Abstract: A method of producing a multi-layer ceramic substrate involves the steps of preparing compact blocks including a raw ceramic functional material to be the passive component, preparing a raw composite laminated member having a plurality of laminated ceramic green sheets containing a ceramic insulating material and wiring conductors and preliminarily providing spaces in the inside such that the compact blocks fit into the spaces, arranging sheet type bases made from a raw ceramic not sintered at the baking temperature of the composite laminated member on the principal plane at both ends with respect to the lamination direction of the raw composite laminated member, baking the raw composite laminated member with the raw composite laminated member interposed by the sheet type bases so as to restrain the contraction at a temperature not more than about 1000° C., and eliminating the unsintered sheet type bases.

Abstract: A method for producing printed wiring boards comprises the steps of perforating through holes at predetermined positions in an adhesive insulator sheet, filling the through holes with a conductive material such as a conductive paste or metal balls, transferring conductive wiring patterns that have been formed on surfaces of releasable supporting sheets onto the surfaces of the adhesive insulator sheet by heat and pressure. Simultaneously, interlayer via-connections are performed by means of the conductive material filled into the through holes.

Abstract: A dielectric filter device comprising a resonator body formed by arranging a plurality of resonators in parallel in a same direction and a laminated circuit arrangement to be bonded to an open-circuit end surface of the resonator body, wherein a bonding means is provided to mechanically bond them with a sufficient strength and establish required electric connections between them, said bonding means includes solder balls (20) for electrically connecting the resonator body (1a) and the laminated circuit arrangement (10a) bonded to the open-circuit end surface of the resonator body (1a) to produce solder sections p having a uniformly dotted profile. Unlike conventional techniques using an electrically conductive adhesive agent, such solder sections p provide a sufficient bonding strength without requiring any cumbersome operation.

Abstract: The present invention provides a packaged substrate which has a superior positioning accuracy of wiring formed on a circuit substrate made of ceramics, and a conductive pattern with a thick film and yet a fine pattern. On a surface of flexible base member made of plastic, fine grooves are formed in a pattern corresponding to a first conductive pattern so that a cavity face is produced. Conductive paste is filled and into the grooves on this cavity face, and then dried. The cavity face and a circuit substrate are pasted with each other by applying predetermined heat and pressure. A pattern of the dried conductive paste is transcribed onto the circuit substrate, and then the first conductive pattern is formed by firing. A first ball solder is coupled with a second conductive pattern which is coupled to the first conductive pattern through an electrode in a through-hole of the circuit substrate.

Abstract: Via portions are formed in a first green sheet for a first layer of a laminated substrate. Then, conductive lands are formed on a surface of the first green sheet and a wiring pattern is formed on a back face of the first green sheet to be connected to the conductive lands through the via portions. The thus formed first green sheet is joined to a second green sheet having via portions therein so that the wiring pattern of the first green sheet contacts the via portions of the second green sheet. In this case, by forming the wiring pattern on the back face of the first green sheet, lamination slippage of the wiring pattern caused by lamination of the first and second green sheets can be prevented.

Abstract: A method of fabricating a ceramic multilayer substrate includes steps of laminating a plurality of green sheets including an inside green sheet formed with a conductor pattern and pressing a laminate of green sheets under a predetermined pressure together with sheet restricting members applied to opposite surfaces of the laminate respectively, thereby bonding the laminate and sheet restricting members together, each sheet restricting member having a smaller percent change in thickness than the green sheets during the bonding and a higher firing temperature than the green sheets, firing a bonded assemblage of the green sheets and sheet restricting members at a firing temperature of the green sheets, and removing the sheet restricting members from the opposite surfaces of a fired body.

Abstract: A process for manufacturing a multi-layer printed wire board, also referred to as a multilayer, comprising at least two electrically insulating substrates with electrically conductive traces or layers provided on at least three surfaces thereof, in which process, by means of lamination under pressure, a cured basic substrate based on a UD-reinforced synthetic material, provided on either side with traces, is combined with and bonded to a back-up substrate, wherein during the laminating process the back-up substrate is added to the basic substrate, the base substrate and the back-up substrate comprising a UD-reinforced cured core layer, the base substrate having been provided at least on the side facing the back-up substrate with a still plastically deformable (flowable) adhesive layer, and such a pressure is exerted on the laminate as to bring said back-up substrate into contact or practically into contact with the conducting traces of the basic substrate, and the space between these traces is filled with the

Abstract: A sintered body, for manufacturing a ceramic substrate, on which a via can be formed with high positional accuracy and the substrate is not warped and further the productivity is high. The sintered body includes a pillar-shaped ceramic body and metallic wiring rods provided in the ceramic body in parallel with the axis. The metallic wiring rods are made of metal, the melting point of which is lower than the sintering temperature of the sintered ceramic body.

Abstract: A method of manufacturing a monolithic ceramic electronic device includes the following steps: forming a first metal film on a PET film; forming a multilayered metal film by forming a second metal film on a part of the first metal film, the second metal film being thicker than the first metal film; forming a monolithic ceramic structure including the multilayered metal film; forming the first metal film, which is partially overlain by the second metal film in the monolithic ceramic structure, into an insulating structure in such a manner that metal components forming the first metal film are diffused into the ceramics; and firing the ceramics. Disclosed also is a monolithic ceramic electronic device manufactured by the method.

Abstract: The method of producing a ceramic sheet for laminated ceramic electronic devices according to the present invention comprises printing an electrically conductive composition imagewise on one side of a carrier film F either directly or indirectly through a green ceramic layer G' by the screen printing technique to form electrodes E and then printing a green ceramic composition in solid on top of the printed surface by the screen printing technique to form a green ceramic layer G.

Abstract: The present invention provides a recording head for electrostatic recording having a plurality of lower electrodes and a plurality of upper electrodes constituting a matrix with an insulating layer interposed therebetween and a space for ion generation where corona discharge is caused by applying a voltage between the lower and upper electrodes characterized in that a plurality of short partial recording heads are formed by integrally firing the lower electrodes, insulating layer and upper electrodes and are joined to provide a recording head of a desired length.

Abstract: A multilayer substrate is constituted by laminating a plurality of sheet substrates, the respective sheet substrates are constituted by forming conductive layers of a refractory metal such as W on ceramic green sheets composed mainly of an alumina ceramic, and the ceramic green sheets are laminated and sintered to constitute the multilayer substrate. Porous conductive material layers are formed on the surface of the multilayer substrate so as to be selectively connected to the conductive layers, and copper-plated layers are formed on the porous conductive material layers. Thick film conductor layers are formed on the copper-plated layers to constitute terminal conductors, and, a thick film resistor layer for example is connected to the terminal conductors.

Abstract: Disclosed is an electronic packaging substrate which includes a sintered ceramic body having at least one internal layer of wiring and at least one cooling channel internal to and integral with the sintered ceramic body for cooling a heat-generating electronic device placed on the sintered body. Also disclosed is a method of making the electronic packaging substrate.

Abstract: In a method of forming an electrode on a ceramic green sheet, an electrode is formed on a support film by a thin film forming method, an adhesion inhibitor is formed on top of the electrode for protecting the same from adhesion of a ceramic slurry, and thereafter a ceramic slurry is applied onto the support film to form a ceramic green sheet, thereby obtaining a ceramic green sheet, provided with a through electrode.

Abstract: Patterned laminated green tape multilayer stacks can be fired while maintaining the dimensions of the pattern by applying, as by screen printing or spraying, a ceramic ink over surface portions of the green tape stack. Complex patterns can be formed in the green tapes by punching openings in one or more of the laminated green tape stacks before laminating them together.

Abstract: A ceramic circuit substrate providing a circuit pattern with a fine line as well as high accuracy for positioning the circuit pattern and a method of producing the ceramic circuit substrate. An alumina layer that is green containing an alumina that is not sintered at a temperature ranging from 800.degree. to 1000.degree. C. is applied on a surface of a ceramic green sheet containing glass and then fired at a temperature ranging from 800.degree. to 1000.degree. C. The ceramic green sheet is sintered into a sintered ceramic substrate. A porous alumina layer is formed on a surface of the sintered ceramic substrate. The glass contained in the sintered ceramic substrate is caused to flow to the inside of the porous alumina layer so that the part of the porous alumina layer filled with the glass is bonded to the sintered ceramic substrate.

Abstract: A method of fabricating a ceramic multi-layered wiring substrate, in which deformation of ceramic green sheets is prevented so that the probability of connection failure of through-holes is reduced, includes forming a ceramic green sheet on a carrier film and forming through-holes through the ceramic green sheet and the carrier film. The carrier film is used as a mask when the through-holes are filled with electrically conductive paste. The green sheet is attached onto a thick plate. The green sheets attached on the respective thick plates are sequentially adhered and laminated temporarily. The laminated green sheets form a ceramic green sheet lamination block which is sintered, resulting in a ceramic multi-layered wiring substrate.

Abstract: Disclosed is a method of selectively depositing a metallic layer on a metallic feature on a ceramic substrate. The metallic layer preferably may be elemental nickel particles, elemental copper particles, a mixture of copper and nickel particles, or copper/nickel alloy particles. The metallic layer is deposited as a paste mixture which includes the metallic particles and a binder material. Through a subsequent heating step, the metallic layer tightly bonds to the metallic feature but only loosely bonds to the ceramic substrate. Thereafter, an ultrasonic treatment is applied to remove the loosely adhered metallic layer on the ceramic substrate. The metallic layer on the metallic feature, being tightly bonded, is not removed by the ultrasonic treatment.

Abstract: A method for making a printed circuit with a cavity is disclosed. The method comprises the step of laying a sticker sheet on a first, metallized dielectric layer and laying a second, metallized dielectric layer on the sticker sheet. The second metallized dielectric layer and the sticker sheet each have a window which is registered with the other window forming a cavity. Next, a flexible release layer is laid above the second metallized dielectric layer and a thermosetting visco-plastic material is laid on the release layer over the cavity. Next, the first and second metallized dielectric layers, sticker sheet, release layer and visco-plastic material are laminated by heat and pressure to cure the sticker sheet and thereby bind the first and second metallized dielectric sheets to each other. During the lamination step, the sticker sheet flows to the perimeter of the cavity.

Abstract: A sensor for detecting moisture on a non-conductive support, in particular a windshield of a motor vehicle, has one or more metallic, electrically conductive layers which are arranged in a given pattern on the outer surface of the support. The metallic, electrically conductive layer is produced from a metallic resinate which is applied to the support and then burned-in by the action of heat. Also deseribed is a method for constructing such a moisture sensor whit applies a glass layer in the form of a glass frit paste to be sintered upon the metallic electrically conductive layer, where the burning-in of the metallic resinate and the sintering of the glass frit paste are effected in single step.

Abstract: A rain sensor for the windshield of a vehicle has one or more electrically conductive layers which are arranged in a given pattern upon the outer surface of such windshield, and is constructed as a laminate of conductive and resistive layers formed by process steps of printing and sintering for construction of electrodes of the sensor. A conductive layer is formed of a mixture of electrically conductive particles and a glass frit which melts at a lower temperature than a melting temperature of the material of the window which serves as a support for the sensor. The conductive paste is applied with a heating action step, in the configuration of an electrode structure, by sintering to the window.

Abstract: A method of manufacturing a monolithic ceramic electronic device includes the following steps: forming a first metal film on a PET film; forming a multilayered metal film by forming a second metal film on a part of the first metal film, the second metal film being thicker than the first metal film; forming a monolithic ceramic structure including the multilayered metal film; forming the first metal film, which is partially overlain by the second metal film in the monolithic ceramic structure, into an insulating structure in such a manner that metal components forming the first metal film are diffused into the ceramics; and firing the ceramics. Disclosed also is a monolithic ceramic electronic device manufactured by the method.

Abstract: The present invention relates generally to a new apparatus and method for screening using porous backing material. More particularly, the invention encompasses an apparatus that uses a porous backing material which is adhered to a green sheet during the screening process. Basically, a backing layer having a very high porosity is adhered to a green sheet, while the green sheet is screened. During the drying process of the green sheet some of the screening fluids are absorbed by the porous backing layer, which allows the screened vias of the green sheet to have a smooth surface.

Abstract: A multilayer ceramic substrate for microelectronics includes stress relief pads to reduce stress in the vicinity of functional vias penetrating through multiple ceramic layers. The stress relief pads are located only on the major surface of a ceramic layer and accordingly do not prevent wiring from being placed directly below the stress relief pads on the bottom surface of the same layer or the top surface of the immediately underlying layer. The invention also includes the method of making the multilayer ceramic substrate with stress relief pads.

Abstract: A multi-chip module is provided which utilizes benzocyclobutene as a laminate adhesive for bonding the upper dielectric films in a high density interconnect structure. The benzocyclobutene thermosetting polymer is spin coated on a polyimide film, and baked at low temperature to remove any solvent to leave a B-staged coating on the polyimide film. The composite film can be laminated to an underlying electrical structure using a vacuum laminator and heat. As the heat is applied, the BCB layer softens, flows and then cures to bond the polyimide film to the underlying electrical structure.

Abstract: A method for manufacturing multiple circuit board for mounting LIS elements and general electronic elements, and which is direcdted to provide a method for manufacturing a porous multiple layer ceramic circuit board in which a granularity of lead-zinc-borate glass (Pb--Zn--B glass) powder mixed together with ceramic powder is classified into two kinds and then the powders classified with granularity is used, so that closed pores of suitable magnitude and quantity are formed within interior even without addition of high molecular open gap type raw material whereby an insulation property and wetproof property are excellent and dielectric constant is low. The invention is made such that only A green sheets are piled by printing a conductor electrode to A green sheet manufactured by mixing 30-70 wt % of ceramic powder and Pb--Zn--B glass powder made of 50-90 wt % of powder being 9-20 wt % in average granular diameter and 10-50 wt % of powder being less than 3 .mu.

Abstract: A method for producing a multilayer ceramic circuit substrate having therein internal conductor patterns comprising W and/or Mo as a main component and surface conductor patterns comprising Cu as a main component formed onto a surface layer of the multilayer ceramic circuit substrate, wherein an intermediate metal layer comprising 40 to 90 wt. % of W and/or Mo and 10 to 60 wt. % of at least one element selected from the group consisting of Ir, Pt, Ti, and Cr is formed in through-holes of the surface layer and on parts of the surface layer in the vicinity of the through holes on the surface layer, whereby the internal conductor patterns and the surface conductor patterns are electrically connected through the intermediate metal layer. The alumina multilayer ceramic circuit substrate enables an excellent bonding strength and electrical conductivity between the internal conductors and the surface conductors and high precision wiring and miniaturization of an electronic circuit part.

Abstract: A method of manufacturing a resistor integrated in a sintered body, by patterning a plurality of metal thin films which are formed by a thin film forming method, thereafter transferring the patterned metal thin films onto a ceramic green sheet (11), stacking another ceramic green sheet and/or a ceramic green sheet stacked with another metal thin film thereon for obtaining a laminate, and firing the resulting laminate, thereby forming a resistor integrated in a sintered body which is structured by by alloying the plurality of metal thin films in a ceramic sintered body.

Abstract: A method of fabricating a large, rectangular, multilayer ceramic capacitor formed of alternating ceramic and electrode layers. Capacitors so formed have a high dielectric constant, extremely low leakage current and an extremely low dissipation factor. Exemplary capacitors can be made with a lead magnesium niobate dielectric composition powder to which is added several organic constituents, including a surfactant and a plasticizer, plus small amounts of several dopants, such as lithium niobate, copper oxide, magnesium titanate, manganese niobate and zirconium oxide. That total mixture is ball milled to form a slip with very small grain size. The slip is cast as a thin tape on a Mylar backing, cut into a plurality of blanks, and alternating layers of the green tape ceramic and electrode layers are laminated on a polyvinyl alcohol coated foundation plate. Firing and sintering steps are followed by application of electrical terminations to complete the capacitor.

Abstract: In an electro-mechanical energy conversion device which is disclosed, green sheets on which whole surface electrodes for grounding have been printed and green sheets on which 2-divided electrodes have been printed are laminated. The green sheets having the 0.degree. phase and 90.degree. phase on which the 2-divided electrodes have been printed are laminated through the printed sheet on which the whole surface electrode for grounding. After the laminate body was sintered and integrated, it is polarized in a manner such that the polarizing directions in the thickness direction of each layer are opposite between the two divided electrodes which form one pair by using the whole surface electrodes for grounding and the 2-divided electrodes which were printed, thereby constructing the conversion device for the laminated type vibration driven motor.

Abstract: A method of making a multi-layered ceramic substrate which includes the steps of laminating a desired number of green sheets each being made of glass ceramics containing at least an organic binder and a solvent and each having a pattern of electrodes formed thereon by the use of an electroconductive paste, to thereby provide a green sheet laminate, The electrodes on opposite surfaces or an entire surface layer of the green sheet laminate are subsequently printed with a paste comprising an inorganic component added with at least an organic binder containing a Zn composition. On each surface of the laminate printed with the paste of the Zn composition, a green sheet made of an inorganic composition incapable of being sintered at a temperature of crystallization of the glass ceramics is then laminated thereby providing a laminate plate which is subsequently fired.

Abstract: Disclosed is a method of increasing the adhesion between gold and silica derived from hydrogen silsesquioxane resin. The method comprises joining the gold and silica followed by annealing under an oxidizing atmosphere.

Abstract: Method for producing ceramic laminates from a plurality of greensheet layers which include one or more thin greensheet layers, e.g. having a thickness less than about 3 mils, with interposed patterned circuit layers and conductive vias, while avoiding the loss of strength and the distortion encountered when paste compositions are pre-applied to such thin greensheet layers. The invention avoids the aforementioned problems by the use of a plurality of greensheet layers including thicker, paste-resistant greensheet layers having a thickness greater than the thin greensheet layer, e.g., between 5 and 10 mils, each pair of the thicker greensheet layers confining therebetween an unscreened thin greensheet layer, one of the thicker greensheet layers also being screened with the circuit pattern layer normally applied to the interposed thin greensheet layer. Thereafter the superposed layers are laminated and sintered to form the composite.

Abstract: In the manufacture of ceramic circuit boards having ceramic or metal support substrates, a bonding glass layer that is adherent both to the substrate material and to multilayer green tape compositions having circuitry printed thereon, is deposited and flowed onto the support substrate. The bonding glasses suitable for use with nickel plated metal substrates and green tape compositions containing forsterite-cordierite-type glasses are mixed oxides including calcium, zinc and boron as well as other oxides. These bonding glasses have a thermal coefficient of expansion that is larger than said metal substrate, and a flow temperature below that of said cordierite-type glasses.

Abstract: Low-thermal-expansivity polyimides have a linear rigid skeleton, so that adhesion between perfectly cured low-thermal-expansivity polyimide films is very low. On the other hand, a film of a polyimide having a flexible skeleton shows high adhesiveness even after perfect curing, so that it is possible to enhance adhesion between the low-thermal-expansivity polyimide films by interposing a polyimide having a flexible skeleton. A flexible polyimide thin film is formed as a highly adhesive film on a low-thermal-expansivity polyimide film in a half-cured state, then metallic wiring is applied thereon, followed by formation of another highly adhesive thin film in a half-cured state, and then a low-thermal-expansivity polyimide film is further formed thereon. It is possible to provide a multilayer wiring structure which has improved adhesion between the low-thermal-expansivity polyimide film and the wiring pattern layer or the substrate.

Abstract: A printed circuit board and method of manufacture thereof is disclosed. The printed circuit board includes a first substrate provided from a conductive layer having disposed on a first surface thereof a cured adhesive layer, A semi-cured adhesive layer is then disposed over the cured adhesive layer and a second substrate is disposed against the semi-cured adhesive layer.

Abstract: The method of manufacturing a ceramic substrate having a plurality of bumps of the present invention, includes the steps of: forming a bump forming layer having a plurality of holes therein on at least one of upper and lower faces of a laminated body of green sheets; filling the holes in the bump forming layer with a bump forming paste; sintering the laminated body of the green sheets and the bump forming paste; and forming bumps made of the sintered bump forming paste by removing the bump forming layer.

Abstract: A process for producing a thin-film measurement resistor in which an electrically insulating work material with a low specific heat capacity serves as substrate material, a metal film, preferably platinum, being applied thereto. The lateral electrical resistor is then structured and trimmed by erosive after-treatment, and the metal film is passivated in a final process step. The resistor element reacts more quickly to changes in temperature, the cover layer is extremely resistant to corrosion, and the entire construction is simple to produce in that glass is used as a substrate material and is provided, before applying the metal film, with a bonding agent layer of Al.sub.2 O.sub.3 which is substantially thinner than the metal film. The metal film is then applied by evaporation and structured by sputter etching. Finally, the metal film is provided with a protective coat of SiO.sub.x.

Abstract: A method of fabricating a printed circuit board power core is disclosed wherein ceramic particles that have a diameter that is approximately equal to the desired dielectric thickness are combined with dielectric powders that have a relatively very small size. To produce a dielectric core using this technique, a dielectric material mixture is applied between two conductor layers and bonded therebetween. This dielectric material mixture preferably has a concentration of large particles equal to the desired core thickness with a loading factor of large/small particles less than the maximum ratio needed to provide the desired dielectric constant, but greater than the ratio required to provide stability during the pressing and curing steps.

Abstract: A method of manufacturing a layered product to obtain a multilayer ceramic capacitor. A mother sheet supported by a carrier film is cut to obtain respective sheets to form a plurality of sheets. The sheets are transferred to a frame having inner dimensions capable of positioning the sheets inside the frame. The stacked sheets are then pressurized. The arrangement enables the sheets forming the layered product to be stacked for pressurizing without misalignment of internal electrodes embedded in the respective sheets and without air being entrapped between the stacked sheets.

Abstract: A method of forming recessed patterns in insulators is described. One embodiment of the invention is directed to ceramic green sheet fabrication by providing a sculptured plastic tape mold which includes a floor, a plurality of sidewalls adjacent to and extending above the floor and a plurality of protrusions on and extending above the floor, casting a ceramic slurry into the mold such that the slurry contacts the floor, the sidewalls and the protrusions, and drying the slurry so as to produce a ceramic green sheet with a recessed pattern that replicates the shapes of the protrusions. The ceramic green sheet may be removed from the mold and filled with a conductor before firing; alternatively, the ceramic green sheet can be fired before removing the mold to form a rigid ceramic substrate which is then filled with a conductor.

Abstract: An electronic circuit substrate excellent in reliability, which comprises a porous ceramic sintered body with film devices such as a conductive circuit, a resistor and a capacitor directly formed on a surface thereof. A resin is filled in the pores of the porous ceramic sintered body, and the bottom surface of the film devices are fit into the pores and recesses on the surface of the porous ceramic sintered body in close contact therewith in a wedged state. A method of producing the aforesaid electronic circuit substrate comprises the steps of forming film devices directly on a surface of a porous ceramic sintered body. Then, filling the pores of the porous ceramic sintered body with a resin so as to fit the under surface of the film devices into the pores and recesses on the surface of the porous ceramic sintered body in close contact therewith in a wedge state.

Abstract: A method for forming a co-fired glass ceramic structure including the steps of:forming at least one green sheet of a first crystallizable glass in a thermally decomposable binder;metallizing the green sheet with a pattern of conductive paste including conductive metal, a second crystallizable glass and a thermally decomposable binder, the pattern including at least one via;firing the green sheet according to the following firing cycle steps:a. preheating the green sheet to a first temperature in a furnace with a neutral or reducing ambient so as to effect pyrolysis of the thermally decomposable binders, wherein the first temperature is insufficient to coalesce the first crystallizable glass or the conductive paste;b. introducing a steam ambient into the furnace and then heating the green sheet in the furnace at the first temperature to burn off the pyrolyzed binders;c.

Abstract: The present invention incorporates a specially-designed low-pass filter into the feedthrough of a monolithic microwave integrated circuit (MMIC) to provide compensation for discrepancies from the impedance required for an MMIC package to be matched to a transmission line. The compensation allows all parameters to be adjusted and the complete filter to be printed.The main features of the invention include minimum width for the under-wall conductor and brazing metallization, two open-circuited stubs at the package-die interface for wire bonding ease, and metal-filled vias connecting the ground plane base and the lid sealing ring to bring the lid sealing ring to RF ground.The present invention also includes a method for designing the desired feedthrough the obviates the need for scale-model feedthrough design before printing, a prior art method that requires precision in the scale model. An electrical model of a feedthrough is first derived.

Abstract: A method for fabricating multilayer circuits comprising patterned conductive layers separated by dielectric layers and connected by vias in the dielectric, wherein the unfired dielectric layers are laminated as tapes or sheets over either a fired or unfired conductor layer while under a vacuum.

Abstract: A high temperature optical fiber connector in which the optical fiber bundle is physically bonded to the connector body by sintered metallic body contained in an interior cavity of the connector.

Abstract: A method of manufacturing a ceramic capacitor of the lead filled type includes coating the ends of the ceramic monolith with a terminating paste incorporating oxidizable metal particles characterized in that the lead will not wet to oxides of the metals but will wet to unoxidized or lightly oxidized increments of the metals. The paste is fused in an oxidizing environment or is fused in an inert environment and thereafter heated in an oxidizing environment with the result that the metal increments adjacent the exterior of the fused coating are oxidized whereas the metal at the interior portions of the paste are unoxidized or only slightly oxidized. Upon metal injection, the lead will wet to the interior portions of the fused paste but will not wet to the exterior of the paste whereby injected chips may be readily separated and whereby the size of the chip is rendered predictable due to the absence of adherent lead.

Abstract: Sealing and stress relief are provided to a low-fracture strength glass-ceramic substrate. Hermeticity is addressed through the use of capture pads in alignment with vias and through polymer overlays with interconnection between the underlying via or pad metallurgy and the device, chip, wire or pin bonded to the surface of the layer. Multilevel structures are taught along with a self-aligned sealing and wiring process.

Abstract: There is disclosed a dual purpose separator-release plate (30) for the use in the lamination and drilling of printed circuit boards, comprising a substrate sheet of aluminum foil (32), covered on both sides with release material (34), the plates being placed in engagement with the foil surfaces (6) and (8) of a PC board prior to curing the epoxy layer (4), after curing, retaining the separator-release plates in engagement with the PC board, and which plates serve as drill entry and drill backup material.

Abstract: There is disclosed a method of producing a transition metal pattern on a glass or glass-ceramic substrate by selective exudation of a transition metal from a glass substrate containing the metal as an oxide. The selective exudation is effected by applying an intense, well-focused source of energy to a glass in a pattern corresponding to the desired metal pattern. This develops localized heating, and thereby causes corresponding localized metal exudation from the glass. The metal pattern may be rendered electroconductive, and may constitute a pattern of interconnecting lines for microcircuitry.