For Structural Parameters, E.g., Thickness, Line Width, Refractive Index, Temperature, Warp, Bond Strength, Defects, Optical Inspection, Electrical Measurement Of Structural Dimensions, Metallurgic Measurement Of Diffusions (epo) Patents (Class 257/E21.53)
  • Patent number: 11011490
    Abstract: An assembly includes at least one first element comprising at least one first electrical bonding pad; at least one second element comprising at least one second electrical bonding pad; electrical and mechanical interconnect means, wherein the electrical and mechanical interconnect means comprise at least: at least one first intermediate metal interconnect element, on the surface of at least the first electrical bonding pad; at least one sintered joint of metal microparticles or nanoparticles stacked with the first intermediate metal interconnect element; the melting point of the first intermediate metal interconnect element being greater than the sintering temperature of the metal microparticles or nanoparticles. A method for fabricating an assembly is also provided.
    Type: Grant
    Filed: January 26, 2017
    Date of Patent: May 18, 2021
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Rabih Khazaka, Benoît Thollin
  • Patent number: 10957609
    Abstract: A method includes performing Chemical Mechanical Polish (CMP) on a wafer, placing the wafer on a chuck, performing a post-CMP cleaning on the wafer, and determining cleanness of the wafer when the wafer is located on the chuck.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: March 23, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yu-Ting Yen, Chi-Ming Tsai, Hui-Chi Huang
  • Patent number: 10928418
    Abstract: A scanning probe microscope with a first actuator (3) configured to move a feature in the form of a tip (2) so that the feature follows a scanning motion. A vision system (10) is configured to collect light from a field of view to generate image data. The field of view includes the feature and the light from the field of view travels from the feature to the vision system via the steering element (13). A tracking control system (15)bis configured to generate one or more tracking drive signals in accordance with stored reference data. A second actuator (14) is configured to receive the one or more tracking drive signals and move the steering element on the basis of the one or more tracking drive signals so that the field of view follows a tracking motion which is synchronous with the scanning motion and the feature remains within the field of view.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: February 23, 2021
    Assignee: INFINITESIMA LIMITED
    Inventors: Andrew Humphris, David Gray
  • Patent number: 10876979
    Abstract: Provided are a processing method, a processing apparatus and a processing program which can perform pole figure measurement continuously without overlapping of an angle a in a pole figure with the small number of times of ? scan, thereby enabling the efficient measurement. The processing method for determining conditions of pole figure measurement by X-ray diffraction, includes the steps of. receiving input of a diffraction angle 2?; and determining an angle ? formed by an incident X-ray and an x-axis, and a tilt angle ? of a sample in each ? scan for a rotation angle ? within a sample plane so as to make a range of an angle a continuous from ?=90° to ?=0° without overlapping, the angle ? being formed by the sample plane and a scattering vector, the range of the angle ? are detectable at a time on a two-dimensional detection plane in the pole figure measurement at the diffraction angle 2?, in which determining the angle ? and the tilt angle ? is repeated.
    Type: Grant
    Filed: June 9, 2017
    Date of Patent: December 29, 2020
    Assignee: RIGAKU CORPORATION
    Inventors: Hisashi Konaka, Akihiro Himeda, Toru Mitsunaga, Keigo Nagao
  • Patent number: 10871515
    Abstract: Provided is a method of measuring the Fe concentration in a p-type silicon wafer by the SPV method, by which the detection limit for the Fe concentration can be lowered, and the measurement can be performed in a short time. The measurement by the SPV method is performed in a measurement mode in which irradiation with a plurality of lights having mutually different wavelengths is performed during the same period under conditions where (i) Time Between Readings is 35 ms or more and 120 ms or less and Time Constant is 20 ms or more, or Time Between Readings is 10 ms or more and less than 35 ms and Time Constant is 100 ms or more, and (ii) Number of Readings is 12 times or less.
    Type: Grant
    Filed: September 5, 2016
    Date of Patent: December 22, 2020
    Assignee: SUMCO CORPORATION
    Inventors: Shinya Fukushima, Masahiko Mizuta
  • Patent number: 10867873
    Abstract: A method and a device for measuring a plurality of semiconductor chips in a wafer array are disclosed. In an embodiment a method for measuring the semiconductor chips in a wafer array, wherein the wafer array is arranged on an electrically conductive carrier so that in each case back contacts of the semiconductor chips are contacted by the carrier, wherein a contact structure is arranged on a side of the wafer array facing away from the carrier, and wherein the contact structure includes a contact element and/or a plurality of radiation-emitting measurement semiconductor chips, includes applying a voltage between the contact structure and the carrier and measuring the semiconductor chips depending on a luminous image which is generated by emitted radiation which is caused simultaneously by fluorescence when the semiconductor chips are illuminated or by a radiation-emitting operation of the measurement semiconductor chips when the voltage is applied.
    Type: Grant
    Filed: July 25, 2017
    Date of Patent: December 15, 2020
    Assignee: OSRAM OLED GMBH
    Inventors: Holger Specht, Roland Zeisel, Anton Vogl, Jens Ebbecke
  • Patent number: 10854384
    Abstract: A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer and first and second internal electrodes alternately exposed to first and second outer surfaces with the dielectric layer interposed therebetween; and first and second external electrodes disposed on the first and second outer surfaces of the ceramic body so as to be connected to the first and second internal electrodes, respectively. The first internal electrode has a plurality of first ends connected to the first external electrode and a first recessed region positioned between the plurality of first ends, the first recessed region at least partially filled with a dielectric material. The second internal electrode has a plurality of second ends connected to the second external electrode and a second recessed region positioned between the plurality of second ends, the second recessed region at least partially filled with the dielectric material.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: December 1, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sun Cheol Lee, Gi Seok Jeong, Ho In Jun
  • Patent number: 10801976
    Abstract: A method for displaying measurement results from X-ray diffraction measurement, in which a sample is irradiated with X-rays and the X-rays diffracted by the sample are detected by an X-ray detector, comprises: (1) forming a one-dimensional diffraction profile by displaying, on the basis of output data from an X-ray detector, a profile in which one orthogonal coordinate axis shows 2? angle values and another orthogonal coordinate axis shows X-ray intensity values; (2) forming a two-dimensional diffraction pattern by linearly displaying X-ray intensity data, for each 2? angle value and on the basis of output data from the X-ray detector; the X-ray intensity data being present in the circumferential direction of a plurality of Debye rings formed at each 2? angle by diffracted X-rays; and (3) displaying the two-dimensional diffraction pattern and the one-dimensional diffraction profile so as to be aligned such that the 2? angle values of both coincide with each other.
    Type: Grant
    Filed: August 17, 2018
    Date of Patent: October 13, 2020
    Assignee: RIGAKU CORPORATION
    Inventors: Akito Sasaki, Akihiro Himeda, Yukiko Ikeda, Keigo Nagao
  • Patent number: 10790206
    Abstract: Testing structures, and their fabrication methods and testing methods are provided. An exemplary testing structure includes a base substrate containing a well region; a first doped epitaxial region in the well region and having a doping type same as a doping type of the well region; a dielectric layer on the base substrate and covering the well region and the first doped epitaxial region; a first contact plug passing through the dielectric layer and electrically connected with the first well region; and a second contact plug and a third contact plug. The second contact plug and the third contact plug pass through the dielectric layer and electrically connected with the first doped epitaxial region. The second contact plug is independent from the third contact plug and between the first contact plug and the third contact plug.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: September 29, 2020
    Assignees: Semiconductor Manufacturing International (Shanghai) Corporation, Semiconductor Manufacturing International (Beijing) Corporation
    Inventor: Yong Li
  • Patent number: 10739275
    Abstract: Disclosed is apparatus for inspecting a sample. The apparatus includes illumination optics for simultaneously directing a plurality of incident beams at a plurality of azimuth angles towards a sample and collection optics for directing a plurality of field portions of output light from two or more of the plurality of angles towards two or more corresponding sensors. The two or more sensors are arranged for receiving the field portions corresponding to two or more angles and generating two or more corresponding images. The apparatus further comprises a processor for analyzing the two or more images to detect defects on the sample.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: August 11, 2020
    Assignee: KLA-Tencor Corporation
    Inventors: Guoheng Zhao, Sheng Liu, Ben-ming Benjamin Tsai
  • Patent number: 10720345
    Abstract: Techniques and mechanisms for forming a bond between two wafers. In an embodiment, a first wafer and a second wafer are positioned with respective wafer holders, and are deformed to form a first deformation of the first wafer and a second deformation of the second wafer. The first deformation and the second deformation are symmetrical with respect to a centerline which is between the first wafer and the second wafer. A portion of the first deformation is made to contact, and form a bond with, another portion of the second deformation. The bond is propagated along respective surfaces of the wafers to form a coupling therebetween. In another embodiment, one of the wafer holders comprises one of an array of elements to locally heat or cool a wafer, or an array of displacement stages to locally deform said wafer.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: July 21, 2020
    Assignee: Intel Corporation
    Inventors: Mauro J. Kobrinsky, Myra McDonnell, Brennen K. Mueller, Chytra Pawashe, Daniel Pantuso, Paul B. Fischer, Lance C. Hibbeler, Martin Weiss
  • Patent number: 10682596
    Abstract: The application generally relates to digital Engine Integrity Protection (EIP) systems for filters for internal combustion engines and methods of using the digital EIP systems. A pre-programmed digital chip is integrated in filtration hardware such that the Engine Control Unit (ECU) or another controller installed on the engine or vehicle can read encrypted digital signal from the chip when electrically connected with the filter hardware. Based on the read information from the chip, the ECU or controller can determine whether the filter associated with the chip is a genuine filter or a non-genuine filter.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: June 16, 2020
    Assignee: CUMMINS FILTRATION IP, INC.
    Inventors: Abhijit Shimpi, Andry Lesmana, Adaeze Okoye, Joseph Okoro
  • Patent number: 10669210
    Abstract: Provided is a large-sized silicon nitride sintered substrate and a method for producing the same. The silicon nitride sintered substrate has a main surface 101a of a shape larger than a square having a side of a length of 120 mm. A ratio dc/de of the density dc of the central area and the density de of the end area of the main surface 101a is 0.98 or higher. The void fraction vc of the central area of the main surface 101a is 1.80% or lower, and the void fraction ve of the end area is 1.00% or lower. It is preferred that the density dc of the central area is 3.120 g/cm3 or higher, the density de of the end area is 3.160 g/cm3 or higher, and a ratio ve/vc of the void fraction vc of the central area and the void fraction ve of the end area is 0.50 or higher.
    Type: Grant
    Filed: March 24, 2017
    Date of Patent: June 2, 2020
    Assignee: HITACHI METALS, LTD.
    Inventors: Hisayuki Imamura, Suguru Fujita, Youichirou Kaga, Hiroyuki Teshima, Shigeyuki Hamayoshi
  • Patent number: 10636583
    Abstract: A system may include a controller configured to cause a capacitance probe to subject a material to a first electric signal having a first frequency and determine a first capacitance of the material at the first frequency. The controller is configured to cause the capacitance probe to subject the material to a second electric signal at a second frequency and determine a second capacitance of the material at the second frequency. The material includes at least a first constituent phase and a second constituent phase. The first constituent phase and the second constituent phase have substantially similar dielectric constants at the first frequency and substantially different dielectric constants at the second frequency. The controller is further configured to determine a porosity of the material based on the first capacitance and determine a relative phase composition of the first constituent phase and the second constituent phase based on the second capacitance.
    Type: Grant
    Filed: February 14, 2018
    Date of Patent: April 28, 2020
    Assignee: Rolls-Royce Corporation
    Inventor: Michael George Glavicic
  • Patent number: 10614338
    Abstract: Methods and systems for descriptor guided fast marching method based image analysis and associated systems are disclosed. A representative image processing method includes processing an image of a microelectronic device using a fast marching algorithm to obtain arrival time information for the image. The arrival time information is analyzed using a targeted feature descriptor to identify targeted features. The detection of defects is facilitated by segmenting the image. The segmented image can be analyzed to identify targeted features which are then labeled for inspection.
    Type: Grant
    Filed: May 31, 2017
    Date of Patent: April 7, 2020
    Assignee: Micron Technology, Inc.
    Inventors: Yuan He, Hong Chen
  • Patent number: 10599043
    Abstract: Implementations described herein generally relate to methods for leveling a component above a substrate. In one implementation, a test substrate is placed on a substrate support inside of a processing chamber. A component, such as a mask, is located above the substrate. The component is lowered to a position so that the component and the substrate are in contact. The component is then lifted and the particle distribution on the test substrate is reviewed. Based on the particle distribution, the component may be adjusted. A new test substrate is placed on the substrate support inside of the processing chamber, and the component is lowered to a position so that the component and the new test substrate are in contact. The particle distribution on the new test substrate is reviewed. The process may be repeated until a uniform particle distribution is shown on a test substrate.
    Type: Grant
    Filed: August 11, 2017
    Date of Patent: March 24, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Hiroyuki Ogiso, Jianhua Zhou, Zonghui Su, Juan Carlos Rocha-Alvarez, Jeongmin Lee, Karthik Thimmavajjula Narasimha, Rick Gilbert, Sang Heon Park, Abdul Aziz Khaja, Vinay Prabhakar
  • Patent number: 10586318
    Abstract: A method includes obtaining data associated with an electronic component. The method also includes conducting a multi-tier inspection process to verify a conformance of the electronic component. Each of the tiers includes a different type of identification test, and at least one of the tiers is configured to provide fuzzy outputs. The method further includes analyzing the data associated with the electronic component using one or more first tests associated with a first of the tiers to determine whether the electronic component conforms to a pre-specified requirement. In addition, the method includes generating an output based on the analysis and determining whether additional testing is required using one or more next-level tests associated with another of the tiers.
    Type: Grant
    Filed: October 7, 2016
    Date of Patent: March 10, 2020
    Assignee: Raytheon Company
    Inventors: Kristen Stone, Alexandra Cintron-Aponte, Blair Simons
  • Patent number: 10551166
    Abstract: Apparatus and methods for performing optically based film thickness measurements of highly absorbing films (e.g., high-K dielectric films) with improved measurement sensitivity are described herein. A highly absorbing film layer is fabricated on top of a highly reflective film stack. The highly reflective film stack includes one or more nominally identical sets of multiple layers of different, optically contrasting materials. The highly reflective film stack gives rise to optical resonance in particular wavelength ranges. The high reflectance at the interface of the highly absorbing film layer and the highly reflective film stack increases measured light intensity and measurement sensitivity. The thickness and optical dispersion of the different material layers of the highly reflective film stack are selected to induce optical resonance in a desired wavelength range. The desired wavelength range is selected to minimize absorption by the highly absorbing film under measurement.
    Type: Grant
    Filed: October 2, 2018
    Date of Patent: February 4, 2020
    Assignee: KLA-Tencor Corporation
    Inventors: Carlos L. Ygartua, Shankar Krishnan
  • Patent number: 10518700
    Abstract: An intrusion detection system and methods thereof are provided. In exemplary embodiments, the system may comprise an upper scanner adapted to create a first detection layer; a lower scanner adapted to create a second detection layer, the second detection layer overlapping the first detection layer; signal lighting for producing a visual signal; at least one server adapted analyze data received from the upper scanner and the lower scanner to determine if an object is in the path of the vehicle; and wherein the at least one server is adapted to activate the signal lighting when it is determined by the server that an object is in the path of the vehicle.
    Type: Grant
    Filed: April 3, 2017
    Date of Patent: December 31, 2019
    Inventors: George Engel, David Engel
  • Patent number: 10510623
    Abstract: A method for inline inspection during semiconductor wafer fabrication is provided. The method includes forming a plurality of test structures on a semiconductor wafer along two opposite directions. An offset distance between a sample feature and a target feature of each of the test structures increases gradually along the two opposite directions. The method further includes producing an image of the test structures. The method also includes performing image analysis of the image to recognize a position with an extreme of a gray level. In addition, the method includes calculating an overlay error according to the recognized position.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: December 17, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shang-Wei Fang, Jing-Sen Wang, Yuan-Yao Chang, Wei-Ray Lin, Ting-Hua Hsieh, Pei-Hsuan Lee, Yu-Hsuan Huang
  • Patent number: 10458912
    Abstract: Methods and systems for performing optical, model based measurements of a small sized semiconductor structure employing an anisotropic characterization of the optical dispersion properties of one or more materials comprising the structure under measurement are presented herein. This reduces correlations among geometric parameters and results in improved measurement sensitivity, improved measurement accuracy, and enhanced measurement contrast among multiple materials under measurement. In a further aspect, an element of a multidimensional tensor describing the dielectric permittivity of the materials comprising the structure is modelled differently from another element. In a further aspect, model based measurements are performed based on measurement data collected from two or more measurement subsystems combined with an anisotropic characterization of the optical dispersion of the materials under measurement.
    Type: Grant
    Filed: July 14, 2017
    Date of Patent: October 29, 2019
    Assignee: KLA-Tencor Corporation
    Inventors: Houssam Chouaib, Qiang Zhao, Andrei V. Shchegrov, Zhengquan Tan
  • Patent number: 10446563
    Abstract: In accordance with some examples, a system comprises a substrate layer having an outer surface. The system also comprises a plurality of trenches extending from the outer surface into the substrate layer. The system then comprises a plurality of active regions with each active region positioned between a different pair of consecutive trenches of the plurality of trenches. The system also comprises a dielectric layer disposed in each of the plurality of trenches and on each of the plurality of active regions. The system then comprises a floating gate layer disposed on the dielectric layer and extending at least partially into each of the plurality of trenches.
    Type: Grant
    Filed: April 4, 2018
    Date of Patent: October 15, 2019
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Xiang-Zheng Bo, John H. Macpeak, Douglas T. Grider
  • Patent number: 10361102
    Abstract: A cutting apparatus includes a cutting unit including a cutting blade that has a cutting edge for cutting a dresser board. An elastic wave detection sensor is disposed in the cutting unit, for detecting an elastic wave produced when the dresser board is cut. The elastic wave detection sensor produces an output signal representing the detected elastic wave when the cutting blade cuts the dresser board and is dressed thereby, the output signal being variable as the cutting blade is progressively dressed by the dresser board. A control unit stores in advance, as a threshold value, the value of the output signal when the dressing of the cutting blade is completed. The control unit stops cutting the dresser board with the cutting blade and finishes the dressing of the cutting blade when the output signal produced by the elastic wave detection sensor reaches the threshold value.
    Type: Grant
    Filed: January 19, 2018
    Date of Patent: July 23, 2019
    Assignee: DISCO CORPORATION
    Inventors: Takuya Kaminaga, Tomoaki Sugiyama, Saki Miyakawa
  • Patent number: 10346966
    Abstract: A non-destructive inspection method that comprises obtaining one or more images corresponding to an X-ray, scanning electron microscope, or CT scan of an object, assigning numeric values to pixels of the images, comparing the numeric values to reference numeric values, and identifying an anomaly in the object based on the comparison. A non-destructive inspection system that comprises at least one processor, a memory in communication with the processor and storing instructions that causes the processor to obtain an image corresponding to an X-ray, scanning electron microscope, or CT scan of an object, assign numeric values to pixels of the image, compare the assigned numeric values to reference numeric values, and identify an anomaly in the object based on the comparison.
    Type: Grant
    Filed: December 18, 2014
    Date of Patent: July 9, 2019
    Assignee: HALLIBURTON ENERGY SERVICES, INC.
    Inventors: Corbin Sean Glenn, Zhenyu Xue
  • Patent number: 10338009
    Abstract: A method and apparatus to measure specular reflection intensity, specular reflection angle, near specular scattered radiation, and large angle scattered radiation and determine the location and type of defect present in a first and a second transparent solid that have abutting surfaces. The types of defects include a top surface particle, an interface particle, a bottom surface particle, an interface bubble, a top surface pit, and a stain. The four measurements are conducted at multiple locations along the surface of the transparent solid and the measured information is stored in a memory device. The difference between an event peak and a local average of measurements for each type of measurement is used to detect changes in the measurements. Information stored in the memory device is processed to generate a work piece defect mapping indicating the type of defect and the defect location of each defect found.
    Type: Grant
    Filed: May 29, 2017
    Date of Patent: July 2, 2019
    Assignee: KLA-TENCOR CORPORATION
    Inventors: Steven W. Meeks, Ronny Soetarman
  • Patent number: 10339262
    Abstract: A method includes identifying a first set of a first care area with a first sensitivity threshold, the first care area associated with a first design of interest within a block of repeating cells in design data; identifying an additional set of an additional care area with an additional sensitivity threshold, the additional care area associated with an additional design of interest within the block of repeating cells in design data; identifying one or more defects within the first set of the first care areas in one or more images of a selected region of a sample based on the first sensitivity threshold; and identifying one or more defects within the additional set of the additional care areas in the one or more images of the selected region of the sample based on the additional sensitivity threshold.
    Type: Grant
    Filed: November 15, 2016
    Date of Patent: July 2, 2019
    Assignee: KLA-Tencor Corporation
    Inventors: Junqing Huang, Soren Konecky, Hucheng Lee, Kenong Wu, Lisheng Gao
  • Patent number: 10325796
    Abstract: An apparatus includes a holder configured to carry one or more semiconductor wafers, an arm coupled with the holder, and a detector coupled with either the holder or the arm. The detector is configured to measure a change in weight of the one or more semiconductor wafers. The detector includes a strain gauge weight sensor, a piezoelectric sensor, or any other suitable sensor. The change in weight of the one or more semiconductor wafers is used to determine any possible presence of a broken or missing wafer.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: June 18, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yi-Feng Chen, Yan Cing Lin, Chui-Ya Peng
  • Patent number: 10283420
    Abstract: The invention is directed to a method for the production of an optoelectronic module including a support (5) and an additional layer, said support being formed by an assembly (25) which has no optoelectronic properties and which comprises, successively, a metal substrate (27), a dielectric coating (29) disposed on the metal substrate, and an electrically conductive layer (31) disposed on the dielectric coating. The production method comprises: a step of providing the support and performing a method in which the support is checked, or providing the support after it has already been checked; and a step of depositing at least one additional layer on the electrically conductive layer.
    Type: Grant
    Filed: December 23, 2015
    Date of Patent: May 7, 2019
    Assignee: ArcelorMittal
    Inventor: Philippe Guaino
  • Patent number: 10250258
    Abstract: Embodiments of devices and method for detecting semiconductor substrate thickness are disclosed. In an embodiment, an IC device includes a semiconductor substrate, a charge emitter embedded in the semiconductor substrate and configured to produce an electrical charge in the semiconductor substrate and a charge sensor embedded in the semiconductor substrate and configured to generate a response signal in response to the electrical charge produced in the semiconductor substrate. The magnitude of the response signal depends on the thickness of the semiconductor substrate.
    Type: Grant
    Filed: September 28, 2016
    Date of Patent: April 2, 2019
    Assignee: NXP B.V.
    Inventors: Andreas Bernardus Maria Jansman, Franciscus Petrus Widdershoven, Viet Thanh Dinh
  • Patent number: 10215688
    Abstract: The system includes a modulatable illumination source configured to illuminate a surface of a sample disposed on a sample stage, a detector configured to detect illumination emanating from a surface of the sample, illumination optics configured to direct illumination from the modulatable illumination source to the surface of the sample, collection optics configured to direct illumination from the surface of the sample to the detector, and a modulation control system communicatively coupled to the modulatable illumination source, wherein the modulation control system is configured to modulate a drive current of the modulatable illumination source at a selected modulation frequency suitable for generating illumination having a selected coherence feature length. In addition, the present invention includes the time-sequential interleaving of outputs of multiple light sources to generate periodic pulse trains for use in multi-wavelength time-sequential optical metrology.
    Type: Grant
    Filed: July 22, 2016
    Date of Patent: February 26, 2019
    Assignee: KLA-Tencor Corporation
    Inventors: Andrei V. Shchegrov, Lawrence D. Rotter, David Y. Wang, Andrei Veldman, Kevin Peterlinz, Gregory Brady, Derrick A. Shaughnessy
  • Patent number: 10156512
    Abstract: Embodiments are provided herein for testing multichip module (MCM) thermal reliability. An embodiment method includes selecting a chip with higher thermal risk from a plurality of chips in the MCM, and measuring a plurality of predetermined temperature parameters associated with the selected chip. A thermal resistance is then calculated using the predetermined temperature parameters. The thermal resistance is used to determine a thermal performance of the MCM. The predetermined temperature parameters include a junction temperature of the selected chip and at least one of a case temperature above the selected chip, a board temperature below the selected chip, and an ambient air temperature.
    Type: Grant
    Filed: February 28, 2014
    Date of Patent: December 18, 2018
    Assignee: FUTUREWEI TECHNOLOGIES, INC.
    Inventors: Qian Han, Junsheng Guo, Yongwang Xiao
  • Patent number: 10152595
    Abstract: A method of container and image scanning includes storing at a central scan store of a multi-tenant system, an image scan result for a container image, the container image for executing functionality of applications and comprising layers, wherein the image scan result generated by a scan process comprising scanning a top layer of the container image, the remaining layers of the container image are immutable, verifying a clean status of the remaining layers of the container image with the central scan store, and transmitting the image scan result for the container image, the image scan result being clean in response to a clean result returned for the scanning and successful verification of the clean status of the remaining layers. The method further includes responsive to receiving a container image scan result request for the container image, transmitting the image scan result for the container image.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: December 11, 2018
    Assignee: Red Hat, Inc.
    Inventors: Thomas Wiest, Joel Smith
  • Patent number: 10126238
    Abstract: Angle-resolved reflectometers and reflectometry methods are provided, which comprise a coherent light source, an optical system arranged to scan a test pattern using a spot of coherent light from the light source to yield realizations of the light distribution in the collected pupil, wherein the spot covers a part of the test pattern and the scanning is carried out optically or mechanically according to a scanning pattern, and a processing unit arranged to generate a composite image of the collected pupil distribution by combining the pupil images. Metrology systems and methods are provided, which reduce diffraction errors by estimating, quantitatively, a functional dependency of measurement parameters on aperture sizes and deriving, from identified diffraction components of the functional dependency which relate to the aperture sizes, correction terms for the measurement parameters with respect to the measurement conditions.
    Type: Grant
    Filed: December 13, 2017
    Date of Patent: November 13, 2018
    Assignee: KLA-Tencor Corporation
    Inventors: Amnon Manassen, Andrew Hill, Daniel Kandel, Ilan Sela, Ohad Bachar, Barak Bringoltz
  • Patent number: 10127651
    Abstract: Criticality of a detected defect can be determined based on context codes. The context codes can be generated for a region, each of which may be part of a die. Noise levels can be used to group context codes. The context codes can be used to automatically classify a range of design contexts present on a die without needing certain information a priori.
    Type: Grant
    Filed: November 21, 2016
    Date of Patent: November 13, 2018
    Assignee: KLA-Tencor Corporation
    Inventors: Ashok Kulkarni, Saibal Banerjee, Santosh Bhattacharyya, Bjorn Brauer
  • Patent number: 10114065
    Abstract: An electron beam absorbed current measurement method includes connecting a conductive probe to a conductive structure of a sample, irradiating a pulsed electron beam along the conductive structure to generate an alternating current in the conductive probe, and determining a presence of a high resistance defect in the conductive structure based on at least one of a delay of a rising edge of the alternating current waveform and a decrease in amplitude of the alternating current waveform.
    Type: Grant
    Filed: September 15, 2016
    Date of Patent: October 30, 2018
    Assignee: SANDISK TECHNOLOGIES LLC
    Inventor: Norio Toshima
  • Patent number: 10113944
    Abstract: The present application discloses a circuit board testing apparatus to the printed circuit board, including: a base frame; a carrying platform located on the upper surface of the base frame, the carrying platform including a carrying curved surface, a first distance is formed between the central portion of the carrying curved surface and the upper surface of the base frame, a second distance is formed between the two terminals of the carrying curved surface and the upper surface of the base frame, the second distance is greater than the first distance; and a plurality of supporting components disposed in intervals, each of the supporting components including a supporting rod and a driving member, the driving member is fixed on the base frame, the supporting rods pass through the carrying curved surface, the driving member drives the supporting rod to move in the direction perpendicular to the upper surface, and makes the printed circuit board bending and deformation.
    Type: Grant
    Filed: June 27, 2016
    Date of Patent: October 30, 2018
    Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd
    Inventor: Xiaoyu Huang
  • Patent number: 10103071
    Abstract: A reticle may be fabricated and inspected. The reticle, which may include thin patterns, may be selectively incorporated into a fabricated semiconductor device based on measurement information generated based on the inspecting. The inspecting may include forming thin patterns on a substrate, forming a first discharge layer on the thin patterns, and directing a first charged particle beam to the substrate, such that the first charged particle beam passes through the first discharge layer. Measurement information may be generated based on the first charged particle beam. The first discharge layer may connect the thin patterns to each other and may be separated from the substrate between the thin patterns.
    Type: Grant
    Filed: May 31, 2017
    Date of Patent: October 16, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eokbong Kim, Jin sung Choi, Mun Ja Kim, Kijung Son
  • Patent number: 10062160
    Abstract: Tracking patterns during a semiconductor fabrication process includes: obtaining an image of a portion of a fabricated device; extracting contours of the portion of the fabricated device from the obtained image; aligning the extracted contour to a matching section of a reference design; decomposing the matching section of the reference design into one or more patterns; and updating a pattern tracking database with information pertaining to at least one pattern in the one or more patterns generated as a result of the decomposition.
    Type: Grant
    Filed: September 20, 2017
    Date of Patent: August 28, 2018
    Assignee: Anchor Semiconductor Inc.
    Inventors: Khurram Zafar, Chenmin Hu, Ye Chen, Yue Ma, Chingyun Hsiang, Justin Chen, Raymond Xu, Abhishek Vikram, Ping Zhang
  • Patent number: 10043259
    Abstract: A method for facilitating detection of at least one anomaly in a representation of a product having a pattern is provided. The method involves causing at least one processor to receive image data representing the product during processing, identify from the image data generally similar images representing respective instances of a repeated aspect of the pattern, each of the images including image element values, generate a set of corresponding image element values including an image element value from each image, identify at least one image element value from the set of corresponding image element values to be excluded from a subset of the set of corresponding image element values, generate at least one criterion based on the subset, and cause the at least one criterion to be used to facilitate identification of the at least one anomaly. Other methods, apparatuses, systems, and computer readable media are also provided.
    Type: Grant
    Filed: July 25, 2016
    Date of Patent: August 7, 2018
    Assignee: PT PAPERTECH INC.
    Inventor: Juha Reunanen
  • Patent number: 10006872
    Abstract: Provided is an optical inspection system including a supporting unit, allowing a target object to be loaded thereon, a light source unit configured to emit a laser beam toward the target object, a light condensing unit collecting scattered light that is scattered at the target object when the laser beam is irradiated onto the target object, and a control unit controlling the light source unit and the light condensing unit and analyzing the scattered light to examine whether there are pollutants on the target object. The supporting unit may include a first supporting unit, on which the target object is disposed, and which is formed of a first material, and a second supporting unit, which is disposed under the first supporting unit and is formed of a second material different from the first material.
    Type: Grant
    Filed: December 1, 2015
    Date of Patent: June 26, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Wonguk Seo, Kyoungchon Kim, Kuihyun Yoon, Kyunlae Kim, Jaeyoung Park, Kyoungho Yang, Young Heo
  • Patent number: 9991174
    Abstract: The measurement method may include obtaining first measurement data from a recess region formed in a semiconductor substrate, obtaining second measurement data from a conductive pattern filling a portion of the recess region, calculating a first volume of the recess region from the first measurement data, calculating a second volume of the conductive pattern from the second measurement data, and calculating a measurement target parameter using a difference between the first and second volumes.
    Type: Grant
    Filed: October 22, 2014
    Date of Patent: June 5, 2018
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Choonshik Leem, Jihye Lee, Deokyong Kim, Soobok Chin
  • Patent number: 9984982
    Abstract: The present invention relates to a device and method for generating an identification key using a process variation in a via process, and specifically the device for generating an identification key may include a first node provided in a semiconductor chip, a second node which is formed in a different layer from the first node, a via which is electrically shorted to the first node, and which is formed between the first node and the second node, the overlap distance between the second node and the via, in a pattern layout of the semiconductor chip, being adjusted to a value that is less than a threshold according to a design rule that ensures that the first node and the second node are shorted by the via, and a reader which provides an identification key by identifying whether the first node and the second node are shorted due to the via.
    Type: Grant
    Filed: February 19, 2014
    Date of Patent: May 29, 2018
    Assignee: ICTK CO., LTD.
    Inventors: Byong Deok Choi, Dong Kyue Kim
  • Patent number: 9922765
    Abstract: In a method of manufacturing a laminated electronic component, in a step of obtaining a laminate, a position of a second green sheet with respect to a first green sheet is determined such that an overall width of a first portion printed on the first green sheet and a second portion printed on the second green sheet becomes substantially equal to a width of the first portion or a width of the second portion.
    Type: Grant
    Filed: October 22, 2014
    Date of Patent: March 20, 2018
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Takashi Sawada
  • Patent number: 9922269
    Abstract: Defect classification includes acquiring one or more images of a specimen including multiple defects, grouping the defects into groups of defect types based on the attributes of the defects, receiving a signal from a user interface device indicative of a first manual classification of a selected number of defects from the groups, generating a classifier based on the first manual classification and the attributes of the defects, classifying, with the classifier, one or more defects not manually classified by the manual classification, identifying the defects classified by the classifier having the lowest confidence level, receiving a signal from the user interface device indicative of an additional manual classification of the defects having the lowest confidence level, determining whether the additional manual classification identifies one or more additional defect types not identified in the first manual classification, and iterating the procedure until no new defect types are found.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: March 20, 2018
    Assignee: KLA-Tencor Corporation
    Inventors: Sankar Venkataraman, Li He, John R. Jordan, III, Oksen Baris, Harsh Sinha
  • Patent number: 9875923
    Abstract: A control system that includes deflection sensors which can control clamping forces applied by electrostatic chucks, and related methods are disclosed. By using a sensor to determine a deflection of a workpiece supported by an electrostatic chuck, a control system may use the deflection measured to control a clamping force applied to the workpiece by the electrostatic chuck. The control system applies a clamping voltage to the electrostatic chuck so that the clamping force reaches and maintains a target clamping force. In this manner, the clamping force may secure the workpiece to the electrostatic chuck to enable manufacturing operations to be performed while preventing workpiece damage resulting from unnecessary higher values of the clamping force.
    Type: Grant
    Filed: December 20, 2016
    Date of Patent: January 23, 2018
    Assignee: Applied Materials, Inc.
    Inventors: Wendell Boyd, Jr., Vijay D. Parkhe, Matthew James Busche, Konstantin Makhratchev, Masanori Ono, Senh Thach
  • Patent number: 9865514
    Abstract: A through-silicon via (TSV) capacitive test structure and method of determining TSV depth based on capacitance is disclosed. The TSV capacitive test structure is formed from a plurality of TSV bars that are evenly spaced. A first group of bars are electrically connected to form a first capacitor node, and a second group of bars is electrically connected to form a second capacitor node. The capacitance is measured, and a TSV depth is computed, prior to backside thinning. The computed TSV depth may then be fed to downstream grinding and/or polishing tools to control the backside thinning process such that the semiconductor wafer is thinned such that the backside is flush with the TSV.
    Type: Grant
    Filed: March 10, 2015
    Date of Patent: January 9, 2018
    Assignee: GLOBALFOUNDRIES Inc.
    Inventors: Hanyi Ding, J. Edwin Hostetter, Ping-Chuan Wang, Kimball M. Watson
  • Patent number: 9864173
    Abstract: A spot scanning imaging system with run-time alignment includes a beam scanning device configured to linearly scan a focused beam of illumination across a sample, one or more detectors positioned to receive light from the sample, and a controller communicatively coupled to the beam scanning apparatus, the sample stage, and the one or more detectors. The controller is configured to store a first image, transmit a set of drive signals to at least one of the beam scanning device, the sample stage, or the one or more detectors, compare at least a portion of the second sampling grid to at least a portion of the first sampling grid to determine one or more offset errors, and adjust at least one drive signal in the set of drive signals based on the one or more offset errors such that the second sample grid overlaps the first sample grid.
    Type: Grant
    Filed: January 22, 2016
    Date of Patent: January 9, 2018
    Assignee: KLA-Tencor Corporation
    Inventors: Jamie M. Sullivan, Wenjian Cai, Kai Cao
  • Patent number: 9824443
    Abstract: [Object] To improve work efficiency with respect to work using a transparent object, such as a transparent operation tool, for example. [Solution] An image region where an object exists as a target region is detected on the basis of a second captured image, when a first captured image is a captured image obtained by selectively receiving a light of a first wavelength band, and the second captured image is a captured image obtained by selectively receiving a light of a second wavelength band, the captured images being obtained by capturing the object that is transparent for the light of the first wavelength band and is opaque for the light of the second wavelength band. Subsequently, an outline of the object is superimposed on the first captured image on the basis of information of the target region detected by the target detecting unit.
    Type: Grant
    Filed: July 24, 2014
    Date of Patent: November 21, 2017
    Assignee: SONY CORPORATION
    Inventor: Tsuneo Hayashi
  • Patent number: 9810905
    Abstract: A support information display method is provided with an acquiring process for acquiring a first image by photographing, via a camera provided in a head mount display, a predetermined part of a substrate processing apparatus as a maintenance object, an estimating process for estimating the support information related to the predetermined part in the first image from information stored in a database, an image creating process for creating a second image by converting the support information estimated in the estimating process into an image, and a displaying process for displaying the second image on the head mount display in order for the operator to visually recognize the support information.
    Type: Grant
    Filed: February 6, 2014
    Date of Patent: November 7, 2017
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Toshiaki Kodama, Toru Yamauchi, Sensho Kobayashi, Hiroshi Nakamura, Gaku Ikeda, Kazuya Uoyama
  • Patent number: 9784691
    Abstract: A method and apparatus to measure specular reflection intensity, specular reflection angle, near specular scattered radiation, and large angle scattered radiation and determine the location and type of defect present in a first and a second transparent solid that have abutting surfaces. The types of defects include a top surface particle, an interface particle, a bottom surface particle, an interface bubble, a top surface pit, and a stain. The four measurements are conducted at multiple locations along the surface of the transparent solid and the measured information is stored in a memory device. The difference between an event peak and a local average of measurements for each type of measurement is used to detect changes in the measurements. Information stored in the memory device is processed to generate a work piece defect mapping indicating the type of defect and the defect location of each defect found.
    Type: Grant
    Filed: July 31, 2014
    Date of Patent: October 10, 2017
    Assignee: ZETA INSTRUMENTS, INC.
    Inventors: Steven W. Meeks, Ronny Soetarman