Abstract: A method of making a component for use in a touch sensor includes modifying a substrate having disposed on it a plurality of electrically isolated conductors. Subsets of the conductors are electrically coupled to form composite electrodes. The component can be used as a set of electrodes in a customized touch sensor.

Abstract: A method of manufacturing an ink jet recording head made of a laminate structure, in which plural members are laminated, includes making an ink channel including a nozzle by laminating the plural members including a nozzle plate having the nozzle; and performing a channel film forming process for forming a channel film having an ink resistance, the channel film covering an entire inner wall of the ink channel formed in the plural members including the nozzle plate and the nozzle.

Abstract: A base material (20) is arranged on top of at least one first internal layer base material (10), and a second internal base material (30) is arranged underneath the base material (10). And thereafter a surface layer circuitry conductive foil (40) is arranged underneath the base material (30), and subsequently these materials are colaminated for forming a colaminated body (80). While this colaminating operation, conductive portions being formed in the base materials 10, 30 are aligned to electrically connect one another for forming an internal circuitry. And thereafter, an interlayer conductive portion (51) being electrically connected to the internal circuitry is formed, and a minute circuitry is formed on the top of the base material (20) and the conductive foil (40) accordingly.

Abstract: In one embodiment, a method of fabricating an implantable pulse generator, comprises: providing a lead body including a plurality of conductors; providing a feedthrough component comprising a plurality of feedthrough pins; hermetically enclosing pulse generating circuitry and switching circuitry within a housing, the feedthrough component being welded to the housing; laser machining each of the plurality of feedthrough pins to comprise a slot along a surface of the respective feedthrough pin; placing a respective conductor from the lead body in the respective slot of each of the plurality of feedthrough pins; and performing welding operations to connect the plurality of conductors of the lead body with the plurality of feedthrough pins of the feedthrough component.

Abstract: Present embodiments include a remanufactured bandage-type medical sensor having an optical assembly with an emitter adapted to transmit one or more wavelengths of light and a photodetector adapted to receive the one or more wavelengths of light transmitted by the emitter. The sensor also includes a laminate assembly having an electrically conductive adhesive transfer tape (ECATT) layer disposed over the photodetector, and the ECATT layer is adapted to shield the photodetector from electromagnetic interference (EMI). A nonconductive layer supports the emitter, the photodetector, and the ECATT layer within the sensor. At least a portion of the optical assembly is from a used bandage-type medical sensor, and at least a portion of the laminate assembly is new.

Abstract: A method of applying a conductive pattern of metal onto a web of indefinite length material. This method includes applying a metal containing composition onto the web in a predefined pattern, providing a roll having a very low thermal mass, and conveying the patterned web around the roll while simultaneously applying heat energy to the metal containing composition thereby converting the metal to a conductive pattern. This allows for flexible circuitry to be fabricated in an inexpensive roll-to-roll process.

Abstract: Disclosed herein is a method for fabricating a printed circuit board, including: stacking a second insulating layer including a reinforcement on an outer surface of a first insulating layer having a post via formed thereon; polishing an upper surface of the second insulating layer to expose an upper side of the post via; stacking a film member on the second insulating layer to cover the post via and compress the second insulating layer; polishing an upper surface of the film member to expose an upper side of the post via; and forming a circuit layer connected to the post via on the upper surface of the film member.

Abstract: A method of manufacturing a printed circuit board includes arranging a core layer in which a bending prevention portion of at least two layers that are metal layers having different thermal expansion coefficients is disposed between a plurality of insulating members; forming a circuit pattern so as to have a desired pattern on at least one of the inside of the core layer and an outer face of the core layer; and forming an insulating layer including an opening portion that exposes the circuit pattern on the core layer.

Abstract: This disclosure relates to retrofit systems and methods for lighting installations, and in particular, to retrofit systems and methods used to retrofit troffer-style lighting installations with LED light sources. Retrofit systems can be used with different light fixtures, but those described are particularly adapted for use with troffer-style fixtures. These retrofit systems can provide the same amount of light as traditional light fixtures already do, for example 1600-4000 lumens or more. The retrofit systems can be used with many different light sources but are particularly well-suited for use with solid state light sources or light engines, such as those utilizing LEDs. Some embodiments of the present invention comprise a mechanical mounting system for installing an LED light engine within an existing lighting system housing or pan, such as a troffer pan, without penetrating the ceiling plenum.

Abstract: A printed wiring board includes a Cu wiring pattern formed on a substrate. A first metal layer is formed on the Cu wiring pattern. A second metal layer is formed on the first metal layer. The first metal layer has a less reactivity with Cu than the second metal layer. The first metal layer and the second metal layer together cause an eutectic reaction.

Abstract: A novel method for manufacturing embedded a capacitive stack and a novel capacitive stack apparatus are provided having a capacitive core that serves as a structural substrate on which alternating thin conductive foils and nanopowder-loaded dielectric layers may be added and tested for reliability. This layering and testing allows early fault detection of the thin dielectric layers of the capacitive stack. The capacitive stack may be configured to supply multiple isolated capacitive elements that provide segregated, device-specific decoupling capacitance to one or more electrical components. The capacitive stack may serve as a core substrate on which a plurality of additional signaling layers of a multilayer circuit board may be coupled.

Abstract: Disclosed herein a sensor package for a touch panel and a method of manufacturing the same, the sensor package for the touch panel including: a printed circuit board; a sensor formed over the printed circuit board so as to be spaced apart from the printed circuit board; printed circuit board side connecting pads formed on one surface of the printed circuit board; sensor side connecting pads formed on one surface of the sensor and formed to face the printed circuit board side connecting pads; a first insulating layer formed between the printed circuit board side connecting pads on one surface of the printed circuit board; and a second insulating layer formed between the printed circuit board side connecting pad and the sensor side connecting pad and including conductive balls.

Abstract: A sensor assembly is disclosed that includes a hollow casing having a radiation entrance opening. A radiation-transmissive optic is at the radiation entrance opening. A substrate is inside and sealed against the hollow casing. An optical sensing element is coupled to the substrate and configured to sense radiation that has passed through the radiation-transmissive optic. A method of manufacturing the sensor assembly also is disclosed.

Abstract: A method and system for improving alignment precision of a pair of MEMS parts. The method involves stacking the two parts such that at least one rolling element is between facing surfaces of said two parts, and each rolling element has a first diameter and an axis of rotation parallel to the facing surfaces. The first and second of a pair of MEMS parts respectively include a first alignment pad and a second alignment pad and a liquid drop formed in contact with both alignment pads can align the two parts which can then be locked together by solidification of solder while remaining spaced by the first diameter.

Abstract: In a build-up step, a plurality of resin insulation layers and a plurality of conductive layers are alternately laminated in multilayer arrangement on a metal foil separably laminated on a side of a base material, thereby forming a wiring laminate portion. In a drilling step, a plurality of openings are formed in an outermost resin insulation layer through laser drilling so as to expose connection terminals. Subsequently, in a desmear step, smears from inside the openings are removed. In a base-material removing step performed after the build-up step, the base material is removed and the metal foil is exposed.

Abstract: Provided is a method for manufacturing an in-plane switching mode liquid crystal display, which can prevent the problem of bubble generation caused by an Ag dot during the attachment process of a liquid crystal panel and a cover substrate, and improve the yield of an Ag dot process. A method for manufacturing an in-plane switching mode liquid crystal display according to an embodiment of the present invention may comprise: forming a liquid crystal panel by interposing a liquid crystal layer between a color filter substrate and a TFT array substrate; attaching a polarizer, with a protective film attached thereon, on the color filter substrate; forming an Ag dot to be in contact with an edge of the protective film, the color filter substrate, and the TFT array substrate; removing part of the Ag dot by removing the protective film; and attaching a cover substrate on the color filter substrate.

Abstract: A high-dielectric sheet for a printed circuit board includes a first electrode, a first sputter film formed on the first electrode, an intermediate layer formed on the first sputter film by calcining a sol-gel film, a second sputter film formed on the intermediate layer, and a second electrode provided on the second sputter film.

Abstract: A pane having at least one electrical connection element is described. The pane has a substrate, an electrically conductive structure on a region of the substrate, a layer of a solder material on a region of the electrically conductive structure, and at least two soldering points of a connection element on the solder material. The at least two soldering points define at least one contact surface between the connection element and the electrically conductive structure, and a shape of the at least one contact surface has at least one segment of an oval, an ellipse, or a circle with a central angle ? of at least 90°.

Abstract: Representative implementations of devices and techniques provide improved electrical performance of components, such as chip dice, for example, disposed on different layers of a multi-layer printed circuit board (PCB). In an example, the components may be embedded within layers of the PCB. An insulating layer located between two component layers or sets of layers includes a conductive portion that may be strategically located to provide electrical connectivity between the components. The conductive portion may also be arranged to improve thermal conductivity between points of the PCB.

Abstract: Embodiments disclosed herein include receiver optical assemblies (ROAs) having a photo-detector remotely located from a differential transimpedance amplifier (TIA). Related components, circuits, and methods are also disclosed. By providing the photo-detector remotely located from a TIA, additional costs associated with design constraints of providing the photo-detector intimate with a TIA may be avoided, thereby reducing cost of the ROA. In this regard as a non-limiting example, the ROAs according to the embodiments disclosed herein allow shorter haul active optical cable applications for use in consumer applications from a cost standpoint with the added benefits of increased bandwidth and low noise performance of optical fiber.

Abstract: Embodiments disclosed herein include receiver optical assemblies (ROAs) having a photo-detector remotely located from a differential transimpedance amplifier (TIA). Related components, circuits, and methods are also disclosed. By providing the photo-detector remotely located from a TIA, additional costs associated with design constraints of providing the photo-detector intimate with a TIA may be avoided, thereby reducing cost of the ROA. In this regard as a non-limiting example, the ROAs according to the embodiments disclosed herein allow shorter haul active optical cable applications for use in consumer applications from a cost standpoint with the added benefits of increased bandwidth and low noise performance of optical fiber.

Abstract: A sensor device has a ceramic carrier substrate. At least two conductor tracks are arranged on the carrier substrate. The sensor device has at least one ceramic component that is in the form of a chip and is connected to the conductor tracks in an electrically conductive manner. The at least one ceramic component is mechanically connected to the conductor tracks by means of a screen printing paste which has been burnt in.

Abstract: A flexible substrate layer having metallic bus-lines and connecting stitches is formed. A trace layer having electrical traces and thermal vias is also formed. The substrate layer and the trace layer are bonded together by way of respective thermal pathways and electrically interconnected. The resulting layer-wise assembly is configured to support and electrically interconnect an array of photovoltaic cells and to channel away heat during operation.

Abstract: One aspect of the present invention resides in a method of producing a circuit board, including a film-forming step of forming a resin film on a surface of an insulative substrate; a circuit pattern-forming step of forming a circuit pattern portion by forming a recessed portion having a depth equal to or greater than a thickness of the resin film, with an outer surface of the resin film serving as a reference; a catalyst-depositing step of depositing a plating catalyst or a precursor thereof on a surface of the circuit pattern portion and a surface of the resin film; a film-separating step of removing the resin film from the insulative substrate; and a plating step of forming an electroless plating film only in a region where the plating catalyst or the precursor thereof remains after the resin film is separated.

Abstract: An improved microwave mixer manufactured using multilayer processing includes an integrated circuit that is electrically connected to a top metal layer of a substrate. The microwave mixer includes: a first metal layer; a dielectric substrate on the first metal layer; a second metal layer directly on the substrate, at least two passive circuits arranged on the second metal layer and a top layer metal; a thin dielectric layer on the second metal layer, wherein the top layer metal is directly on the thin dielectric layer; an integrated circuit (IC) attached to the second metal layer, wherein the IC includes at least one combination of non-linear devices, and wherein the IC is directly connected to the passive circuits on the second metal layer; and a protection layer on the IC.

Abstract: An illumination source includes a heat sink with an inner core region and an outer core region having structures to dissipate heat from the inner core region. An LED assembly is pressed into a thermally-conductive compound disposed between the LED assembly and the inner core region. A retaining clamp is used to mechanically press the LED assembly into the thermally-conductive compound.

Abstract: A faceplate assembly includes a faceplate member; at least one jack module mounted in an opening of the faceplate member; and a printed circuit board assembly. The printed circuit board assembly includes a printed circuit board; a first set of secondary contacts that are electrically connected to the printed circuit board; and a network connector that is electrically connected to the secondary contacts of the first set via the printed circuit board. The secondary contacts extend into the jack module. The secondary contacts are isolated from primary contacts of the jack module.

Abstract: Method for stacking microelectronic devices using two or more carriers, each holding microelectronic devices in an array so they may be registered. Each device is releasably held by its edges in a carrier to allow access to top and bottom surfaces of the device for joining. Arrays of devices held in two or more carriers are juxtaposed and joined to form an array of stacked devices. A resulting stacked device is released from the juxtaposed carriers holding each device by releasing forces of the corresponding carrier urging upon edges of the device, thereby permitting removal of the stacked device.

Abstract: Disclosed is a method for producing a metal-ceramic substrate. According to said method, a metal layer is applied to at least one face of a ceramic substrate or a ceramic layer by means of a direct bonding process, and the metal-ceramic substrate or partial substrate is aftertreated in a subsequent step at a gas pressure (aftertreatment pressure) ranging approximately between 400 and 2000 bar and an aftertreatment temperature ranging approximately.

Abstract: A method for mounting planar lighting modules on a mounting surface may include: providing on opposite sides of the lighting module fixing indentations opening toward the aforesaid sides, superimposing on said opposite sides of the lighting module stiffening bars having lateral lobes extending into said indentations, and fixing to the mounting surface the stiffening bars superimposed on the opposite sides of the lighting module with the opposite sides of the lighting module sandwiched between the stiffening bars and the mounting surface, whereby the stiffening bars urge the lighting module toward the mounting surface.

Abstract: A strobe light includes a base, a mounting post, a plurality of light emitting diode (LED) lights, a control system, and a lens. The mounting post extends vertically from the base. The plurality of LED lights are mounted around a periphery of the mounting post. The control system is coupled to the plurality of LED lights and operable to independently control each LED light to produce at least one of a 360° strobe light pattern and a rotating beacon light pattern. The lens is connected to the base and covers the plurality of LED lights.

Abstract: Enhanced modularity in heterogeneous three-dimensional computer processing chip stacks includes a method of manufacture. The method includes preparing a host layer and integrating the host layer with at least one other layer in the stack. The host layer is prepared by forming cavities on the host layer for receiving chips pre-configured with heterogeneous properties relative to each other, disposing the chips in corresponding cavities on the host layer, and joining the chips to respective surfaces of the cavities thereby forming an element having a smooth surface with respect to the host layer and the chips.

Abstract: A method of manufacturing an electronic device that comprises a microelectromechanical (MEMS) element, the method comprising the steps of: providing a material layer (34) on a first side of a substrate (32); providing a trench (40) in the material later (34); etching material from the trench (40) such as to also etch the substrate (32) from the first side of the substrate (32); grinding the substrate (32) from a second side of the substrate to expose the trench (40); and using the exposed trench (40) as an etch hole. The exposed trench (40) is used as an etch hole for releasing a portion of the material layer (34), for example a beam resonator (12), from the substrate (32). An input electrode (6), an output electrode (8), and a top electrode (10) are provided.

Abstract: A touch screen panel and a method for preparing the same, and more specifically, a touch screen panel includes a window plate 311, a non-conductive color pattern 312 formed on a non-display part on one face of the window plate, and a non-conductive shielding pattern 313 formed on the non-conductive color pattern 312, so as to provide a non-conductive pattern having the desired colors and shielding effects, and to reduce failure rates during the formation of the non-conductive pattern, as well as a method for preparing the same.

Abstract: A display-driving structure for driving a display panel is disclosed. The display-driving structure includes a first circuit board, a second circuit board, a transmission wiring, a first circuit, a second circuit, first source driver circuits and second source driver circuits. The transmission wiring is connected between the first circuit board and the second circuit board. The first circuit is disposed on the first circuit board for generating a first signal. The second circuit is disposed on the second circuit board for generating a second signal. The first source driver circuits receive the first signal from the first circuit board, and further receive the second signal via the transmission wiring and the second circuit board. The second source driver circuits receive the second signal from the second circuit board, and further receive the first signal via the transmission wiring and the first circuit board.

Abstract: A method of manufacturing a circuit board is described herein. The method may include adding a resin, forming first and second fiberglass fibers, and forming first and second signal line traces capable of transmitting electrical signals. In some examples, a ratio between fiberglass and resin material near the first signal line trace is similar to a ratio between fiberglass and resin material near the second signal line trace. In some examples, the first and second fiberglass fibers diagonally cross near the first and second signal line traces. In some examples, the first and second fiberglass fibers cross near the first and second signal line traces in a zig-zag pattern.

Abstract: Low temperature bond balls connect two structures having disparate coefficients of linear thermal expansion. An integrated circuit is made to heat the device such that the low temperature bond balls melt. After melting, the bond balls solidify, and the device is operated with the bond balls solidified. In one example, one of the two structures is a semiconductor substrate, and the other structure is a printed circuit board. The integrated circuit is a die mounted to the semiconductor substrate. The bond balls include at least five percent indium, and the integrated circuit is an FPGA loaded with a bit stream. The bit stream configures the FPGA such that the FPGA has increased power dissipation, which melts the balls. After the melting, a second bit stream is loaded into the FPGA and the FPGA is operated in a normal user-mode using the second bit stream.

Abstract: A capture pad structure includes a lower dielectric layer, a capture pad embedded within the lower dielectric layer, the capture pad comprising a plurality of linear segments. To form the capture pad, a focused laser beam is moved linearly to form linear channels in the dielectric layer. These channels are filled with an electrically conductive material to form the capture pad.

Abstract: The invention discloses methods for transferring a tactile signal through an inert piece of material. In some embodiments, clear, impact resistant covers are employed with devices including touch-sensitive screens. The instant invention, in some embodiments, describes a method for employing a plurality of magnets to allow a user to input information on a touch-sensitive screen through the inert cover. Contact of a magnet pair above the cover may allow for a signal to be delivered to the touch-sensitive display via a second magnet pair that includes a stylus adapted to activate the surface of the display.

Abstract: A method for fabricating a laminated structure includes (i) preparing a first substrate having electroconductivity, (ii) forming a first electroconductive film having a prescribed hardness on the first substrate by an electroforming, (iii) forming a second electroconductive film having a hardness that is lower than the prescribed hardness on the first electroconductive film by an electroforming, (iv) patterning the first electroconductive film and the second electroconductive film to a prescribed pattern to form a plurality of electroconductive film patterns, and (v) subjecting the first substrate and a second substrate repeatedly to pressure contact and release to transfer sequentially the plurality of electroconductive film patterns on the first substrate onto the second substrate.

Abstract: A test system includes a test printed circuit board (PCB), a flip chip package mounted on the PCB, one or more test probes coupled to the flip chip package and a first integrated circuit (IC) coupled to the test probes to enable testing of the first IC using electrical circuitry of the flip chip package.

Abstract: A through-hole stub AC termination circuit including a resistor and a capacitor, is connected to an open end of a stub of a through-hole provided in a circuit board.

Abstract: The present invention relates to a method for manufacturing a microvalve device of a lab-on-a-chip by interposing a polyvinylidene chloride film between upper and lower substrates, each of which is produced by injection molding of a rigid polymer resin, and heating and pressurizing the resultant structure. The present invention also relates to a microvalve device manufactured by the method. According to the method of the present invention, each of the upper and lower substrates can be produced by injection molding of a rigid polymeric material, thus being appropriate for mass production in a short time. Excellent thermal bonding properties between the polyvinylidene chloride film and the substrates enable the formation of the rigid substrate/film membrane/rigid substrate structure in an easy and reliable manner, which shortens the time required to manufacture the microvalve device. Therefore, the method of the present invention is suitable for the mass production of labs-on-a-chip.

Abstract: Techniques for mounting a sensor are disclosed. In some implementations, a molded interconnect device carries a sensor for transducing a position of a rotor of the implantable blood pump. The molded interconnect device includes one or more integrated electronic circuit traces configured to electrically connect the Hall sensor with a printed circuit board of the implantable blood pump, and the molded interconnect device is configured to be mounted to the printed circuit board.

Abstract: A method of making a handheld, electromechanical device useful in mammalian body-care includes the steps of: a) forming a one-piece housing having a single opening defined by a rim; b) assembling a unitary insert; c) inserting the unitary insert through the single opening of the housing; d) removably applying a cover having an exterior surface to close the opening of the one-piece housing; and e) attaching the unitary insert to at least one of the one-piece housing and the removable cover. The rim of the one-piece housing circumscribes a rim area, and the one-piece housing has a projected area that is substantially larger than the rim area. The unitary insert is dimensioned to be insertable through the opening defined by the rim, and it has a frame having disposed thereon electromechanical elements interconnected in an electrical circuit. The cover closes off the opening of the one-piece housing.

Abstract: A method of making a touch-responsive capacitive device includes providing a transparent substrate and forming anisotropically conductive first and second electrodes extending in corresponding first and second orthogonal length directions over the substrate. Anisotropically conductive first and second electrodes each with electrically connected micro-wires are formed on opposing sides of the transparent substrate. The anisotropically conductive first and second electrodes extend in corresponding first and second length directions.

Abstract: A method for assembling components on a circuit board includes driving the circuit board to an assembling position after the circuit board is moved in a first direction and then is blocked at a positioning point by a positioning rod, assembling a first component set on a first region of the circuit board when the circuit board is positioned in the assembling position, folding the positioning rod, driving the circuit board back to the positioning point after the first component set has been assembled on the first region of the circuit board, driving the circuit board in the first direction until the positioning rod moves to an end of a slot on the circuit board, driving the circuit board to the assembling position again, and assembling a second component set on a second region of the circuit board when the circuit board is positioned in the assembling position.

Abstract: A method for fabricating a circuit apparatus includes forming a wiring layer, a conductive layer, and a first insulating layer on the wiring substrate, removing the conductive layer in an opening of the first insulating layer so as to expose the wiring layer, forming a gold plating layer on the wiring layer, removing the first insulating layer and the conductive layer, forming a second insulating layer on the wiring substrate, the second insulating layer having an opening through which the gold plating and adjacent wiring layers are exposed, and electrically connecting a circuit element to the gold plating layer.

Abstract: A LED lighting method and a LED lighting device has been disclosed, a method for improving the luminous efficiency of LED, an integrating method of a LED lighting circuit and a LED lighting integrated chip are provided, which use the negative power characteristics of the constant current diode CRD to enable the power supply current to drive the LED to emit light and illuminate after affecting by the constant current effect of the constant current diode CRD. The constant current diode CRD and an LED light module group are packaged and integrated into a chip to form an LED light module group integrated chip.

Abstract: An object is to provide an electronic component mounting method in which an adequate component mounting work to which a check result is correctly reflected is enabled and it is possible to satisfy both reduction of the failure occurrence rate and improvement of the working efficiency. An electronic component mounting apparatus in which an appearance checking section which checks a board to detect existence or non-existence of a failure item, and a component mounting section which transfers and mounts an allocated mounting object component to the board in which the check is ended are integrally disposed includes a mounting availability determination processing section 28d which determines an availability of an execution of an operation of mounting the mounting object component, based on a result of detection of a failure item.