Abstract: The invention is directed to a method for fabricating multilayer circuits on rigid substrates using conventional dielectric green tape and thick film conductive pastes while maintaining excellent X-Y dimensional stability.

Abstract: The invention is directed to a method for fabricating multilayer circuits on rigid ceramic substrates using conventional dielectric green tape and thick film conductive pastes in which the number of firing steps is substantially reduced while maintaining excellent X-Y dimensional stability.

Abstract: A ceramic substrate having a plurality of holes arranged regularly with a specified pitch can be used for an universal high density ceramic wiring board, wherein predetermined one or more holes among said plurality of holes are used as through holes for interconnecting both side circuits, and the remaining holes not used for a circuit are filled with an electrical insulating material.Said ceramic substrate of universal type can easily be produced inexpensively and within a short lead time, because said substrate requires no individual mold for each of various circuits to punch a green sheet and can be kept in stock as a fired ceramic substrate.

Abstract: A thermal fuse is formed by a conductive path formed in a ceramic body, the path being of a fusible alloy. A ceramic substrate and a ceramic cover, both in green form, are fused together with defined channels. The channels can be defined by a material which is burnt out, preferably when the ceramic members are fused together. The channels can be defined in other ways. The channels are filled with a fusible alloy leaving an air layer, end contacts being provided. Several channels can be formed in one assembly. The assembly can then be cut into separate fuses, each with one channel.

Abstract: A multi-layer comprising a multi-layer glass ceramic substrate and a multi-layer wire line matrix. The multi-layer wired line matrix includes an insulating layer made from a photosensitive insulating layer, amenable to time geometry processing. The insulating layer of the multi-layer wire line matrix has a pad for accommodating variations of the locations of the through holes. The metal is plated in and fills the through holes so that the metal is not cut off at the corners. The wire line matrix is composed of a plurality of layers of a photo-lithographically formed fine conductive pattern. The glass ceramic insulating layer is also formed photo-lithographically, and is formed of the source material of the insulating layers.

Abstract: Ceramic insulating substrate layers (1) for a multilayered ceramic wiring circuit board (3) consist essentially of crystals of mullite and sillimanite, non-crystalline silicon dioxide occupying the interstices between the crystals and magnesium oxide dissolved substantially in the crystals in solid solution and have a thermal expansion coefficient of 40-60.times.10.sup.-7 /.degree. C. and a dielectric constant below 6.7.

Abstract: A measured-value sensor for an inductive flowmeter comprises a fluid impermeable sintered ceramic measuring tube adapted to be positioned in a conductive-liquid flow path. Magnetic coils surround the tube and are adapted to apply a magnetic field to a conductive liquid traversing the path. A pair of diametrically opposite measuring electrodes contact the liquid traversing the path for tapping an induced voltage across the electrodes representing the flow of the liquid along the path, each of the electrodes having a metallic shaft traversing the tube substantially radially and sealingly sintered to the material of the tube. The ends of the ceramic measuring tube are provided with a flange, ground at its peripheral wall surface and fastened by shrinkage stress in a bore of a steel casing.

Abstract: A ceramic substrate having a plurality of holes arranged regularly with a specified pitch can be used for an universal high density ceramic wiring board, wherein predetermined one or more holes among said plurality of holes are used as through holes for interconnecting both side circuits, and the remaining holes not used for a circuit are filled with an electrical insulating material.Said ceramic substrate of universal type can easily be produced inexpensively and within a short lead time, because said substrate requires no individual mold for each of various circuits to punch a green sheet and can be kept in stock as a fired ceramic substrate.

Abstract: A method of laser-machining IC carrier bodies from a sheet ceramic blank, and the IC carrier products produced from such laser-machining. The ceramic blank, preferably of alumina or beryllia, is high temperature fired to permanently fix its size and shape prior to the laser-machining, permitting a matrix of IC carrier bodies to be laser-machined to close tolerances, whereby metallization conductors can be located on the bodies also to close tolerances, and lower temperature firing may be employed to fix such conductors without disturbing any of the tolerances. Novel elongated peripheral groove vias in the carrier bodies permit the sequential laser-machining of elongated slots to form the via grooves and scribe recesses.

Abstract: A method and apparatus for making electrical connections between conductors on a substrate utilizes a dielectric-like metal film deposited on the substrate interconnecting the conductors to be connected. The dielectric-like film is deposited in the form of microscopic islands or columns that are spaced by microscopic distances, thus making the film non-conductive when deposited. When an electrical connection is desired, the dielectric-like film is melted by localized heating, for example, by a focused laser, thereby melting the individual metal islands and permitting them to flow together to make the film conductive.

Abstract: We disclose a process for manufacturing multilayer circuit boards which includes providing a conductive, or an insulating substrate with a conductive pattern thereon, and then transferring and firing a glass-ceramic tape layer to the surface of the substrate. This tape layer provides both electrical isolation between the substrate and electrical conductors or electronic components which are subsequently bonded to or mounted on the top surface of the glass-ceramic tape layer. By providing vertical electrical conductors by means of vias in the tape layer prior to firing the tape layer directly on the substrate, good X and Y lateral dimensionally stability of the tape material is maintained. In addition, a high quality thick film glass-ceramic electrical interconnect structure is achieved at a relatively low manufacturing cost.

Abstract: The substrate is formed by a stack of sheets of dielectric material (10) at least some of which have conductive patterns thereon (21-24); the substrate has conductive emerging portions (31, 32) for connecting the terminals of the component (1) to at least one internal layer provided with conductive tracks (24) providing layer-to-layer interconnection and interconnection with emerging portions in accordance with a pre-established patterns. According to the invention, the composition of the dielectric material comprises 92% to 98% alumina, and preferably 96%, with a melting agent based on magnesia titanate enabling the maximum firing temperature to be reduced to about 1400.degree. C. The conductive patterns are made of a non-oxidizable metal which is not meltable at high temperature, e.g. palladium or a silver-palladium alloy. The properties of the substrate obtained in this manner are comparable to those of a substrate made of 99.9% ultra-pure alumina.

Abstract: A process for removing organic materials from an article formed from a slurry of glass and/or ceramic particles, resin binder, and a solvent for the resin binder, the process involving including in the slurry a particulate catalyst selected from the group consisting of Cu, Cu.sub.2 O, CuO, Cu.sub.2 SO.sub.4, CuCl.sub.2, Cu organometallic compounds, and mixtures thereof, the catalyst promoting a rapid and complete removal from the shaped article when heated of the organic materials of the slurry.

Abstract: A process for placing conductive paths on to the surface of a heat softenable substrate by applying a layer of metal powder to the substrate, compacting the powder in a pre-determined pattern by applying a heated die under pressure, and embedding the compacted powder by the continued application of the die at a pressure less than the compacting pressure.

Abstract: A process for forming a top surface metallurgy pattern on a green unsintered ceramic substrate including the steps of forming indented lines on the surface of the substrate, sintering the substrate, depositing a blanket layer over the top surface of the substrate with a thickness less than the depth of the indented lines, applying a masking layer over the metal layer, removing the masking layer over all portions except the indented lines, removing the exposed areas of the metal layer, and removing the remaining portions of the masking layer.

Abstract: A miniaturized thick-film isolation transformer comprising two rectangular substrates each carrying successive screen-printed thick-film layers of dielectric with spiral planar windings embedded therein. The spiral windings comprise conductors formed of fused conductive particles embedded within a layer of dielectric insulating means solidified by firing at high temperature to form a rigid structure with the windings hermetically sealed within the dielectric and conductively isolated from each other within the transformer. The substrates are formed at opposite ends thereof with closely adjacent connection pads all located at a single level to accommodate automated connection making. Connections between the pads and the windings are effected by conductors formed of fused conductive particles. The substrates and the dielectric layers are formed with a central opening in which is positioned the central leg of a three-legged solid magnetic core.

Abstract: A process for forming a pattern of conductive lines on the top of a multi-layer ceramic substrate comprising:providing a green ceramic substrate, embossing a pattern of grooves in the top surface of the green ceramic substrate,sintering the green ceramic substrate to thereby form a multi-layer ceramic substrate anddepositing a conductive material in at least a portion of said embossed pattern of grooves.

Abstract: A process for forming a high density solder pad and fan-out metallurgy system in a ceramic substrate wherein a pattern of indented lines is formed in the surface of a green ceramic substrate, the lines filled with a conductive metal paste, a layer of dielectric green ceramic material deposited over at least a portion of the area of the pattern of indented lines, and sintering the resultant substrate.

Abstract: A molybdenum or tungsten metallurgical pattern is formed on or in a dielectric green sheet. Palladium, nickel, platinum or rhodium is coated on a layer of polyvinyl butyral which is carried on a polyester film. The metal layer of this assembly is laminated to a dielectric green sheet which carries the molybdenum or tungsten metallurgy. The polyester film is stripped off. The resulting assembly is sintered to a fired structure, whereby the polyvinyl butyral is volatilized off and the palladium, nickel, platinum or rhodium is alloyed with the molybdenum or tungsten metallurgy to provide a densified metallurgy whose surface is free of glass.

Abstract: A ceramic wiring board which comprises ceramic part in which through-holes are made, sintered wiring pattern part provided on the surface of said ceramic part and sintered conductor part filled in said through-holes shows much decrease in cracks at the through-hole part caused by sintering and remarkable reduction in moisture absorbency when the ceramic part comprises ceramic containing a sintering assistant and the sintered conductor part comprises a metal containing the same sintering assistant as that present in said ceramic part.

Abstract: A lightning arrester comprises a non-linear resistor as a lightning arrester element and an insulator holding the non-linear resistor in one body without a gap to prevent deterioration of the non-linear resistor caused by moisture.

Abstract: A process for forming a substantially glass free surface on screened refractory metallurgy areas on a ceramic substrate wherein a thin layer of Pd is deposited over the metallurgy areas and the metallurgy areas subsequently sintered causing the surface refractory metal particles to be fused into a substantially solid metallurgy layer under the catalyzing influence of the Pd.

Abstract: A method of fabricating an improved multi-layer ceramic substrate for mounting semiconductor devices having a low incidence of cracks between metal filled surface vias, the substrate constructed with a top ceramic layer having a thickness that is at least 20 percent greater than the underlying sheets that embody a redistribution system.

Abstract: An improved composite substrate comprises a patterned surface conductive layer of a refractory metal and a patterned compensation electrically conductive layer. The patterned compensation layer entirely overlies and extends beyond the shrunken patterned conductive layer. Additionally, thick film elements such as resistors are fabricated and contact selected areas of the patterned compensation conductive layer.

Abstract: An improved composite substrate comprises a patterned surface conductive layer of a refractory metal and a patterned compensation electrically conductive layer. The patterned compensation layer entirely overlies and extends beyond the shrunken patterned conductive layer. Additionally, thick film elements such as resistors are fabricated and contact selected areas of the patterned compensation conductive layer.