Abstract: Methods for fabricating a semiconductor device are disclosed. In an example, a method includes forming an isolation region on a substrate, wherein the isolation region extends a depth into the substrate from a substrate surface; forming a recess in the isolation region, wherein the recess is defined by a concave surface of the isolation region; and forming a first gate structure over the substrate surface and a second gate structure over the concave surface of the isolation region.

Abstract: The trench IGBT is provided with a plurality of trench gates disposed in a manner so as to form wide and narrow of gaps; has a MOS structure that has a channel of a first conductivity type and that is between the trench gate pair that is disposed with a narrow gap therebetween; and is provided with a floating semiconductor layer of the first conductivity type and that is separated from the trench gates by interposing a portion of a third semiconductor layer of a second conductivity type between the trench gate pair that is disposed with a wide gap therebetween. Also, this floating semiconductor layer is disposed parallel to and at a position corresponding to an emitter electrode and a first semiconductor layer having the same electric potential, with a insulating film therebetween.

Abstract: A semiconductor memory device includes a plurality of memory cell arrays each includes a plurality of memory cells, the plurality of memory cell arrays being stacked on a semiconductor substrate to form a three-dimensional structure, a first well formed in the semiconductor substrate and having a first conductivity type, an element isolation insulating film including a bottom surface shallower than a bottom surface of the first well in the first well, and buried in the semiconductor substrate, a second well including a bottom surface shallower than the bottom surface of the first well in the first well, formed along a bottom surface of at least a portion of the element isolation insulating film, and made of an impurity having a second conductivity type, and a contact line electrically connected to the first well.

Abstract: A system and method for forming a phase change memory material on a substrate, in which the substrate is contacted with precursors for a phase change memory chalcogenide alloy under conditions producing deposition of the chalcogenide alloy on the substrate, at temperature below 350° C. with the contacting being carried out via chemical vapor deposition or atomic layer deposition. Various tellurium, germanium and germanium-tellurium precursors are described, which are useful for forming GST phase change memory films on substrates.

Abstract: An apparatus comprises two n-type metal oxide semiconductor (MOS) devices formed next to each other. Each n-type MOS device further includes a pair of face-to-face diodes formed in an isolation ring. A method of modeling the apparatus comprises reusing four-terminal MOS device models in standard cell libraries and combining the four-terminal MOS device model and the isolation ring model into a 4T MOS plus isolation ring model. The method of modeling the apparatus further comprises adding a dummy device between a body contact of the first n-type MOS device and a body contact of the second n-type MOS device.

Abstract: The semiconductor device includes a first MIS transistor including a gate insulating film 92, a gate electrode 108 formed on the gate insulating film 92 and source/drain regions 154, a second MIS transistor including a gate insulating film 96 thicker than the gate insulating film 92, a gate electrode 108 formed on the gate insulating film 96, source/drain regions 154 and a ballast resistor 120 connected to one of the source/drain regions 154, a salicide block insulating film 146 formed on the ballast resistor 120 with an insulating film 92 thinner than the gate insulating film 96 interposed therebetween, and a silicide film 156 formed on the source/drain regions 154.

Abstract: Methods of forming and using a microelectronic structure are described. Embodiments include forming a diode between a metal fuse gate and a PMOS device, wherein the diode is disposed between a contact of the metal fuse gate and a contact of the PMOS device, and wherein the diode couples the contact of the metal fuse gate to the contact of the PMOS device.

Abstract: A switching device has an input node, an output node, and a control node. The device includes: a substrate having a first side and a second side with a ground plane on the first side of the substrate and a mesa on the second side of the substrate. The mesa is made of a normally-conductive semiconductor material, and an isolation region substantially surrounds the mesa. A field effect transistor (FET) is on the mesa. The FET has an input terminal connected to the input node, an output terminal connected to the output node, and a gate. A capacitor is connected in series between the output terminal of the FET and the gate, and a resistor is connected in series between the control node and the gate. A gate electrode is directly connected to the gate. The gate electrode is disposed substantially entirely on the mesa.

Abstract: The present invention provides a method of integrating an electrical fuse process into a high-k/metal gate process. The method simultaneously forms a dummy gate stack of a transistor and a dummy gate stack of an e-fuse; and simultaneously removes the polysilicon of the dummy gate stack in the transistor region and the polysilicon of the dummy gate stack in the e-fuse region. Thereafter, the work function metal layer disposed in the opening of the e-fuse region is removed; and the opening in the transistor region and the opening in the e-fuse region with metal conductive structures are filled to form an e-fuse and a metal gate of a transistor.

Abstract: According to an embodiment of a method of manufacturing a power transistor module, the method includes mechanically fastening a first terminal, a second terminal and at least two different DC bias terminals to an electrically conductive flange; connecting the flange to a source of a power transistor device; electrically connecting the first terminal to a gate of the power transistor device; electrically connecting the second terminal to a drain of the power transistor device; mechanically fastening a bus bar to the flange which extends between and connects the DC bias terminals; and electrically connecting the bus bar to the drain via one or more RF grounded connections.

Abstract: By integrating a diode and a resistor connected in parallel into the same chip as an IGBT and connecting a cathode of the diode to a gate of the IGBT, the value of dv/dt can be limited to a predetermined range inside the chip of the IGBT without a deterioration in turn-on characteristics. Since the chip includes a resistor having such a resistance that a dv/dt breakdown of the IGBT can be prevented, the IGBT can be prevented from being broken by an increase in dv/dt at a site (user site) to which the chip is supplied.

Abstract: According to one embodiment, a method of manufacturing a semiconductor device, the method includes forming first and second cores on a processed material, forming a covering material having a stacked layer includes first and second layers, the covering material covering an upper surface and a side surface of the first and second cores, removing the second layer covering the first core, forming a first sidewall mask having the first layer on the side surface of the first core and a second sidewall mask having the first and second layers on the side surface of the second core by etching the covering material, removing the first and second cores, and forming first and second patterns having different width in parallel by etching the processed material in condition of using the first and second sidewall masks.

Abstract: A semiconductor device including a low conducting field-controlling element is provided. The device can include a semiconductor including an active region, and a set of contacts to the active region. The field-controlling element can be coupled to one or more of the contacts in the set of contacts. The field-controlling element can be formed of a low conducting layer having a sheet resistance between approximately 103 Ohms per square and approximately 107 Ohms per square. During direct current and/or low frequency operation, the field-controlling element can behave similar to a metal electrode. However, during high frequency operation, the field-controlling element can behave similar to an insulator.

Abstract: The present invention is generally directed to an apparatus with embedded (bottom side) control lines for vertically stacked semiconductor elements. In accordance with various embodiments, a first semiconductor wafer is provided with a first facing surface on which a first conductive layer is formed. The first semiconductor wafer is attached to a second semiconductor wafer to form a multi-wafer structure, the second semiconductor wafer having a second facing surface on which a second conductive wafer is formed. The first conductive layer is contactingly bonded to the second conductive layer to form an embedded combined conductive layer within said structure. Portions of the combined conductive layer are removed to form a plurality of spaced apart control lines that extend in a selected length or width dimension through said structure.

Abstract: A semiconductor device includes: a semiconductor substrate; an impurity-doped region at a top surface of the semiconductor substrate; an insulating region located around the impurity-doped region on the top surface of the semiconductor substrate; a gate electrode on the impurity-doped region; a first electrode and a second electrode located on the impurity-doped region, sandwiching the gate electrode; a first pad located on the insulating region and connected to the gate electrode; a second pad facing the first pad across the impurity-doped region, on the insulating region, and connected to the second electrode; and a conductor located between the first electrode and the second pad on the insulating region.

Abstract: Provided are a semiconductor memory device and a method of manufacturing the semiconductor memory device. The semiconductor memory device includes a semiconductor substrate including a first active region and a second active region, a gate electrode including a silicide layer formed on the first active region and a resistor pattern formed on the second active region. A distance from a top surface of the semiconductor substrate to a top surface of the resistor pattern is smaller than a distance from a top surface of the semiconductor substrate to a top surface of the gate electrode.

Abstract: Field effect devices having a drain controlled via a nanotube switching element. Under one embodiment, a field effect device includes a source region and a drain region of a first semiconductor type and a channel region disposed therebetween of a second semiconductor type. The source region is connected to a corresponding terminal. A gate structure is disposed over the channel region and connected to a corresponding terminal. A nanotube switching element is responsive to a first control terminal and a second control terminal and is electrically positioned in series between the drain region and a terminal corresponding to the drain region. The nanotube switching element is electromechanically operable to one of an open and closed state to thereby open or close an electrical communication path between the drain region and its corresponding terminal.

Abstract: A plurality of bit lines s arranged crossing a plurality of first word lines. A first diode is arranged at each cross point of the first word lines and the bit lines. A cathode of the first diode is connected to one of the first word lines. A first variable resistance film configuring the first diode is provided between the anodes of the first diodes and the bit lines, and configures a first memory cell together with each of the first diodes, and further, is used in common to the first diodes.

Abstract: An electrical device includes a substrate; first and second active areas; first and second word lines disposed in a first plane; first and second bit lines in a second plane and in electrical communication with first and second active areas; and a reference line disposed in a third plane. A nanotube element disposed in a fourth plane is in electrical communication with first and second active areas and the reference line via electrical connections at a first surface of the nanotube element. The nanotube element includes first and second regions having resistance states that are independently adjustable in response to electrical stimuli, wherein the first and second regions nonvolatilely retain the resistance states. Arrays of such electrical devices can be formed as nonvolatile memory devices. Methods for fabricating such devices are also disclosed.

Abstract: A semiconductor memory device includes first and second memory cells each including a variable resistance element and a diode and having a pillar shape, and an insulating layer provided between the first memory cell and the second memory cell and including a void. A central portion of the diode has a smaller width than widths of upper and lower portions of the diode.

Abstract: An RF-power device includes a semiconductor substrate having a plurality of active regions arranged in an array. Each active region includes one or more RF-power transistors. The active regions are interspersed with inactive regions for reducing mutual heating of the RF-power transistors in separate active regions. The devices also includes at least one impedance matching component located in one of the inactive regions of the substrate.

Abstract: A nonvolatile semiconductor memory device including a memory cell configured to store data and a resistor element provided around the memory cell. The memory cell includes a charge storage layer provided above a substrate, a first semiconductor layer formed on a top surface of the charge storage layer via an insulating layer, and a first low resistive layer formed on a top surface of the first semiconductor layer and having resistance lower than that of the first semiconductor layer. The resistor element includes a second semiconductor layer formed on the same layer as the first semiconductor layer, and a second low resistive layer formed on the same layer as the first low resistive layer and on a top surface of the second semiconductor layer, having resistance lower than that of the second semiconductor layer.

Abstract: An electronic element (39?, 39, 40) having feedback control is provided by placing an inductive interposer (42) between the output connection or bus (382) and the input connection or bus (381), wherein the inductive interposer (42) forms part of a closed circuit (47) with the inductive interposer (42) substantially parallel with the output connection or bus (382) and input connection or bus (381) for a distance permitting significant inductive coupling therebetween. In a preferred embodiment, the closed circuit (47) containing the inductive interposer (42) comprises impedance ZT. By including various circuit elements (e.g., resistance, capacitance, and/or inductance) in ZT, the output-to-input feedback can be modified to advantage. This greatly increases the available design freedom, especially for power devices, such as for example, field effect, MOSFET, LDMOS. bipolar and other power devices that use substantially parallel input and output bus structures.

Abstract: A standard cell includes a capacity element which is made up of a first well diffusion layer into which a first conductive impurity is diffused in a region from a surface of a substrate to a predetermined depth, an insulation film which is provided on the first well diffusion layer, and a first dummy pattern which is provided on the insulation film.

Abstract: A semiconductor device includes an MIS transistor and an electric fuse. The MIS transistor includes a gate insulating film formed on the semiconductor substrate, and a gate electrode including a first polysilicon layer, a first silicide layer, and a first metal containing layer made of a metal or a conductive metallic compound. The electric fuse includes an insulating film formed on the semiconductor substrate, a second polysilicon layer formed over the insulating film, and a second silicide layer formed on the second polysilicon layer.

Abstract: A semiconductor device includes an IPD structure, a first semiconductor die mounted to the IPD structure with a flipchip interconnect, and a plurality of first conductive posts that are disposed adjacent to the first semiconductor die. The semiconductor device further includes a first molding compound that is disposed over the first conductive posts and first semiconductor die, a core structure bonded to the first conductive posts over the first semiconductor die, and a plurality of conductive TSVs disposed in the core structure. The semiconductor device further includes a plurality of second conductive posts that are disposed over the core structure, a second semiconductor die mounted over the core structure, and a second molding compound disposed over the second conductive posts and the second semiconductor die. The second semiconductor die is electrically connected to the core structure.

Abstract: The invention relates to a memory device, in particular to a resistively switching memory device such as a Phase Change Random Access Memory (“PCRAM”). In one disclosed method, a nanowire of non-conducting material is formed serving as a mould for producing a nanotube of conducting material. A volume of switching active material is deposited on top of the nanotube, so that the ring-shaped front face of the nanotube couples to the switching active material and thus forms a bottom electrode contact.

Abstract: Various embodiments of the present invention are generally directed to an apparatus with embedded (bottom side) control lines for vertically stacked semiconductor elements, and a method for forming the same. In accordance with various embodiments, a first semiconductor wafer is provided with a first facing surface on which a first conductive layer is formed. The first semiconductor wafer is attached to a second semiconductor wafer to form a multi-wafer structure, the second semiconductor wafer having a second facing surface on which a second conductive wafer is formed. The first conductive layer is contactingly bonded to the second conductive layer to form an embedded combined conductive layer within said structure. Portions of the combined conductive layer are removed to form a plurality of spaced apart control lines that extend in a selected length or width dimension through said structure.

Abstract: A technique to be applied to a semiconductor device for achieving low power consumption by improving a shape at a boundary portion of a shallow trench and an SOI layer of an SOI substrate. A position (SOI edge) at which a main surface of a silicon substrate and a line extended along a side surface of an SOI layer are crossed is recessed away from a shallow-trench isolation more than a position (STI edge) at which a line extended along a sidewall of a shallow trench and a line extended along the main surface of the silicon substrate are crossed, and a corner of the silicon substrate at the STI edge has a curved surface.

Abstract: A memory cell device has a bottom electrode and a top electrode, a plug of memory material in contact with the bottom electrode, and a cup-shaped conductive member having a rim that contacts the top electrode and an opening in the bottom that contacts the memory material. Accordingly, the conductive path in the memory cells passes from the top electrode through the conductive cup-shaped member, and through the plug of phase change material to the bottom electrode.

Abstract: A semiconductor device, including: a semiconductor substrate; a plurality of unit cells connected in parallel with each other, each unit cell including a plurality of electric field effect transistors formed on the semiconductor substrate; a plurality of gate bus wirings each configured to connect each of the gate electrodes of the transistors constituting the unit cell; a plurality of gate pad electrodes having a multi-layered structure of conductive layers, each of the gate pad electrodes connected to the gate bus wiring; and a resistive element configured to connect adjacent gate pad electrodes and formed along at least one side of an outer peripheral portion of the gate pad electrode, and formed of at least one conductive layer of the conductive layers constituting the gate pad electrode.

Abstract: A method includes forming an electrical insulator material over an integrated circuit having a metal-containing conductive interconnect and activating a dopant in a semiconductor material of a substrate to provide a doped region. The doped region provides a junction of opposite conductivity types. After activating the dopant, the substrate is bonded to the insulator material and at least some of the substrate is removed where bonded to the insulator material. After the removing, a memory cell is formed having a word line, an access diode, a state-changeable memory element containing chalcogenide phase change material, and a bit line all electrically connected in series, the access diode containing the junction as a p-n junction. A memory device includes an adhesion material over the insulator material and bonding the word line to the insulator material.

Abstract: A dielectric material layer is formed on a metal gate layer for a metal gate electrode, and then lithographically patterned to form a dielectric material portion, followed by formation of a polycrystalline semiconductor layer thereupon. A semiconductor device employing a metal gate electrode is formed in a region of the semiconductor substrate containing a vertically abutting stack of the metal gate layer and the polycrystalline semiconductor layer. A material stack in the shape of an electrical fuse is formed in another region of the semiconductor substrate containing a vertical stack of the metal gate layer, the dielectric material portion, and the polycrystalline semiconductor layer. After metallization of the polycrystalline semiconductor layer, an electrical fuse containing a polycrystalline semiconductor portion and a metal semiconductor alloy portion is formed over the dielectric material portion that separates the electrical fuse from the metal gate layer.

Abstract: A magnetic random access memory includes a first bit line and a second bit line, a source line formed for a group having the first bit line and the second bit line, adjacent to the first bit line, and running in a first direction in which the first bit line and the second bit line run, a first magnetoresistive effect element connected to the first bit line, a second magnetoresistive effect element connected to the second bit line, a first transistor connected in series with the first magnetoresistive effect element, and a second transistor connected in series with the second magnetoresistive effect element. A first cell having the first magnetoresistive effect element and the first transistor and a second cell having the second magnetoresistive effect element and the second transistor are connected together to the source line.

Abstract: Circuits, methods, and systems are disclosed in which a current is provided to compensate for spurious current while receiving signals through a line. For example, the spurious current can be sensed and the compensating current can be approximately equal to the sensed spurious current. The spurious current could include photocurrent from a bright light, and the compensating current can prevent bright light effects.

Abstract: An imaging device comprising a plurality of photosensors, a shared diffusion region for receiving charge generated by the photosensors, and a dual conversion gain element that can be selectively coupled to the shared diffusion region to increase a conversion gain of the shared diffusion region. A method of operating such an imaging device is also described, comprising resetting a shared diffusion region, sampling a reset voltage level at the shared diffusion region, transferring charge accumulated in one of a plurality of photosensors to the shared diffusion region, sampling a pixel signal voltage level at the shared diffusion region, and activating a dual conversion gain element to increase a conversion gain of the shared diffusion region.

Abstract: A nonvolatile semiconductor memory includes memory cell transistors and resistors. Each memory cell transistor has source/drain diffusion layers provided in a semiconductor substrate, a first gate insulating film located between the source/drain diffusion layers, a floating gate electrode layer located on the first gate insulating film, a first inter-gate insulating film located on the floating gate electrode layer, a control gate electrode layer located on the first inter-gate insulating layer, and a first low-resistance layer located on the control gate electrode layer. Each resistor has a second gate insulating film located on the semiconductor substrate, a first electrode layer located on the second gate insulating film, a second inter-gate insulating film located on the first electrode layer, a second electrode layer located on the second inter-gate insulating film, a second low-resistance layer located on the second electrode layer, and a contact plug connected to the second low-resistance layer.

Abstract: A method for fabricating a memory is described. Word lines are provided in a first direction. Bit lines are provided in a second direction. A top electrode is formed connecting to a corresponding word line. A bottom electrode is formed connecting to a corresponding bit line. A resistive layer is formed on the bottom electrode. At least two separate L-shaped liners are formed, wherein each L-shaped liner has variable resistive materials on both ends of the L-shaped liner and each L-shaped liner is coupled between the top electrode and the resistive layer.

Abstract: A semiconductor package for mounting multiple field effect transistors (FETs) is disclosed. The package includes a drain conductor between each FET's drain connection point and a drain terminal connector on the semiconductor package; a source conductor between each FET's source connection point and a source terminal connector of the source conductor on the semiconductor package, the source conductor containing the common inductance; a dielectric substantially overlaying said source conductor; a gate conductor on the dielectric substantially overlaying the source conductor; and said gate conductor, said dielectric and said source conductor forming a transformer, the transformer creating voltage in the gate conductor which almost exactly cancels voltage in said source conductor.

Abstract: An integrated circuit device. The integrated circuit device includes a semiconductor substrate having a surface region. A gate dielectric layer overlies the surface region of the substrate. The device includes a MOS device having a p+ active region. The p+ active region forms a first electrode for a resistive switching device. The resistive switching device includes an amorphous silicon switching material overlying the p+ active region and a metal electrode overlies the first metal conductor structure. The metal electrode includes a metal material, upon application of a positive bias to the metal electrode, forms a metal region in the amorphous silicon switching material. The MOS device provides for a select transistor for the integrated circuit device.

Abstract: A gate insulating film is formed on a main surface of a substrate in which an element isolation region is formed. A metal film is formed on the gate insulating film. A silicon film is formed on the metal film. A gate electrode of a MIS transistor composed of a stacked structure of the silicon film and metal film is formed on an element region and a high-resistance element composed of a stacked structure of the silicon film and metal film is formed on the element isolation region by patterning the silicon film and metal film. An acid-resistant insulating film is formed on the side of the gate electrode. The metal film of the high-resistance element is oxidized. A diffused layer of the MIS transistor is formed in the substrate.

Abstract: An anti-fuse apparatus includes a substrate of a first conductivity type and a well region of a second conductivity type formed in the substrate. A junction between the well region and the substrate is characterized by a breakdown voltage higher than a predetermined voltage. The apparatus includes a contact region of the second conductivity type within the well region. The apparatus also includes a channel region and a drain region within the substrate. A gate dielectric layer overlies the channel region and the contact region. A first polysilicon gate, the drain region, and the well region are associated with an MOS transistor. The apparatus also includes a second polysilicon gate overlying the gate dielectric layer which overlies the contact region. The contact region is configured to receive a first supply voltage and the second polysilicon gate is configured to receive a second supply voltage.

Abstract: A semiconductor device, has a main transistor that is a first-conductivity-type MOS transistor and has the drain connected to a first potential; a first switch circuit that is connected between the source of said main transistor and a second potential; a dummy transistor that is a first-conductivity-type MOS transistor whose source serves also as the source of said main transistor; and a second switch circuit that is connected between the drain of said dummy transistor and said first potential or said second potential.

Abstract: An integrated circuit includes a Schottky diode having a cathode defined by an n-type semiconductor region, an anode defined by a cobalt silicide region, and a p-type region laterally annularly encircling the cobalt silicide region. The resulting p-n junction forms a depletion region under the Schottky junction that reduces leakage current through the Schottky diodes in reverse bias operation. An n+-type contact region is laterally separated by the p-type region from the first silicide region and a second cobalt silicide region is formed in the n-type contact region. The silicided regions are defined by openings in a silicon blocking dielectric layer. Dielectric material is left over the p-type region. The p-type region may be formed simultaneously with source/drain regions of a PMOS transistor.

Abstract: In a full CMOS SRAM having a lateral type cell (memory cell having three partitioned wells arranged side by side in a word line extending direction and longer in the word line direction than in the bit line direction) including first and second driver MOS transistors, first and second load MOS transistors and first and second access MOS transistors, two capacitors are arranged spaced apart from each other on embedded interconnections to be storage nodes, with lower and upper cell plates cross-coupled to each other.

Abstract: A phase change material including a high adhesion phase change material formed on a dielectric material and a low adhesion phase change material formed on the high adhesion phase change material. The high adhesion phase change material includes a greater amount of at least one of nitrogen and oxygen than the low adhesion phase change material. The phase change material is produced by forming a first chalcogenide compound material including an amount of at least one of nitrogen and oxygen on the dielectric material and forming a second chalcogenide compound including a lower percentage of at least one of nitrogen and oxygen on the first chalcogenide compound material. A phase change random access memory device, and a semiconductor structure are also disclosed.

Abstract: A system and circuit for simulating gate-to-drain breakdown in an N-channel field effect transistor (NFET). In one embodiment, a simulation circuit includes a primary field effect transistor (FET), a first depletion mode FET and a second depletion mode FET. The first depletion mode FET and the second depletion mode FET are connected between a gate and a drain of the primary FET. A gate and a drain of the first depletion mode FET are connected to the gate of the primary FET. A gate and a drain of the second depletion mode FET are connected to the drain of the primary FET.

Abstract: A method of forming a semiconductor device having an asymmetrical source and drain. In one embodiment, the method includes forming a gate structure on a first portion of the substrate having a well of a first conductivity. A source region of a second conductivity and drain region of the second conductivity is formed within the well of the first conductivity in a portion of the substrate that is adjacent to the first portion of the substrate on which the gate structure is present. A doped region of a second conductivity is formed within the drain region to provide an integrated bipolar transistor on a drain side of the semiconductor device, in which a collector is provided by the well of the first conductivity, the base is provided by the drain region of the second conductivity and the emitter is provided by the doped region of the second conductivity that is present in the drain region. A semiconductor device formed by the above-described method is also provided.

Abstract: Circuits and systems comprising one or more switches are provided. A circuit includes a first switch formed on a substrate; and a second switch formed on the substrate, the second switch including a first terminal coupled to a third terminal of the first switch. A system includes a supply; a first switch formed on a substrate, the first switch coupled to the supply; a second switch formed on the substrate, the second switch coupled to the first switch; a third switch formed on the substrate, the third switch coupled to the supply; a fourth switch formed on the substrate, the fourth switch coupled to the third switch; and a driver coupled to respective second terminals of the first, second, third, and fourth switches.

Abstract: A non-volatile memory devices includes: a substrate including a circuit device and a metal line electrically connected with the circuit device; a diode connected with the metal line in a vertical direction with respect to a surface of the substrate, and including a metal layer disposed on a lower part of the diode facing the surface of the substrate; and a resistor electrically connected with the diode in series.