Abstract: A method for manufacturing a light set with surface mounted light emitting components is disclosed. A rod having a predetermined length and a winding control architecture with corresponding driving spindles are prepared first. The rod is driven to rotate by a winding machine via driving spindles to wind conducting wires. The insulating layer of each conducting wire is then ground along an axial direction of the rod to expose the conductor of each conducting wire to form contact-pad area. A conductive paste is applied to each contact-pad area, and the surface mounted light emitting components are straddled thereon. Each lead of the surface mounted light emitting components is respectively positioned corresponding to the contact-pad areas, and is electrically connected to the conductors by the conductive paste. The contact-pad areas and the surface mounted light emitting component are then covered with a package.

Abstract: A system (10) for simultaneously introducing a cable (11) and another item (21) into a conduit (12) includes a pushing machine (13) and an air blower (15) which introduces the cable (11) into the conduit (12). The conduit (12) is split near the pushing machine (13) so that the item (21) may be attached to the cable (11) by means of an attachment device (25) carried by a bullet head (23) at the leading end of the cable (11). A block (18) then connects the split ends (16, 17) of the conduit (12), and the cable (11) and other item (21) may then be moved together through the conduit (12) by the pushing machine (13) and air blower (15).

Abstract: A biomedical conductor assembly adapted for at least partial insertion in a living body. The conductor assembly includes a plurality of the first electrical conductors each covered with an insulator and helically wound in a first direction to form an inner coil with a lumen. A plurality of second electrical conductors each including a plurality of un-insulated wires twisted in a ropelike configuration around a central axis to form a plurality of cables. Each cable is covered with an insulator and helically wound in a second opposite direction forming an outer coil in direct physical contact with the inner coil. The inner and outer coils are covered by an insulator. A method of making the conductor assembly and implanting a neurostimulation system is also disclosed.

Abstract: A handheld computing device is disclosed. The handheld computing device includes a seamless housing formed from an extruded tube. The extruded tube includes open ends and internal rails which serve as a guide for slidably assembling an operational assembly through the open ends of the extruded tube, a reference surface for positioning the operational assembly relative to an access opening in the seamless housing, and a support structure for supporting the operational assembly during use.

Abstract: A photovoltaic module conductor supporting structure that can be used to secure the conductor during manufacturing and in some situations to seal the terminal-area opening.

Abstract: A method for providing an alternative power source for a graphics card are disclosed. Specifically, one embodiment of the present invention sets forth a method, which includes the steps of laying a set of gold fingers on a printed circuit board according to an industrial standard bus interface, positioning a wire in a middle layer of the printed circuit board, attaching a first end of the wire to a specific gold finger, and attaching the alternative power source to a second end of the wire, wherein the second end of the wire is an electroplated contact protruded external to the printed circuit board.

Abstract: A method of fabricating an image drum includes preparing a hollow drum body having a slot extending in a longitudinal direction, preparing a printed circuit board (PCB) having a plurality of board terminals, mounting the PCB inside the hollow drum body with a fixing member such that the board terminals of the PCB are placed in the slot of the hollow drum body, coating a first insulating layer on an outer circumference of the hollow drum body, forming a plurality of ring electrodes on the first insulating layer corresponding to the board terminals of the PCB, in which a portion of ring electrodes which corresponds to the board terminals of the PCB is non-continuous, exposing the board terminals below non-continuous area of the ring electrodes by etching the first insulating layer with the ring electrodes as an etching mask, and forming a connecting electrode to electrically connect the board terminals to the ring electrodes.

Abstract: A method of manufacturing an electronic device includes: roughening an underside surface of a film made of a resin, opposite to a mounting surface of the film for mounting a circuit chip; forming a conductor pattern on the mounting surface of the film, thereby obtaining a substrate made of the film where the conductor pattern is formed; and attaching a thermoset adhesive to a conductor-pattern-formed surface of the substrate. The method further includes: mounting the circuit chip to be connected to the conductor pattern on the substrate via the thermoset adhesive; clamping the substrate by a heating apparatus having a presser section and a support section, the presser section abutting the circuit chip mounted on the substrate and the support section abutting the underside surface of the roughened film; and fixing the circuit chip to the conductor pattern by heating and hardening the thermoset adhesive using the heating apparatus.

Abstract: A high-voltage bushing includes a housing and a tube disposed within the housing. A conductor is disposed within the tube. An electrically conductive contact member is connected to the tube and has a first opening to receive and contact the conductor. Accordingly, spark-over between the inner surface of the tube and the outer surface of the draw-lead cable caused by a high-frequency transient is substantially prevented.

Abstract: The invention describes apparatus for designing and installing power distribution systems for: residential, commercial and industrial applications, as well as for power distribution within electro-mechanical devices. The invention transforms existing labor-intense installations into practically plug-and-power type modular systems. For a specific project, pre-designed, fabricated and tested kit, including factory assembled and tested: power and control enclosures, power outlets and junction boxes, interface cables, as specified by the invention, will be delivered directly to the installation site. No labor intense operations: wire crimping, outlet/switch wiring, junction box wiring, load wiring. No exposed hot wires or leads at any point outside enclosure. The invention will: significantly lower labor costs, reduce installation time, improve safety, reliability and quality.

Abstract: A method for calibrating a test instrument and a set of leads having proximal ends coupled with the test instrument is described. The method includes shorting the distal ends of the set of leads during calibration and zeroing the test instrument during the shorting. The shorting includes coupling an electrical conductor with at least two of the distal ends.

Abstract: A method for manufacture of an electronic interface card including defining a pair of apertures in a substrate layer, associating an antenna with the substrate layer such that opposite ends of the antenna terminate at the apertures, placing a conductor in each of the apertures, connecting the antenna to the conductor, forming a recess in the substrate layer, attaching continuous connection wires to a plurality of chip modules, attaching the continuous connection wires to a plurality of conductors on a corresponding plurality of the substrate layers, cutting the continuous connection wires so as to retain portions thereof which connect each chip module to a corresponding pair of conductors and sealing the chip module in the recess.

Abstract: A space transformer for a semiconductor test probe card and method of fabrication. The method may include depositing a first metal layer as a ground plane on a space transformer substrate having a plurality of first contact test pads defining a first pitch spacing, depositing a first dielectric layer on the ground plane, forming a plurality of second test contacts defining a second pitch spacing different than the first pitch spacing, and forming a plurality of redistribution leads on the first dielectric layer to electrically couple the first contact test pads to the second contact test pads. In some embodiments, the redistribution leads may be built directly on the space transformer substrate. The method may be used in one embodiment to remanufacture an existing space transformer to produce fine pitch test pads having a pitch spacing smaller than the original test pads.

Abstract: Formation of an assemblage of electrically conductive components for a new electrosurgical pencil is disclosed, and assembly of those components in a method for automating the manufacture and combination of current carrying metal circuitry and operable switching components in “electrosurgical pencils” which supply current to an active terminal, for application of high frequency or high power electrical current to a surgical site, and control of such current through coaction of the elements of the switch. In manufacture, the design of the switch components allows start-to-finish automated assembly of the switch, whereby an array of identical multiple metal “frames” may be formed from a reel, then each frame separated and enclosed within molded plastic, and the resulting cabinet joined with a housing to create an inexpensive hand piece, for use with a high quality, reusable cable and plug assembly.

Abstract: Methods for the manufacture of electrical components, such as ultrasound transducers, are illustrated and described. In particular, several embodiments of the methods can include patterning electrodes, such as for the connection of an ultrasound transducer to an electrical circuit. The methods also can include depositing metal on surfaces and making an integrated matching layer for an ultrasound transducer. Ultrasound transducers produced by these methods also are illustrated and described.

Abstract: A producing method of a wired circuit board includes the steps of preparing the wired circuit board, placing the wired circuit board on a support table, and applying light from above the wired circuit board toward the wired circuit board, and sensing pattern reflected light, table reflected light and foreign-matter reflected light to inspect the conductive pattern and the foreign matter based on a contrast therebetween. In the step of inspecting the conductive pattern and the foreign matter, a reflectance of the table reflected light is in a range of 25 to 55%, and a reflectance of the foreign-matter reflected light is in a range of not more than 10%.

Abstract: A light module for a side mounted rear view mirror of a vehicle includes a light and an electrical conductor for connecting the light to a power source through an opening to be formed in a forward facing surface of the rear view mirror housing. The module includes a boot having an opening at a front end and a flexible back end. A fastening system is adapted for mounting the light and boot on the forward facing surface of the rear view mirror housing so the flexible back end of the boot is compressed against the forward facing surface of the mirror housing and a segment of the electrical conductor extending from the opening in the forward facing surface of the rear view mirror housing is substantially enclosed in the boot when the light module is installed on the rear view mirror.

Abstract: An implantable medical lead for transmitting electrical pulses to excitable bodily tissue and/or signals detected at bodily tissue to a detection and evaluation unit, including a distal electrode or a distal sensor, or actuator; a proximal electrode connector or sensor/actuator connector; and a lead pole which connects the electrode or the sensor or actuator to the electrode connector or sensor/actuator connector and extends in the lead body, wherein the lead pole comprises at least two separate and individually insulated conductors which are electrically interconnected at least at one point which functions as an interchange point, or reversal point, in the lead extension from the proximal electrode or sensor connector to the distal electrode or the distal sensor, and wherein at least one of the separate conductors, in particular close to the reversal point, is interrupted at least once and/or is not connected at one end.

Abstract: Microelectronic devices and methods for manufacturing microelectronic devices are disclosed herein. An embodiment of one such method includes forming a plurality of through holes in a substrate with the through holes arranged in arrays, and attaching a plurality of singulated microelectronic dies to the substrate with an active side of the individual dies facing toward the substrate and with a plurality of terminals on the active side of the individual dies aligned with corresponding holes in the substrate. The singulated dies are attached to the substrate after forming the holes in the substrate.

Abstract: A lead includes a lead body defining a lumen extending through the lead body; a conductor disposed in the lumen; a slit extending from an exterior of the lead body through at least a portion of the lead body to the lumen; and a contact strip. A portion of the contact strip is optionally disposed in the slit and is in contact with a portion of the conductor. A second portion of the contact strip is optionally wrapped around the lead body. A method of making a lead includes disposing one or more conductors in a lumen of a lead body; forming a slit from an exterior of the lead body to the lumen to access a portion of at least one conductor disposed in the lumen; coupling a flat contact strip to the portion of the conductor, and wrapping the contact strip around the lead body.

Abstract: A buss bar strip for mounting to a solar panel to electrically connect to a series of electrical lines extending from solar cells. The buss bar strip can include a thin elongate flat flexible strip of insulative material having a longitudinal length. A predetermined pattern of elongate conductors can be longitudinally disposed on the insulative strip in at least two rows along the longitudinal length and electrically isolated from each other. Each conductor can have a predetermined position, length, and spacing from each other on the insulative strip for laterally electrically connecting to selected electrical lines from the solar cells at lateral electrical connection points located along the length of the conductor on exposed surfaces on the conductor.

Abstract: A level-shifter circuit may include a pair of inputs which receive a first and a second low-voltage phase signal having a first voltage dynamic with a first maximum value. The level-shifter circuit may also include a pair of outputs which supply a first high-voltage phase signal and a second high-voltage phase signal, level-shifted with respect to the low-voltage signals and having a second voltage dynamic with a second maximum value, higher than the first maximum value. The level-shifter circuit may further include transfer transistors coupled between one of a first reference terminal and a second reference terminal, which are set at one of a first reference voltage and a second reference voltage, and the first output or second output. Protection elements may be coupled to a respective transfer transistor to protect from overvoltages between at least one of the corresponding conduction terminals and control terminals.

Abstract: A lighting fixture includes a first housing portion and a second housing portion. The first housing portion includes a base and a wall extending outwardly from substantially the perimeter of the base. A top portion of the wall includes one or more hinges extending outwardly therefrom. The second housing portion includes a front panel and a side panel extending outwardly from substantially the perimeter of the front panel. A top portion of the front panel includes at least one slot. The second housing is coupled to the first housing in an open position when the hinge is inserted into the slot and the front panel is disposed elevationally above the base. The second housing is coupled to the first housing in an operational position when the hinge is inserted into the slot and the front panel covers the base.

Abstract: A method and apparatus are provided for making radio frequency (RF) inlays. The RF inlays include an integrated circuit and an antenna affixed to a substrate material carrying the integrated circuit. During processing, portions of the wire forming the antenna are located adjacent to, but not directly over the integrated circuit such that the wire may be subject to further processing, such as removing insulation without potentially damaging the integrated circuit. In the subsequent processing step, the wire ends are placed in contact with and secured to the integrated circuit terminal areas. Methods of the invention include forming loops with the wire ends wherein the loops extend above a plane of the substrate, and in another processing step, the loops are displaced to be electrically connected to the terminal areas. Methods also include repositioning the wire and using a brush or comb device.

Abstract: A microelectronic device mounting substrate includes a bond pad with a side wall and an upper surface. A dielectric first layer is disposed on the mounting substrate and a solder mask second layer is disposed on the dielectric first layer. A uniform recess is disposed through the solder mask second layer and the dielectric first layer that exposes the portion of the bond pad upper surface.

Abstract: Apparatus for making an electrical connection in a system requiring four electrical connections, including an electrical connection pad having an array of four types of electrically conductive contacts, all conductive contacts of a given type being electrically connected to all other conductive contacts of the same type; and an arrangement for providing electrical connections to conductive contacts on the pads, the arrangement having electrically conductive pins for making contact with the conductive contacts, wherein the types of electrically conductive contacts include two contacts for power and two separate contacts for signals. The pins may be arranged at corners of a first square and a second square, with the first square being rotated by forty-five degrees with respect to the second square, and a pin located at a common center of both squares. A method of operation of the apparatus, and various applications and configurations for its use.

Abstract: In one embodiment, a plug-cable unit comprises a plug connector (11) which is equipped to receive a coding plug (20), a cable (12) for connecting to a functional unit (30) to be controlled, in particular of an electromechanically adjustable piece of furniture, and a plug module (13) for connecting to a control device (40) of the piece of furniture. In one embodiment, a coding plug comprises at least two ports (21, 22) for connecting to related contacts (14, 15) of a plug connector (11) of a plug-cable unit (10), and at least one electronic component (23) comprising at least one parameter of a functional unit (30) to be controlled, of the electromechanically adjustable piece of furniture. In addition, a setting device and a method for configuring a functional unit, in particular of an electromechanically adjustable piece of furniture, are provided.

Abstract: A tool for changing first and second parts of a connector from a pre-assembly relationship into an assembled relationship. The tool is portable and has a frame with an operating mechanism thereon. The operating mechanism has a plunger that is movable to thereby change the relationship of the connector parts. The operating mechanism is operable by a pressurized fluid within a container that is connected to the frame.

Abstract: Provided is a wiring substrate, a semiconductor device package including the wiring substrate, and methods of fabricating the same. The semiconductor device package may include a wiring substrate which may include a base film. The base film may include a mounting region and a non-mounting region. The wiring substrate may further include first wiring patterns on the non-mounting region and extending into the mounting region, second wiring patterns on the first wiring patterns of the non-mounting region, and an insulating layer on the non-mounting region, and a semiconductor device which may include bonding pads. At least one of side surfaces of the second wiring patterns adjacent to the mounting region may be electrically connected to at least one of the bonding pads of the semiconductor device.

Abstract: This disclosure relates to an improved electrochemical sensor that has a simplified electrode assembly. The electrode assembly incorporates electrodes into or onto a single polymeric substrate. The working electrode can be porous, to enable an analyte, such as a toxic gas, to access an electrode-electrolyte interface. Ionic connection between electrodes can be made by an electrolyte on a back side of the electrode assembly, and external electronic circuitry can be connected directly to the electrode assembly. This construction dramatically simplifies the sensor, resulting in reduced costs and potentially improved performance. The construction is compatible with batch fabrication methods.

Abstract: An electrical connector (2) housing (1) for connecting at least one cable lug (31) to a threaded terminal of an electrical device (4), including, for each lug, a hole (11) for receiving a screw (12) for retaining a lug in a threaded terminal, which hole has a lateral slot (13) designed to allow a lug to penetrate the hole, a lower opening (14) for connecting the lug to a threaded terminal and an upper opening (15) designed to allow the passage of a screwing tool for the screw, the size of the upper opening of the hole at its widest point being strictly less than the size of the hole at its widest point, said opening being designed so as to allow the passage of the screwing tool and having a section which is less than the section of a human finger.

Abstract: A cable lighting assembly comprising two electrically isolated electrical conductors, and at least one light emitting diode comprising an anode lead and a cathode lead. An electrical joint is formed between the anode lead and one of the electrical conductors, an electrical joint is formed between the cathode lead and the other electrical conductor, and a thermal joint is formed between the light emitting diode and one of the electrical conductors.

Abstract: An electrotherapy electrode device. A generally thin, flexible top layer includes an aperture. A terminal is adjacent the top layer. The terminal has a generally planar shoulder, a post projecting from the shoulder, and a generally planar contact surface opposing the shoulder. The terminal includes a magnetic material. The post of the terminal extends through the aperture of the top layer and the shoulder of the terminal contacts the top layer.

Abstract: In one aspect, a method to repair a cable jacket includes disposing a shrink tube on a damaged area of a cable jacket of a cable. The shrink tube includes a first end portion and a second end portion. The method also includes heating the shrink tube to seal the damaged area and tapering the first end portion of the shrink tube by cutting the shrink tube. Another aspect includes a device to taper end portions of a cable jacket shrink tube repair. A further aspect includes a device to dispose a tube on a cable.

Abstract: One unhoused electronic component, e.g., a semiconductor power component, has at least one connecting surface disposed on a top side and/or on a bottom side for fastening and/or for electric contacting. One side of the component is attached to and/or electrically contacts a direct copper bonding ceramic substrate, at an opposing connecting surface in the region of the connecting surface. An electrically insulating carrier film is created on the substrate on the side facing the component outside the region of the connecting surface and extending beyond the bottom side. An electrically conducting conductor part is attached to and/or electrically contacts the connecting surface on the top side. A pre-formed, three dimensional structure is formed extending beyond the area of the top side, thus creating an electrically insulating mass between the carrier film and the three-dimensional structure of the conductor part.

Abstract: A terminal insertion apparatus having a connector housing holding unit, a terminal insertion unit, and a control unit. The connector housing holding unit holds a connector housing movably in horizontal and vertical directions. The terminal insertion unit inserts a terminal attached to an electric wire into a terminal accommodating chamber of the connector housing. After the terminal insertion unit has inserted an end of the terminal into the terminal accommodating chamber, the control unit controls a movable supporting unit of the connector housing holding unit so as to move a holding jig by amounts of movement in horizontal and vertical directions so that the terminal is not caught on an inner surface of the terminal accommodating chamber, and then the terminal is completely inserted in the terminal accommodating chamber.

Abstract: A semiconductor device includes a substrate, a die assembly attachable to the substrate and a flexible strip extending over the substrate and the die assembly. The flexible strip has one or more routing circuits carried thereon. The die assembly and the substrate are arranged to be electrically connected through the one or more routing circuits carried on the flexible strip.

Abstract: A method of manufacturing an electrically driven L.E.D. lamp assembly (20) comprises disposing an electrically insulative coating (24) on a thermally conductive substrate (22). A plurality of light emitting diodes (26) is secured to the coating (24). A coupling agent is disposed on a tape portion (48) of a foil tape (46), and the foil tape (46) is secured to the coating (24) with the coupling agent in predetermined spaced lengths (42) along the coating (24) to establish discrete and electrically conductive spaced lengths (42) with the light emitting diodes (26) disposed between the spaced lengths (42). Each light emitting diode (26) includes a pair of electrical leads (32) which are secured to the spaced lengths (42) to electrically interconnect the light emitting diodes (26).

Abstract: In the disassembling method of a display device of the present invention, the display device has a display panel, and metal plate unit having a panel member formed of a chassis member disposed on the back surface of the display panel and a circuit board as an electric circuit member attached to the chassis member through an attaching member. The disassembling method has a mounting step of mounting metal plate unit on stage whose tilt angle can be adjusted by mechanism section and a cutting step of cutting the attaching member in parallel with the surface of stage with saw blade that abuts on the attaching member by the own weight of metal plate unit based on the tilt angle of stage.

Abstract: A process for manufacturing a single microcircuit into an integrated cochlear electrode array includes securing and supporting a nonconductive film substrate; attaching a metallic ribbon to a surface of the substrate; machining a flat multiconductor microcircuit from the ribbon to produce a flat elongated multiconductor tail portion with spaced outwardly exposed electrode receiving pads, and a flat multiconductor head portion connected to the tail portion and having spaced outwardly exposed attachment pads; laminating the flat microcircuit between the film substrate and an insulating cover; excising the laminated microcircuit from the film substrate with the electrode receiving pads exposed; wrapping the tail portion of the excised laminated microcircuit into a helix with the exposed electrode receiving pads wrapped around the insulating cover; mounting and electrically connecting the ring electrodes on and to the exposed electrode pads; and overmolding the helix tail portion with a polymeric material to read

Abstract: A method for producing a rigid magnetic circuit component for an electromagnetically operable valve includes: a) providing a base element made of a magnetic or a magnetizable material, b) complete first heat treatment of the base element, c) a local second heat treatment of the base element so as to form a subregion having a microstructure of martensite and residual austenite in the otherwise martensitic base element, and d) installing the finished processed base element as the magnetic circuit component in a magnetic circuit.

Abstract: On-board model railroad speaker enclosure designs are presented that allow maximum sized speakers, improve impedance matching of sound to the outside of the locomotive, and isolate back and front speaker waves while maintaining the standard horizontal drive-train in model train locomotives.

Abstract: Embodiments of amplifiers with depletion and enhancement mode thin film transistors are disclosed herein. Other examples, devices, and related methods are also disclosed herein.

Abstract: A method for using a cable assembly apparatus for coupling a connector to a cable having a base supporting an interface pedestal dimensioned to receive the connector; an inductor coil coupled to an inductor coil actuator operable to move the inductor coil between a load position and an operation position proximate the interface pedestal; a grip clamp operable by a clamp actuator to move between an open position and a closed position above the interface pedestal; and a temperature sensor configured to read a temperature proximate the interface pedestal. The method includes using the apparatus for retaining the pre-assembled connector and cable in an aligned orientation for controlled heating by the induction heater to heat a solder perform to solder the connector to an outer conductor of the cable.

Abstract: An electrical bushing for use in a housing of an implantable medical device is proposed. The electrical bushing includes at least one electrically insulating base body and at least one electrical conducting element. The conducting element establishes, through the base body, at least one electrically conductive connection between an internal space of the housing and an external space. The conducting element is hermetically sealed with respect to the base body, at least in part. The at least one conducting element includes at least one cermet. The electrical bushing includes at least one head part. The head part includes at least one plug connector element that enables electrical connection of at least one plug element from the external space to the plug connector element.

Abstract: An electrical bushing for use in a housing of an implantable medical device is proposed. The electrical bushing includes at least one electrically insulating base body and at least one electrical conducting element. The conducting element establishes, through the base body, at least one electrically conductive connection between an internal space of the housing and an external space. The conducting element is hermetically sealed with respect to the base body, at least in part. The at least one conducting element includes at least one cermet. The electrical bushing further includes at least one metallic frame element, which fixes the base body in at least one housing opening of the housing.

Abstract: A method for mounting electronic components includes a step of providing an adhesive on each of plural electronic component mounting parts on a wiring board; and a step of fixing one of the electronic components on each of the plural electronic component mounting parts via the adhesive. When the adhesive is provided on each of the plural electronic component mounting parts, the center of gravity of a volume of the adhesive provided on the mounting part where an Nth electronic component is to be mounted is shifted in a direction closer to the mounting part where an (N minus 1 or greater)th electronic component is provided neighboring and adjacent to the mounting part where the Nth electronic component is to be mounted.

Abstract: Shielding performance and protection from radiated RF energy at a cable's point of entry to an enclosure are improved when a shield of the cable is AC coupled around an entire opening of the enclosure using a discoidal capacitor. The capacitor may be electrically coupled to the shield and the enclosure around the entire inner and outer circumferences of the discoidal capacitor. Compared to traditional DC coupling or the use of a drain wire and traditional capacitor, using the discoidal capacitor lowers inductance and improves shielding of the opening itself while improving AC filtering characteristics and preventing ground loops.

Abstract: The invention relates to the attachment of a multiple-conductor electronic cable to an electronic circuit in a sealed housing. The cable is placed in a sheath of a heat-deformable material and the method comprises the following steps: placing a rigid bushing (40) with a protruding collar (48) on the exposed end of the cable, heating the end in a conical mold or softening the sheath, inserting the bushing between the cable conductors and the softened sheath, the collar of the bushing pushing the sheath material until the conical portion of the mold is filled, cooling the sheath for solidifying it, extracting the end of the cable from the mold, the end having a conical portion with an increasing diameter ending with the protruding collar, inserting the cable in the housing opening from the inside before closing the housing. The invention can be used or an intra-oral dental radiology sensor.

Abstract: A locking latch for an appliance provides an improved three-wire interface that reduces the chance of malfunction if the door is forcibly opened when it is in the lock state and a bi-stabile actuator is used. In one embodiment, the door switch is positioned to disengage the major load of the washing machine when the doors open, regardless of the lock or unlock state.