Abstract: In some embodiments, a power terminal is in electrical connection to a power supply terminal, and a printed circuit board is supplied with a board to power contact. Bringing the board to power contact together with the PCB contact causes an electrical connection between the power supply and the PCB. In some embodiments the electrical connection resists disconnection from the PCB contact without requiring an external force on the PCB. In some embodiments the PCB-to-power-contact and the PCB contact are brought together in a direction perpendicular to a plane of the PCB. In some embodiments the PCB-to-power-contact includes fingers with grasp the PCB contact on two sides.

Abstract: A board to board connector (100) includes an insulative housing (1) and a number of contacts (2) assembled in the insulative housing. The insulative housing has a first face (11), a second face (12) opposite to the first face, a pair of longitudinal vertical walls (13) connecting between the first face and the second face, a pair of transverse vertical walls (14) connecting between the first face, the second face and the longitudinal vertical walls, and a number of protrusions (131) protruding from the longitudinal vertical walls to be planar with the first face. The contacts are assembled in the insulative housing from the second face to the first face.

Abstract: A method of forming an array of piezoelectric actuators on a membrane (18) which includes the steps of preparing a piezoelectric comb-like structure having an array of islands that are integrally connected by a continuous top portion and that form piezoelectric layers of the actuators, the islands having an electrode at a bottom side, attaching the comb-like structure with its bottom electrode to a surface of the membrane, removing the continuous top portion of the comb-like structure to thereby separate the actuators from one another, and forming top electrodes on the top surfaces of the piezoelectric layers of the actuators.

Abstract: A method of manufacturing a stacked thin film piezoelectric filter includes the steps of forming a lower thin film piezoelectric resonator on a substrate, measuring a frequency of the lower thin film piezoelectric resonator and adjusting the frequency, forming an acoustic coupling layer on the lower thin film piezoelectric resonator whose frequency has been adjusted, forming the stacked thin film piezoelectric filter by forming an upper thin film piezoelectric resonator on the acoustic coupling layer, and measuring a frequency of the upper thin film piezoelectric resonator and adjusting the frequency.

Abstract: A connector support system for an automation system device is provided. The connector support system includes a device housing configured to hold a printed circuit board with a connector coupled to the printed circuit board. The connector support system also includes one or more support members coupled to a surface of the housing, wherein the one or more support members are configured to support the connector relative to the housing and configured to resist an overturning moment tending to remove the connector from the printed circuit board.

Abstract: The removing jig includes a frame member and an arm member. The arm member includes a pair of side plates each provided with an axial hole. The arm member further includes an engagement portion that engages with the lever portion at its tip. The frame member includes a contact portion that contacts with a back surface of the connector body, a pair of side frame plates each provided with a guide groove formed with respect to the axial hole, and a first window portion from which the engagement portion protrudes.

Abstract: A terminal board includes a base portion with a length; a plurality of terminals extending from the base portion; and a plurality of barriers extending from the base portion between terminals and having a barrier spacing distance between each barrier. The ratio of length to barrier spacing distance is at least 5.124:1. The terminal board can be connected to a starter-generator housing for outputting power from the starter-generator.

Abstract: An electrical apparatus includes a printed circuit board (PCB) and a socket to electrically interface with the PCB. The PCB includes conductive traces formed in a layer of the PCB and one or more recess. Each of the recess includes an inner surface. A portion of the inner surface forms a first electrical contact connected to one of the conductive traces. The socket includes a multitude of conductive pins and one or more mechanical support matching the position of the recesses. Each of the mechanical support includes an outer surface. A portion of the outer surface forms a second electrical contact connected to an interface pin. The first electrical contact at the PCB and the second electrical contact at the socket form a conduction path from one of the conductive traces on the PCB to the interface pin at the socket when the PCB is inserted into the socket.

Abstract: A method is provided for the sealed assembly of an electronic housing containing one or more electronic components. The method includes: assembling the housing by bringing a support, to which the electronic components are fixed, in contact with a cover by means of a mixture-including a paste and nanoparticles in suspension in the paste. The size of the nanoparticles range from 10 to 30 nm. The housing is closed in a sealed manner by heating the housing to a temperature T of between 150° C. and 180° C. making it possible to sinter the metal nanoparticles, while subjecting the housing to a pressure greater than 2.5×105 Pa.

Abstract: The invention provides a process for producing a liquid ejection head, including the steps providing an element substrate provided with an element for generating energy to be utilized for ejecting a liquid, a wiring substrate electrically connected to the element substrate through a lead wire, and a support member provided with a first support portion and a second support portion; applying a sealant to the second support portion; placing the element substrate on the first support portion and bringing the lead wire into contact with the sealant applied to the second support portion; and curing the sealant.

Abstract: A portable terminal including a module, in which one or more storage members are disposed, and a method for manufacturing the portable terminal are provided. The portable terminal includes a first assembly that includes a shield can and a flexible circuit board attached to a surface of the shield can. The portable terminal also includes at least one socket unit mounted to an upper side of the first assembly. The socket unit is mounted to an upper side of the flexible circuit board while the first assembly is positioned on a jig.

Abstract: Disclosed is wiring substrate and method of manufacturing thereof, the wiring substrate including a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a window section formed in the substrate; and a connection terminal extended from an inside surface portion of the window section and bending in a direction perpendicular to a surface of the substrate.

Abstract: A connector component for operably coupling a removable integrated circuit component such as a Micro SIM™, to a host PCB is provided. The connector component is configured to fit within an aperture formed within the host PCB and houses the removable integrated circuit component within an internal cavity. The connector component includes a coupling portion configured for coupling to the top face of the host PCB, and a port for insertion and removal of the removable integrated circuit component which is exposed within the bottom face of the host PCB. The connector component may be made flush with the bottom face of the host PCB, and the host PCB may optionally be populated on one side only.

Abstract: An electric apparatus is adapted to be electrically coupled to a target platform. The electric apparatus includes a first printed circuit including a first surface parallel to a first plane and a second surface parallel to a second plane perpendicular to the first plane. The first surface has a first area and the second surface has a second area smaller than the first area. A multitude of conductive traces are formed in a layer of the first printed circuit parallel to the first plane. First and second contact regions respectively overlay first and second portions of the second surface. The first and second contact regions are electrically connected to first and second ones of the multitude of conductive traces respectively. The first printed circuit is coupled to the target platform at the first and second contact regions when the first printed circuit is electrically coupled to the target platform.

Abstract: An electronic module comprises: a multilayer circuit board having a bifurcated area along one edge and a plurality of electronic components mounted on at least one surface; a plurality of electrode pads functionally connected to the electronic components and positioned on the inner surfaces of the bifurcated area so that when the two legs of the bifurcated area are spread apart by about 180° the electrode pads align with respective contacts on a motherboard, and are connectable thereto, so that a secure connection may be created between the circuit board and the motherboard; and, two metal, heat spreading covers lockably enclosing the circuit board, one on either side, the covers further providing mating surfaces upon which a mechanical clamping device can engage and secure the module to a motherboard.

Abstract: A method to fit a contact portion in a plug housing by a robot is presented. Steps in the method include attaching a plug housing to a holder and gripping the contact portion by a gripping device of the robot. Other steps in the method include taking at least one spatially resolved picture by at least one optical detection device such that the plug housing and the contact portion are contained in the picture, determining a respective position of the plug housing and the contact portion in the picture by a control unit of the moveable robot, calculating a robot movement by the control unit that is a function of the determined positions, and performing the calculated movement by the robot to fit the contact portion in the plug housing. An apparatus to perform the method and another method to calibrate the control unit of the robot are also presented.

Abstract: A security device for protecting stored sensitive data includes a closed housing including an array of conductor paths and tamper detecting means adapted to detect a change in impedance of the array of conductor paths above a predetermined threshold value.

Abstract: A testing probe card for wafer level testing semiconductor IC packaged devices. The card includes a circuit board including testing circuitry and a testing probe head. The probe head includes a probe array having a plurality of metallic testing probes attached to a substrate including a plurality of conductive vias. In one embodiment, the probes have a relatively rigid construction and have one end that may be electrically coupled to the vias using a flip chip assembly solder reflow process. In one embodiment, the probes may be formed from a monolithic block of conductive material using reverse wire electric discharge machining.

Abstract: A method of making a connection-pad structure includes providing a substrate and coating a curable layer over the substrate. A group of intersecting micro-channels is embossed in the curable layer. Each micro-channel extends from a surface of the curable layer into the curable layer toward the substrate. The curable layer is cured to form a cured layer having embossed intersecting micro-channels in the cured layer; the group of intersecting micro-channels forms a connection pad. A curable electrical conductor is located in the intersecting micro-channels. The curable electrical conductor is cured to form an electrically continuous cured electrical conductor formed in the group of intersecting micro-channels and an electrical connector is electrically connected to the cured electrical conductor.

Abstract: Approaches for formation of a circuit via which electrically connects a first thin film metallization layer a second thin film metallization layer are described. Via formation involves the use of an anodization barrier and/or supplemental pad disposed in a via connection region prior to anodization of the first metallization layer. The material used to form the barrier is substantially impermeable to the anodization solution during anodization, and disrupts the formation of oxide between the electrically conducting layer and the barrier. The supplemental pad is non-anodizable, and is covered by the barrier to substantially prevent current flow through the pad during anodization. Following anodization, the barrier is removed. If the supplemental pad is sufficiently conductive, it can be left on the first metallization layer after removal of the barrier.

Abstract: An apparatus and method for crosstalk compensation in a jack of a modular communications connector includes a flexible printed circuit board connected to jack contacts and to connections to a network cable. The flexible printed circuit board includes conductive traces arranged as one or more couplings to provide crosstalk compensation.

Abstract: These teachings disclose a multi-purpose electric window that comprises a printed transparent sheet and a reflective layer laminated onto an electric light-switching device and a power source. The electric light-switching device is made of electrically actuated polymer dispersed liquid crystal or suspended polarized particles laminated between two transparent electrodes. There are surface lens structures at one side or both sides of the transparent sheet. Images are printed unto the surface lens structures. The lens structures are selected from prism, half spherical, half cylindrical, pyramidal, Fresnel structure or a combination of the above. The transparent sheet is laminated on the side with reflective layer or the other side of the electric light-switching device without reflective layer. Light emitting diodes can be placed at the sides or under the transparent sheet.

Abstract: A printed circuit board is fabricated so contacts for tight-pitch components are at an angle with respect to the bundles of glass fibers in the epoxy-glass printed circuit board such that adjacent component contacts do not contact the same bundle of glass fibers. This angle may be accomplished by manufacturing a printed circuit board panel with the glass fibers at an angle with respect to its edges. This angle may also be accomplished by placing parts on a printed circuit board panel that has a traditional X-Y orthogonal weave of glass fiber bundles at an angle with respect to the edges of the panel. This angle may also be accomplished by starting with a traditional panel that has an X-Y orthogonal weave, laying out parts on the panel along the X-Y weave, then placing components on the parts at an angle with respect to the edges of the parts.

Abstract: Methods are provided for making layers with nano-and micro-patterned topographies by laser action or inkjet printing on a first surface. These topographies have a periodicity of 5 nm to 500 ?m in a first direction in the plane of the first surface. These layers can be used as anisotropically patterned alignment layers in electro-optical devices and generate an orientational order of at least 0.30.

Abstract: A method for fabricating a piezoelectric multilayer are described. The method includes providing conductive layers. Alternating conductive layers are electrically connected. A first plurality of alternating conductive layers is electrically isolated from a second plurality of alternating conductive layers. Piezoelectric layers are interleaved with the conductive layers. Apertures are provided in the piezoelectric layers. A first conductive plug electrically connects the first plurality of alternating conductive layers, includes a first plurality of segments, and is in apertures in the piezoelectric layers. Each of the first plurality of segments extends through one of the piezoelectric layers. A second conductive plug electrically connects the second plurality of alternating conductive layers, includes a second plurality of segments, and is in a second portion of the plurality of apertures. Each of the second plurality of segments extends through one of the plurality of piezoelectric layers.

Abstract: An electric connecting structure between a substrate and an electric component includes a substrate mounted in a case, an electric component assembled to a member which the case is mounted, a bus bar fixed to the case and connected to an electric circuit on the substrate at its one end and a spring disposed in compressed state between the bus bar and an electrode formed on the electric component. The substrate is electrical lyconnected to the electric component through the bus bar and the spring and a held portion formed on the spring is held by a spring holding portion integrally formed on the bus bar.

Abstract: Disclosed herein is a mechanism for forming an interconnect comprising forming a connector on an interconnect disposed on a first surface of a first substrate and applying a nonconductive material in a non-liquid form over the interconnect after forming the connector. The nonconductive material covers at least a lower portion of the interconnect, and at least a portion of the interconnect is exposed. The nonconductive material is formed around the connector by pressing the nonconductive material over the connector with a roller. An angle between a top surface of the nonconductive material and a connector sidewall between about 65 degrees and about 135 degrees. The nonconductive material may be formed to extend under the connector.

Abstract: Electrode systems for use with neuromuscular monitoring systems are provided herein. An example electrode system for use with a monitoring system can include a flexible substrate, a connector interface, one or more stimulating electrodes, one or more recording electrodes and a plurality of conductive traces carried on the flexible substrate. The connector interface can be configured to communicatively connect the electrode system with the monitoring system. In addition, the one or more stimulating electrodes can be configured to deliver an electrical pulse, and the one or more recording electrodes can be configured to receive an electrical signal. The plurality of conductive traces can electrically connect at least one stimulating electrode or at least one recording electrode with the connector interface. Further, each of the one or more stimulating electrodes can have an elongate shape with a length dimension that is substantially greater than a width dimension.

Abstract: A wiring substrate includes an insulating layer having a first surface on which a projecting part is formed, and an electrode pad being formed on the projecting part and including a first electrode pad surface and a second electrode pad surface on a side opposite to the first electrode pad surface. The first electrode pad surface is exposed from the projecting part of the insulating layer. The second electrode pad surface is covered by the insulating layer. A cross-section of the projecting part is a tapered shape. One side of the cross-section toward the first electrode pad surface is narrower than another side of the cross-section toward the first surface of the insulating layer.

Abstract: A method of manufacturing a multi-layer printed wiring board including forming a core substrate, forming a first interlayer insulation layer over the core substrate, forming a first filled via in the first interlayer insulation layer, the first filled via having a bottom portion having a first diameter, forming a second interlayer insulation layer over the first interlayer insulation layer, and forming a second filled via in the second interlayer insulation layer, the second filled via having a bottom portion having a second diameter smaller than the first diameter.

Abstract: Some embodiments of the invention comprise a customizable multichannel microelectrode array with a modular planar microfabricated electrode array attached to a carrier and a high density of recording and/or stimulation electrode sites disposed thereon. Novel methods of making and using same are also disclosed.

Abstract: This disclosure provide a nanopillar electrode device, comprising a substrate patterned with a plurality of metal pads. The device may further comprise a plurality of nanopillars electrode arrays, wherein each nanopillar electrode array is attached to the substrate above a metal pad and electrically connected to the pad. The device may further comprise and a chamber surrounding the nanopillar electrodes, which can be used for culturing cells of interest for recording action potentials. The nanopillar electrode device may be configured to apply a voltage through the nanopillar electrodes from a voltage source. Nanopillar electroporation may be used to increase the permeability of cell membranes to allow intracellular recording. Also provided are methods of device fabrication, and methods of use.

Abstract: A method of fabricating a thickness shear mode (TSM) gas and organic vapor sensor having a visco-elastic polymer coating and a fundamental frequency greater than 20 MHz. The method begins by providing a piezoelectric crystal and milling a central region of the crystal. Milling the crystal creates a central oscillating region of reduced thickness surrounded by a thicker outer region. Two electrodes are then deposited in the oscillating region of the crystal—one on each side of the crystal. The oscillating region on both sides of the crystal and the electrodes are then coated with a polymer coating.

Abstract: A USB plug connector (100) includes an insulative housing (1), a number of contacts (2) retained in the insulative housing, a metal shield (3) covering the insulative housing, a PCB (4) soldered with the contacts, an insulative cover (5) partly molded over a part of the metal shield, and a cable (6) connecting to the PCB and electrically connected with the contacts. The metal shield includes a top wall (31), a bottom wall (32), a front wall (33) connecting with the top wall and the bottom wall, and a pair of sidewalls (34) extending from two lateral edges of the front wall and retained between the top wall and the bottom wall. Each sidewall has a pair of protrusions (35) respectively on an upper edge and a lower edge thereof Each of the top wall and the bottom wall has a number of cutouts (312) correspondingly receiving the protrusions.

Abstract: The present invention relates to a method and tool for assisting alignment of one or more pin headers. In particular, the invention relates to a tool-assisted method of aiding alignment of one or more pin headers placed on a printed circuit board (PCB) prior to soldering, as well as to the tool itself.

Abstract: An improved electronic receptacle connector with portions thereof formed from an electrically conductive polymer is disclosed. A conductive polymer front face enables improved device aesthetics and can discharge electrostatic energy from a plug before it is mated with the connector. A conductive polymer housing with internal ground structures may provide electromagnetic interference shielding and improved data transfer speed.

Abstract: A mounting method for a circuit board. The circuit board is formed with pilot holes that are placed onto pilot pins of a tool such that the pilot pins protrude through and beyond the circuit board. Then the tool is displaced toward a circuit board holder of the housing whereupon the pilot pins engage with a form fit in corresponding centering holes of the circuit board holder. After fixing the circuit board in the housing, the tool is withdrawn by detaching the pilot pins from the pilot holes, the circuit board remaining in the circuit board holder. The tool has an upper plate with associated pilot pins and a lower plate with a housing holder for positioning the housing. The circuit board, with the pilot pins engaging the pilot holes, is displaced by moving the upper plate toward the lower plate.

Abstract: An electrical module includes a housing, at least one electrical component mounted within the housing and an electrical press-fit contact. The electrical press-fit contact is located in part within the housing and has a press fit portion and a stop portion at its distal end and a mounting portion at its proximal end. The mounting portion is electrically coupled to the electrical component. The press-fit portion is located exterior of the housing such that the stop portion is able to block movement of the press-fit section into the housing when a press-in force is introduced onto the press-in contact to press the press-fit contact into the housing.

Abstract: A method of manufacturing a terminal block for a telecommunication cable, which includes providing a housing having a front side and a back side and positioning multiple pairs of electrical connectors in the housing such that one end of each of the electrical connectors is exposed on the front side of the housing and one end of the connector is exposed on the back side of the housing. Each of electrical connectors having an insulation displacement contact terminal on the end exposed on the back side of the housing, and connecting multiple pairs of insulated electrical wires to the connectors on the back side of the housing. A dielectric material is pressure molded on the back side of the housing to encapsulate the connections of the wires and the connectors on the back side of the housing.

Abstract: A multilayer ceramic component includes a stack containing ceramic layers and electrode layers interspersed among the ceramic layers. The electrode layers contain copper and define first and second internal electrodes. First and second external contacts are on different sides of the stack. The first and second external contacts contain copper and are substantially perpendicular to the ceramic layers and electrode layers. The first internal electrode is connected to the first external contact and the second internal electrode is connected to the second external contact. The first and second internal electrodes overlap each other at a plane intersecting the stack. In areas adjacent to boundaries between the first and second external contacts and the ceramic layers, the first and second external contacts are not oxidized and material making-up the ceramic layers is not diminished. A bonding strength of the external contacts to the stack exceeds 50 N.

Abstract: A part mounting method of mounting first mounting parts and a second mounting part to a board includes taking an image of a configuration of the second mounting part and performing an image-recognition, mounting the first mounting parts to the board based on a result of the image-recognition of the configuration of the second mounting part, and mounting the second mounting part to the board based on a result of an image-recognition of the first mounting parts mounted to the board.

Abstract: A module 100 can be precisely manufactured by mounting an electronic component 102 and a terminal assembly 10 having a simple configuration, in which a plurality of connection terminals 11 are supported by a support body 12, the configuration being highly precise, inexpensive, and new, on one principal surface of a wiring substrate; and by sealing the electronic component 102 and the terminal assembly 10 mounted on the one principal surface of the wiring substrate 101, with a first resin layer 103. Also, since the plurality of connection terminals 11 are merely supported by the support body 12, the support body 12 can be easily removed from the plurality of connection terminals 11. Accordingly, the manufacturing time of the module 100 is decreased.

Abstract: A wire extends through a ceramic body. The wire comprises a material selected from the group consisting of platinum, palladium, rhodium, iridium, osmium and alloys of platinum, palladium, rhodium, iridium, and osmium. The wire directly contacts the ceramic body to form a substantially hermetic seal between the ceramic body and the wire.

Abstract: A method of reducing crosstalk. The method may include forming a first contact over a first vertical conductor. The method may include forming a second contact over a second vertical conductor. The method may include forming a capacitive coupler between the first contact and the second contact, wherein the capacitive coupler is to cancel crosstalk received at the second vertical conductor from the first vertical conductor.

Abstract: A method for producing an electric component including a dielectric layer on a substrate, includes the method steps of applying a metallic layer to the substrate and oxidizing the metallic layer to form a dielectric layer, wherein at least one partial region of the metallic layer is fully oxidized through the entire thickness of the layer.

Abstract: The present invention discloses methods and apparatuses for the separations of IC fabrication and assembling of separated IC components to form complete IC structures. In an embodiment, the present fabrication separation of an IC structure into multiple discrete components can take advantages of dedicated IC fabrication facilities and achieve more cost effective products. In another embodiment, the present chip assembling provides high density interconnect wires between bond pads, enabling cost-effective assembling of small chip components. In an aspect, the present process bonds multiple interconnect wires to bond pads with electrical linkages between the bond pads and then subsequently separates the adjacent bond pads.

Abstract: A method of making carbon nanotube contact structures on an electronic device includes growing a plurality of carbon nanotube columns on a mandrel. Electrically-conductive adhesive is applied to ends of the columns distal from the mandrel, and the columns are transferred to the electronic device. An electrically-conductive material is deposited onto some or all of the columns. The mandrel can be reused to grow a second plurality of carbon nanotube columns.

Abstract: A pointer with an integrated light emitting diode (LED) designed with the female side of a jack connector. A motor is designed with the male side of the jack connector, replacing the shaft of the motor. The pointer is assembled with the male side of the jack connector integrated in the motor. The pointer is designed as an in-mold, integrated LED and female side of the jack connector. LED terminals are connected to the jack connector. The motor integrates the male side of the jack connector, replacing the shaft of the motor. LED supply voltage signals (VCC,GND) reach the printed circuit board (PCB) through the jack connector by implementing new contact springs in the base of the motor. Inside the motor the shaft is connected to the contact springs with brushes.

Abstract: A method of producing a land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane.

Abstract: The invention relates to a method for applying soft solder to a mounting surface of a component, wherein a connecting means comprising a carrier layer and a soft solder layer formed by physical vapor deposition on the carrier layer is brought into mechanical contact between the soft solder layer and the mounting surface, such that a first bond strength between the soft solder layer and the mounting surface is greater than a second bond strength between the soft solder layer and the carrier layer. The connecting means is subsequently removed from the component so that the carrier layer releases from the soft solder layer in the area of the mounting surface and thus soft solder remains only at the mounting surface.