Abstract: A vapor delivery system and method is provided that is adapted for treating prostate tissue. The vapor delivery system includes a vapor delivery needle configured to deliver condensable vapor energy to tissue. In one method, the vapor delivery system is advanced transurethrally into the patient to access the prostate tissue. The vapor delivery system is properly positioned by measuring and advancing the system based on a field-of-view of an endoscope or camera disposed within the system.

Abstract: A capacitive sensor includes: a resinous panel that has a translucent property, a main surface of the panel being a manipulation surface; a sensor substrate placed so as to face another main surface of the panel, the other main surface being opposite to the manipulation surface of the panel, the sensor substrate having a glass base material and a transparent electrode provided on at least one main surface of the base material; an intermediate layer that has a translucent property, the intermediate layer being disposed between the panel and the sensor substrate; a first adhesive layer disposed between the panel and the intermediate layer, the first adhesive layer bonding the panel and the intermediate layer together; and a second adhesive layer disposed between the sensor substrate and the intermediate layer, the second adhesive layer bonding the sensor substrate and the intermediate layer together.

Abstract: The present disclosure provides a force touch structure and a display device. The force touch structure includes a force sensor and a reference layer. A capacitor is formed between the force sensor and the reference layer, the force sensor includes a first pattern layer and a second pattern layer, and the second pattern layer includes a heat dissipation structure.

Abstract: A method of fabricating a MEMS structure includes providing a substrate comprising a logic element region and a MEMS region. Next, a logic element is formed within the logic element region. A nitrogen-containing material layer is formed to cover the logic element region and the MEMS region conformally. Then, part of the nitrogen-containing material layer within the MEMS region is removed to form at least one shrinking region. Subsequently, a dielectric layer is formed to cover the logic element region and MEMS region, and the dielectric layer fills in the shrinking region. After that, the dielectric layer is etched to form at least one releasing hole, wherein the shrinking region surrounds the releasing hole. Finally, the substrate is etched to form a chamber.

Abstract: The present invention relates to composition comprising Lactobacillus rye ferment, dialkylisosorbide and phospholipid. Preferably, the composition further comprises ethoxylated sorbitan fatty acid ester. The composition has been shown to be effective against infections of closed comedones. The invention further relates to a method of preparing the composition, to a roll-on applicator comprising the composition and to the use of the composition in treatment of closed comedones infections.

Abstract: A buried cavity is formed in a monolithic body to delimit a suspended membrane. A peripheral insulating region defines a supporting frame in the suspended membrane. Trenches extending through the suspended membrane define a rotatable mobile mass carried by the supporting frame. The mobile mass forms an oscillating mass, supporting arms, spring portions, and mobile electrodes that are combfingered to fixed electrodes of the supporting frame. A reflecting region is formed on top of the oscillating mass.

Abstract: A probe card includes a conductive body, an insulation block, and a plurality of conductive microsprings. The insulation block covers at least one side of the body and at least partially encloses the microsprings. A first end of each microspring is connected to the conductive body and a second end is exposed from the insulation block. In operation, the probe card is moved onto one or more semiconductor devices to be tested. As the probe card is moved toward the semiconductor devices, the second ends of the conductive microsprings come into contact with contact pads on the semiconductor devices. The insulation block encloses the microsprings, which prevents the microsprings from buckling or making contact with each other. As a result, the probe card produces fewer false positives and false negatives during the testing process.

Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.

Abstract: A microelectro-mechanical system (MEMS) device includes a substrate of a semiconductor material having thereon a movable component, a glass substrate bonded to the substrate, an electrostatic biasing layer disposed between the movable component and the glass substrate. A cavity is defined between the movable component and a top surface of the glass substrate. The electrostatic biasing layer completely overlaps with the movable component.

Abstract: A multi-layer sealing film for high seal yield is provided. In some embodiments, a substrate comprises a vent opening extending through the substrate, from an upper side of the substrate to a lower side of the substrate. The upper side of the substrate has a first pressure, and the lower side of the substrate has a second pressure different than the first pressure. The multi-layer sealing film covers and seals the vent opening to prevent the first pressure from equalizing with the second pressure through the vent opening. Further, the multi-layer sealing film comprises a pair of metal layers and a barrier layer sandwiched between metal layers. Also provided is a microelectromechanical systems (MEMS) package comprising the multilayer sealing film, and a method for manufacturing the multi-layer sealing film.

Abstract: Apparatuses and methods for the haptic sensation of forces at a remote location. Groups of MEMS-based pressure sensors are combined into sensor arrays. In some embodiments, the pressure sensors are encased in silicone or other elastomeric substance to allow for routine use in the aqueous environment of the body. The sensor arrays may be housed in a bio-compatible material (e.g., stainless steel, plastic) and may be attached to a printed circuit board to allow the electrical signal generated by the sensors to be communicated to a user. The sensor arrays may be used with faceplates that directly interact with the target tissue or object. The faceplates may be rough, smooth, serrated, or any other texture. The present apparatuses and methods are particularly well suited for robotic surgery and may be used wherever haptic sensing of forces at a remote location is desired.

Abstract: A mixed-signal multi-chip package comprises a lead frame, a first die, and a digital die. The first die can provide an analog signal in an analog chip pad of the first die. The digital die can receive the analog signal from the first die through an analog chip pad. The analog input chip pad is coupled with the respective analog output chip pad of the first die by a first bonding wire. The digital die is configured to communicate with external circuitry using a digital signal-bearing signal exchanged via at least one first bond pad of the lead-frame. A second bond pad of the lead frame configured to be coupled to a DC voltage extends laterally along a plane of the lead-frame between the first bond pad and the first bonding wire, to form a DC guard between the first bond pad and the first bonding wire.

Abstract: A touch sensor is provided that includes a transparent, insulating substrate and at least one U-shaped electrically conductive micromesh that includes traces disposed on the substrate. The traces include an elemental metal or an alloy of elemental metal. The touch sensor may be configured to determine a location and a magnitude of a force of a touch.

Abstract: A support substrate has a face above which at least one electronic component is fixed. A peripheral area of the face includes an annular local metal layer. An encapsulating cover for the electronic component includes a peripheral wall having an end edge that is mounted above the peripheral area. The annular metal local layer includes, at the periphery thereof, a series of spaced-apart teeth with notches formed therebetween. The teeth extend as far as the peripheral edge of the support substrate.

Abstract: A three-dimensional stacking technique performed in a wafer-to-wafer fashion reducing the machine movement in production. The Wafers are processed with metallic traces and stacked before dicing into separate die stacks. The traces of each layer of the stacks are interconnected via electroless plating.

Abstract: A user manages security of one or more user devices by manipulating one or more sensors located in the user's mouth in a predetermined pattern corresponding to a password. The matching of the predetermined pattern to the password unlocks at least a portion of at least one user device.

Abstract: An integrated chip including a first substrate, a second substrate overlying the first substrate, and a third substrate overlying the second substrate is provided. The first, second, and third substrates at least partially define a cavity, and the second substrate includes a movable mass in the cavity between the first and third substrates. A getter structure is in the cavity and includes a getter layer and a filter layer. The getter layer comprises a getter material. The filter layer has a first side adjoining the getter layer, and further has a second side that is opposite the first side and that faces the cavity. The filter layer is configured to pass the getter material from the first side to the second side while blocking any impurities.

Abstract: Conventional packages for 5G applications suffer from disadvantages including high mold stress on the die, reduced performance, and increased keep-out zone. To address these and other issues of the conventional packages, it is proposed to pre-apply a wafer-applied material, which remains in place, to form an air cavity between the die and the substrate. The air cavity can enhance the die's performance. Also, since the wafer-applied material can remain in place, the keep-out zone can be reduced. As a result, higher density modules can be fabricated.

Abstract: An integrated circuit may include a semiconductor die having a trench formed in a surface of the semiconductor die. One or more circuit components may be formed on the surface of the semiconductor die. The trench can extend into the semiconductor die next to at least one circuit component. The trench may surround the circuit component partially or wholly. The trench may be filled with a material having a lower bulk modulus than the semiconductor die in which the trench is formed.

Abstract: A pressure sensor may measure gas or liquid pressure. A chamber may have an inlet that receives the gas or liquid. A flexible diaphragm may be within the chamber that has a surface exposed to the gas or liquid after it flows through the inlet. A pressure sensor system may sense changes in the flexible diaphragm caused by changes in the pressure of the gas or liquid. A pressure-insensitive sensor system may sense changes in the flexible diaphragm that are not caused by changes in the pressure of the gas or liquid. The pressure-insensitive sensor system may be insensitive to changes in the flexible diaphragm caused by changes in the pressure of the gas or liquid.

Abstract: A ground terminal with a novel structure is provided that enables reliable detection of loosening of a terminal. A ground terminal that is bolted to ground a ground wire of a vehicle-mounted device to a negative terminal of a battery, the ground terminal including: a connection portion that has a bolt insertion hole into which a bolt used for the bolting is inserted. A piezoelectric element is provided surrounding the bolt insertion hole of the connection portion.

Abstract: A MEMS multi-module assembly, manufacturing method, and electronics apparatus are disclosed herein. The MEMS multi-module assembly comprises: a first die having a first hole; and a second die stacked on the first die, having a second MEMS device, wherein the second MEMS device is connected outside via the first hole.

Abstract: A semiconductor wafer and a method for forming a semiconductor. The semiconductor wafer includes: a first semiconductor component having a first device; a second semiconductor component having a second device; an insulation layer laterally extending to the first semiconductor component and the second semiconductor component; and a grind layer configured on or adjacent to a backside of the semiconductor wafer. Therefore, chipping or cracking can be decreased or avoided when the grind layer is exposed during the thinning process (such as backside grinding).

Abstract: Provided are a touch display panel and a touch display device. The touch display panel includes at least one semiconductor pressure-sensing touch device, and the semiconductor pressure-sensing touch device includes a first pressure-sensitive resistor, a second pressure-sensitive resistor, a third pressure-sensitive resistor and a fourth pressure-sensitive resistor. A first end of the first pressure-sensitive resistor and a first end of the second pressure-sensitive resistor are connected to a first power inputting terminal, a second end of the first pressure-sensitive resistor and a first end of the fourth pressure-sensitive resistor are connected to a first sense signal measuring terminal, a second end of the fourth pressure-sensitive resistor and a second end of the third pressure-sensitive resistor are connected to a second power inputting terminal.

Abstract: A method for fabricating an integrated MEMS device and the resulting structure therefore. A control process monitor comprising a MEMS membrane cover can be provided within an integrated CMOS-MEMS package to monitor package leaking or outgassing. The MEMS membrane cover can separate an upper cavity region subject to leaking from a lower cavity subject to outgassing. Differential changes in pressure between these cavities can be detecting by monitoring the deflection of the membrane cover via a plurality of displacement sensors. An integrated MEMS device can be fabricated with a first and second MEMS device configured with a first and second MEMS cavity, respectively. The separate cavities can be formed via etching a capping structure to configure each cavity with a separate cavity volume. By utilizing an outgassing characteristic of a CMOS layer within the integrated MEMS device, the first and second MEMS cavities can be configured with different cavity pressures.

Abstract: A method for manufacturing a porous body includes a structure forming step that is repeatedly performed a plurality of times and includes: a pore-forming material placing step of placing a pore-forming material 50 for forming pores in the porous body; an aggregate placing step of placing aggregate particles 51 which are part of raw materials of the porous body; a binder placing step of placing binder particles 52 which are part of the raw materials of the porous body; and a binding step of heat-fusing at least part of the placed binder particles 52 to bind aggregate particles 51 together.

Abstract: A transducer converts an actuation, applied to the transducer, into a raw actuation signal. The sensor device comprises an acceleration intermediary for converting an acceleration of the transducer into an actuation which is applied to the transducer, an underlying surface state detector for generating an underlying surface state signal by evaluating the raw actuation signal and an actuation signal generator for generating the actuation signal, processed in dependence on an underlying surface state, by evaluating the raw actuation signal taking into account the underlying surface state signal. Furthermore, the invention relates to a corresponding vehicle and to a corresponding method for generating an actuation signal which is processed in dependence on an underlying surface state.

Abstract: Methods, systems, and apparatus, including medium-encoded computer program products, for combining electronic circuitry with mechanical structures using a design tool to build hybrid electro-mechanical three-dimensional circuits for 3D printed devices. In some implementations, the design tool facilitates creation and placement of components and traces, and print preparation for additive manufacturing systems.

Abstract: A microphone, a manufacturing method and a control method of the microphone are provided. The microphone includes an insulating layer bonded to a surface of a substrate in which a sound inlet is formed and includes a plurality of sound apertures. A diaphragm is formed at a position that corresponds to the sound inlet of the substrate on an upper surface of the insulating layer. A displacement adjusting layer is disposed in a circumference of the diaphragm on the upper surface of the insulating layer and is configured to adjust hardness of the diaphragm based on an input sound. A fixing layer is disposed on the diaphragm and the displacement adjusting layer while spaced apart from the diaphragm and the displacement adjusting layer.

Abstract: A capacitive accelerometer including: at least one additional fixed capacitor electrode with a plurality of additional fixed capacitive electrode fingers extending along the sensing direction. The proof mass comprises a plurality of moveable capacitive electrode fingers extending from the proof mass along the sensing direction and arranged to interdigitate with the plurality of additional fixed capacitive electrode fingers of the at least one additional fixed capacitor electrode. A means is provided for applying a voltage to the at least one additional fixed capacitor electrode to apply an electrostatic force to the plurality of moveable capacitive electrode fingers that acts to pull the proof mass towards the at least one further fixed capacitor electrode and thereby reduces the lateral spacings between the movable capacitive electrode fingers of the proof mass and the first and second sets of fixed capacitive electrode fingers that provide electrostatic forces for sensing purposes.

Abstract: A novel high resolution, low noise MEMS capacitive accelerometer is disclosed. The accelerometer utilizes a piston-tube electrode configuration that enables the use of a wide area for the electrodes. Therefore, a high capacitive sensitivity is achieved. The accelerometer consists of two structures: upper and lower. The lower structure contains a plurality of fixed electrodes that are attached to the base and have a piston-style shape (teeth). Those pistons form the sensing electrodes of the accelerometer. The upper structure contains a plurality of moving electrodes that have a tube-style shape (through holes), and they are attached to a substrate via restoring mechanical springs. The proof mass of the accelerometer is distributed around these tubes to reduce squeeze thin film damping in the system. The accelerometer is able to sense linear acceleration along the z-axis and/or the angular acceleration about the in-plane axes (x and y).

Abstract: A sensor unit includes: a sensor device including an inertial sensor; a substrate to which the sensor device is bonded; a case member accommodating at least the sensor device; and an adhesive member provided to cover, in a plan view of the substrate as viewed from the case member side, an outer periphery of the sensor device and so as to connect the sensor device with the case member.

Abstract: A user manages security of one or more user devices by manipulating one or more sensors located in the user's mouth in a predetermined pattern corresponding to a password. The matching of the predetermined pattern to the password unlocks at least a portion of at least one user device.

Abstract: Nanopantography is a method for patterning nanofeatures over large areas. Transfer of patterns defined by nanopantography using highly selective plasma etching, with an oxide layer of silicon serving as a hard mask, can improve patterning speed and etch profile. With this method, high aspect ratio features can be fabricated in a substrate with no mask undercut. The ability to fabricate complex patterns using nanopantography, followed by highly selective plasma etching, provides improved patterning speed, feature aspect ratio, and etching profile.

Abstract: Improving noise rejection of a micro-electro-mechanical system (MEMS) microphone by utilizing a membrane sandwiched between oppositely biased backplates is presented herein. The MEMS microphone can comprise a diaphragm that converts an acoustic pressure into an electrical signal; a first backplate capacitively coupled to a first side of the diaphragm—the first backplate biased at a first direct current (DC) voltage; a second backplate capacitively coupled to a second side of the diaphragm—the second backplate biased at a second DC voltage; and an electronic amplifier that buffers the electrical signal to generate a buffered output signal representing the acoustic pressure.

Abstract: An acceleration sensor includes a detection device, an opposed electrode, and a top lid. The detection device includes an active layer, a base layer, an oxide layer disposed between the active layer and the base layer, a first insulating layer, a contact portion, and a self-check electrode. The first insulating layer is disposed on the active layer at a side opposite to the oxide layer and provided with a first opening. The contact portion is disposed on a part of the first insulating layer at a side opposite to the active layer and includes a first metal layer connected to the active layer through the first opening. The opposed electrode is disposed at a location opposing the self-check electrode, and the top lid supports the opposed electrode.

Abstract: A method is provided. The method includes one or more of extracting a die from an original packaged integrated circuit, modifying the extracted die, reconditioning the modified extracted die, placing the reconditioned die into a cavity of a hermetic package base, bonding a plurality of bond wires between reconditioned die pads of the reconditioned die to leads of the hermetic package base or downbonds to create an assembled hermetic package base, and sealing a hermetic package lid to the assembled hermetic package base to create a new packaged integrated circuit. Modifying the extracted die includes removing the one or more ball bonds on the one or more die pads. Reconditioning the modified extracted die includes adding a sequence of metallic layers to bare die pads of the modified extracted die. The extracted die is a fully functional semiconductor die with one or more ball bonds on one or more die pads of the extracted die.

Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) cavity includes forming a first sacrificial cavity layer over a wiring layer and substrate. The method further includes forming an insulator layer over the first sacrificial cavity layer. The method further includes performing a reverse damascene etchback process on the insulator layer. The method further includes planarizing the insulator layer and the first sacrificial cavity layer. The method further includes venting or stripping of the first sacrificial cavity layer to a planar surface for a first cavity of the MEMS.

Abstract: A pressure sensor includes a pressure sensor element, a joint provided to a target member, and an attachment member that is fitted into the joint through the connection section and connected to the target member. Each of the pressure sensor element and the joint is formed of a material that is not embrittled upon being in contact with a fluid to be measured that embrittles a material, and more rigid than the attachment member. The connection section is subjected to a plastic deformation connection (metal flow). An expensive hydrogen embrittlement resistant material is used for the pressure sensor element and the joint that are brought into contact with the fluid to be measured, and an inexpensive material is used for the attachment member that is not brought into contact with the fluid to be measured, thereby reducing the production cost of the pressure sensor.

Abstract: In one embodiment a pressure sensor is provided. The pressure sensor includes a housing having an input port configured to allow a media to enter the housing. A support is mounted within the housing, the support defining a first aperture extending therethrough. A stress isolation member is mounted within the first aperture of the support, the stress isolation member defining a second aperture extending therethrough, wherein the stress isolation member is composed of silicon. sensor die bonded to the stress isolation member. The sensor die includes a silicon substrate having an insulator layer on a first side of the silicon substrate; and sensing circuitry disposed in the insulator layer on the first side, wherein a second side of the silicon substrate is exposed to the second aperture of the stress isolation member and the second side is reverse of the first side.

Abstract: A mechanical memory transistor includes a substrate having formed thereon a source region and a drain region. An oxide is formed upon a portion of the source region and upon a portion of the drain region. A pull up electrode is positioned above the substrate such that a gap is formed between the pull up electrode and the substrate. A movable gate has a first position and a second position. The movable gate is located in the gap between the pull up electrode and the substrate. The movable gate is in contact with the pull up electrode when the movable gate is in a first position and is in contact with the oxide to form a gate region when the movable gate is in the second position. The movable gate, in conjunction with the source region and the drain region and when the movable gate is in the second position, form a transistor that can be utilized as a non-volatile memory element.

Abstract: A composite electronic component includes a capacitor device and a resistor device disposed on one another in a heightwise direction. The capacitor device includes a capacitor body, a first external electrode, and a second external electrode. The resistor device includes a base portion, a resistor body, a first upper surface conductor, a second upper surface conductor, a first lower surface conductor, a second lower surface conductor, a first end surface connection conductor, and a second end surface connection conductor. An upper surface of the base portion of the resistor device faces a lower surface of the capacitor body of the capacitor device, the first upper surface conductor and the first external electrode are electrically connected, and the second upper surface conductor and the second external electrode are electrically connected.

Abstract: The present disclosure relates to a MEMs package having a heating element configured to adjust a pressure within a hermetically sealed chamber by inducing out-gassing of into the chamber, and an associated method. In some embodiments, the MEMs package has a CMOS substrate having one or more semiconductor devices arranged within a semiconductor body. A MEMs structure is connected to the CMOS substrate and has a micro-electromechanical (MEMs) device. The CMOS substrate and the MEMs structure form a hermetically sealed chamber abutting the MEMs device. A heating element is electrically coupled to the one or more semiconductor devices and is separated from the hermetically sealed chamber by an out-gassing layer arranged along an interior surface of the hermetically sealed chamber. By operating the heating element to cause the out-gassing layer to release a gas, the pressure of the hermetically sealed chamber can be adjusted after it is formed.

Abstract: A power electronics assembly includes a semiconductor device, a metal substrate, and a cooling structure. The metal substrate includes a plurality of stress-relief features that extend at least partially through a thickness of the metal substrate. The plurality of stress-relief features are at least partially filled with a transient liquid phase (TLP) bonding material. The semiconductor device is positioned over the plurality of stress-relief features and thermally bonded to the metal substrate via TLP bonding material. Vehicles having power electronics assemblies with stress-relief through-features are also disclosed.

Abstract: A sensor is achieved by applying a layer of a mixture that contains polymer and conductive particles over a substrate or first surface, when the mixture has a first viscosity that allows the conductive particles to rearrange within the material. An electric field is applied over the layer, so that a number of the conductive particles are assembled into one or more chain-like conductive pathways with the field and thereafter the viscosity of the layer is changed to a second, higher viscosity, in order to mechanically stabilize the material. The conductivity of the pathway is highly sensitive to the deformations and it can therefore act as deformation sensor. The pathways can be transparent and is thus suited for conductive and resistive touch screens. Other sensors such as strain gauge and vapor sensor can also be achieved.

Abstract: A module includes a sensor device, a mounting substrate that has a plurality of mounting faces, a portion between the mounting faces adjacent to each other being foldable, a supporting member having fixing faces, wherein the sensor device is mounted on at least one of the mounting faces, each of the mounting faces is disposed along each of the fixing faces, and the sensor device is disposed on the supporting member side.

Abstract: Embodiments of a lead frame for a packaged semiconductor device are provided, one embodiment including: a die pad; a first row of active lead fingers that are laterally separated from one another along their entire length; a package body perimeter that indicates placement of a package body of the packaged semiconductor device, wherein the package body perimeter is located laterally around the die pad; a first dummy lead finger positioned in parallel next to an initial active lead finger of the first row of active lead fingers, wherein the first dummy lead finger and the initial active lead finger are laterally separated from one another along their entire length, and wherein the first dummy lead finger is separated from the package body perimeter by a gap distance; and a first tie bar connected to an outside edge of the first dummy lead finger.

Abstract: A sensor is disclosed for detecting a rotational motion about a resulting sensitivity axis. The sensor includes at least two dual mass gyroscope units, each of the gyroscope units are adapted to detect a rotational motion about a sensitivity axis of the respective gyroscope unit. The sensitivity axes being parallel to each other and to the resulting sensitivity axis. The gyroscope units are interconnected at the inertial masses of the gyroscope units which cause the gyroscope unit to operate synchronously.

Abstract: A process for fabricating relatively thin SiC diaphragms may include fast Reactive Ion Etching (RIE) followed by Dopant Selective Reactive Ion Etching (DSRIE). The process may produce silicon carbide (SiC) diaphragms thinner than 10 microns. These thinner, more sensitive diaphragms may then be used to effectively resolve sub-psi pressures in jet engines, for example.

Abstract: A semiconductor sensor device is assembled using a lead frame having a flag surrounded by lead fingers. A pressure sensor die is mounted on the flag and electrically connected to the leads. Prior to encapsulation, a pre-formed block of gel material is placed over the sensor region on the die. Encapsulation is performed and mold compound covers the pressure sensor die and the bond wires. Mold compound covering the gel block may be removed. Additionally, a trench may be formed around an upper portion of the gel block so that the lateral sides of the gel block are at least partially exposed.