Complementary Transistors In Wells Of Opposite Conductivity Types More Heavily Doped Than The Substrate Region In Which They Are Formed, E.g., Twin Wells Patents (Class 257/371)
  • Patent number: 11342323
    Abstract: A semiconductor die with high-voltage tolerant electrical overstress circuit architecture is disclosed. One embodiment of the semiconductor die includes a signal pad, a ground pad, a core circuit electrically connected to the signal pad, and a stacked thyristor protection device. The stacked thyristor includes a first thyristor and a resistive thyristor electrically connected in a stack between the signal pad and the ground pad, which enhances the holding voltage of the circuit relatively to an implementation with only the thyristor. Further, the resistive thyristor includes a PNP bipolar transistor and a NPN bipolar transistor that are cross-coupled, and an electrical connection between a collector of the PNP bipolar transistor and a collector of the NPN bipolar transistor. This allows the resistive thyristor to exhibit both thyristor characteristics and resistive characteristics based on a level of current flow.
    Type: Grant
    Filed: December 2, 2019
    Date of Patent: May 24, 2022
    Assignee: Analog Devices, Inc.
    Inventors: Javier A. Salcedo, Linfeng He
  • Patent number: 11289481
    Abstract: A semiconductor device includes a semiconductor substrate, an isolation structure in the semiconductor substrate for isolating a first active region and a second active region, a first device formed in the first active region, and a second device formed in the second active region. The first device has a first gate dielectric layer and a first gate electrode over the first gate dielectric layer. The first gate electrode includes at least one of Ta and C, and has a first work function for a first conductivity. The second device has a second gate dielectric layer and a second gate electrode over the second gate dielectric layer. The second gate electrode includes at least one of Ta, C, and Al, and has a second work function for a second conductivity. The second conductivity is different from the first conductivity.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: March 29, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yih-Ann Lin, Ryan Chia-Jen Chen, Donald Y. Chao, Yi-Shien Mor, Kuo-Tai Huang
  • Patent number: 11205597
    Abstract: A method includes forming a first fin extending from a substrate, forming a first gate stack over and along sidewalls of the first fin, forming a first spacer along a sidewall of the first gate stack, the first spacer including a first composition of silicon oxycarbide, forming a second spacer along a sidewall of the first spacer, the second spacer including a second composition of silicon oxycarbide, forming a third spacer along a sidewall of the second spacer, the third spacer including silicon nitride, and forming a first epitaxial source/drain region in the first fin and adjacent the third spacer.
    Type: Grant
    Filed: July 1, 2019
    Date of Patent: December 21, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Chun Tan, I-Hsieh Wong, Te-En Cheng, Yung-Hui Lin, Wei-Ken Lin, Wei-Yang Lee, Chih-Hung Nien
  • Patent number: 11201158
    Abstract: An SRAM structure is provided. The SRAM structure includes a plurality of first well regions with a first doping type, a second well region with a second doping type, a plurality of first well pick-up regions, a plurality of second well pick-up regions and a plurality of memory cells. The first well regions are formed in a semiconductor substrate. The second well region is formed in the semiconductor substrate. The first well pick-up regions are formed in the first well regions. The second well pick-up regions are formed in the second well region. Each of the memory cells is disposed on two adjacent first well regions and a portion of the second well region between the two adjacent first well regions. Each of the first well pick-up regions is disposed between two adjacent second well pick-up regions.
    Type: Grant
    Filed: July 6, 2020
    Date of Patent: December 14, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
    Inventors: Feng-Ming Chang, Chia-Hao Pao, Lien-Jung Hung, Ping-Wei Wang
  • Patent number: 11170855
    Abstract: A semiconductor device according to an embodiment includes first and second chips, and a first conductor. The first chip includes a first substrate, a first circuit and a first joint metal. The first circuit is provided on the first substrate. The first joint metal is connected to the first circuit. The second chip includes a second substrate, a second circuit, and a second joint metal. The second substrate includes P-type and N-type well regions. The second circuit is provided on the second substrate and includes a first transistor. The second joint metal is connected to the second circuit and the first joint metal. The first conductor is connected to the N-type well region from a top region of the second chip. The P-type well region is arranged between a gate electrode of the first transistor and the N-type well region.
    Type: Grant
    Filed: September 1, 2020
    Date of Patent: November 9, 2021
    Assignee: Kioxia Corporation
    Inventors: Yuka Itano, Minoru Oda, Masato Shini
  • Patent number: 11133399
    Abstract: A semiconductor device includes a semiconductor layer which has a first device formation region and a second device formation region, a first HEMT which is formed in the first device formation region and has a first two-dimensional electron gas region as a channel, a second HEMT which is formed in the second device formation region and has a second two-dimensional electron gas region as a channel, and a region separation structure which is formed in the semiconductor layer and defines the first device formation region and the second device formation region.
    Type: Grant
    Filed: February 20, 2019
    Date of Patent: September 28, 2021
    Assignee: ROHM CO., LTD.
    Inventor: Kenichi Yoshimochi
  • Patent number: 11063033
    Abstract: Provided are integrated circuits including a plurality of standard cells aligned along a plurality of rows. The integrated circuit includes first standard cells aligned on the first row and including first conductive patterns to which a first supply voltage is applied in a conductive layer and second standard cells aligned on the second row which is adjacent to the first row in the conductive layer and including second conductive patterns to which the first supply voltage is applied in the conductive layer. A pitch between the first conductive patterns and the second conductive patterns may be less than a pitch provided by single-patterning.
    Type: Grant
    Filed: September 2, 2020
    Date of Patent: July 13, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Jung-Ho Do
  • Patent number: 11056181
    Abstract: A SRAM array is provided. The SRAM array includes a first bit cell array and a second bit cell array arranged along a first direction, and a strap cell arranged along a second direction and positioned between the first bit cell array and the second bit cell array along the first direction. The strap cell includes a first P-type well region, two first N-type well regions, a second N-type well region. The two first N-type well regions are separated by the first P-type well region in the first direction, and the second N-type well region and one of the two first N-type well regions are separated by the first P-type well region in the second direction. The strap cell further includes a deep N-type well region underlying the two first N-type well regions and the second N-type well region.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: July 6, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chia-Hao Pao, Kian-Long Lim, Feng-Ming Chang, Lien-Jung Hung
  • Patent number: 10943912
    Abstract: A semiconductor device includes a base substrate including an NMOS region and a PMOS region. The PMOS region includes a first P-type region and a second P-type region. The semiconductor device also includes an interlayer dielectric layer, a gate structure formed through the interlayer dielectric layer and including an N-type region gate structure formed in the NMOS region, a first gate structure formed in the first P-type region and connected to the N-type region gate structure, and a second gate structure formed in the second P-type region and connected to the first gate structure. The direction from the N-type region gate structure to the second gate structure is an extending direction of the gate structure, and along a direction perpendicular to the extending direction of the gate structure, the width of the first gate structure is larger than the width of the second gate structure.
    Type: Grant
    Filed: May 3, 2019
    Date of Patent: March 9, 2021
    Assignees: Semiconductor Manufacturing International (Shanghai) Corporation, Semiconductor Manufacturing International (Beijing) Corporation
    Inventor: Yong Li
  • Patent number: 10910435
    Abstract: A method of forming an electrical device that includes forming an amorphous semiconductor material on a metal surface of a memory device, in which the memory device is vertically stacked atop a first transistor. The amorphous semiconductor material is annealed with a laser anneal having a nanosecond duration to convert the amorphous semiconductor material into a crystalline semiconductor material. A second transistor is formed from the semiconductor material. The second transistor vertically stacked on the memory device.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: February 2, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Alexander Reznicek, Bahman Hekmatshoartabari, Oleg Gluschenkov, Yasir Sulehria
  • Patent number: 10879126
    Abstract: A semiconductor device and method includes: forming a gate stack over a substrate; growing a source/drain region adjacent the gate stack, the source/drain region being n-type doped Si; growing a semiconductor cap layer over the source/drain region, the semiconductor cap layer having Ge impurities, the source/drain region free of the Ge impurities; depositing a metal layer over the semiconductor cap layer; annealing the metal layer and the semiconductor cap layer to form a silicide layer over the source/drain region, the silicide layer having the Ge impurities; and forming a metal contact electrically coupled to the silicide layer.
    Type: Grant
    Filed: April 22, 2019
    Date of Patent: December 29, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shahaji B. More, Zheng-Yang Pan, Cheng-Han Lee, Shih-Chieh Chang
  • Patent number: 10868019
    Abstract: A semiconductor device includes: a first well having a first conductivity-type extending along a first direction; second and third wells having a second conductivity-type and disposed on opposite sides of the first well in a second direction; a first array of bitcells and a second array of bitcells disposed on the first to third wells; a strap cell disposed on the first to third wells and between the first and second arrays and including first and second well pickup regions having the first conductivity-type, disposed on the first well, and spaced-apart from each other in the first direction, and third and fourth well pickup regions having the second conductivity-type and disposed on the second and third wells, respectively; first and second conductive patterns electrically connected to the first and second well pickup regions, respectively; and a third conductive pattern electrically connected to the third and fourth well pickup regions.
    Type: Grant
    Filed: May 5, 2020
    Date of Patent: December 15, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Kuo-Hung Lo, Feng-Ming Chang, Ying-Hsiu Kuo, Ping-Wei Wang
  • Patent number: 10861753
    Abstract: A method includes forming a gate stack over a semiconductor substrate, forming a first spacer layer on a sidewall of the gate stack, forming a sacrificial spacer film over the first spacer layer, forming an epitaxy structure on the semiconductor substrate, and performing an etching process on the sacrificial spacer film to form a gap between the first spacer layer and the epitaxy structure. An outer portion of the sacrificial spacer film has a topmost end higher than that of an inner portion of the sacrificial spacer film after performing the etching process. The method further includes forming a second spacer layer to seal the gap between the epitaxy structure and the first spacer layer.
    Type: Grant
    Filed: May 14, 2019
    Date of Patent: December 8, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Bo-Yu Lai, Kai-Hsuan Lee, Wei-Yang Lee, Feng-Cheng Yang, Yen-Ming Chen
  • Patent number: 10854279
    Abstract: A SRAM array is provided, including a first bit cell array and a second bit cell array arranged along a first direction; a strap cell arranged in a second direction and positioned between the first bit cell array and the second bit cell array along the first direction. The strap cell includes a first strap column, a second strap column, a doped P-type region, a doped N-type region, and a deep N-type well region. The first strap column includes a first P-type well region and two first N-type well regions adjacent opposite sides of the first P-type well region along the first direction. The second strap column is adjacent to the first strap column along the second direction. The second strap column includes a second N-type well region and two second P-type well regions adjacent opposite sides of the second N-type well region along the first direction.
    Type: Grant
    Filed: July 6, 2020
    Date of Patent: December 1, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chia-Hao Pao, Kian-Long Lim, Feng-Ming Chang, Lien-Jung Hung
  • Patent number: 10818599
    Abstract: An electrical device including a first semiconductor device having a silicon and germanium containing source and drain region, and a second semiconductor device having a silicon containing source and drain region. A first device contact to at least one of said silicon and germanium containing source and drain region of the first semiconductor device including a metal liner of an aluminum titanium and silicon alloy and a first tungsten fill. A second device contact is in contact with at least one of the silicon containing source and drain region of the second semiconductor device including a material stack of a titanium oxide layer and a titanium layer. The second device contact may further include a second tungsten fill.
    Type: Grant
    Filed: January 1, 2019
    Date of Patent: October 27, 2020
    Assignees: INTERNATIONAL BUSINESS MACHINES CORPORATION, GLOBALFOUNDRIES INC.
    Inventors: Hiroaki Niimi, Shariq Siddiqui, Tenko Yamashita
  • Patent number: 10790275
    Abstract: An electronic device includes a substrate having a second conductivity type including a semiconductor surface layer with a buried layer (BL) having a first conductivity type. In the semiconductor surface layer is a first doped region (e.g., collector) and a second doped region (e.g., emitter) both having the first conductivity type, with a third doped region (e.g., a base) having the second conductivity type within the second doped region, wherein the first doped region extends below and lateral to the third doped region. At least one row of deep trench (DT) isolation islands are within the first doped region each including a dielectric liner extending along a trench sidewall from the semiconductor surface layer to the BL with an associated deep doped region extending from the semiconductor surface layer to the BL. The deep doped regions can merge forming a merged deep doped region that spans the DT islands.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: September 29, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Zaichen Chen, Akram A. Salman, Binghua Hu
  • Patent number: 10741551
    Abstract: An integrated circuit die that may have one vertical transistor and one horizontal transistor is disclosed. The transistors may have substantially different breakdown voltages. The vertical transistor may be used in power circuitry applications and the horizontal transistor may be used in logic circuitry applications.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: August 11, 2020
    Assignee: GENERAL ELECTRIC COMPANY
    Inventor: Victor Mario Torres
  • Patent number: 10714168
    Abstract: A static random access memory (SRAM) array is provided. The SRAM array includes a first bit cell array and a second bit cell array arranged along a first direction. The SRAM array includes a strap cell arranged along a second direction and positioned between the first bit cell array and the second bit cell array along the first direction. The SRAM array includes a deep N-type well region underlying and connected to the first N-type well region and the second N-type well region.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: July 14, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
    Inventors: Chia-Hao Pao, Kian-Long Lim, Feng-Ming Chang, Lien-Jung Hung
  • Patent number: 10679991
    Abstract: Apparatuses and methods are disclosed. One such apparatus includes a well having a first type of conductivity formed within a semiconductor structure having a second type of conductivity. A boundary of the well has an edge that is substantially beneath an edge of an active area of a tap to the well.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: June 9, 2020
    Assignee: Micron Technology, Inc.
    Inventor: Michael Smith
  • Patent number: 10680103
    Abstract: A method for forming a semiconductor device is provided. The method includes forming an isolation structure in a semiconductor substrate, and the isolation structure surrounds an active region of the semiconductor substrate. The method also includes forming a gate over the semiconductor substrate, and the gate is across the active region and extends onto the isolation structure. The gate has an intermediate portion over the active region and two end portions connected to the intermediate portion, the end portions are over the isolation structure. The method includes forming a support film over the isolation structure, and the support film is a continuous film which continuously covers the isolation structure and at least one end portion of the gate.
    Type: Grant
    Filed: August 7, 2017
    Date of Patent: June 9, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Jung-Chi Jeng, I-Chih Chen, Wen-Chang Kuo, Ying-Hao Chen, Ru-Shang Hsiao, Chih-Mu Huang
  • Patent number: 10672671
    Abstract: Semiconductor devices and methods of forming the same include forming a first channel region on a first semiconductor region. A second channel region is formed on a second semiconductor region. The second semiconductor region is formed from a semiconductor material that is different from a semiconductor material of the first semiconductor region. A semiconductor cap is formed on one or more of the first and second channel regions. A gate dielectric layer is formed over the nitrogen-containing layer. A gate is formed on the gate dielectric.
    Type: Grant
    Filed: July 13, 2017
    Date of Patent: June 2, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Takashi Ando, Martin M. Frank, Renee T. Mo, Vijay Narayanan
  • Patent number: 10643987
    Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate, a metal layer, a gate, a drain, a source and a first doping region. The substrate has a first doping type. The metal layer is adjacent to the surface of the substrate. The gate is formed on the substrate. The drain is formed in the substrate and located at one side of the gate. The drain is adjacent to the metal layer. The source is formed in the substrate and located at another side of the gate. The first doping region is formed in the substrate and surrounds the metal layer and the drain. The first doping region has a second doping type. The second doping type is different from the first doping type.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: May 5, 2020
    Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION
    Inventors: Jian-Hsing Lee, Shao-Chang Huang, Chih-Hsuan Lin
  • Patent number: 10644161
    Abstract: Disclosed are an LTPS-based CMOS component and a method for manufacturing the same. The CMOS component includes an NMOS type LTPS. PN junctions are provided in an NMOS type LTPS channel to reduce the movement speed of electrons in the channel, so that hot electron effects can be avoided. The LTPS-based CMOS component can reduce the movement speed of electrons and avoid hot electron effects.
    Type: Grant
    Filed: January 16, 2017
    Date of Patent: May 5, 2020
    Assignee: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventor: Longqiang Shi
  • Patent number: 10629585
    Abstract: An electrostatic discharge (ESD) protection device includes a substrate, a first gate group and a second gate group on the substrate, a drain region and a fourth doped region respectively at two sides of the first gate group, a source region and the fourth doped region respectively at two sides of the second gate group, a first doped region in the substrate and surrounded by the drain region, and a second doped region in the substrate and surrounded by the fourth doped region. The drain region and the source region have a first conductivity type. The first doped region and the second doped region have a second conductivity type complementary to the first conductivity type. The drain region is electrically connected to an input/output pad. The source region is electrically connected to a ground pad. The first doped region and the second doped region are electrically connected to each other.
    Type: Grant
    Filed: May 18, 2018
    Date of Patent: April 21, 2020
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chung-Yu Huang, Kuan-Cheng Su, Tien-Hao Tang, Ping-Chen Chang
  • Patent number: 10520467
    Abstract: The present disclosure provides a bio-field effect transistor (BioFET) and a method of fabricating a BioFET device. The method includes forming a BioFET using one or more process steps compatible with or typical to a complementary metal-oxide-semiconductor (CMOS) process. The BioFET device may include a substrate; a gate structure disposed on a first surface of the substrate and an interface layer formed on the second surface of the substrate. The interface layer may allow for a receptor to be placed on the interface layer to detect the presence of a biomolecule or bio-entity.
    Type: Grant
    Filed: March 5, 2018
    Date of Patent: December 31, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Alexander Kalnitsky, Yi-Shao Liu, Kai-Chih Liang, Chia-Hua Chu, Chun-Ren Cheng, Chun-Wen Cheng
  • Patent number: 10515802
    Abstract: A method may include depositing a mask layer on a substrate using physical vapor deposition, wherein an absolute value of a stress in the mask layer has a first value; and directing a dose of ions into the mask layer, wherein the absolute value of the stress in the mask layer has a second value, less than the first value, after the directing the dose.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: December 24, 2019
    Assignee: Varian Semiconductor Equipment Associates, Inc.
    Inventors: Rajesh Prasad, Tzu-Yu Liu, Edwin Arevalo, Deven Mittal, Somchintana Norasetthekul, Kyuha Shim, Lauren Liaw, Takaski Shimizu, Nobuyuki Sasaki, Ryuichi Muira, Hiro Ito
  • Patent number: 10515687
    Abstract: A static random access memory (SRAM) array is provided. The SRAM array includes a first bit cell array, a second bit cell array, and a strap cell. The second bit cell array is arranged along a first direction. The strap cell is arranged along a second direction and is positioned between the first bit cell array and the second bit cell array along the first direction. The strap cell includes an H-shaped NW region, an H-shaped PW region, and a deep N-type well (DNW) region. The H-shaped NW region and the H-shaped PW region each includes two strip portions extending along the first direction and a linking portion extending along the second direction. Two terminals of the linking portion are in contact with the two strip portions.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: December 24, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chia-Hao Pao, Kian-Long Lim, Feng-Ming Chang, Lien-Jung Hung
  • Patent number: 10504799
    Abstract: Semiconductor devices and methods of forming the same include forming a first channel region on a first semiconductor region. A second channel region is formed on a second semiconductor region. The second semiconductor region is formed from a semiconductor material that is different from a semiconductor material of the first semiconductor region. A semiconductor cap is formed on one or more of the first and second channel regions. A gate dielectric layer is formed over the nitrogen-containing layer. A gate is formed on the gate dielectric.
    Type: Grant
    Filed: July 13, 2017
    Date of Patent: December 10, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Takashi Ando, Martin M. Frank, Renee T. Mo, Vijay Narayanan
  • Patent number: 10388575
    Abstract: A method for fabricating a semiconductor structure includes providing a base substrate including a first device region, a second device region, and a transition region separating the first region from the second region; forming a first work function layer on the first region, the transition region, and the second region; removing a first portion of the first work function layer formed in the transition region; forming a hard mask layer on the base substrate in the transition region and on the first work function layer in the second region; removing a second portion the first work function layer formed in the first region using the hard mask layer as an etch mask; removing the hard mask layer; and forming a second work function layer, on the base substrate in the first region and the transition region, and on the first work function layer in the second region.
    Type: Grant
    Filed: May 21, 2018
    Date of Patent: August 20, 2019
    Assignees: Semiconductor Manufacturing International (Shaghai) Corporation, Semiconductor Manufacturing International (Beijing) Corporation
    Inventor: Fei Zhou
  • Patent number: 10269783
    Abstract: Various implementations described herein are directed to an integrated circuit. The integrated circuit may include a cell having a first region designated for a first type of implant and a second region designated for a second type of implant that is different than the first type of implant. The integrated circuit may include a first implant structure configured to implant the first region with the first type of implant such that the first region extends within a portion of the second region. The integrated circuit may include a second implant structure configured to implant the second region with the second type of implant such that the second region extends within a portion of the first region.
    Type: Grant
    Filed: January 22, 2016
    Date of Patent: April 23, 2019
    Assignee: ARM Limited
    Inventors: Abhilash V. Thazhathidathil, Denil Das Kolady, Anand Dhanalakshmi Ramdass
  • Patent number: 10269646
    Abstract: A semiconductor device and method includes: forming a gate stack over a substrate; growing a source/drain region adjacent the gate stack, the source/drain region being n-type doped Si; growing a semiconductor cap layer over the source/drain region, the semiconductor cap layer having Ge impurities, the source/drain region free of the Ge impurities; depositing a metal layer over the semiconductor cap layer; annealing the metal layer and the semiconductor cap layer to form a silicide layer over the source/drain region, the silicide layer having the Ge impurities; and forming a metal contact electrically coupled to the silicide layer.
    Type: Grant
    Filed: June 8, 2017
    Date of Patent: April 23, 2019
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shahaji B. More, Zheng-Yang Pan, Cheng-Han Lee, Shih-Chieh Chang
  • Patent number: 10269665
    Abstract: A semiconductor device and a method of fabricating the same are disclosed. A semiconductor device according to an embodiment of the present invention includes: a first type doped semiconductor substrate; a second type doped deep well configured such that one or more semiconductor device elements are formed therein; a first type doped first well formed inside a region surrounded by the deep well of the one surface of the semiconductor substrate, and separated from the semiconductor substrate by the deep well; a first electrical contact formed on a part of the one surface of the semiconductor substrate, and electrically connected to the first well; and a second electrical contact formed on another surface of the semiconductor substrate.
    Type: Grant
    Filed: February 5, 2016
    Date of Patent: April 23, 2019
    Assignee: Seoul National University R&DB Foundation
    Inventors: Jin Hong Ahn, Young June Park
  • Patent number: 10211094
    Abstract: An electrical device including a first semiconductor device having a silicon and germanium containing source and drain region, and a second semiconductor device having a silicon containing source and drain region. A first device contact to at least one of said silicon and germanium containing source and drain region of the first semiconductor device including a metal liner of an aluminum titanium and silicon alloy and a first tungsten fill. A second device contact is in contact with at least one of the silicon containing source and drain region of the second semiconductor device including a material stack of a titanium oxide layer and a titanium layer. The second device contact may further include a second tungsten fill.
    Type: Grant
    Filed: July 5, 2017
    Date of Patent: February 19, 2019
    Assignees: INTERNATIONAL BUSINESS MACHINES CORPORATION, GLOBALFOUNDRIES INC.
    Inventors: Hiroaki Niimi, Shariq Siddiqui, Tenko Yamashita
  • Patent number: 10193553
    Abstract: The invention concerns a circuit comprising: a processing circuit (102) comprising a plurality of circuit domains (103), each circuit domain (103) comprising a plurality of transistors and being configured to apply one or more corresponding transistor biasing voltages to said transistors; and a control circuit (104) configured to determine, based on at least a selected accuracy setting of the processing circuit, the level of said one or more transistor biasing voltages to be applied in each of said circuit domains, the control circuit (104) being further configured to cause said transistor biasing voltages to be applied to the circuit domains.
    Type: Grant
    Filed: March 20, 2018
    Date of Patent: January 29, 2019
    Assignee: COMMISSARIAT À L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Daniele Jahier Pagliari, Edith Beigne, Yves Durand, Massimo Poncino
  • Patent number: 10170574
    Abstract: An electrical device including a first semiconductor device having a silicon and germanium containing source and drain region, and a second semiconductor device having a silicon containing source and drain region. A first device contact to at least one of said silicon and germanium containing source and drain region of the first semiconductor device including a metal liner of an aluminum titanium and silicon alloy and a first tungsten fill. A second device contact is in contact with at least one of the silicon containing source and drain region of the second semiconductor device including a material stack of a titanium oxide layer and a titanium layer. The second device contact may further include a second tungsten fill.
    Type: Grant
    Filed: October 24, 2017
    Date of Patent: January 1, 2019
    Assignees: INTERNATIONAL BUSINESS MACHINES CORPORATION, GLOBALFOUNDRIES INC.
    Inventors: Hiroaki Niimi, Shariq Siddiqui, Tenko Yamashita
  • Patent number: 10096704
    Abstract: A semiconductor device includes a plurality of compensation regions of a vertical electrical element arrangement, a plurality of drift regions of the vertical electrical element arrangement and a non-depletable doping region. The compensation regions of the plurality of compensation regions are arranged in a semiconductor substrate of the semiconductor device. Further, the plurality of drift regions of the vertical electrical element arrangement is arranged in the semiconductor substrate within a cell region of the semiconductor device. The plurality of drift regions and the plurality of compensation regions are arranged alternatingly in a lateral direction. The non-depletable doping region extends laterally from an edge of the cell region towards an edge of the semiconductor substrate. The non-depletable doping region has a doping non-depletable by voltages applied to the semiconductor device during blocking operation.
    Type: Grant
    Filed: August 18, 2017
    Date of Patent: October 9, 2018
    Assignee: Infineon Technologies Austria AG
    Inventor: Franz Hirler
  • Patent number: 10062695
    Abstract: A semiconductor device and a manufacturing method thereof are provided. The semiconductor device includes a substrate, a metal-oxide-semiconductor (MOS) transistor, and a dielectric layer. The MOS transistor includes a gate structure formed over the substrate. The dielectric layer is formed aside the gate structure, and the dielectric layer is doped with a strain modulator. An effective lattice constant of the dielectric layer modified by the doping with the strain modulator is different from an effective lattice constant of the dielectric layer prior to the doping.
    Type: Grant
    Filed: December 8, 2015
    Date of Patent: August 28, 2018
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shang-Chi Tsai, Kang-Min Kuo
  • Patent number: 10062704
    Abstract: A method is provided for fabricating a buried-channel MOSFET and a surface-channel MOSFET of the same type and different gate electrodes on a same wafer. The method includes providing a semiconductor substrate having a well area and a plurality of shallow trench isolation structures; forming a threshold implantation region doped with impurity ions opposite of that of the well area in the well area for the buried-channel MOSFET; forming a gate structure including a gate dielectric layer and a gate electrode on the semiconductor substrate, wherein the gate electrode of the buried-channel MOSFET is doped with impurity ions with a same type as that of the well area, and the gate electrode of the surface-channel MOSFET is doped with impurity ions with a type opposite of that of the well area; and forming source and drain regions in the semiconductor substrate at both sides of the gate structure.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: August 28, 2018
    Assignees: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION, SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
    Inventors: Tzu Yin Chiu, Clifford Ian Drowley, Leong Tee Koh, Yu Lei Jiang, Da Qiang Yu
  • Patent number: 10050035
    Abstract: A method includes forming a first polysilicon structure over a first portion of a substrate. A second polysilicon structure is formed over a second portion of the substrate. Two spacers are formed on opposite sidewalls of the second polysilicon structure. A layer of protective material is formed to cover the first and second portions of the substrate. The layer of protective material has a first thickness over the second polysilicon structure and a second thickness over the two spacers. The first thickness is equal to or greater than 500 ?, and the second thickness is equal to or less than 110% of the first thickness. A patterned photo resist layer is formed to cover a first portion of the layer of protective material that covers the first portion of the substrate. The second portion of the layer of protective material is removed.
    Type: Grant
    Filed: January 17, 2014
    Date of Patent: August 14, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yu-Shao Cheng, Shin-Yeu Tsai, Chui-Ya Peng, Kung-Wei Lee
  • Patent number: 9972682
    Abstract: Techniques for forming Ga-doped source drain contacts in Ge-based transistors are provided. In one aspect, a method for forming Ga-doped source and drain contacts includes the steps of: depositing a dielectric over a transistor; depositing a dielectric over the transistor; forming contact trenches in the dielectric over, and extending down to, source and drain regions of the transistor; depositing an epitaxial material into the contact trenches; implanting gallium ions into the epitaxial material to form an amorphous gallium-doped layer; and annealing the amorphous gallium-doped layer under conditions sufficient to form a crystalline gallium-doped layer having a homogenous gallium concentration of greater than about 5×1020 at./cm3. Transistor devices are also provided utilizing the present Ga-doped source and drain contacts.
    Type: Grant
    Filed: January 22, 2016
    Date of Patent: May 15, 2018
    Assignee: International Business Machines Corporation
    Inventors: Oleg Gluschenkov, Zuoguang Liu, Shogo Mochizuki, Hiroaki Niimi, Chun-chen Yeh
  • Patent number: 9923017
    Abstract: A monolithic active pixel radiation detector including a method of fabricating thereof. The disclosed radiation detector can include a substrate comprising a silicon layer upon which electronics are configured. A plurality of channels can be formed on the silicon layer, wherein the plurality of channels are connected to sources of signals located in a bulk part of the substrate, and wherein the signals flow through electrically conducting vias established in an isolation oxide on the substrate. One or more nested wells can be configured from the substrate, wherein the nested wells assist in collecting charge carriers released in interaction with radiation and wherein the nested wells further separate the electronics from the sensing portion of the detector substrate. The detector can also be configured according to a thick SOA method of fabrication.
    Type: Grant
    Filed: May 31, 2016
    Date of Patent: March 20, 2018
    Assignee: Fermi Research Alliance, LLC
    Inventor: Grzegorz W. Deptuch
  • Patent number: 9911730
    Abstract: A transient voltage suppressor can include: a semiconductor substrate; a first buried layer of a first type formed in and on the semiconductor substrate; a second buried layer of a second type formed in a first region of the first buried layer; a first epitaxial region of the second type formed on the second buried layer and a second epitaxial region of the first type formed on a second region of the first buried layer; a first doped region of the first type formed in the first epitaxial region and a second doped region of the second type formed in the second epitaxial region; a conductive channel extending from a surface of the second epitaxial region into the first buried layer; and a first electrode connected to the conductive channel, a second electrode connected to the first doped region, and a third electrode connected to the second doped region.
    Type: Grant
    Filed: September 19, 2016
    Date of Patent: March 6, 2018
    Assignee: Silergy Semiconductor Technology (Hangzhou) LTD
    Inventors: Fei Yao, Shijun Wang
  • Patent number: 9887147
    Abstract: A thin stacked semiconductor device has a plurality of circuits that are laminated and formed sequentially in a specified pattern to form a multilayer wiring part. At the stage for forming the multilayer wiring part, a filling electrode is formed on the semiconductor substrate such that the surface is covered with an insulating film, a post electrode is formed on specified wiring at the multilayer wiring part, a first insulating layer is formed on one surface of the semiconductor substrate, the surface of the first insulating layer is removed by a specified thickness to expose the post electrode, and the other surface of the semiconductor substrate is ground to expose the filling electrode and to form a through-type electrode. A second insulating layer is formed on one surface of the semiconductor substrate while exposing the forward end of the through-type electrode, and bump electrodes are formed on both electrodes.
    Type: Grant
    Filed: December 20, 2016
    Date of Patent: February 6, 2018
    Assignee: LAPIS SEMICONDUCTOR CO., LTD.
    Inventor: Masamichi Ishihara
  • Patent number: 9853115
    Abstract: An electrical device including a first semiconductor device having a silicon and germanium containing source and drain region, and a second semiconductor device having a silicon containing source and drain region. A first device contact to at least one of said silicon and germanium containing source and drain region of the first semiconductor device including a metal liner of an aluminum titanium and silicon alloy and a first tungsten fill. A second device contact is in contact with at least one of the silicon containing source and drain region of the second semiconductor device including a material stack of a titanium oxide layer and a titanium layer. The second device contact may further include a second tungsten fill.
    Type: Grant
    Filed: September 22, 2016
    Date of Patent: December 26, 2017
    Assignees: INTERNATIONAL BUSINESS MACHINES CORPORATION, GLOBALFOUNDRIES INC.
    Inventors: Hiroaki Niimi, Shariq Siddiqui, Tenko Yamashita
  • Patent number: 9843322
    Abstract: An integrated circuit chip includes a bimodal power N-P-Laterally Diffused Metal Oxide Semiconductor (LDMOS) device having an N-gate coupled to receive an input signal and a level shifter coupled to receive the input signal and to provide a control signal to a P-gate driver of the N-P-LDMOS device. A method of operating an N-P-LDMOS power device is also disclosed.
    Type: Grant
    Filed: March 11, 2016
    Date of Patent: December 12, 2017
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Yongxi Zhang, Sameer P. Pendharkar, Philip L. Hower, Salvatore Giombanco, Filippo Marino, Seetharaman Sridhar
  • Patent number: 9831134
    Abstract: A semiconductor device includes first and second voltage device regions and a deep well common to the first and second voltage device regions. An operation voltage of electronic devices in the second voltage device region is higher than that of electronic devices in the first voltage device region. The deep well has a first conductivity type. The first voltage device region includes a first well having the second conductivity type and a second well having the first conductivity type. The second voltage region includes a third well having a second conductivity type and a fourth well having the first conductivity type. A second deep well having the second conductivity type is formed below the fourth well. The first, second and third wells are in contact with the first deep well, and the fourth well is separated by the second deep well from the first deep well.
    Type: Grant
    Filed: September 28, 2016
    Date of Patent: November 28, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Meng-Han Lin, Chih-Ren Hsieh, Chen-Chin Liu
  • Patent number: 9748270
    Abstract: The present disclosure provides in one aspect a semiconductor device including an SOI substrate with an active semiconductor layer disposed on a buried insulating material layer, which, in turn, is formed on a base substrate material, a gate structure formed on the active semiconductor layer, and a back gate region provided in the base substrate material below the gate structure opposing the gate structure. Herein, the back gate region may be electrically insulated from the surrounding base substrate material via an isolation region surrounding the back gate region.
    Type: Grant
    Filed: June 25, 2015
    Date of Patent: August 29, 2017
    Assignee: GLOBALFOUNDRIES Inc.
    Inventor: Juergen Faul
  • Patent number: 9735261
    Abstract: A semiconductor devices and method of formation are provided herein. A semiconductor device includes a gate structure over a channel and an active region adjacent the channel. The active region includes a repaired doped region and a growth region over the repaired doped region. The repaired doped region includes a first dopant and a second dopant, where the second dopant is from the growth region. A method of forming a semiconductor device includes increasing a temperature during exposure to at least one of dopant(s) or agent(s) to form an active region adjacent a channel, where the active region includes a repaired doped region and a growth region over the repaired doped region.
    Type: Grant
    Filed: November 2, 2015
    Date of Patent: August 15, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Mao-Lin Huang, Chien-Hsun Wang, Chun-Hsiung Lin, Meng-Ku Chen, Li-Ting Wang, Hung-Ta Lin
  • Patent number: 9716171
    Abstract: A semiconductor device and a method of manufacturing the semiconductor device includes forming a first and a second gate electrode on a semiconductor substrate, forming a first and a second insulator on the first and second gate electrodes, forming a third insulator on the second insulator, a first thickness of the third insulator on the first gate electrode being different than a second thickness of the third insulator on the second gate electrode, and etching-back the first, second and third insulators to form a first spacer beside the first gate electrode and a second spacer beside the second gate electrode. Herein, a horizontal length of the first spacer being contacted with a surface of the semiconductor substrate is different from a horizontal length of the second spacer being contacted with a surface of the semiconductor substrate.
    Type: Grant
    Filed: July 15, 2014
    Date of Patent: July 25, 2017
    Assignee: Magnachip Semiconductor, Ltd.
    Inventors: Gukhwan Kim, Boseok Oh
  • Patent number: 9698786
    Abstract: Aspects of the present disclosure are directed to detecting and powering external circuits via a common port. As may be implemented in accordance with one or more embodiments, an accessory detection circuit detects a type of an external circuit based upon a pull-down resistance at an interface port (e.g., where each accessory type provides a discernable pull-down resistance). Power switching circuitry couples power between the interface port and an internal power-based circuit, and operates in an open condition when the accessory detection circuit is active. An adaptive biasing circuit sets a voltage across the power switching circuitry to about zero, based on a voltage level provided on the interface port, thereby mitigating changes in the pull-down resistance due to current leakage. Once the type of external circuit is identified, the power switching circuitry couples power between the external circuit and the internal circuit.
    Type: Grant
    Filed: May 29, 2015
    Date of Patent: July 4, 2017
    Assignee: Nexperia B.V.
    Inventors: Madan Mohan Reddy Vemula, Harold Hanson