Abstract: Disclosed is an electronic component mounting line on which a substrate undergoes solder paste printing, electronic component placements, and then reflow, while being moved from upstream to downstream. The line includes: a substrate feeding machine; a printing machine for applying solder paste to a first placement area of the substrate; a first electronic component placement machine for placing a first electronic component on the first placement area; a second electronic component placement machine for dispensing a thermosetting resin onto a reinforcement position on a peripheral edge portion of a second placement area of the substrate, and for placing on the area the second electronic component having solder bumps; and a reflow machine for bonding the electronic components to the substrate, by heating and cooling the resultant. The second electronic component is placed after the resin is dispensed, such that a peripheral edge portion thereof comes in contact with the resin.

Abstract: Systems and methods for routing cables in an electronic device are provided. In some embodiments, the electronic device may include a touch sensor having a number of traces, a display component, and a mechanical button, each of which may be coupled to a circuit board via a single flexible circuit cable. This may save valuable space within the electronic device.

Abstract: A method for fabricating a laminated structure includes (i) preparing a first substrate having electroconductivity, (ii) forming a first electroconductive film having a prescribed hardness on the first substrate by an electroforming, (iii) forming a second electroconductive film having a hardness that is lower than the prescribed hardness on the first electroconductive film by an electroforming, (iv) patterning the first electroconductive film and the second electroconductive film to a prescribed pattern to form a plurality of electroconductive film patterns, and (v) subjecting the first substrate and a second substrate repeatedly to pressure contact and release to transfer sequentially the plurality of electroconductive film patterns on the first substrate onto the second substrate.

Abstract: A dual earth starter motor for a vehicle. The starter motor includes a housing, an armature within the housing, a brush plate within the housing arranged to deliver electric current, by means of conductive brushes, to the armature, and two separate earth terminals electrically connected to the brush plate with each terminal extending through a wall of the housing. In a preferred form, the two earth terminals are electrically isolated from the housing, and at least one of the terminals is mechanically and electrically coupled to the brush plate my means of an interference fit between a portion of the terminal and a hole formed in the brush plate. A method of retrofitting a second earth terminal to an existing starter motor is also disclosed.

Abstract: An electrosurgical forceps has at least the tip of one blade member formed of a composite material having aligned elongated particles of nickel interspersed in a matrix of silver particles. The tip can be provided as a tip member attached, such as by brazing, to the body of the blade member, or the entire blade member can be formed of the silver/nickel composite material. In another embodiment, the tip or blade member is formed of a dispersion strengthened silver or copper composite material.

Abstract: An electrode has a unitary ring with an exterior surface, interior surface, and at least two edges. The electrode also includes a seat formed in at least the exterior surface of the unitary ring. The seat is configured and arranged for attachment of a terminal end of a lead wire, disposed in the seat, to the electrode. A lead includes a lead body; a plurality of electrodes disposed at the distal end of the lead body; and a plurality of lead wires. Each electrode includes a unitary ring and a seat in the unitary ring. The unitary ring has an exterior surface and an interior surface and defines a hollow center region. The seat is formed as a depression of a portion of the unitary ring. Each of the lead wires extends along the lead body and is attached to a corresponding electrode at the seat of the corresponding electrode.

Abstract: A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency.

Abstract: Electronic components each having a chip module with module contacts and an antenna having antenna contacts is made by securing a plurality of the chip modules the inner face of a module film strip having an outer periphery projecting past the chip module with the chip modules spaced from one another at a uniform predetermined module spacing. A plurality of the antennas are secured to an inner face of an elongated antenna strip with the antennas spaced from one another by a predetermined antenna spacing. The module strip is longitudinally subdivided into sections each of which is of a length equal to the predetermined module spacing and each of which carries a respective chip module. The module-strip sections are pressed against the antenna strip such that the module contacts of each of the chip modules engage and bear on the antenna contacts of a respective antenna.

Abstract: Techniques for efficient routing of wires and electrical components within a device are disclosed. A wire can be routed, for example, in the space between two battery cells (or other components/structures) with the use of a bracket inserted between the cells to provide structural support. The electrical tape surrounding a battery may be cut or otherwise breached in order to expose the cavity between distinct battery cells. In some embodiments, multiple brackets may be inserted between the battery cells, creating a trough through which a wire or other component may be routed. After routing a wire through the trough, another electrical part or housing may be fixed above the battery cells.

Abstract: According to one embodiment, an LED lamp includes a lighting circuit, a storage, a thermal radiating body, an LED substrate, and a cover. The storage includes a pair of electrode pins electrically connected to the lighting circuit, and stores the lighting circuit in the interior thereof. The thermal radiating body integrally includes a lid portion configured to cover the storage and an arrangement portion located in a periphery of the lid portion. The LED substrate includes an LED configured to emit light upon receipt of power feed from the lighting circuit, and is arranged so as to be thermally connected to the arrangement portion of the thermal radiating body. The cover has translucency and covers the LED substrate.

Abstract: A method of manufacturing a rigid-flexible printed circuit board, including providing a base substrate in which coverlays are respectively formed on two sides of a flexible copper foil laminate on both sides of which inner circuit patterns are respectively formed; layering insulation layers and copper foil layers on portions of coverlays which are to be a rigid region of the flexible copper foil laminate; forming a via hole in the rigid region, and, simultaneously, forming first windows in the coverlays in a flexible region; forming outer circuit patterns including areas adjacent to the first windows; and applying solder resist in the rigid region to expose portions of the external circuit patterns, where the outer circuit patterns formed in the areas adjacent to the first windows include additional plating portions for covering portions of the coverlays.

Abstract: A high speed cable with terminating assemblies at the respective ends of the cable includes a ground wire, one or more signal wires, and a conductive layer enclosing the ground wire and the signal wires. The ground wire as well as the signal wires and the conductive layer extend into the terminating assemblies, in each of which corresponding inductive elements are coupled between the conductive layer and the ground wire. In each terminating assembly, the ground wire is shunted to the conductive layer by inductive elements, thus providing added low frequency connectivity in the cable, while at the same time blocking high frequency noise energy that may be present in the ground wire and preventing it from being coupled into, and transmitted through, the conductive layer.

Abstract: A guide wire arrangement, a strip arrangement, a method of forming a guide wire arrangement, and a method of forming a strip arrangement are provided. The guide wire arrangement includes a strip; a sensor being disposed on a first portion of the strip; a chip being disposed next to the sensor on a second portion of the strip, wherein the second portion of the strip is next to the first portion of the strip; wherein the strip is folded at a folding point between the first portion of the strip and the second portion of the strip such that the first portion of the strip and the second portion of the strip form a stack of strip portions.

Abstract: A method includes providing a cable connector and a compression tool that includes a hydraulic assembly, the hydraulic assembly having an axially extendable ram. The compression tool further includes a connector frame detachably attached to the hydraulic assembly, the connector frame having a cable cradle configured to accommodate the cable, and a sliding guide structure mounted to the connector frame assembly, the sliding guide structure comprising a sliding bar and one or more sliding guides, and a sleeve attached to the sliding bar. The method including locating the cable connector into the compression tool and disposing one end of the prepared cable into one end of the compression member, activating the hydraulic assembly, so that extending the axially extendable ram along the longitudinal axis causes the sliding bar to move along the longitudinal axis producing compression of a compression member and a connector body into operative engagement with the cable.

Abstract: In one embodiment, a stimulation lead for applying electrical pulses to tissue of a patient, the stimulation lead comprises: a plurality of electrodes on a first end of the lead body; a plurality of terminals on a second end of the lead body; a lead body comprising a flex film component disposed within insulative material, wherein (i) the flex film component comprises a plurality of electrical traces, (ii) the plurality of electrical traces electrically couple the plurality of electrodes with the plurality of terminals, and (iii) the flex film component comprises a plurality of bends along a substantial length of the lead body; wherein the stimulation lead is adapted to elastically elongate under application of stretching forces to the lead body without disconnection of the electrical connections between the plurality of electrodes and the plurality of terminals through the electrical traces of the flex film component.

Abstract: A relay unit electrically opens and closes between a power supply and a power-consuming device. The relay unit includes electronic components in a housing including a case and a cover, the electronic components including a resistor, a first relay connected in series with the resistor, and a second relay, the second relay connecting the power supply and the power-consuming device through an external connection terminal and being connected in parallel with the resistor and the first relay.

Abstract: A solid housing tag and method to form the solid housing tag, the method including for example, an injection molding process. The solid housing tag has a single, continuous housing of which at least partially surrounds one or more various tag components arranged about a frame. The tag components may include a lock component and/or security component. The security component may include EAS elements, such as AM, EM, and/or RF technology elements; RFID elements; and/or benefit denial type elements.

Abstract: An internal control rod drive mechanism (CRDM) including an electric motor is disposed in a nuclear reactor and further includes a support surface with sealed electrical connectors electrically connected with the electric motor power the motor. The internal CRDM is disposed on a support element secured inside the nuclear reactor. The support element includes sealed electrical connectors mating with the sealed electrical connectors on the support surface of the internal CRDM to power the electric motor. The sealed electrical connectors may be sealed glass, ceramic, or glass-ceramic connectors welded onto the ends of the MI cables extending from the motor. Springs, are disposed between the mating sealed electrical connectors of the support element and the support surface. A purge line is integrated with each mated connection.

Abstract: Various embodiments include apparatus and methods having circuitry to test continuity of conductive paths coupled to dice arranged in a stack. In at least one of these embodiments, a method includes electrically coupling each of the conductive paths to at least one of a first supply node and a second supply node. One of the conductive paths includes conductive material inside a via that can extend at least partly through a die among the dice in the stack. The method also includes receiving signals from the conductive paths, and determining continuity of the conductive paths based on the signals without using a boundary scan.

Abstract: An ACF attachment method includes supplying an electronic component from a component supply unit, suctioning the electronic component, simultaneously attaching a first ACF to a first terminal surface of the electronic component and a second ACF to a second terminal surface of the electronic component, and providing an ACF attachment device which includes two ACF attachment units for attaching the first ACF and the second ACF. The first terminal surface is disposed on a first edge portion of the electronic component and the second terminal surface is disposed on a second edge portion of the electronic component. The two ACF units are positioned according to a space between the first terminal surface and the second terminal surface of the electronic component, and attaching the first and second ACFs is performed using the two ACF attachment units.

Abstract: An adapter assembly is disclosed that enables a memory card having a smaller length than a standard ExpressCard to be compatible with the standard ExpressCard slot. The adapter assembly includes an adapter having side rails configured to disable the ExpressCard slot ejector mechanisms. The adapter assembly further includes a tongue provided for rigidly connecting the adapter to a finger grip, which gets positioned outside of the opening of the ExpressCard slot upon insertion of the adapter assembly into the slot. The adapter allows a memory card having the approximate size, look and feel of a conventional CompactFlash card to be used in a conventional ExpressCard slot.

Abstract: An electrical stimulation lead includes a cog-shaped conductor guide disposed either at the proximal end or the distal end of the lead. The cog-shaped conductor guide includes a central core and multiple protrusions extending outwards from the core. Conductor tracks are defined within the cog-shaped conductor guide between adjacent protrusions. Electrodes are provided along the distal end of the lead, terminals are provided along the proximal end of the lead, and conductors couple the electrodes to the terminals. An elongated lead body extends from the electrodes to the terminals of the lead. Each of the conductors has an end portion positioned within one of the conductor tracks of the cog-shaped conductor guide.

Abstract: A method for hermetically sealing electronic circuitry within a housing of an implantable medical device is provided. The method comprises assembling the housing having an interior cavity, joining a feed-through assembly to the housing, and joining a back-fill member to the feed-through housing. The back fill member has an opening there through communicating with the interior cavity of the housing. The housing is back-filled with an inert gas through the opening in the back-fill member, and the interior cavity is hermetically sealed by closing the opening through the back-fill member with a sealing element. The sealing element and back-fill member are formed of different first and second materials, respectively.

Abstract: The invention relates to a method for manufacturing a USB electronic key, whereby a chip is cut out of a tape, provided with a plurality of chips, each chip defining contact pads in USB format and supporting an electronic component, connected to the pads. The thickness adjustment step is directly carried out on the chip to give a thickness conforming to the USB standard, at least in the area of the contact pads.

Abstract: To form a conductive region in a prepreg without opening a through hole in a fibrous body. A wiring substrate is provided, including: an organic resin layer and a fibrous body, wherein the fibrous body is impregnated with the organic resin layer; and a wiring with which the fibrous body is impregnated and which is formed by dissolving the organic resin layer. The wiring is exposed on both surfaces of the organic resin layer and penetrates the fibrous body so that the fibrous body is positioned in the through wiring. Further, a semiconductor device is provided by adhering an integrated circuit chip having a bump to the wiring substrate so that the bump is in contact with the wiring.

Abstract: An electrical interconnect including at least one electrically-conductive fibre configured to form a stretchable interlaced configuration.

Abstract: In one embodiment, a percutaneous stimulation lead for applying electrically stimulation pulses to tissue of the patient comprises: a plurality of electrode assemblies electrically coupled to a plurality of terminals through a plurality of conductors of the stimulation lead, wherein each electrode assembly is disposed in an annular manner around the lead body and each electrode assembly comprises (i) an electrode adapted to deliver electrical stimulation to tissue of a patient, (ii) an interior conductive layer, and (iii) a dielectric layer disposed between the electrode and the interior conductive layer; the electrode and interior conductive layer being capacitively coupled, the dielectric layer further comprising an inductor, the inductor being electrically connected to one of the plurality of conductors through the interior conductive layer, and the inductor being electrically coupled to the electrode.

Abstract: An electrical box is mounted on a wall stud, and a wiring panel is installed within the electrical box so as to partition the interior of the electrical box into a user inaccessible wiring compartment and a user accessible module compartment. A protective cover is attached to the wiring panel so as to protect the wiring panel during a makeup phase of wall panel installation and painting. After the makeup phase, the protective cover is removed from the wiring panel and a module having a user operable electrical function is mounted to the wiring panel within the user accessible module compartment.

Abstract: A CNT bundle is formed by growing a plurality of CNTs from opposing surfaces of contact blocks toward mutual opposing surfaces, and by contacting the CNTs so that they intersect to electrically connect with each other. Subsequently, a gap of the electrically connected CNT bundle is filled with a metal material, to thereby form a wiring being a composite state of the CNT bundle and the metal material.

Abstract: A layout method for electronic components of a double-sided surface mount circuit board is presented, which includes the following steps. At least one first electronic component is fixed on a first side surface of a circuit board through a reflow soldering process. At least one second electronic component is inserted on the first side surface of the circuit board. The other first electronic component is placed on a second side surface of the circuit board, and the other second electronic component is inserted on the second side surface of the circuit board. Finally, a reflow soldering process is performed on the circuit board disposed with the first electronic components and the second electronic components, thereby completing a layout process for the electronic components on the two side surfaces of the circuit board at the same time.

Abstract: A transmission line RF applicator apparatus and method for coupling RF power to a plasma in a plasma chamber. The apparatus comprises an inner conductor and one or two outer conductors. The main portion of each of the one or two outer conductors includes a plurality of apertures that extend between an inner surface and an outer surface of the outer conductor.

Abstract: A standoff supporting a control rod drive mechanism (CRDM) in a nuclear reactor is connected to a distribution plate which provides electrical power and hydraulics. The standoff has connectors that require no action to effectuate the electrical connection to the distribution plate other than placement of the standoff onto the distribution plate. This facilitates replacement of the CRDM. In addition to the connectors, the standoff has alignment features to ensure the CRDM is connected in the correct orientation. After placement, the standoff may be secured to the distribution plate by bolts or other fasteners. The distribution plate may be a single plate that contains the electrical and hydraulic lines and also is strong enough to provide support to the CRDMs or may comprise a stack of two or more plates.

Abstract: A manufacturing method for a skin material of a vehicle interior equipment includes exposing a conductive wire material by removing a main fiber material from a first fabric material formed of the conductive wire material and the main fiber material that is weaker than the conductive wire material and electrically connecting a conductive member, which is used to supply electric power to the conductive wire material, to the exposed portion of the conductive wire material.

Abstract: A manufacturing method of package carrier is provided. A first copper foil layer, a second copper foil layer on the first foil layer, a third copper foil layer and a fourth foil layer on the third foil layer are provided. The second copper foil layer is partially bonded the fourth copper foil layer by an adhesive gel so as to form a substrate of which the peripheral region is glued and the effective region is not glued. Therefore, the thinner substrate can be used in the following steps, such as patterning process or plating process. In addition, the substrate can be extended be the package carrier structure with odd-numbered layer or even-numbered layer.

Abstract: A method for producing an assembly of electronic components and assemblies in accord with this, wherein the electronic components have component terminals. A conductive firmament having a first side and a second side is provided. Then the component terminals are connected to the first side of the firmament with an anisotropic conductor. A pattern is applied to the second side of said firmament. And portions of the firmament are removed based on the pattern, such that remaining portions of said firmament form the electrical circuit interconnecting the component terminals.

Abstract: An occupancy sensor may include a plurality of user-selectable mounting features that enable the sensor to be mounted to building structure in a variety of ways. The sensor may include: a nipple for engaging a connector associated with the building structure; one or more key hole slots for engaging fasteners associated with the building structure; and one or more flat side surfaces for engaging corresponding flat surfaces of a mounting plate associated with the building structure. A spring on the flat side surface may lock the sensor to the mounting plate. The nipple may be removable to allow the sensor to be flush mounted to the building structure. The sensor may also include a user-adjustable lens that enables a user to make discrete adjustments of the field of view of the sensor according to present levels. Other embodiments are disclosed and claimed.

Abstract: A package manufacturing method capable of easily manufacturing a penetration electrode-attached base board having excellent shape accuracy with a high degree of flatness without forming cracks or the like is provided. The package manufacturing method includes an insertion hole forming step of forming insertion holes in one surface of a base board wafer so as not to penetrate through the base board wafer; a core portion insertion step of inserting conductive core portions made of a metal material into the insertion holes; a welding step of heating the base board wafer to a temperature higher than the softening point of the glass material so as to weld the base board wafer to the core portions while holding the one surface side of the base board wafer with a receiving mold and pressing the other surface of the base board wafer with a flat pressurizing mold; a cooling step of cooling the base board wafer; and a polishing step of polishing both surfaces of the base board wafer.

Abstract: An acoustic wave device includes: a substrate; an input terminal that is located on a first surface of the substrate, and to which a high-frequency signal is input; a resonator that is connected to the input terminal, and to which a high-frequency signal input to the input terminal is input; and an insulating layer that is located between the input terminal and the substrate, and has a permittivity smaller than that of the substrate.

Abstract: When a formed position of a via formed on a board is the same as a position of a footprint of a chip component located on the back surface of the board corresponding to an area on which a BGA is mounted, a board designing apparatus determines that the chip component and the BGA can be connected using chip on hole. When it is determined that the chip component and the BGA can be connected, the board designing apparatus carries out chip on hole by forming a via in an area of the board on which the BGA is mounted, the via leading to the footprint of the chip component located on the back surface of the board.

Abstract: A method and device for controlling current flow through a welding clamp are provided. One welding clamp includes a first contact piece configured to contact a workpiece and to provide a first current path that limits current flow. The welding clamp also includes a second contact piece configured to contact the workpiece and to provide a second current path. When the welding clamp is being clamped to the workpiece, the first contact piece is configured to contact the workpiece prior to the second contact piece. In addition, the welding clamp is configured so that current flows through the first current path prior to flowing through the second current path when the welding clamp is being clamped to the workpiece.

Abstract: A board-level package includes a printed circuit board, a semiconductor die package mounted on the printed circuit board, a tuned mass structure, and a support structure mounted to the printed circuit board and supporting the tuned mass structure.

Abstract: A method for assembling LEDs to a ceramic heat conductive piece comprises: mixing ceramic materials together and subjecting the mixed ceramic materials to hot pressing to form the ceramic heat conductive piece, the ceramic heat conductive piece has a cold end; subjecting the cold end of the ceramic heat conductive piece to sliver printing, drying process and silver reduction process to form the silver layer; choosing conductive binders, and applying the conductive binders to the silver layer by coating process; attaching the LEDs between paired conductive binders by welding; getting a finished product. The structure produced by the method is such that the LEDs are located between the paired conductive binders, and each of the LEDs includes a LED wafer disposed on a substrate, so that the heat generated by the LEDs can be transmitted quickly to the ceramic heat conductive piece via the conductive binders and the silver layer.

Abstract: Light emitter devices with improved light extraction and related methods are disclosed. In one embodiment, the light emitter device can include a submount, at least one light emitting chip disposed over the submount, and a lens disposed over the light emitting chip. The lens can include a lens base that can have substantially the same geometry as a geometry of the submount.

Abstract: A string combiner is provided for coupling multiple strings of series-connected photovoltaic (PV) panels in a PV array to downstream equipment, each string including positive and negative conductors. The combiner includes a combiner box containing a busbar connected to the protection devices for receiving and combining the currents from the multiple strings of PV panels, output terminals for connection to the downstream equipment, and a disconnect device within the combiner box and including a multi-pole switch connected to the busbar for disconnecting the downstream equipment from the multiple strings. A plurality of connectors are provided for connecting selected poles of the multi-pole switch to each other or to selected ones of the output terminals in either a grounded or an ungrounded configuration.

Abstract: The invention relates to a wind turbine rotor blade having a blade root, a blade tip, two interconnected rotor blade half shells, which include a fiber-reinforced plastics material, and an electrical heating element, which is arranged on an outer side of the rotor blade and has a blade root end and a blade tip end, wherein the blade tip end is connected via an electrical line leading to the blade root and at least a first segment of the electrical line, which is arranged on an inner side of one of the rotor blade half shells, is made of a carbon fiber material. Further, the present invention relates to a method for making a wind turbine rotor blade having an electrical heating element.

Abstract: A method for fabricating a piezoelectric vibrator includes inserting a filling member formed with a through hole inside of a ring having a substantially cylindrical shape, and inserting one piece of a lead to the through hole of the filling member to project from both sides of the ring. The method further includes sintering the filling member along with the ring and the lead to integrate in an airtight manner, subjecting an exciting electrode of the piezoelectric vibrating piece to a bump connection with an inner lead portion of the lead projected from the ring, subjecting another exciting electrode on a side of the piezoelectric vibrating piece opposed to the other exciting electrode to wire bonding with the ring, and press-fitting the ring to an opening portion of a case and sealing the piezoelectric vibrating piece connected with the inner lead portion inside of the case in an airtight manner.

Abstract: A substrate for mounting a preamp chip thereupon, fabricated using a stiffener layer made of a conductive material; an insulating layer provided over the circuitry area of the substrate; a circuitry made of a conductive material provided over the insulating layer; and a flap which is an extension of the stiffener layer having no insulating layer provided thereupon. The flap is fabricated to fold over the preamp chip to remove heat therefrom.

Abstract: A method for the manufacture of a sensor for a thermal flow measuring device, wherein the sensor has at least one housing with a first open end and a second open end. The first open end is securable in a sensor holder; and at least one resistance thermometer is inserted into the housing through the second open end of the housing and the second open end of the housing is closed. Cables for electrical contacting of the resistance thermometer lead out of the housing through the first open end of the housing.

Abstract: A method for assembling an ultrasonic surgical device includes the steps of providing a proximal end of an ultrasonic waveguide at an ultrasonic surgical handle body, removably coupling an ultrasonic-movement-generator assembly having a ultrasonic-driving-wave-signal generating circuit to the ultrasonic surgical handle body, mechanically coupling an ultrasonic transducer rotationally freely and substantially longitudinally fixedly to the ultrasonic surgical handle body to place an ultrasonic-movement-producing distal end of the ultrasonic transducer opposite and adjacent the proximal end of the ultrasonic waveguide, and rotating the waveguide and the ultrasonic transducer with respect to one another to removably fixedly couple the waveguide to the ultrasonic-movement-producing distal end of the ultrasonic transducer and to electrically couple the ultrasonic-driving-wave-signal generating circuit to the ultrasonic surgical handle body.

Abstract: A connector assembly for an implantable medical device includes a plurality of feedthroughs mounted in a conductive array plate, each feedthrough in the plurality of feedthroughs including a feedthrough pin electrically isolated from the conductive array plate by an insulator and an electronic module assembly including a plurality of conductive strips set in a non-conductive block. The plurality of conductive strips is in physical and electrical contact with the feedthrough pins at an angle of less than 135 degrees. The connector assembly further includes at least one circuit, the circuit including a plurality of conductors corresponding to the plurality of feedthroughs. The plurality of conductors of the circuit is in physical and electrical contact with a corresponding one of the conductive strips of the plurality of conductive strips of the electronic module assembly at an angle of less than 135 degrees.