Abstract: A conductive sleeved fastener assembly includes an electrically-conductive fastener having a fastener head and a fastener shank extending from the fastener head and an electrically-conductive fastener sleeve receiving the fastener shank of the fastener and a fastener sleeve flange provided on the fastener sleeve and disposed in direct contact with the fastener head of the fastener. A method of preparing a conductive sleeved fastener for use is also disclosed.

Abstract: A female connector for electrical connection to an edge connector, the edge connector being of predetermined width, the female connector comprising: two parallel outer segments, at least one of the outer segments comprising electrical connections for the edge connector located on an inwardly facing surface thereof; and a spacer spacing the outer segments apart by approximately the edge connector width, the outer segments extending forward of the spacer to fit over corresponding electrical connections on either side of the edge connector to provide electrical connection.

Abstract: A cover device for a contact section of a printed circuit board for a mechatronics module is proposed. The printed circuit board includes a contact section which has at least one connection hole, for connecting an electrical connection element to the printed circuit board. The cover device is characterized in that the cover device has a voltage protection element and a sealing element for sealing the at least one connection hole. The sealing element has at least one blind hole thereby, for receiving an end section of the electrical connection element.

Abstract: Provided is a method for manufacturing an acoustic wave device that has an excellent temperature coefficient of frequency (TCF) and high accuracy of IDT pattern forming and is capable of resisting high temperature processing of 200 degrees or more. The method for manufacturing an acoustic wave device according to the present invention includes forming an IDT (2) on a principal surface (1a) of a piezoelectric substrate (1), and forming a film by thermal spraying a material (3) having a smaller linear thermal expansion coefficient than the piezoelectric substrate onto an opposite principal surface (1b) of the piezoelectric substrate (1) where the IDT (2) is formed.

Abstract: A capacitive sensor (20) includes a capacitive sensor field (2), the capacitive sensor field (2) having a plurality of discrete electrodes (4) which are coupled to discrete leads (8). The leads (8) of a first electrode (41) are guided such that they are capacitively coupled with at least one second electrode (42). A first signal (Cm1) is detected at a first lead (8) which is coupled with the first electrode (41), and a second signal (Cm2) is detected at a second lead (8) which is coupled with a second electrode (42). The capacity (Cf1, Cf2) of the first electrode (41) or of the second electrode (42) is determined using a predetermined calculation formula which takes the first signal (Cm1), the second signal (Cm2) and the capacitive coupling between the second electrode (4) and the first lead (8) coupled with the first electrode (41) into account.

Abstract: Method for interfacing an integrated circuit with a biological ion channel, the integrated circuit being at least partially disposed within an electrolytic solution and including an amplifier and one or more electrodes on a surface thereof, includes forming one or more microwells proximate the one or more electrodes, applying a lipid membrane over the integrated circuit proximate the microwells, and placing a further electrode in the electrolytic solution proximate the lipid membrane on a side opposite the integrated circuit. A biological ion channel interface is also provided.

Abstract: An LGA socket suitable for electro-optical modules, such as transceivers having channels operable at 25 Gbit/s, or greater. A socket may include a socket body having a bottom side to face a printed circuit board (PCB) and a backstop on a top side to receive a leading edge of a module substrate. The backstop has an overhang to contact a first side of the module substrate when seated into the socket body. The socket further includes a first and a second row of electrical contacts, the first row being more proximate to the backstop than is the second row. Contacts extend through the socket body between the top and bottom sides and are positioned relative to the overhang to be compressed against contact pads on a second side of the module substrate by a torque applied to the module substrate about a fulcrum within the socket body.

Abstract: A touch screen includes a plurality of first transparent electrodes extending in a first direction and a plurality of second transparent electrodes extending in a second direction intersecting the first direction disposed on the substrate; first conductive layers located on at least one side of the first transparent electrodes and connected in parallel with the first transparent electrodes; and/or second conductive layers located on at least one side of the second transparent electrodes and connected in parallel with the second transparent electrodes; the first conductive layers and the second conductive layers are metal layers or alloy layers. A manufacturing method of the touch screen and a display device having the touch screen are further disclosed.

Abstract: A one glass solution touch screen panel includes a substrate, a shielding layer, an indium tin oxide film layer, a soft circuit board, an infiltrate layer, and a plurality of conducting connectors. The shielding layer is formed on a first portion of the substrate. The indium tin oxide film layer is formed on a second portion of the substrate and has a plurality of indium tin oxide film connecting portions. The soft circuit board is formed on the shielding layer. The infiltrate layer is formed on the connecting portions and defines a plurality of infiltrate gaps within the infiltrate layer. The conducting connectors are formed on the infiltrate layer. The conducting connectors are electrically connected to the soft circuit board. The conducting connectors extend into the infiltrate layer substantially filling a substantial portion of the plurality of infiltrate gaps and electrically connecting to the connecting portions.

Abstract: A dual orientation connector having a connector tab with first and second major opposing surfaces and a plurality of electrical contacts carried by the connector tab. A retainer is positioned at an entrance end of the tab and is overmolded on a portion of a carrier. The carrier has a first portion positioned within the tab, a second portion extending through the retainer and a third portion extending out of the retainer at an angle with respect to the longitudinal plane of the tab. The carrier has a plurality of conductors formed thereon and extending from the first portion to the third portion.

Abstract: A vibration layer is formed by the AD method on a cavity plate before forming pressure chambers, a common electrode is formed on the vibration layer, and a piezoelectric layer is formed on the common electrode by the AD method. Subsequently, the pressure chambers are formed in the cavity plate by the etching. After that, individual electrodes are formed on the piezoelectric layer. Subsequently, the stack of the cavity plate, the vibration layer, the common electrode, the piezoelectric layer, and the individual electrodes is heated at about 850° C. to simultaneously perform the annealing of the piezoelectric layer and the sintering of the individual electrodes and the common electrode. Accordingly, the atoms of the cavity plate are suppressed from being diffused into the driving portions of the piezoelectric layer.

Abstract: A method of forming nanotube contact structures may include forming an interconnect layer over a portion of a layer of a microelectronics device and forming a nanotube layer over a portion of the interconnect layer. The nanotube layer may define openings through the nanotube layer. The method also may include forming self-aligned electrodes in the openings of the nanotube layer such that the self-aligned electrodes are formed only in openings in the nanotube layer that substantially reside over metal filled vias of the microelectronics device. In some examples, the self-aligned electrodes may be formed on the metal in the vias, and the self-aligned electrodes may not be formed in openings that do not reside over the metal filled vias.

Abstract: A method of manufacturing a sensor network is described which includes stretching a silicon substrate over a desired area, and generating a plurality of nodes fabricated on the stretchable silicon substrate. The nodes include at least one of an energy harvesting and storage element, a communication device, a sensing device, and a processor. The nodes are interconnected via interconnecting conductors formed in the substrate.

Abstract: Provided is a method for manufacturing a probe card which inspects electrical characteristics of a plurality of semiconductor devices in batch. The method includes: a step of forming a plurality of probes, which are to be brought into contact with external terminals of the semiconductor devices, on one side of a board which forms the base body of the probe card; a step of forming on the board, by photolithography and etching, a plurality of through-holes which reach the probes from the other side of the board; a step of forming, in the through-holes, through electrodes to be conductively connected with the probes, respectively; and a step of forming wiring, which is conductively connected with the through electrodes, on the other side of the board.

Abstract: An electrical connector lock can include a mounting member configured to attach to a substrate. The electrical connector lock can also include force cancellation member that cancels forces generated on an electrical component by a mated component.

Abstract: In accordance with one embodiment, an electrical connector can be mounted to a first printed circuit board to obtain a first current capacity, and the electrical connector can be mounted to a second printed circuit board to obtain a second current capacity that is lower than the first current capacity.

Abstract: An interactive card or the like employs a piezoelectric charge generator (piezo-strip) for temporarily driving an indicator. The piezo-strip may be displaced (bent) in order to generate charge to drive the indicator. Printed electronic processes are utilized to produce the indicator and/or the piezoelectric charge generator. An indicator is formed on a substrate by way of a printed electronics process. A displaceable region of piezoelectric material associated with the said substrate is formed by way of a printed electronics process. Electrical interconnections are formed on said substrate by way of a printed electronics process. The electrical interconnections connecting said indicator and said first region of piezoelectric material such that displacement of said first region of piezoelectric material generates a voltage therein that is provided to said indicator in order to actuate said indicator and thereby indicate the displacement of said first region of piezoelectric material.

Abstract: The invention relates to a method for fabricating a bond by providing a body including a metallic surface provided with an inorganic, dielectric protective layer. The protective layer covers at least one surface zone of the metallic surface in which the metallic surface is to be electrically conductive bonded to a contact conductor. To fabricate the bond, a portion of a provided contact conductor above the surface zone is pressed on to the protective layer and the body so that the protective layer is destroyed above the surface zone in achieving an electrically conductive bond between the metallic surface and the contact conductor.

Abstract: A package substrate includes a core layer, a first dielectric layer, a second circuit pattern, a first solder mask and an insulating layer. A first circuit pattern is disposed on a first surface of the core layer. The first dielectric layer covers the first circuit pattern. The second circuit pattern is located on the first dielectric layer and the second circuit pattern includes an interconnection circuit pattern within a chip mounting area. The first solder mask covers a portion of the second circuit pattern outside the chip mounting area. The insulating layer covers the chip mounting area and the interconnection circuit pattern. A plurality of embedded pads are located on an upper surface of the insulating layer.

Abstract: Microelectronic assemblies and methods of making the same are disclosed.

Abstract: A mountable device includes a bio-compatible structure embedded in a polymer that defines at least one mounting surface. The bio-compatible structure has a first side defined by a first layer of bio-compatible material, a second side defined by a second layer of bio-compatible material, an electronic component, and a conductive pattern that defines sensor electrodes. A portion of the second layer of bio-compatible material is removed by etching to create at least one opening in the second side in which the sensor electrodes are exposed. The etching further removes a portion of the first layer of bio-compatible material so as to create at least one opening in the first side that is connected to the at least opening in the second side. With this arrangement of openings, analytes can reach the sensor electrodes from either the first side or the second side of the bio-compatible structure.

Abstract: A flexible film carrier and methods of manufacture, and more particularly, methods and structures to increase interconnect density of modules onto circuit boards is discloses. The structure includes a substrate comprising a plurality of holes and a plurality of contacts having a pitch corresponding to a pitch of I/O connections of a laminate. The structure further includes at least one type of connection provided on the substrate and which is positioned so as to avoid interference with a connection of the laminate to a circuit board. The structure further includes wiring electrically connecting the plurality of contacts to the at least one type of connection.

Abstract: Ion filter for FAIMS fabricated using the LIGA technique. The ion filter is manufactured using a metal layer to form the ion channels and an insulating support layer to hold the structure rigidly together after separation of the metal layer into two electrodes.

Abstract: An apparatus having a connector housing having an interior socket to receive a connector plug. The connector housing including a mounting hole through the interior socket, the mounting hole comprising a top opening in a first side of the interior socket and a bottom opening in a second side of the interior socket, the first side opposite the second side. A central axis of the mounting hole is oriented perpendicular to a central axis of the interior socket and the central axis of the mounting hole intersects the central axis of the interior socket, the mounting hole to allow a mounting element to pass through the interior socket along the central axis of the mounting hole.

Abstract: A method is provided for mounting a plurality of cable connectors onto a panel that defines a plurality of target mounting locations. At least two of the plurality of cable connectors defines at least a pair of cable retaining apertures. The pairs of cable retaining apertures of a first one of the two cable connectors are spaced apart in a first direction, and the pair of cable retaining apertures of a second one of the two cable connectors are spaced apart in a second direction that is different than the first direction.

Abstract: An electrical connector adapted to receive a mating plug utilizes low-profile jack terminal contacts that can flex in their PCB-anchored base portions, which are substantially parallel to the PCB. Any bend in the distal connecting portion or in the intermediate transition portion of each terminal contact is gradual and forms an obtuse angle, thus minimizing stress concentrations. The contacts preferably are arranged in two oppositely facing and interdigitating rows of four contacts each. In one embodiment, the terminal contacts are anchored to the PCB by a contact cradle that constrains the base portion of each terminal contact at two spaced anchoring locations, allowing the base portion to flex therebetween. In another embodiment, the base portions of the terminal contacts are embedded in at least one elastomeric member, which is fitted to the PCB.

Abstract: Disclosed are an electronic control apparatus for a vehicle and provides an electronic control apparatus for a vehicle using a radiation board in which a radiation plate having a slide fixing structure (for example, “U” shaped) is attached onto a portion opposite to a portion which requires the radiation in a printed circuit board(PCB) and if additional radiation performance is required, a slidable radiation board which is detachable is attached/detached to directly emit heat to the atmosphere through the radiation plate and the radiation board to the atmosphere, thereby improving a radiation effect and to implement a standard platform of the radiation structure and implement an optimal radiation structure through a slidable radiation board and a manufacturing method thereof.

Abstract: Disclosed herein is a system and method for mounting packages by forming one or more wire loop interconnects, optionally, with a wirebonder, and mounting the interconnects to a mounting pad on a first substrate. A first and second stud ball may each have at least one flat surface be disposed on a single mounting pad, and a wire having a bend region and forming a loop may be disposed between the stud balls. The stud balls may be formed from a deformed mouthing node formed on a wire. The loop may be mounted on a mounting pad on a first substrate and a second substrate may be mounted on the loop via a conductive material such as solder.

Abstract: A method, and apparatus resulting from the method, for fabricating a circuit board suitable for mounting electronic components. The method includes drilling a plurality of through-holes in a plurality of dielectric sheets, forming a conductive film on at least one side of each of the plurality of dielectric sheets, and substantially filling each of the plurality of through holes with a conductive material. The conductive material is both electrically and thermally uninterrupted from a first face to a second face of each of the plurality of dielectric sheets. The plurality of dielectric sheets are then sequentially mounted, one atop another, to form the circuit board. The sequential mounting step is performed after the steps of drilling the plurality of through-holes, forming the conductive layer, and substantially filling the plurality of through-holes.

Abstract: An electrical plug-type connector consisting of an electrically nonconductive material includes a plug housing with an inner wall and at least one plug-type contact. The inner wall delimits a first space. The at least one plug-type contact has a first end with which contact can be made by a mating plug-type contact, and a second end, which is opposite the first end. The second end is connected to a printed circuit board by solder. The plug housing is moved from the first end in a direction of the second end via the at least one plug-type contact in the axial direction into a predetermined position. In the predetermined position, the plug-type contact has a lack of force-fitting connection transversely to the axial direction. In the predetermined position, the printed circuit board is fixedly connected to the plug housing. In the predetermined position, the first end protrudes into the first space.

Abstract: Various embodiments may provide a monolithic transformer for a radio frequency (RF) power amplifier module, such as a microwave frequency power amplifier module. The transformer may include a plurality of pairs of edge-coupled transmission lines, with individual pairs including first and second edge-coupled transmission lines. The first transmission lines may include first ends coupled with one another and second ends coupled with an input terminal of the transformer. The second transmission lines may include first ends coupled with the input terminal and second ends coupled with an output terminal of the transformer. The transformer may pass a communication signal from the input terminal to the output terminal, and provide a first impedance at the input terminal and a second impedance at the output terminal. The second impedance may be higher than the first impedance (e.g., by a factor of four).

Abstract: Hermetically-sealed electrical circuit apparatus and methods for constructing such apparatus using one or more seal portions.

Abstract: An adapter apparatus for receiving a packaged device having a plurality of contact elements disposed on a surface thereof may include a conductive elastomer interconnect. The conductive elastomer interconnect may include a carrier having a plurality of openings defined therethrough from a first side to a second side thereof (e.g., the plurality of openings being arranged to align with the plurality of contact elements of the packaged device) and conductive elastomer suspended in each of the plurality of openings to contact a contact element of a plurality of contact elements of a packaged device when positioned adjacent the second side of the carrier. Further, the adapter apparatus may include one or more adapter wall members used with the conductive elastomer interconnect to define a socket cavity adapted to receive the packaged device.

Abstract: To be small-sized/light in weight, and to easily cope with the variation of an inter-electrode pitch of battery cells. A flexible printed circuit with bus bars of one embodiment includes a flexible printed wiring board having a flexible insulating base material and a plurality of wiring patterns provided on one main surface of the flexible insulating base material and provided with land parts for bus bar connection at one end, and a plurality of bus bars and fixed to the land parts for the bus bar connection with an adhesive. The plurality of bus bars and are electrically connected to the respectively corresponding land parts for the bus bar connection in block by a plating layer formed on the bus bar and the land part for the bus bar connection.

Abstract: A method for forming a lead or lead extension having an arrangement of elongated conductors disposed in a body of a lead or lead extension includes ablating a plurality of spaced-apart channels in proximity to at least one of the proximal end or the distal end of the body to expose at least part of at least one of the conductors. A C-shaped contact is disposed into each of a different one of the transverse channels. Each C-shaped contact is electrically coupled to at least one of the conductors. Each C-shaped contact is closed so that opposing ends of the C-shaped contact are adjacent to one another and aligned over one of the elongated conductors. The two opposing ends of each C-shaped contact is coupled together such that each C-shaped contact forms a continuous path around the arrangement within the transverse channel in which the C-shaped contact is disposed.

Abstract: The flexible cable mounting structure of the Present Disclosure is a flexible cable connector comprising a housing, whereon a contact terminal is mounted that enables insertion and withdrawal of the flexible cable and contact with the flexible cable. An actuator that opens/closes is installed in such a way as to enable rotation on the housing. A fitting nail is furnished on the housing and fixes the housing to the PCB. The fully-assembled flexible cable connector, wherein the contact terminal, actuator, and fitting nail have each been mounted to the housing, passes through from the bottom to the top of the PCB, and the bottom of the contact terminal and bottom of the fitting nail are soldered to the lower surface of the PCB.

Abstract: Disclosed herein is a method of manufacturing a noise removing filter, including preparing at least one conductive pattern, an insulating layer for covering the at least one conductive pattern, and a lower magnetic body including input/output stud terminals for electrically inputting and outputting electricity to and from the at least one conductive pattern; disposing a recognizable portion on upper surfaces of the input/output stud terminals; disposing an upper magnetic body on the recognizable portion and the insulating layer; polishing the upper magnetic body; and removing the recognizable portion such that a level of an upper surface of the upper magnetic body is higher than levels of the upper surfaces of the input/output stud terminals.

Abstract: To make it possible to connect a flat signal-transmission medium to a plug connector efficiently and surely with a simple configuration where the number of components are reduced.

Abstract: A wiring board unit includes: a polygonal wiring board having three or more sides in top view, a product insulating part comprising a plurality of external terminals, and a dummy insulating part at an outer edge of one of the at least three sides; and a lead frame including a frame having an inner edge defining an opening within which the wiring board is disposed in top view, and a plurality of leads, one end of each of the plurality of leads connected to the inner edge of the frame and the other end of each of the plurality of leads respectively connected to one of the plurality of external terminals of the wiring board, wherein a connection unit for connecting the frame of the lead frame and the dummy insulating part of the wiring board is arranged therebetween.

Abstract: A method for producing a multilayer substrate involves: a base-material pretreatment step in which a hole forming step and a metal adhesion step are performed in no particular order, the hole forming step being a step of subjecting a core base material having at least an insulating layer and a first metal layer to a hole opening process, the metal adhesion step being a step in which a predetermined metal or metal ion is made to adhere to the other surface of the insulating layer; a desmearing step of performing desmearing by plasma etching; a cleaning step of cleaning the core base material by using an acidic solution; and a plating step of applying a plating catalyst or a precursor thereof onto the insulating layer and performing plating.

Abstract: A plug connector set-up for a control unit includes: a pin support having a pin; and a guide element having a lead-through for positioning the pin at a circuit board of the control unit. The lead-through has an entrance opening on the side facing the pin support and an outlet opening on the side facing away from the pin support. A diameter of the entrance opening is greater than a diameter of the outlet opening. The pin includes a centering region having a diameter which is less than the diameter of the entrance opening and greater than the diameter of the outlet opening.

Abstract: Heat-assisted wiring traces and a conductive support substrate are respectively formed on first and second surfaces of an insulating layer. Further, connection terminals electrically insulated from the support substrate and electrically respectively connected to the heat-assisted wiring traces are formed on the second surface of the insulating layer. Each connection terminal has an element connection portion, a pattern connection portion and a spread blocking portion. When a circuit element is connected to the element connection portion of the connection terminal by solder, spreading of a molten solder applied to the element connection portion to the pattern connection portion is blocked by the spread blocking portion.

Abstract: A device connects a computer network cable transceiver to a printed circuit board. The device includes a high-profile connector body that mounts to a printed circuit board. The height of the device above the printed circuit board is greater than the width of the device on the printed circuit board. The device has a receiving element that receives and electrically connects the network cable transceiver to an electrical connection element. The rotated aspect of this device controls the profile of the network cable transceiver that is inserted into the device. The electrical connection element is mechanically and electrically attached to the printed circuit board to enable data transfer to and from the network cable transceiver.

Abstract: A textile-based electrode system includes a first fabric layer having an inner and an outer surface. The inner surface includes a knitted electrode configured to be placed in contact with the skin of a user. A second fabric layer is disposed and configured to contact the outer surface of the first fabric layer. The second fabric layer includes a knitted conductive pathway configured to be electrically coupled to the knitted electrode. Furthermore, a third fabric layer is configured and disposed to contact the second fabric layer. A connector is disposed on the third fabric layer and is configured to be electrically coupled to the knitted conductive pathway. The second fabric layer can be folded about a first fold axis and the third fabric layer can be folded about a second fold axis to place the second fabric layer in contact with the first fabric layer and the third fabric layer.

Abstract: An electrode structure 100 on which a solder bump is placed includes an electrode pattern 50 made of an electrode-constituting material selected from the group consisting of Cu, Al, Cr, and Ti, a Ni layer 52 formed on a part of the electrode pattern 50, a Pd layer 54 formed on at least a part of a region other than the part of the electrode pattern 50, and an Au layer 56 formed on the Ni layer 52 and the Pd layer 54.

Abstract: A resistor with heat sink is provided. The heat sink includes a conductive path having metal or other thermal conductor having a high thermal conductivity. To avoid shorting the electrical resistor to ground with the thermal conductor, a thin layer of high thermal conductivity electrical insulator is interposed between the thermal conductor and the body of the resistor. Accordingly, a resistor can carry large amounts of current because the high conductivity thermal conductor will conduct heat away from the resistor to a heat sink. Various configurations of thermal conductors and heat sinks are provided offering good thermal conductive properties in addition to reduced parasitic capacitances and other parasitic electrical effects, which would reduce the high frequency response of the electrical resistor.

Abstract: A power supply module and a method for manufacturing the same are disclosed. The power supply module includes a coil including a coil body and a connecting terminal; electronic components at least including an integrated circuit chip; a connector configured to be electrically connected with the coil and the electronic component; and a magnetic conductor configured to enclose in and around the coil body and the electronic component, wherein the connector is integrally formed with the integrated circuit chip when manufacturing the latter. The present disclosure can make the structure of the power supply module be more compact to further meet the needs of miniaturization design, reduce material consumption, simplify procedure, and therefore reduce the production costs.

Abstract: A printed wiring board including solder pads excellent in frequency characteristic is provided. To do so, each solder pad 73 is formed by providing a single tin layer 74 on a conductor circuit 158 or a via 160. Therefore, a signal propagation rate can be increased, as compared with a printed wiring board of the prior art on which two metal layers are formed. In addition, due to lack of nickel layers, manufacturing cost can be decreased and electric characteristics can be enhanced.

Abstract: Disclosed are methods of making a dielectric on a metal foil, and a method of making a large area capacitor that includes a dielectric on a metal foil. A first dielectric layer is formed over the metal foil by physical vapor deposition, and a dielectric precursor layer is formed over the first dielectric layer by chemical solution deposition. The metal foil, first dielectric layer and dielectric precursor layer are prefired at a prefiring temperature in the range of 350 to 650° C. The prefired dielectric precursor layer, the first dielectric layer and the base metal foil are subsequently fired at a firing temperature in the range of 700 to 1200° C.

Abstract: The present disclosure relates to an electronic control apparatus for a vehicle using waterproof type housing sealing and a manufacturing method thereof, in which when a connector cover including a sealing material injection hole formed on a front surface is coupled with a body coupling part, a sealing space is formed along a circumference of an inner surface of each of the coupled coupling parts and a preventive protrusion formed at a body coupling part, and a sealing material is injected through a sealing material injection hole so that a sealing space between the connector cover and a housing body is sealed, thereby improving waterproof performance between the connector cover and the housing body, and simplifying a process by replacing a process of manufacturing and mounting an O-ring in advance with a simple process of injecting the sealing material.