Abstract: A semiconductor light-emitting element mounting module includes a metal conductor plate including at least one connection surface formed on one side thereof, wherein a semiconductor light-emitting element is connectable to the connection surface; a pair of terminals provided away from the connection surface and which are connectable to the connection surface to be electrically conductive therewith; a surface-insulation portion formed from a resin material, wherein the surface-insulation portion covers the entire surface of the metal conductor plate except for the connection surface. The pair of terminals are connectable with a corresponding pair of terminals that are provided on another semiconductor light-emitting element mounting module.

Abstract: In an electronic components mounting process fabricating a mount circuit board due to an electronic components mounting system formed of a plurality of electronic components mounting apparatuses by connecting them to each other, data of solder paste position which is printed on the circuit board is transmitted as feedforward data to an electronic components placement apparatus and a placement state inspecting apparatus. A control parameter which controls a placing position in a components placement operation due to the electronic components placement apparatus and an inspection parameter which indicates a standard position of the components in a placement state inspection are updated on the basis of the soldering position data. Therefore, it is possible to achieve a precise mounting by effectively and properly using inspection information obtained from each process.

Abstract: A printed circuit board and method of making a print circuit board having one or more holes that are controllably drilled to extend into the printed circuit board substrate to a predetermined depth intermediate first and second faces. A mechanical locating pin is received into each of the one or more holes to mechanically align a first component for electronically interfacing with the printed circuit board substrate. A second component is installed on the second face directly opposite of the one or more holes such that the second component is in electronic communication with conductive traces or interconnects formed on the second face directly opposite of the hole.

Abstract: Methods and apparatus are provided for mass production of electronic devices. Rows of perforation are formed across a sheet of conductive material such that plural conjoined strips are defined. Respective electronic entities are soldered to each of the conjoined strips. The strips are separated by severing the perforations such that plural discrete electronic devices are defined. Solar panels, electronic circuits and other apparatus can be formed in this way.

Abstract: Electrical components are mounted on a substrate and a stiffening member is mechanically coupled to the substrate to increase the stiffness of the substrate. The stiffening member includes passive devices that are electrically connected to the electrical components via traces on the substrate. The passive devices can be serially mechanically connected to each other so that the stiffening member extends across at least 60% of the substrate.

Abstract: A process for the wafer-scale fabrication of CMS electronic modules starts from a wafer with metallized outputs, comprising electronic components molded in resin and, on one side, the external outputs of the electronic components on which a nonoxidizable metal or alloy is deposited, and of a printed circuit provided with oxidizable metal or alloy contact pads. In the process, the wafer is cut in predetermined patterns for obtaining reconfigured molded components that include at least one electronic component; the reconfigured components are assembled on the printed circuit, the metallized external outputs of the reconfigured components being placed opposite the metallized contact pads of the printed circuit; and these external outputs are connected solderlessly to the metallized contact pads of the printed circuit by means of a material based on an electrically conductive adhesive or ink.

Abstract: Disclosed herein is a method of manufacturing a printed circuit board, including: providing a carrier including an insulation layer, first metal foils formed on both sides of the insulation layer, adhesive layers respectively formed on the first metal foils and made of a thermoplastic resin, and second metal foils respectively formed on the adhesive layers; applying resists having openings for forming metal posts onto both sides of the carrier; forming metal plating layers for forming the metal posts in the openings; grinding surfaces of the resists; removing the resist and forming insulation layers on both sides of the carrier; and grinding surfaces of the insulation layers. The method is advantageous in that both sides of a carrier are simultaneously layered, it is possible to prevent a substrate from warping during the process of manufacturing the printed circuit board.

Abstract: A wiring board connection method comprising: arranging a continuous conductive joint body on adjacent connection terminals of one of the wiring boards in a space between the adjacent connection terminals on one of the wiring boards; aligning the wiring boards so that the connection terminals face each other with the conductive joint body interposed therebetween; and bonding the connection terminals with each other by heating and then cooling the conductive joint body, wherein: the conductive joint body is a material that generates air bubbles upon being heated; and a recessed portion is formed on a surface of at least one of the connection terminals, the surface being opposite to the connection terminal of another wiring board. When the connection terminals are bonded with each other, the conductive joint body is allowed to move so as to gather on the surfaces of the connection terminals where no recessed portions are formed.

Abstract: A structure such as a button may have a substrate. Components such as switches may be mounted on the substrate. The substrate may be a printed circuit board with solder pads. A snap member may be soldered to one of the solder pads. A metal clip may have a snap arm with an opening. The metal clip may be attached to the printed circuit board. When attached, the opening in the snap arm may mate with the snap member that is soldered to the solder pad on the printed circuit board. The printed circuit board may be attached to a button housing member. A button cover member may be attached to the clip. A ground connection may be formed between the metal clip and the snap member by providing the snap member with structures that bear against the metal clip and form an electrical connection.

Abstract: In a method for integrating a component (3) into a printed circuit board, the following steps are provided: providing two completed printed circuit board elements (1, 4), which more particularly consist of a plurality of interconnected plies or layers (6, 7, 8), wherein at least one printed circuit board element (4) has a cutout or depression (10), arranging the component (3) to be integrated on one of the printed circuit board elements (1) or in the cutout of the at least one printed circuit board element, and connecting the printed circuit board elements (1, 4) with the component (3) being accommodated in the cutout (10), as a result of which it is possible to obtain secure and reliable accommodation of a component or sensor (3) in a printed circuit board. Furthermore, a printed circuit board of this type comprising an electronic component (3) integrated therein is provided.

Abstract: A mounting method for mounting an electronic component on a printed circuit board, the mounting method includes fixing a lower surface of a magnet panel to a magnetic body included in the electronic component by a magnetic force, seizing the electronic component by attracting a part of an upper surface of the magnet panel to an attaching unit, determining a position of the attracting unit to place the electronic component at a predetermined position with respect to the printed circuit board and releasing the attracting unit from the upper surface of the magnet panel.

Abstract: A manufacturing method for a lens drive device provided with a lens drive module having a movable body, a fixed body and a drive mechanism for driving the movable body, and a circuit board on which the lens drive module is mounted may include a module assembling step in which the lens drive module is assembled, a module mounting step in which the lens drive module is soldered by a reflow method after the module assembling step to be mounted on the circuit board, and a magnetizing step in which a drive magnet of the drive mechanism is magnetized after the module mounting step so that a magnetic pole of one end face and a magnetic pole of the other end face in the optical axis direction are different from each other.

Abstract: A method for manufacturing a printed circuit board having a substrate composed of an insulation material, a via hole formed in the substrate, and a via land formed around the opening of the via hole on a surface of the substrate includes processes of measuring deformation of the substrate having the via hole formed therein, calculating a position where the via land is to be patterned on the basis of the deformation of the substrate measured in the measurement process, and patterning the via land at a position corrected on the basis of the value calculated in the calculation process.

Abstract: A method of manufacturing a printed circuit board having a flow preventing dam, including: applying a dry film resist on a base substrate having a solder pad, and then primarily exposing the dry film resist to light; secondarily exposing the primarily exposed dry film resist formed on a peripheral area of the base substrate to light, thus forming a flow preventing dam; removing the unexposed dry film resist to expose the solder pad, thus forming an opening; printing the opening with a solder paste, and then forming a solder bump through a reflow process; and removing the primarily exposed dry film resist.

Abstract: The invention provides systems and methods for power connection, which may be a sealed power connection. The sealed power connection may be used with an electric machine or any device that may require electrical and/or mechanical connection for power. The sealed power connection may provide an effective electrical connection while providing a robust mechanical connection. The electric machine or device may be fluid-sealed and/or fluid-cooled. The sealed power connection may provide for electrical insulation of the connection from the machine or device enclosure, and may also be sealed to provide for fluid sealing and/or internal fluid cooling of the electric machine or device, as well as fluid cooling of the connection.

Abstract: The electronic component mounting line includes a computing unit for calculating a print position of solder paste printed on board-side electrodes, an electronic component placement device for placing an electronic component onto the board-side electrodes by referencing the print position of the solder paste, a placement position control device for controlling the placement position of the electronic component by referencing the print position of the solder paste, a bonding device for melting the solder paste to bond the electronic component and the board-side electrodes to each other, and a mounting-position control device for controlling the mounting position of the electronic component by referencing the board-side electrode position. In this configuration, position control responsive to displacement of the electronic component by the self alignment effect exerted by the molten solder paste is fulfilled.

Abstract: A method for producing a joined structure, containing: after placing an anisotropic conductive film in the predetermined manner, placing a wiring member containing a wiring plate formed thereon, where the wiring plate has a resist region in which the wiring plate is covered with a resist layer, and a second electrode region in which the wiring plate is not covered with the resist layer, so that the edge of the resist region at a boundary with the second electrode region comes above the chamfer part of the substrate; and heating and compressing the anisotropic conductive film from the side of the wiring member to melt and make the anisotropic conductive film flow into the side of the resist region to thereby cover the second electrode region with the anisotropic conductive film, so as to electrically connect the first electrode region and the second electrode region.

Abstract: The invention relates to a method for applying soft solder to a mounting surface of a component, wherein a connecting means comprising a carrier layer and a soft solder layer formed by physical vapor deposition on the carrier layer is brought into mechanical contact between the soft solder layer and the mounting surface, such that a first bond strength between the soft solder layer and the mounting surface is greater than a second bond strength between the soft solder layer and the carrier layer. The connecting means is subsequently removed from the component so that the carrier layer releases from the soft solder layer in the area of the mounting surface and thus soft solder remains only at the mounting surface.

Abstract: A method for packaging an airtight multi-layer array type LED is disclosed. The method includes: integrally forming a metal substrate with an airtight metal frame surrounding an accommodating space; forming a light outlet platform surrounding a light outlet opening on a bottom of the accommodating space; forming two horizontal sealing through holes in the airtight metal frame, wherein each sealing through hole has one lead frame inserted therethrough, and all interstitial space in the two horizontal sealing through holes is completely sealed with a sealing material; disposing the optical units and optical components in the accommodating space; sequentially forming a dice protection layer, a fluorescent layer, and a silicone layer on the LED dices; and installing an optical glass cover on the top surface of the airtight metal frame to seal the packaging structure of the present invention.

Abstract: A device including a heat sensitive substrate and an electrical conductor disposed thereon is provided. In certain examples, the heat sensitive substrate may be configured to degrade at or above a sintering temperature. In other examples, the electrical conductor may be processed, prior to disposal on the heat sensitive substrate, at the sintering temperature on a second substrate that can withstand the sintering temperature. Methods and kits are also disclosed.

Abstract: A method of manufacturing a circuit board (PCB) with light emitting diodes includes a channel through the PCB to define first and second sides diametrically opposed from each other, a plurality of first legs from the first side towards the second side, and a plurality of second legs from the second side towards the first side, and alternating across the PCB from the first side to the second side the plurality of legs. The channel thus runs along top and bottom edges defined between a pair of adjacent first and second legs. Bridges are provided along the channel physically connecting the first side to the second legs, and/or connecting the second side to the first legs, and/or connecting between the first and second legs. Lastly, LEDs are populated along the sides and legs.

Abstract: A method of forming an encapsulated coupled coil arrangement. The method includes coupling a first lead of a first coil to a second lead of an electrical circuit device, by soldering or infusion, using a superconductive jointing alloy; and encapsulating the first coil, the electrical circuit device and the jointed leads of the first coil and the electrical circuit device in an encapsulation material. The jointing alloy has a melting point higher than a highest temperature experienced by the encapsulation material having the encapsulation process.

Abstract: The disclosure relates to a method for producing a contact piece, for use in a vacuum interrupter chamber, especially in a low, medium or high voltage vacuum interrupter chamber. The aim of the disclosure is to improve multi-layer contact systems in such a manner that even larger layer thicknesses can be used to improve the electrical properties. For this purpose, the contact piece is comprised of at least two layers of powder-metallurgical pressed green compacts with a solder film inserted thereinbetween, the layers being soldered together in a soldering furnace in a desired relative position to each other at the same time the layers are sintered.

Abstract: A power steering system having a housing having first and second housing sections, a steering shaft rotatably housed in the housing, a sensor coil, a coil bobbin having a coil holding part and a flange part and housed in the first housing section, a first held section provided at the flange part, a sensor board housed in the housing, a second held section provided at the sensor board, first and second riveting portions provided at the first housing section, and an electric motor. The first riveting portion fixes the coil bobbin to the first housing section by melting and deforming the first riveting portion with the first held section touching the first riveting portion. The second riveting portion fixes the sensor board to the first housing section by melting and deforming the second riveting portion with the second held section touching the second riveting portion.

Abstract: A micro pin hybrid interconnect array includes a crystal anode array and a ceramic substrate. The array and substrate are joined together using an interconnect geometry having a large aspect ratio of height to width. The joint affixing the interconnect to the crystal anode array is devoid of solder.

Abstract: A method for manufacturing a printed circuit board includes the steps of: providing a base board having a first surface layer; performing a first patterning process to the base board to form a bottom circuit on the first surface layer; forming a metal protection layer on the bottom circuit; performing a second patterning process to the metal protection layer to form a patterned metal protection layer; performing a build-up process to the base board to form a first built-up layer on the bottom circuit and the patterned metal protection layer; performing a third patterning process to the first built-up layer to form a first built-up layer circuit; performing a laser manufacturing process to the first built-up layer to form a cavity structure; and clearing the patterned metal protection layer.

Abstract: The invention relates to a method to conductively connect an electrical component with at least one conductive layer, whereby the conductive layer is applied to a substrate which is essentially transparent in the visible wavelength zone of light, comprising the following steps: the electrical component or the conductive layer is provided with a soldering material in the area where the component is to be connected to the conductive layer; the soldering material is provided with energy supplied by an energy source, such that the soldering material melts and a non-detachable, material-bonded conductive connection between the electrical component and the conductive layer is established.

Abstract: A packaging method for assembling a captive screw to a printed circuit board (PCB) includes the steps of providing a captive screw having a screw head, a threaded shank and a sleeve; pressing a fixture toward the screw head for a part of the threaded shank to exposed from a distal end of the sleeve, and then clamping the fixture on the sleeve; providing a PCB having through holes and a layer of solder provided thereon; using a tool to pick up the fixture and the captive screw and align the threaded shank with one through hole on the PCB; releasing the fixture and the captive screw from the tool for a flange at the distal end of the sleeve to extend into the through hole; heating, melting and then cooling to harden the solder layer, so that the sleeve is fixedly held to the PCB; and removing the fixture.

Abstract: The invention includes: applying an anisotropic conductive resin including conductive particles only to a plurality of bumps of an electronic component; placing the electronic component above a main surface of a flexible wiring board via the anisotropic conductive resin; and pressurizing the electronic component to the wiring board and curing the anisotropic conductive resin applied to the plurality of bumps to join the plurality of bumps to the electrodes of the wiring board. This can prevent a defective mounting of the electronic component.

Abstract: A solder resist coating for a rigid-flex circuit board contains one or more conductor tracks and at least one flex area. The solder resist coating has one or more movement gaps in the flex area of the circuit board. In addition, an electronic module is formed having at least one rigid-flex circuit board with a solder resist coating.

Abstract: A method for manufacturing a wiring board, comprising the steps of mounting at least one structural aid on each side of a planar temporary bonding means, arranging a slot from the at least one structural aid on each side of the planar temporary bonding means, embedding the electrical component in the slot, such that the terminals of the electrical component face away from the planar temporary bonding means, mounting at least one electrical component on a component foil, such that the terminals of the electrical component face the component foil, mounting the component foil at least partially on the at least one structural aid, on each side of the planar temporary bonding means.

Abstract: A near field transducer (NFT) that includes a disk, the disk having a top surface, a side surface, and a center; a peg, the peg positioned adjacent the side surface of the disk; and a heat sink, the heat sink positioned on the top surface of the disk, and the heat sink having an effective center, wherein the NFT has a peg axis, which is defined by the location of the peg adjacent the side surface of the disk, and a non-peg axis, which is perpendicular to the peg axis, and wherein the effective center of the heat sink is positioned at about the center of the disk.

Abstract: A method of manufacturing a wiring substrate includes forming a conducting layer on a first insulating layer including a first glass cloth; forming a photosensitive resist layer on the conducting layer; recognizing a first origin position on the first insulating layer; forming a mask on the resist layer by positioning the mask with respect to the first origin position, the mask being formed so as to position wiring patterns only on positions overlapping the first glass cloth in a planar view; and exposing the resist layer via the mask and forming the wiring patterns only on the positions overlapping the first glass cloth in the planar view.

Abstract: The invention relates to a method for applying a connection material with a specified shape on at least one surface of at least one workpiece, wherein the connection material and the surface have complementary wetting or wettable properties, and wherein the connection material (3) is deposited on at least one of the surfaces (2) and a shaping device (10, 10?) is arranged at least for the period of a flowable state of the connection material adjacent to the connection material as well as at least partially surrounding this material on the surface (2), wherein this device has a surface (11, 12) that is non-wettable with respect to the wetting properties of the connection material and that is designed for the forced guidance of the flow of the still flowable connection material in the region of the non-wettable surface that thus assumes a specified shape; and the shaped connection material is hardened.

Abstract: Provided are a tape feeder for use in chip mounters that can reduce a chip feeding duration and prevent chips from being turned over or assuming wrong postures to feed the chips stably, and a chip mounting method. The tape feeder includes a second link having one end linked to a link shaft through which a first link and a pivot lever are combined and the other end in which a slot curved at a predetermined inclination is formed. The velocity at which a carrier tape is fed changes according to the inclination of the curve of the slot with respect to the moving direction of the first link, the curve contacting the contact unit upon the movement of the first link in a direction helping to rotate a ratchet gear.

Abstract: One unhoused electronic component, e.g., a semiconductor power component, has at least one connecting surface disposed on a top side and/or on a bottom side for fastening and/or for electric contacting. One side of the component is attached to and/or electrically contacts a direct copper bonding ceramic substrate, at an opposing connecting surface in the region of the connecting surface. An electrically insulating carrier film is created on the substrate on the side facing the component outside the region of the connecting surface and extending beyond the bottom side. An electrically conducting conductor part is attached to and/or electrically contacts the connecting surface on the top side. A pre-formed, three dimensional structure is formed extending beyond the area of the top side, thus creating an electrically insulating mass between the carrier film and the three-dimensional structure of the conductor part.

Abstract: An electronic-parts package includes a base member, a conductive member extending through the base member, the conductive member having the insulating substance on the surface removed by polishing, electronic parts disposed on one surface of the conductive member through a connection portion, an exterior electrode disposed through a metal film on the opposite surface of the surface of the base member on which the electronic parts is disposed, and a cap member that protects the electronic parts on the base member.

Abstract: The present invention relates to a high density printed circuit board and a method of manufacturing the same which enable a thin printed circuit board to be manufactured and can overcome problems occurring in a conventional method of manufacturing a printed circuit board because a conventional CCL is not used as a raw material. The high density printed circuit board includes a first insulating layer having a constant thickness, and a pair of first circuit layers embedded in two sides of the first insulating layer, respectively.

Abstract: An exemplary method for making an electronic device includes: providing a hot press machine having a press head; placing a bonding film on an inner surface of a metallic housing; turning on the hot press machine and heating the press head to a first predetermined temperature; after heated to the first predetermined temperature, driving the press head to press the bonding film to the metallic housing for about two minutes, thereby attaching the bonding film on the metallic housing; placing the metallic element according to the corresponding bonding film of the metallic housing; heating the press head to a second predetermined temperature; and after heated to the second predetermined temperature, driving the press head to press the at least one metallic element to the metallic housing for at least two minutes, thereby attaching the at least one metallic element on the corresponding bonding film.

Abstract: A printed circuit board (“PCB”) includes a first pattern structure, a second pattern structure, a third pattern structure, and a fourth pattern structure. The first pattern structure includes a first ground pattern. The second pattern structure includes a first line pattern overlapping the first ground pattern and a second ground pattern electrically insulated from the first line pattern. The third pattern structure includes a third ground pattern overlapping the first line pattern and a second line pattern overlapping the second ground pattern. The fourth pattern structure includes a fourth ground pattern overlapping the second line pattern. Therefore, the PCB may decrease noise.

Abstract: A flexible, high density decal and the use thereof methods of forming detachable electrical interconnections between a flexible chip carrier and a printed wiring board. The flexible decal has fine-pitch pads on a first surface and pads of a pitch wider than the fine pitch on a second surface, the fine-pitch pads on the first surface designed to electrically connect to a semiconductor device, and the wider-pitch pads on the second surface designed to electrically connect to a printed wiring board or the like. The pads on the first surface are conductively wired to the pads on the second surface through one or more insulating levels in the flexible decal.

Abstract: An oscillator that can suppress a solder crack caused by a temperature change by a simple structure at low cost and improve heat cycle resistance performance is provided. The oscillator includes an epoxy resin board and an electronic component mounted on the board. Two-terminal electrode patterns are formed on the board, and connected to terminal electrodes of the electronic component by solder. A projection is formed on each of the electrode patterns at a part connected to a corresponding terminal electrode to create a space between the terminal electrode and the electrode pattern, and the solder forms a fillet in the space. This contributes to enhanced adhesion strength of the solder.

Abstract: The present disclosure provides a probe card for wafer level testing. The probe card includes a space transformer having first power/ground lines and first signal lines embedded therein, wherein the first power/ground and signal lines are configured to have a first wiring pitch on a first surface and a second wiring pitch on a second surface, the second wiring pitch being substantially less than the first wiring pitch; a printed circuit board bonded to the first surface of the space transformer, wherein the printed circuit board includes second power/ground lines and second signal lines embedded in the printed circuit board and coupled to the first power/ground and signal lines; and conductive lines configured to a surface of the printed circuit board remote to the first surface of the space transformer, wherein each of the conductive lines includes a first end coupled to one of the second signal lines and a second end coupled to a different location of the printed circuit board.

Abstract: In accordance with the teaching of the present invention, a system and method for securing a ball grid array to a printed wire board is provided. In a particular embodiment, a ball grid array comprises one or more balls configured to attach to a spring comprising one or more turns. In addition, there is a spacer plate configured to align and separate the springs, a soldering aid configured to align solder on the printed wire board and a printed wire board configured with conductive pads to attach to the ball grid array via the springs.

Abstract: An electronic product having a double-PCB sandwich structure includes a PCB assembly, and a casing having an open side. The electronic product is configured such that a protuberance is respectively formed on the inner sides of two side walls of the casing in the longitudinal direction, the PCB assembly comprises an electronic component, a base PCB and a main PCB, the length of the base PCB and the length of the main PCB in the longitudinal direction of the casing are substantially equal to each other and slightly smaller than the length of the casing so that the PCB assembly can be installed into the casing by mating with the protuberances.

Abstract: A method for aligning at least two photonic components over an interposer, and an optical package that may align such components. The method may include providing an interposer; fabricating electrical conductors passing from one surface of the interposer to an opposite surface of the interposer at selected contact positions; soldering the photonic components over the selected contact positions on the first surface, while allowing solder self-alignment. Other embodiments are described and claimed.

Abstract: A method of cooling a resistor is provided. The method includes forming a first electrical insulator having a high thermal conductivity in thermal contact with an electrically resistive pathway and forming a substrate adjacent the electrical insulator. The method further includes forming a first electrical conductor having a high thermal conductivity within the second substrate and in thermal contact with the electrical insulator.

Abstract: A method for manufacturing a board with a built-in electronic element, includes providing a support substrate including a support base and a metal foil, forming a protective film made of a metal material on the metal foil of the support substrate, forming a conductive pattern made of a metal material on the protective film by an additive method, placing an electronic element on the support substrate with the conductive pattern such that a surface of the electronic element where a circuit is formed faces the conductive pattern, covering the electronic element with an insulative resin, etching away the metal foil using a first etching solution such that the protective film is not dissolved by the first etching solution or that the protective film has an etching speed which is slower than an etching speed of the metal foil, and electrically connecting terminals of the electronic element and a part of the conductive pattern.

Abstract: In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.

Abstract: Disclosed is a printed circuit board having a plating pattern buried in a via and a method of manufacturing the same. The method of manufacturing the printed circuit board includes forming a negative pattern for forming a plating pattern, thus remarkably reducing the generation of plating thickness deviation in a plating process for forming a circuit pattern, and the printed circuit board has improved electrical signal transmission properties.