Abstract: A light-emitting diode including a semiconductor epitaxial layer, a first electrode, and a second electrode is provided. The semiconductor epitaxial layer includes a first-type doped semiconductor layer, a second-type doped semiconductor layer, and a quantum well layer. A recessed portion is formed in the semiconductor epitaxial layer. The recessed portion separates the second-type doped semiconductor layer, the quantum well layer, and a portion of the first-type doped semiconductor layer and defines a first region and a second region on the semiconductor epitaxial layer. The first electrode is located in the first region and electrically connected to at least a portion of the first-type doped semiconductor layer and at least a portion of the second-type doped semiconductor layer. The second electrode is located in the second region and electrically connected to the second-type doped semiconductor layer.

Abstract: A method for fabricating a micro-LED module is disclosed. The method includes: preparing a micro-LED including a plurality of electrode pads and a plurality of LED cells; preparing a submount substrate including a plurality of electrodes corresponding to the plurality of electrode pads; and flip-bonding the micro-LED to the submount substrate through a plurality of solders located between the plurality of electrode pads and the plurality of electrodes. The flip-bonding includes heating the plurality of solders by a laser.

Abstract: A semiconductor light-emitting device includes a base, a light-emitting element and a sealing resin. The base includes an obverse surface and a reverse surface spaced in a first direction, first side surfaces spaced in a second direction crossing the first direction, and second side surfaces spaced in a third direction crossing the first and second directions. The light-emitting element is on the base obverse surface. The sealing resin for covering the light-emitting element is smaller than the base in plan. The base has a wiring pattern connected to the light-emitting element and including an obverse surface electrode on the base obverse surface. The base also has a resist layer including a pattern-covering portion overlapping with the obverse surface electrode. The pattern-covering portion includes a resin outflow preventing portion, disposed outside the sealing resin in plan and extends continuously from one second side surface to the other.

Abstract: An optical transmission module includes a receptacle-type optical part, a holder part, and a cover part. The receptacle-type optical part includes a resin molding and a device part. The resin molding is provided with a ferrule insertion hole extending in a first direction and a first fitting part in a surface perpendicular to the first direction. The holder part contains resin and includes a back surface plate provided with a second fitting part fitted to the first fitting part and an upper surface plate provided with a third fitting part provided in parallel to the first direction. The cover part is inserted along the first direction between the holder and receptacle-type optical part. The cover part includes an upper surface plate provided with a fourth fitting part capable of fitting to the third fitting part. The cover part is extractable along the first direction from a housed position.

Abstract: Disclosed is a lighting assembly including a substrate, at least one electrode region, and a light emitting region. The light emitting region surrounds at least one surrounded electrode region of the at least one electrode region. Also disclosed is a lighting device including the lighting assembly.

Abstract: Embodiments relate to a light emitting device package having an improved luminous flux, and the light emitting device package includes a body including a cavity, a first lead frame and a second lead frame exposed on a bottom surface of the cavity and separate from each other by an electrode separating member, a first light emitting device disposed on the first lead frame, a second light emitting device disposed on the second lead frame, and a Zener diode disposed on the first lead frame or the second lead frame, and disposed more closely to the electrode separating member than to the first light emitting device and the second light emitting device. Here, the electrode separating member diagonally separate the first lead frame and the second lead frame along a width direction of the body.

Abstract: An LED module is provided with a lead, an LED chip mounted on the obverse surface of the lead, and a case covering at least a part of the lead. The case has a side wall surrounding the LED chip. The lead includes a thin extension whose bottom surface is spaced apart upward from the reverse surface of the lead in the thickness direction of the lead. The case is provided with a holding portion that covers at least a part of each of the top surface and the bottom surface of the first thin extension.

Abstract: Disclosed herein are methods for welding a first substrate and a second substrate, the method comprising bringing the first and second substrates into contact to form a substrate interface, and directing a laser beam operating at a predetermined wavelength through the second substrate onto the substrate interface, wherein the first substrate absorbs light from the laser beam in an amount sufficient to form a weld between the first substrate and the second substrate. The disclosure also relates to glass and/or glass-ceramic packaging and OLED display produced according to the methods disclosed herein.

Abstract: An LED bracket, an LED device and an LED display screen are disclosed. The LED bracket includes a metal bracket and a cup cover wrapping the metal bracket. The metal bracket includes a first metal pin embedded into the cup cover and a second metal pin exposed from the cup cover. A part, located on a top of the second metal pin, in the cup cover is a reflection cup. A light absorbing layer is disposed on a part of an outer side face of the reflection cup.

Abstract: A light emitting device in which a bonding pad is soldered to a mounting substrate, wherein the bonding pad may be formed in various shapes that can minimize the occurrence of voids during soldering or heat fusion.

Abstract: A substrate (5A) includes an aluminum substrate body (10), a reflection layer (12) that is formed between an electrode pattern (20) which obtains electrical connection with a light emitting element (6) and the aluminum substrate body (10) and that contains first ceramics which reflect light from the light emitting element (6), and an intermediate layer (11) that contains second ceramics which are formed by thermal spraying and reinforces dielectric strength performance of the reflection layer (12).

Abstract: The present invention relates to a display device and, particularly, to a display device using semiconductor light-emitting diodes. In the display device according to the present invention, at least one of the semiconductor light-emitting diodes comprises: a first conductive electrode and a second conductive electrode; a first conductive semiconductor layer having the first conductive electrode arranged thereon; a second conductive semiconductor layer overlapping with the first conductive semiconductor layer in a vertical direction, and having the second conductive electrode arranged thereon; and an active layer arranged between the first conductive semiconductor layer and the second conductive semiconductor layer, wherein a connecting unit electrically connected to the first conductive electrode is formed on one surface of the first conductive semiconductor layer, and the connecting unit is arranged so as to lean to one side on the basis of the second conductive electrode along the horizontal direction.

Abstract: One embodiment of a system and method for imaging objects from a barcode scanner may include generating a first color light source drive signal having a first duty cycle and a second color light source drive signal having a second duty cycle that is greater than the first duty cycle. In response to applying the first and second color light source drive signals to first and second color light sources, respectively, combining light beams generated by the first and second color light sources to produce a white illumination beam. An image sensor may generate image data of an object inclusive of a chine readable indicia captured in an image by the image sensor while illuminated by the white illumination beam. The machine readable indicia of the object in the image data may be read.

Abstract: An organic electroluminescent display device and a manufacturing method thereof are disclosed. The organic electroluminescent display device includes a substrate, a first thin film transistor disposed on the substrate, a second thin film transistor disposed on the first thin film transistor, a first light emitting element electrically connected with a drain of the first thin film transistor, wherein the first light emitting element comprises a first electrode, a first light emitting layer and a second electrode which are stacked, a second light emitting element electrically connected with a drain of the second thin film transistor, wherein the second light emitting element is disposed on the second thin film transistor and comprises a third electrode, a second light emitting layer and a fourth electrode, wherein the second light emitting element is configured to emit white light.

Abstract: An embodiment relates to a light-emitting device comprising: a light-emitting structure which comprises a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer, and comprises a plurality of first recesses passing through the second conductive semiconductor layer and active layer and disposed on a part of an area of the first conductive semiconductor layer; a first electrode which is electrically connected to the first conductive semiconductor layer inside the plurality of first recesses; a conductive support substrate which is electrically connected to the first electrode; a second electrode which is electrically connected to the second conductive semiconductor layer; and an insulating layer which is disposed between the conductive support substrate and second conductive semiconductor layer, wherein a second recess passes through the first conductive semiconducto

Abstract: Provided are a perovskite light emitting device containing an exciton buffer layer, and a method for manufacturing the same. A light emitting device of the present invention comprises: an exciton buffer layer in which a first electrode, a conductive layer disposed on the first electrode and comprising a conductive material, and a surface buffer layer containing fluorine-based material having lower surface energy than the conductive material are sequentially deposited; a light-emitting layer disposed on the exciton buffer layer and containing an organic-inorganic hybrid perovskite light emitting body; and a second electrode disposed on the light-emitting layer.

Abstract: A light emitting device includes a light emitting element; a light reflecting member having an Ag-containing layer on a surface thereof; and a protective film having a thickness of 1 nm to 300 nm and covering a surface of the light reflecting member, the protective film covering a surface of the light reflecting member, in which the Ag-containing layer has a thickness of 0.1 ?m to 0.5 ?m.

Abstract: A curable organopolysiloxane composition which is capable of maintaining the refractive index and gas barrier at a certain level by incorporating diphenyl group into a silicone resin and maintaining the phenyl content at a certain level.

Abstract: The light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer under the first conductive semiconductor layer, and a second conductive semiconductor layer under the active layer; a plurality of first electrodes disposed under the light emitting structure and electrically connected to the first conductive semiconductor layer by passing through the second conductive semiconductor layer, the active layer and a portion of the first conductive semiconductor layer; a second electrode disposed under the light emitting structure to be electrically connected to the second conductive semiconductor layer; a first insulating layer disposed around the first electrode to insulate the first electrode from the second electrode; a bonding layer electrically connected to the second electrode by passing through the first electrode and the first insulating layer; and a second insulating layer around the bonding layer.

Abstract: A light-emitting diode (LED) chip including a first semiconductor layer; an active layer disposed on the first semiconductor layer; a second semiconductor layer disposed on said active layer; one or a plurality of indentations, comprising a bottom part extending downward through the second semiconductor layer and the active layer to reach the first semiconductor layer and exposing the first semiconductor layer; a plurality of metal layers, comprising a first metal layer connecting to the first semiconductor layer through the bottom part, and a second metal layer deposited on the first metal layer; and an insulating layer formed between the first and the second metal layers, disposed on the indentation and covering the first metal layer, wherein the second metal layer comprises one or a plurality of recesses at a top surface thereof corresponding to the one or plurality of indentations.

Abstract: An organic light-emitting panel includes a reflective electrode, a functional layer, having a single or multi-layer structure, located on the reflective electrode, an organic light-emitting layer located on the functional layer, a transparent electrode located above the organic light-emitting layer, a low refractive index layer located on the transparent electrode, and a first thin-film sealing layer located on the low refractive index layer. The low refractive index layer has a lower refractive index than both the transparent electrode and the first thin-film sealing layer. Difference between respective refractive indices of the low refractive index layer and the transparent electrode is 0.4-1.1. Difference between respective refractive indices of the low refractive index layer and the first thin-film sealing layer is 0.1-0.8. The low refractive index layer has thickness of 20-130 nm.

Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.

Abstract: There are provided an electronic device including a first electrode, a second electrode and a photoelectric conversion layer sandwiched between the first electrode and the second electrode, the first electrode including an amorphous oxide composed of at least a quaternary compound of indium, gallium and/or aluminum, zinc and oxygen, and a difference between a work function value of the second electrode and a work function value of the first electrode being 0.4 eV or more; and a method of producing an electrode for the electronic device.

Abstract: An embodiment of the invention provides apparatus for providing light pulses comprising a light source electrically connected to a low inductance configuration of electrodes for electrically connecting the light source to a power supply.

Abstract: An electromagnetic radiation-emitting assembly is disclosed. In an embodiment the assembly includes an electromagnetic radiation-emitting component arranged above a carrier, the electromagnetic radiation-emitting component including a first side facing away from the carrier, a second side facing the carrier, and at least one side wall connecting the first side and the second side of the electromagnetic radiation-emitting component to one another, an encapsulating body, into which the electromagnetic radiation-emitting component is embedded, which adjoins the first side and the side wall of the electromagnetic radiation-emitting component, a potting material at least partly surrounding the encapsulating body and a reflector body at least partly surrounding the potting material.

Abstract: The present invention discloses a transferring method, a manufacturing method, a device and an electronic apparatus of micro-LED. The method for transferring micro-LED comprises: forming micro-LEDs on a laser-transparent original substrate; irradiating the original substrate with laser from the original substrate side to lift-off the micro-LEDs from the original substrate; bring the micro-LEDs into contact with pads preset on a receiving substrate through a contactless action.

Abstract: An optoelectronic package includes a wiring substrate having a holding plane, an optoelectronic chip, a reflective material, an optical element and an adhesive. The optoelectronic chip is mounted on the holding plane and electrically connected to the wiring substrate. The optoelectronic chip has an upper surface, a functional region and a side surface connected to the upper surface. The reflective material is on the holding plane and surrounds the optoelectronic chip. The reflective material covers the side surface and has an inclined surface. The inclined surface surrounds the upper surface and extends from an edge of the upper surface. The height of the reflective material at the inclined surface decreases from the optoelectronic chip toward a direction away from the optoelectronic chip. The adhesive covers the reflective material and the upper surface and is connected between the optoelectronic chip and the optical element.

Abstract: A bank partitions a plurality of pixels and has an opening in each of the plurality of pixels. An organic layer includes a light emitting layer, and covers the bank opening. A first inorganic barrier layer is formed of an inorganic material, and covers the bank and the organic layer. A plurality of organic barrier portions are formed of organic materials, and are disposed on the first inorganic barrier layer. A second inorganic barrier layer is formed of the inorganic material, and covers the first inorganic barrier layer and the plurality of organic barrier portions. A recessed portion is formed on the bank and the first inorganic barrier layer (for example, the recessed portion is formed in an area which covers a contact hole), and a portion of the organic barrier portion is formed in the recessed portion.

Abstract: An LED module includes: a substrate having a main surface and a back surface which face in opposite directions from each other in a thickness direction; a first LED chip including a first electrode pad bonded to a surface facing the same direction as the main surface; a first wire having one end bonded to the first electrode pad; and a wiring pattern having a main surface electrode formed in the main surface, wherein the main surface electrode includes a first die pad portion which supports the first LED chip, and when viewed from the thickness direction, the first die pad portion includes a main pad portion to which the first LED chip is bonded and an auxiliary pad portion which protrudes from the main pad portion in a direction toward a position of the first electrode pad from the center position in the first LED chip.

Abstract: A light emitting device in which a bonding pad is soldered to a mounting substrate, wherein the bonding pad may be formed in various shapes that can minimize the occurrence of voids during soldering or heat fusion.

Abstract: A surface mount emissive element is provided with a top surface and a bottom surface. A first electrical contact is formed exclusively on the top surface, and a second electrical contact is formed exclusively on the top surface. A post extends from the bottom surface. An emissive display is also provided made from surface mount emissive elements and an emissions substrate. The emissions substrate has a top surface with a first plurality of wells formed in the emissions substrate top surface. Each well has a bottom surface, sidewalls, a first electrical interface formed on the bottom surface, and a second electrical interface formed on the bottom surface. The emissions substrate also includes a matrix of column and row conductive traces forming a first plurality of column/row intersections, where each column/row intersection is associated with a corresponding well. A first plurality of emissive elements populates the wells.

Abstract: A method of producing optoelectronic semiconductor components includes providing a carrier with a carrier underside and a carrier top. The carrier has a metallic core material and at least on the carrier top a metal layer. A dielectric mirror is applied to the core material. At least two holes are formed through the carrier. A ceramic layer with a thickness of at most 150 ?m at least on the carrier underside and in the holes is produced. The ceramic layer includes the core material as a component. Metallic contact layers are applied to at least subregions of the ceramic layer on the carrier underside and in the holes so that the carrier top electrically connects to the carrier underside through the holes. At least one radiation-emitting semiconductor chip is applied to the carrier top and the semiconductor chip is electronically bonded to the contact layers.

Abstract: A light-emitting diode and a light module are disclosed. In an embodiment the light-emitting diode includes at least one light-emitting diode chip and a first optical element, which is reflective for light generated by the at least one light-emitting diode chip during operation, wherein the first optical element completely covers at least one of the at least one light-emitting diode chip in a plan view.

Abstract: Disclosed is a light emitting device. The light emitting device comprises: a first lead and a second lead which are spaced apart from each other; a body part comprising a base, a reflector, and a cavity; and a light emitting diode which is disposed in the cavity, wherein the first lead includes a first bottom lead and a first top lead located on the first bottom lead, and the second lead includes a second bottom lead and a second top lead located on the second bottom lead, and wherein a separation region between the first top lead and the second top lead has a different shape than the separation region between the first bottom lead and the second bottom lead, the separation region between the first top lead and the second top lead having a shape bent at least once.

Abstract: A light emitting device includes: a resin package including: a plurality of leads that includes: a first lead having an upper surface, and a second lead having an upper surface, and a resin body that includes: a first resin portion, a second resin portion, a third resin portion disposed between the first lead and the second lead, and a resin connection portion, the plurality of leads and the at least one inner lateral wall surface of the first resin portion defining a recess, the second resin portion surrounding an element mounting region, and the resin connection portion connecting the first resin portion and the second resin portion at the bottom of the recess; at least one light emitting element disposed on the element mounting region; and a light-reflective member disposed between the inner lateral wall surface and the second resin portion in the recess.

Abstract: A method of manufacturing a light emitting element mounting base member includes: arranging a plurality of core members each including an electrical conductor core and a light-reflecting insulating member provided on a surface of the electrical conductor core; cutting the arranged core members to form a base member preparatory body including at least one cut surface on which at least one of the electrical conductor cores and the insulating members are exposed; and insert molding by placing the base member preparatory body in a set of mold, and injecting a light blocking resin composition into the set of mold such that at least one of the electrical conductor cores or at least one metal film formed on at least one of the electrical conductor cores are exposed on at least one outer surface of the light emitting element mounting base member.

Abstract: A flip-chip light emitting device includes: a light-emitting epitaxial laminated layer with two opposite surfaces, in which, the first surface is a light-emitting surface; a first electrode and a second electrode that are separated from each other on the second surface of the light-emitting epitaxial laminated layer; a non-conductive substrate with two opposite surfaces and two side walls connecting those two surfaces, in which, the first surface is connected to the light-emitting epitaxial laminated layer through the first and the second electrodes; a first external electrode and a second external electrode on the second surface of the non-conductive substrate, which extend to the side walls of the non-conductive substrate till and at least cover parts of the side walls of the first and the second electrodes to form electrical connection.

Abstract: The invention relates to an organic light-emitting component which has an organic functional layer stack (3) having at least one light-emitting layer, which is designed to generate light during operation of the component, a transparent first electrode (2) and a transparent second electrode (4), which are designed to inject charge carriers into the organic functional layer stack (3) during operation, and a heat distribution layer (9), which is applied over the electrodes (2, 4) and the organic functional layer stack (3) and which has at least one plastic layer (10) and a highly heat conductive layer (11), wherein the heat distribution layer (9) has at least one transparent sub-region (91) and at least one non-transparent sub-region (92).

Abstract: An organic light emitting diode display according to an exemplary embodiment of the present disclosure includes: a substrate; a first electrode disposed on the substrate; an auxiliary electrode formed at the same layer as the first electrode; a pixel defining layer having a first contact hole overlapping a part of the auxiliary electrode; an organic light emitting member disposed on the pixel defining layer and having a second contact hole enclosing the first contact hole; and a second electrode disposed on the organic light emitting member and inside the first contact hole and the second contact hole, wherein the second electrode is in contact with the auxiliary electrode through the first contact hole and the second contact hole.

Abstract: A method for manufacturing a package includes a step of injecting a first resin through an injection port of a dies in which a lead frame has been placed. The method includes a step of cutting out a portion of a border between a first electrode and a first connection portion running through a first through hole, and cutting out a portion of a border between a second electrode and a second connection portion running through a second through hole after molding the first resin. The method includes a step of electroplating the first and second electrodes. The method includes a step of cutting out a remaining portion of the border between the first electrode and the first connection portion, and cutting out a remaining portion of the border between the second electrode and the second connection portion.

Abstract: Provided is an LED device presenting minimal risk of bottom-surface contamination even when foreign substances such as liquids adhere thereto. The LED device has an LED die, a submount substrate on the surface of which the LED die is mounted, a frame-shaped electrode disposed along the outer circumferential part of the bottom surface of the submount substrate, and an inner-side electrode surrounded by the frame-shaped electrode and connected to the electrode of the LED die. In the LED device, the frame-shaped electrode is disposed along the entire outer circumferential part of the bottom surface. In an LED device, the bottom surface is rectangular, and the frame-shaped electrode is disposed along three sides of the bottom surface.

Abstract: An optical module includes: a stem; a temperature control module; a carrier; a light emitting element fixed on a light emitting element fixing surface of the carrier, having a front surface and a rear surface opposite to each other, emitting signal light from a first emission point in the front surface, and emitting back light from a second emission point in the rear surface; a light receiving element fixed on the carrier by a light receiving element fixing surface; a lens cap; and a lens, wherein a reflecting surface is provided on the carrier, the light receiving element receives the back light reflected by the reflecting surface, and a center of a light receiving surface of the light receiving element is positioned between the front surface and the rear surface in an optical axis direction of the signal light.

Abstract: A display device includes a display panel that displays an image, a drive circuit that outputs a drive signal to the display panel, a power supply line that is formed in the display panel to supply a power supply voltage to the drive circuit, and a ground line that is formed in the display panel to supply a ground potential to the drive circuit. At least parts of the power supply line and the ground line overlap each other in planar view with an insulator interposed therebetween.

Abstract: Apparatus for providing pulsed or continuous energy in a process chamber are provided herein. The apparatus may include a base having a plurality of vias formed in a bottom surface of the base, and wherein an electrical connector is disposed in each via, a first metallic layer disposed on a top surface of the base and electrically coupled to the electrical connectors disposed in the plurality of via, and a plurality of solid state light sources disposed on a top surface of the metallic layer and electrically coupled to the metallic layer.

Abstract: A light emitting device includes a package having a recess which includes a bottom surface and an inner peripheral surface around a periphery of the bottom surface. The package includes a first lead to define a first part of the bottom surface, a second lead to define a second part of the bottom surface, and a resin body to provide the inner peripheral surface and a remaining part of the bottom surface. The bottom surface includes a light emitting element mounting region in the first part and a groove surrounding the light emitting element mounting region. A light emitting element is mounted on the light emitting element mounting region. A light-transmissive resin is provided in the recess to be in at least a part of a groove surface. A light reflecting resin is provided between the inner peripheral surface of the recess and the light-transmissive resin.

Abstract: An electronic component includes a connection carrier having a cover surface, a first electric connection point and a second electric connection point, and an organic active area. A first electrode interconnects in an electrically conductive manner the active area and the first electric connection point. An encapsulation layer protects the active area against humidity and atmospheric gases. The electronic component can be contacted from the outside by the electric connection points and the encapsulation layer is in direct contact, in places, with the connection carrier.

Abstract: According to one embodiment, a semiconductor memory device includes a plurality of first interconnects extending in a first direction, a plurality of second interconnects extending in a second direction, a plurality of stacked films respectively provided between the first interconnects and the second interconnects, each of the plurality of stacked films including a variable resistance film, a first inter-layer insulating film provided in a first region between the stacked films, and a second inter-layer insulating film provided in a second region having a wider width than the first region. The second inter-layer insulating film includes a plurality of protrusions configured to support one portion of the plurality of second interconnects on the second region. A protruding length of the protrusions is less than a stacking height of the stacked films.

Abstract: There is proposed an illuminating device, comprising (a) a luminous element, (b) a support, and (c) a primary optical element, characterized in that (i) said luminous element (a) is present on the support (b), and (ii) said primary optical element (c) is arranged on a composite of luminous element (a) and support (b) in such a way that it takes up, directs and emits the radiation emerging from the luminous element in the desired light distribution, wherein (iii) said primary optical element (c) is fabricated from a high refractive index glass and (iv) attached to the support by direct bonding.

Abstract: A light-emitting device may include separate, first and second light-emitting structures that are isolated from direct contact with each other on a phototransmissive substrate. Each light-emitting structure may include a first conductivity-type semiconductor layer, an active layer on the first conductivity-type semiconductor layer, and a second conductivity-type semiconductor layer on the active layer. The first and second light-emitting structures may be electrically connected to each other. An inter-structure conductive layer may electrically interconnect the first conductivity-type semiconductor layer of the first light-emitting structure to the second conductivity-type semiconductor layer of the second light-emitting structure. The second light-emitting structure may include a finger structure extending from an outer edge of the second light-emitting structure toward an interior of the second light-emitting structure.

Abstract: A method for binding a micro device to a conductive pad of an array substrate is provided. The method includes: forming a liquid layer on the conductive pad of the array substrate; disposing the micro device over the conductive pad such that the micro device is in contact with the liquid layer and is gripped by a capillary force produced by the liquid layer between the micro device and the conductive pad, wherein the micro device comprises an electrode facing the conductive pad; and evaporating the liquid layer such that the electrode is bound to and is in electrical contact with the conductive pad.