are separated by a second element isolation region. A silicide is formed on the surface of the semiconductor substrate excluding the first and second element isolation regions. A pad is connected to the second N-type diffusion region through a contact.

Abstract: A resistor or resistance (5) connected between the Gate (3) and Source (1) nodes within any package (4) containing one or more MOSFETs.

Abstract: A structure for a semiconductor resistive element, applicable in particular to power components, having a high concentration substrate of the n type, a first epitaxial layer of the n type, a region of the p type arranged on said first epitaxial layer so to form the resistive element proper, a second epitaxial layer of n type grown on said first epitaxial layer to make the region of the p type a buried region, and an additional layer of the n type with a higher concentration with respect to the second epitaxial level, positioned on the embedded region. Low resistivity regions of the p type adapted to make low resistivity deep contacts for the resistor are provided. The buried region can be made either with a development that is substantially uniform in its main direction of extension or so to present, at on part of its length, a structure of adjacent subregions in marginal continuity.