Abstract: Sensors modules adapted to be mounted to a motherboard under challenging conditions by using automated manufacturing processes are disclosed. A sensor module can include a sensor mounted to a sensor PCB, a connector coupled to the sensor and having a plurality of guide pins extending therefrom in a vulnerable manner, with the guide pins being adapted to be inserted into guide pin holes on an associated motherboard, and a disposable carrier adapted to hold the connector and protect the guide pins thereof prior to mounting. The disposable carrier is removed from the sensor module before the sensor module is mounted directly to a motherboard by press-fitting the guide pins into guide pin holes on the motherboard and soldering connections thereto in an automated surface mounting operation. Disposable carrier protected sensor modules can be stored and processed in a tray or tape-and-reel automated manufacturing system.

Abstract: In one embodiment, a stimulation lead for applying electrical pulses to tissue of a patient, the stimulation lead comprises: a plurality of electrodes on a first end of the lead body; a plurality of terminals on a second end of the lead body; a lead body comprising a flex film component disposed within insulative material, wherein (i) the flex film component comprises a plurality of electrical traces, (ii) the plurality of electrical traces electrically couple the plurality of electrodes with the plurality of terminals, and (iii) the flex film component comprises a plurality of bends along a substantial length of the lead body; wherein the stimulation lead is adapted to elastically elongate under application of stretching forces to the lead body without disconnection of the electrical connections between the plurality of electrodes and the plurality of terminals through the electrical traces of the flex film component.

Abstract: Formation of an assemblage of electrically conductive components for a new electrosurgical pencil is disclosed, and assembly of those components in a method for automating the manufacture and combination of current carrying metal circuitry and operable switching components in “electrosurgical pencils” which supply current to an active terminal, for application of high frequency or high power electrical current to a surgical site, and control of such current through coaction of the elements of the switch. In manufacture, the design of the switch components allows start-to-finish automated assembly of the switch, in an industry which knows only partially automated assembly, and partial assembly by hand, to create an improved tool for surgical cutting, coagulation, and cauterizing.

Abstract: A surge snap-on module assembly includes a plug connector adapted to be received by an electrical device. A second housing is connected to a first housing. A surge protection device is disposed between the first and second housings. At least one first opening is formed in the second housing. A plurality of wires pass through the at least one first opening and are connected to the surge protection device. Accordingly, the surge protection device protects electrical apparatus connected to the electrical device from electrical surges.

Abstract: A chip on film (COF) structure includes a flexible circuit board and a chip. The flexible circuit board includes a flexible base film and a conductive layer. The flexible base film has a polyimide layer and an anisotropic conductive layer (ACL). The conductive layer is disposed on the flexible base film. The conductive layer and the ACL are separated by the polyimide layer. The chip is mounted with the conductive layer via interconnectors.

Abstract: Replacement of a transducer assembly for an ultrasonic fluid meter. At least some of the illustrative embodiments are methods including: disconnecting a wiring harness that electrically couples electronics of an ultrasonic meter to a transducer assembly; removing the transducer assembly as a single unit from a transducer housing; inserting a replacement transducer assembly as a single unit into the transducer housing; and reconnecting the wiring harness.

Abstract: A method (10) of forming an electrically conducting feedthrough. The method (10) comprises a first step (11) of forming an electrically conductive structure (21) comprising a sacrificial component and a non-sacrificial component. At least a portion of the non-sacrificial component can then be coated with a relatively electrically insulating material (35) prior to removal of at least a portion of the sacrificial component from the electrically conductive structure. The structure of the feedthrough provides electrical connection through the wall of a housing of an implantable component while preventing unwanted transfer of materials between the interior of the component and the surrounding environment.

Abstract: An implantable electrode assembly. The electrode assembly comprises an elongate carrier member, at least one electrode contact disposed in the carrier member, and at least one elongate conductive pathway disposed in the carrier member having a distal end attached to the at least one electrode contact and having a substantially planar strain relief formed therein that is located only in the distal region of the at least one pathway.

Abstract: This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.

Abstract: An electrical connector for use with providing an electrical termination to an end of a cable having a conductor helically disposed between a core and a layer overlying the core. The connector includes a first portion having an opening sized greater than a diameter defined by the helically disposed conductor but less than a diameter of the layer. A second portion has an opening sized greater than a diameter defined by the helically disposed conductor. A third portion is configured to receive a conductor of a second cable. As a result of the end of the cable being sufficiently inserted through the opening of the first portion, the helically disposed conductor is exposed about a length of the cable extending through another side of the first portion and received in the opening of the second portion.

Abstract: Approaches for helping to decrease the amount of inactive gas necessary for reflow to interconnect connection terminals of a head slider and a suspension. Inactive gas is blown from a nozzle of a reflow apparatus toward interconnection joints of a head slider and a suspension. The head slider is bonded onto a gimbal tongue. The nozzle comprises a duct through which the inactive gas passes and a porous member fitted in an ejection outlet of the tube. Placing the porous member close to the head slider achieves effective reduction of oxygen concentration around solder balls.

Abstract: A system for feeding a fuel cell stack including fuel cells having separating plates and membrane electrode assemblies (MEAs). The system includes a separating plate supply unit for feeding the separating plates; an MEA supply unit for feeding the MEAs; a feeding unit on which the separating plates and the MEAs are fed, the feeding unit being configured to move upward and downward; and a transfer unit for receiving the separating plates and the MEAs from the separating plate supply unit and the MEA supply unit, respectively, and for loading the separating plates and the MEAs onto the feeding unit. A method for feeding a fuel cell stack includes feeding one of the separating plates, moving a magazine a predetermined amount, lowering a plate of a feeding unit, feeding one of the MEAs, and determining if the separating plates and the MEAs have been fed as much as a required number.

Abstract: An improved LED lamp manufacturing method is described. An LED lamp bulb and a pair of electrical cables are provided. The LED lamp bulb is electrically coupled with the pair of electrical cables. A main body is provided to enclose the LED lamp bulb, wherein the main body consists of a first plastic member and a second plastic member. The first plastic member is coupled with the second plastic member.

Abstract: An area efficient distributed device for integrated voltage regulators comprising at least one filler cell connected between a pair of PADS on I/O rail of a chip and at least one additional filler cell having small size replica of said device is coupled to said I/O rails for distributing replicas of said device on the periphery of said chip. The device is connected as small size replica on the lower portion of said second filler cell for distributing said device on the periphery of said chip and providing maximal area utilization.

Abstract: A probe includes a substrate and a tetragonal structure disposed on the substrate that has four end points. Three of the end points are disposed adjacent to the substrate. A fourth of the end points extends outwardly and substantially normal to the substrate. In a method of making a probe tip, a plurality of tetrapods are grown and at least one of the tetrapods is placed on a substrate at a selected location. The tetrapod is affixed to the substrate at the selected location.

Abstract: An electronics component support assembly and an electronics system assembly employing the component support assembly are provided. The component support assembly includes a rotatable base support and a component connector assembly. The rotatable base support is sized to reside within an electronics enclosure and to operatively support multiple electronics components thereon. The component connector assembly is associated with the rotatable base support, and at least some electronics components of the multiple electronics components couple thereto when operatively supported by the rotatable base support. Rotation of the rotatable base support facilitates access to the multiple electronics components, and the component connector assembly allows for rotation of the rotatable base support with the multiple electronics components operatively supported on the rotatable base support.

Abstract: A first step of the method for assembling a wire element with an electronic chip comprises arranging the wire element in a groove of the chip delineated by a first element and a second element, joined by a link element comprising a plastically deformable material, and a second step then comprises clamping the first and second elements to deform the link element until the wire element is secured in the groove.

Abstract: A disk pack, comprising at least one hard disk, is rotatably mounted to a housing. The disk pack defines an axis of rotation and a radial direction relative to the axis. At least one actuator mounted to the housing is coupled with a suspension and is movable relative to the disk pack. A slider, comprising a slider body and a head configured to read data from and write data to at least one hard disk, is coupled with the suspension. A first suspension electrical interconnect is configured to electrically couple a first signal conducting pathway with the slider and with a first non-terminated signal pathway. A second suspension electrical interconnect is configured to electrically couple a second signal conducting pathway with the slider and with a second non-terminated signal pathway. The length of the second non-terminated signal pathway is selected to achieve a desired impedance level.

Abstract: A method of fabricating a packaging substrate is disclosed. A cladding sheet comprised of a first metal foil, a second metal foil and an etch stop layer interposed between the first and second metal foils is provided. The first metal foil is then patterned into a first circuit trace. An insulating layer is laminated onto the first circuit trace. Thereafter, the second metal foil is patterned into a plurality of bump pads. The etch stop layer that is not covered by the bump pads is stripped off. A solder mask is applied to fill the spacing between the bump pads. A top surface of each of the bump pads is etched to form a bonding aperture in a self-aligned fashion.

Abstract: In a package for a semiconductor device, a core substrate has two metal plates, each of which includes a first through hole, a second through hole, a projection, and an insulating layer formed on its surface. The metal plates are stacked in a manner that the projections of the mutual metal plates enter the second through hole of the metal plate on a partner side, and the first through holes of the metal plates form a through hole penetrating the core substrate. A tip end of each of the projections of the metal plates is exposed to a surface of the metal plate on the partner side to form a first terminal portion, and a second terminal portion is exposed from the insulating layer and formed on a surface of the metal plate on a side where the first terminal portion of the metal plate on the partner side is exposed.

Abstract: A method of forming an electrical component is provided. The method comprises preparing a subassembly by electrically connecting an integrated circuit to a flexible circuit; and attaching the subassembly to a multilayer ceramic capacitor having a mounting surface with a curvature deviation exceeding 0.008 inches per inch.

Abstract: Removal of a conventional separable insulated connector from an electric power system often results in a shortened electric cable. An extender for a separable insulated connector enables the separable insulated connector to connect to a shortened cable. A conventional cable adapter is inserted into the extender, which includes a conductive connector for accepting the shortened cable and a conductive rod for carrying electric power from the shortened cable to the separable insulated connector. The extender also includes an inner semi-conductive layer that borders the conductive rod and compression connector, an outer semi-conductive layer, and a insulating layer between the two semi-conductive layers. The extender is inserted into a separable insulated connector, which is then connected to the electric power system.

Abstract: A solid state switching arrangement includes at least one bus bar configured to carry electrical current and at least one switch that is gallium nitride based. The switch is secured relative to the bus bar and the bus bar is configured to communicate heat away from the switch. An example method of arranging a switch includes mounting a gallium nitride based switch relative to a bus bar and communication heat away from the gallium nitride based switch using the bus bar.

Abstract: An electronic circuit module is mounted on an electronic circuit board. The electronic circuit module includes an electronic component that has a first electrode and a second electrode that form a facing surface. The electronic circuit module also includes a coaxial cable with a core wire and a shielded wire being exposed in stages. The core wire and the shielded wire of the coaxial cable are directly connected to the first electrode and the second electrode that are exposed at a predetermined cable connecting surface of the electronic component.

Abstract: There is provided an endoscopic camera module package including: a lens part including at least one lens arranged along an optical axis; a flexible printed circuit board having an image sensor mounted thereon, the image sensor allowing light passing through the lens part to form an image; and a housing including an image sensor supporting frame allowing the image sensor to be supported at a rear of the lens part while the flexible printed circuit board is bent.

Abstract: A method of sealing a cable penetration includes assembling a cable seal and inserting the cable seal into a cable penetration. Assembling the cable seal includes adhering at least a portion of a heat-shrinkable tubing to at least a portion of a cable outer jacket, and positioning a secondary elastic seal over the heat-shrinkable tubing. An example of a secondary elastic seal could be O-rings. A cap or other means provides the outer sealing surface.

Abstract: The Med-ic™ Electronic Compliance Monitor (ECM) addresses the problem of patient non-compliance with prescribed medication. The Med-ic™ ECM provides precise information about the patient's use of blister-packaged medication in clinical research and general pharmacy settings. Using an on-board central processing unit (CPU), the Med-ic™ ECM records the time each tablet or capsule is expelled from the blister package, keeping a record for later analysis. At the time of refilling or follow-up visit, the information is downloaded to the research assistant's, physician's or pharmacist's computer where it can be displayed graphically. The data can be stored for later analysis. Production of a Med-ic™ ECM Tag involves numerous steps. These steps incorporate certain methods and technologies to accomplish their objective, the steps being detailed in the specification.

Abstract: There is provided a method of manufacturing a multi-layer ceramic condenser. A method of manufacturing a multi-layer ceramic condenser may include: laminating a plurality of dielectric green sheets having internal electrodes formed thereon to form a laminate; forming through holes in a region of the laminate where an external electrode is to be formed; filling the through holes with conductive paste to form the external electrode; cutting the laminate having the external electrode formed thereon; and firing the cut laminate to form at least one multi-layer ceramic condenser.

Abstract: The present invention discloses a system including: (a) a host device including: (i) a cavity; and (ii) a socket, recessed in the cavity; and (b) a UFD configured to be reversibly operationally connected to the host device via the socket, wherein the UFD is configured to physically reside substantially in the cavity when the UFD is operationally connected to the socket. Also disclosed is a UFD system including: (a) a first part having components of a UFD, wherein the components include a primary connector and an electronics assembly; and (b) a second part having a UFD holder and a secondary connector, wherein the UFD holder is configured to reversibly accommodate the first part, wherein a dimension of the first part parallel to an insertion direction of the primary connector is shorter than a dimension of the second pail parallel to an insertion direction of the secondary connector.

Abstract: A medical device is electrically connected to a biological tissue for transmission of an electrical signal between the medical device and the biological tissue. The medical device includes a housing assembly and a control circuit assembly that controls the electrical signal. The control circuit assembly is enclosed within the housing assembly, and the control circuit assembly includes an electrically conductive terminal. The device further includes an electrical component at least partially enclosed within the housing assembly. The electrical component has a connecting member that electrically connects the electrical component to the control circuit assembly. The connecting member is resistance welded and bonded directly to the electrically conductive terminal of the control circuit assembly.

Abstract: A method for terminating a telecommunications cable where the cable comprises a plurality of twisted pairs of wires is disclosed. The method comprises providing an interconnection module comprising a pair of contacts for each of the twisted pairs, aligning the end portions and interconnecting each of the aligned end portions with a corresponding pair of conductive contacts. Aligning comprises arranging the end portions such that when connected to the contact pairs, the twisted pairs remain uncrossed.

Abstract: An iridium oxide (IrOx) nanowire neural sensor array and associated fabrication method are provided. The method provides a substrate with a conductive layer overlying the substrate, and a dielectric layer overlying the conductive layer. The substrate can be a material such as Si, SiO2, quartz, glass, or polyimide, and the conductive layer is a material such as ITO, SnO2, ZnO, TiO2, doped ITO, doped SnO2, doped ZnO, doped TiO2, TiN, TaN, Au, Pt, or Ir. The dielectric layer is selectively wet etched, forming contact holes with sloped walls in the dielectric layer and exposing regions of the conductive layer. IrOx nanowire neural interfaces are grown from the exposed regions of the conductive layer. The IrOx nanowire neural interfaces each have a cross-section in a range of 0.5 to 10 micrometers, and may be shaped as a circle, rectangle, or oval.

Abstract: An electronic device includes an electronic control unit, a wire, and a wiring-side connector. When a movable member is arranged in a first arrangement relative to a wiring-side connector main body, the movable member is in a position where the movable member does not prevent the wire from projecting from the main body to extend straight in a counter-fitting direction. When the movable member rotates from the first arrangement to a second arrangement relative to the main body, a restricting member approaches a portion of the main body from which the wire projects, to press and bend the wire, so a direction in which the wire projects from the main body is limited to a direction crossing the counter-fitting direction. When the movable member is arranged in the second arrangement and the main body is fitted to an ECU-side connector, the second arrangement is maintained.

Abstract: The present invention relates to an electrochromic device comprising: at least one partition (12) that separates the surface of the upper electrode (9) into two regions isolated from each other, namely a free region (9a) and an active region; at least one partition (5) that separates the surface of the lower electrode (4) into two regions electrically isolated from each other, namely a free region (4a) and an active region (4b); at least one free region (9a) of the upper electrode (9) receives a first current-supply connector (15) soldered to the active zone (4b) of the lower electrode (4); and the active area (9b) of the upper electrode (9) is in electrical contact with the connection means (20, 21a) connected to a second current-supply connector (21) electrically isolated from the free zone (9a) connected to the lower electrode (4).

Abstract: In the method according to the invention, the discrete electric component to be cooled is connected to the cooling element without a circuit board or substrate. In the method, a layer of insulating material is thermally sprayed on one surface of the cooling element. The connection points and conductors required by the discrete electric component are formed on top of this insulating layer. The discrete electric component is glued onto the insulating layer. Subsequently, the electrical connections for the discrete component are made. After the discrete component has been electrically connected, it can still be protected using a layer of thermally sprayed insulating material.

Abstract: Disclosed are a method for connecting a bus bar of a capacitor, improving temperature characteristics and reliability of the capacitor by reducing inductance and impedance such that heat generation is restrained during use of the capacitor, and a product fabricated by the same. A pair of bus bars are insulatedly connected to sprayed surfaces on both sides of a plurality of capacitor devices, in such a manner that lead frames arranged alternately on a first bus bar are connected in contact with the sprayed surfaces facing in a diagonal direction, of neighboring capacitor devices. Other lead frames arranged alternately on a second bus bar are connected to the sprayed surfaces facing in another diagonal direction across the above diagonal direction in an X-shape. Then, the pair of bus bars are assembled to be insulated from each other and overlapped at one side of the capacitor device.

Abstract: Apparatus for bleeding electrical charge and methods for installing a ground stud in a composite structure. The apparatus includes a ground stud and a composite structure including a hole. In one embodiment the ground stud engages the hole in the composite structure in a transition fit. In another embodiment the ground stud is countersunk within the composite structure. Embodiments of the present methods include drilling a hole in the composite structure; inserting the ground stud into the hole such that the ground stud is in electrical contact with conductive fibers within the composite structure; securing the ground stud to the composite structure; and attaching a connective device to the ground stud such that the connective device is in electrical contact with the ground stud. In some embodiments the ground stud and the composite structure engage one another in a transition fit.

Abstract: A method for manufacturing an integrated circuit device having antenna conductors is provided. The method includes the steps of providing a wafer with a plurality of integrated circuit components; forming a first antenna conductor on the surface of each integrated circuit component; forming a plurality of metal bumps above the first antenna conductor; coating an insulating layer to encapsulate the plurality of integrated circuit components and to cover the plurality of metal bumps; removing a portion of the insulating layer to expose a top portion of each metal bump; and forming a second antenna conductor on the insulating layer by screen printing.

Abstract: A method for connecting a first terminal array 6 provided in a connection portion 5 of a first electric component and a second terminal array 8 provided in a connection portion 7 of a second electric component to each other in such a manner that electric continuity is established between them has two steps, that is, a step of tentatively fixing the two connection portions 5 and 7 with each other whose terminal arrays 6 and 8 are positioned with respect to each other by soldering them with solder particles 3 using a paste-like anisotropic conductive adhesive 1 in which the solder particles 3 and conductive particles 4 are dispersed in a thermosetting resin 2, and a step of finally fixing the two connection portions 5 and 7 with each other with the thermosetting resin 2 that has been set thermally. This prevents positional deviation from occurring between the two terminal arrays 6 and 8 during a transport from a tentative fixing apparatus to a final fixing apparatus.

Abstract: A method for fabricating a signal controller, e.g., a filter or a switch, for a coplanar waveguide during the LIGA fabrication process of the waveguide. Both patterns for the waveguide and patterns for the signal controllers are created on a mask. Radiation travels through the mask and reaches a photoresist layer on a substrate. The irradiated portions are removed and channels are formed on the substrate. A metal is filled into the channels to form the conductors of the waveguide and the signal controllers. Micromachined quasi-lumped elements are used alone or together as filters. The switch includes a comb drive, a spring, a metal plunger, and anchors.

Abstract: A unitized wiring portion (wiring unit) has a hard pipe member, a wire provided in the pipe member, and outside wiring connectors connected at each end of the wire. A plurality of wiring units are prepared in advance wherein wiring units are divided into multiple groups having different length of wires and so on. The wiring units are arranged in a structure (e.g. a vehicle body) and the outside wiring connectors are connected to each other to form a wiring network. The wiring units are fixed to frame and/or reinforcing members to thereby increase mechanical strength of the structure.

Abstract: The formation of electronic assemblies is described. One embodiment includes providing a body and forming a first metal pad layer on a first surface thereof. A second metal pad layer is formed in contact with the first metal pad layer, the second metal pad layer having a denser pitch than the first metal pad layer. A dielectric layer is formed between the metal pads in the first and second metal pad layers. Vias extending through the body from a second surface thereof are formed, the vias exposing the first metal pad layer. An insulating layer is formed on via sidewalls and on the second surface, and an electrically conductive layer formed on the insulating layer and on the exposed surface of the first metal layer. Elements are coupled to the second metal pad layer and the electrically conductive layer coupled to a substrate. Other embodiments are described and claimed.

Abstract: The invention relates to the collective fabrication of n 3D modules. A batch of n wafers I are fabricated on one and the same plate. This step is repeated K times. The K plates are stacked. Plated-through holes are formed in the thickness of the stack. These holes are intended for connecting the slices together. The stack is cut in order to obtain the n 3D modules. The plate 10, which comprises silicon, is covered on one face 11 with an electrically insulating layer forming the insulating substrate. This face has grooves 20 that define n geometrical features, which are provided with an electronic component 1 connected to electrical connection pads 2? placed on said face.

Abstract: According to certain embodiments of the invention, a single chip COB USB manufacturing is using chip-on-board (COB) processes on a PCB panel with multiple individual USB PCB substrates. This single chip COB USB is laid out in an array of N×M matrixes. The advantages of this method are: 1) use molding over PCBA, versus conventional of using SMT process to mount all necessary component on substrate to form PCBA; 2) simpler rectangular structure to fit any external decorative shell package for added value; and 3) package is moisture resistance if not water proof.

Abstract: One aspect is a stimulation electrode including a base body. The base body encompasses a top area and an end area. The end area encompasses a groove-like, radially revolving coupling element, into which a connection area of a conduction coil can be pressed by means of plastic deformation.

Abstract: This relates to systems and methods for providing one or more vias through a module of an electrical system. For example, in some embodiments, the module can include one or more passive elements and/or active of the electrical system around which a packaging has been plastic molded. The module can be stacked under another component of the electrical system. Vias can then be provided that extend through the module. The vias can include, for example, electrically conductive pathways. In this manner, the vias can provide electrical pathways for coupling the component stacked on top of the module to other entities of an electronic device including the electrical system. For example, the component can be coupled to other entities such as other components, other modules, printed circuit boards, other electrical systems, or to any other suitable entity.

Abstract: A wire routing tool includes a guiding tip, a malleable shaft having a first end operatively connected to said guiding tip and a second end, and a guiding head having a first end operatively connected to said second end of said malleable shaft and a second end including a connector.

Abstract: Embodiments in accordance with the present invention relate to the design and manufacturing of inexpensive photovoltaic or thermal receivers for cost-effective solar energy conversion of concentrated light. Particular embodiments in accordance with the present invention disclose the design of a photovoltaic receiver and a low-pressure, low-flow-rate liquid cooler. Embodiment of the present invention also disclose a preferred low-cost and scalable manufacturing approach.

Abstract: The present invention relates to a socket including a connector insulatedly disposed inside the socket, the connector including contacts electrically connected to a source of input current. The socket further includes a slot for receiving an electronic card in the socket for connecting it to the connector, and a conductor for coupling the connector to at least one blade contact in the socket. According to a preferred embodiment of the present invention, the socket further includes an insulating body defining at least one plug blade receiving slot for disposing the blade contact therein, and a card slot which extends to the connector, and the electronic card is further having contacts complementary to each of the connector contacts.

Abstract: In a structure where an electronic component is mounted on a glass base material, an external electrode is provided on an opposite side to the component mounted on the base, and a through electrode and the base are welded to each other at a temperature equal to or higher than a glass softening point, electrical conduction is ensured between the electronic component and the external electrode. An electronic device includes a base, a through electrode which pass through the base and has a metal film formed on both end surfaces after an insulating material on the surface is removed by polishing, an electronic component which is provided on one surface of the through electrode through a connection portion, an external electrode which is provided on an opposite side to a side of the base on which the electronic component is provided, and a cap which protects the electronic component on the base.