Abstract: The present invention relates to methods for the batch fixation and electrical connection of pre-strained SMA wires on a microstructured substrate using electroplating, providing high bond strength and electrical connections in one processing step. The integration process here developed relies on conventional micro machining techniques and it provides an efficient solution to some problems that have hindered the widespread diffusion of bulk SMA to MEMS, such as the lack of cost-efficient integration methods of bulk SMA and the difficult electrical contacting of the actuator material at small scale. Also disclosed herein is a Joule-heated SMA wire actuator on silicon MEMS.

Abstract: A method of manufacturing a thermal contact arrangement. The method including the operations of providing a thermal conductor and forming a first zone having a first roughness on a first portion of a first exterior surface of the thermal conductor. The method further including the operation of forming a second zone having a second roughness on a second portion of the first exterior surface of the thermal conductor. The second portion is unique from the first portion and formed from a part of the thermal contact arrangement other than the first portion and the second roughness is rougher than the first roughness.

Abstract: A method of A production method including interdiffusion of a Ni component in a magnetic layer and a Zn component in a nonmagnetic sheet to form an interdiffusion layer in a region of the nonmagnetic sheet inside a conductive pattern. This method allows the interdiffusion layer to be formed without need for complicated processing of the nonmagnetic sheet. Furthermore, there is no boundary region between the magnetic layer and the nonmagnetic sheet around it. The nonmagnetic layer is located between turns of a coiled conductor to suppress degradation of dc bias characteristics and a magnetic body penetrates in a region inside the coiled conductor to suppress reduction in inductance due to provision of the nonmagnetic layer between turns of the coiled conductor.

Abstract: Disclosed herein is an implantable pulse generator feedthru configured to make generally planar electrical contact with an electrical component housed within a can of an implantable pulse generator. The feedthru may include a feedthru housing including a header side and a can side, a core within the feedthru housing, a generally planar electrically conductive interface adjacent the can side, and a feedthru wire extending through the core. The feedthru wire may include an interface end and a header end, wherein the header end extends from the header side and the interface end is at least one of generally flush with the generally planar interface and generally recessed relative to the generally planar interface.

Abstract: The manufacturing apparatus of a semiconductor device includes a jig having a plurality of holders arranged in a row, a controller for controlling the pitch of the plurality of holders arranged in a row, a support means provided with a plurality of semiconductor integrated circuits, and a support means provided with a substrate having a plurality of elements. By mounting the semiconductor integrated circuits on the respective elements by using the jig having the plurality of holders arranged in a row, semiconductor devices are manufactured.

Abstract: An implantable electrical medical device includes (i) electronics configured to generate or receive an electrical signal and containing a plurality of channels through which the electrical signal may be transmitted; (ii) a first lead receptacle having a first defined number of internal contacts, wherein each of the internal contacts are independently operably coupled to a discrete channel of the electronics; and (iii) a second lead receptacle having a second defined number of internal contacts, wherein the second defined number is less than the first defined number, and wherein each of the internal contacts of the second receptacle are independently operably coupled to a discrete channel of the electronics. At least one of the internal contacts of the first lead receptacle and at least one of the internal contacts of the second lead receptacle are operably coupled to the same channel of the electronics.

Abstract: A cut-edge positioning type soldering structure and a method for preventing a pin deviation can prevent a plurality of pins of an electronic component from being deviated when the pins are soldered onto a printed circuit board by a solder, and each of at least two solder pads includes at least two cut edges, and the solder pads are installed in an alignment direction on the printed circuit board, such that the cut-edge positioning type soldering structure and the method for preventing a pin deviation can improve the efficiency of manufacturing processes and reduce the manufacturing cost.

Abstract: A methodology for connecting device components with circuitry located at different levels and orientations relative to one another is described. First circuitry can be located on a multi-plane rigid circuit board where the multi-plane rigid circuit board can include at least one flexible member sharing a common substrate with the multi-plane rigid circuit board that extends from a body portion of the multi-plane rigid circuit board. The flexible member can include traces used to convey power and/or data and an interface coupled to the power and/or data traces. The flexible member can be deflected or twisted to connect first circuitry on the body portion of the multi-plane rigid circuit board to second circuitry associated with another device component.

Abstract: Disclosed herein are various embodiments of circuits and methods for capacitively coupling touchscreen electrode terminals to terminals of a flex circuit, printed circuit or printed circuit board, without physically attaching the touchscreen electrode terminals to the flex circuit, printed circuit or printed circuit board terminals by means of conventional electrical connection bonding materials or agents such as anisotropic conductive film or solder. The flex circuit, printed circuit or printed circuit board terminals are spaced apart from, or placed in physical contact with, corresponding ones of the touchscreen electrode terminals, but are not soldered or otherwise physically attached to the touchscreen electrode terminals by conventional electrical connection bonding materials or agents such as anisotropic conductive film or solder.

Abstract: One embodiment of the present invention provides a system that facilitates capacitive communication between integrated circuit chips. The system includes a substrate having an active face upon which active circuitry and signal pads reside, and a back face opposite the active face. The system additionally includes an integrated circuit chip having an active face upon which active circuitry and signal pads reside, and a back face opposite the active face. Additionally, the integrated circuit chip is pressed against the substrate such that the active face of the integrated circuit chip is parallel to and adjacent to the active face of the substrate, and capacitive signal pads on the active face of the integrated circuit chip overlap signal pads on the active face of the substrate. The arrangement of the substrate and integrated circuit chip facilitates communication between the integrated circuit chip and the substrate through capacitive coupling via the overlapping signal pads.

Abstract: The method relates to the assembly of electric power supply cables (10) on a stator (12) of an electric motor, formed by a pack (14) of magnetic laminations and at least one winding of bundles of electrically conductive wires (16), which is housed inside cavities (18) formed in the pack (14) and has at least one head (20) projecting from the pack (14).

Abstract: A method of manufacturing an apparatus 200 comprising forming an integrated magnetometer package 202. Forming an integrated magnetometer package 202 includes forming a movable part 215 from a MEM magnetometer substrate 210, and attaching an integrated circuit 910 to one side 212 of the MEM magnetometer substrate. A spacer structure 410 is formed on an opposite side of the MEM magnetometer substrate such that the moveable part is exposed through an opening 420 in the spacer structure. But the moveable part cannot escape through said opening. A permanent magnet 1010 is mounted through the opening to the movable part.

Abstract: A method and apparatus for reducing dielectric polarization and dielectric relaxation within a signal wire by partially neutralizing the electric charge differential within the dielectric material between the signal conductor and the surrounding insulating dielectric material.

Abstract: A method of manufacturing a handheld computing device that includes an electronic component assembly including at least one user interface component and an enclosure. The enclosure is a tube that is extruded. The extruded tube defines an internal lumen between open ends, and has a substantially uniform cross section along a longitudinal axis thereof. The extruded tube includes a front face, a back face, side portions connecting the front face and the back face, at least one access opening provided on the front face, and a pair of guide rails formed in the lumen along the side portions in parallel with the longitudinal axis. The electronic component assembly is slidably inserted into the lumen along the guide rails. The guide rails support the electronic component assembly and provide a reference surface for positioning the electronic component assembly relative to the front face such that the user interface is placed right behind the access opening to provide user access therethrough.

Abstract: Process for assembly of a diode in a spark plug cable of an internal combustion engine, suppression spark plug cable connector, manufacturing process of a suppression spark plug cable connector, spark plug connector and spark plug connection socket of internal combustion engines, said process being part of a spark plug cable (2) which is cut and receives a pipe sector (7) assembly inside which a diode (8) is located, the pipe (7) is bond between segments (2?) and (2?) of the spark plug cable (2) and receives around it a pipe-bridge (4) and a heat shrinkable cover (5); the connector (A1) featuring a diode (A2) in its inside, mounted in an encapsulated way (A2?); another connector (B1) being provided as a main cylindrical body (B2) made of injected material inside which two metal inserts (B3) are mounted in a centralized and mutual opposition arrangement, each of said inserts having a mutual contact terminal (B4) and in its respective opposite ends, a self-tapping-shaped screw terminal (B5); the socket (C1) pro

Abstract: A method of manufacture of an integrated circuit package-on-package system includes providing a base package and providing solder caps on the top of the base package configured to protrude above subsequent resin bleed, the resin bleed extending to an edge of the base package, and configured for merging with solder balls of a top package to form larger solder balls between such a top package and the base package.

Abstract: A circuit protection device for use with a circuit that includes at least one conductor includes at least one phase electrode assembly that is electrically coupled to the at least one conductor, wherein the at least one phase electrode assembly comprising an adjustable electrode assembly. The circuit protection device also includes a conductor base comprising at least one isolation area sized to secure the adjustable electrode assembly therein, and a conductor cover coupled to the conductor base and including at least one isolation channel, wherein the adjustable electrode assembly extends at least partially through the at least one isolation channel.

Abstract: The present invention provides devices and methods for testing the electrical performance of thin-film transistor backplane arrays and protecting thin-films during testing and handling.

Abstract: The present invention relates to the electronic manufacturing field and provides an automatic inserting method, an inserting system and an inserting device for a PCB board The method includes: obtaining the insertion paths for insertion of components in the PCB, calling the optimization program to adjust the insertion parameters, generating the optimized insertion paths based on the insertion parameters adjusted, and carrying out the insertion based on the optimized insertion paths. In an embodiment of the present invention, the optimization programs are used to adjust the insertion parameters in the original insertion programs, generate the optimized insertion paths based on the parameters adjusted, and carry out the insertion as per the optimized insertion paths, which not only improves the insertion efficiency, but also avoids a waste of manpower and the improvement of insertion efficiency is inconspicuous in relation to man-made modification of insertion programs.

Abstract: A connector is provided for terminating coaxial cable. The connector includes a connector body having a cable receiving end and an opposed connection end. A locking sleeve is provided in detachable, re-attachable snap engagement with the insertion end of the connector body for securing the cable in the connector body. The cable may be terminated to the connector by inserting the cable into the locking sleeve or the locking sleeve may be detachably removed from the connector body and the cable inserted directly into the cable body with the locking sleeve detached subsequently.

Abstract: An electrode assembly includes an electrode electrically connected to a capacitor with a wire. An assembly carrier may be used to hold and secure at least the wire and capacitor during assembly. A method of assembly for attaching a wire to a capacitor and an electrode may include an assembly carrier for housing and securing the wire, capacitor, and electrode during assembly.

Abstract: A cable connection device is described for electroconductive connection of a preferably multiwire cable, comprising a forcing nut, a receiving device and a contact carrier. The cable is guided through the forcing nut and through an opening of the receiving device, which comprises a wire receiving element. A stripped wire section of the cable can be positioned radially to the longitudinal axis of the cable connection device, on the wire receiving element, and the forcing nut can be screwed onto the contact carrier so that the forcing nut engages around the receiving device, the wire receiving element is directed towards the contact carrier and the receiving device can be pushed towards the contact carrier by the screwing nut. The cable has a compact structure and can be very easily and/or rapidly connected to a cable, and/or produced very economically on the basis of its simple construction and few individual parts.

Abstract: A stretchable electronic device is disclosed. In one aspect, the device has a stretchable interconnection electrically connecting two electronic components. The stretchable interconnection includes an electrically conductive channel having a predetermined first geometry by which the channel is stretchable up to a given elastic limit and a first flexible supporting layer provided for supporting the electrically conductive channel and having a predetermined second geometry by which the first supporting layer is stretchable. The predetermined second geometry has a predetermined deviation from the predetermined first geometry chosen for restricting stretchability of the electrically conductive channel below its elastic limit.

Abstract: A method of manufacturing a deflectable electrophysiological catheter includes constructing a shaft having a distal end and at least one lumen. The method further includes inserting a component into the lumen, and processing at least a portion of the distal end to reduce the cross-sectional profile of the lumen to capture/confine the component. A catheter manufactured using this method includes a shaft having at least one lumen. The lumen comprises a longitudinally-extending trough defined by a longitudinally-extending recess, within which a component is disposed, and a longitudinally extending open edge. The lumen further comprises a longitudinally-extending channel defined by a longitudinally-extending cavity and by the open edge of the trough. A planarity wire is disposed within the cavity and is configured to close the open edge of the trough to within a pre-defined tolerance that is less than the size of the component to retain the component in the recess.

Abstract: An image is captured or otherwise converted into a signal in an artificial vision system. The signal is transmitted to the retina utilizing an implant. The implant consists of a polymer substrate made of a compliant material such as poly(dimethylsiloxane) or PDMS. The polymer substrate is conformable to the shape of the retina. Electrodes and conductive leads are embedded in the polymer substrate. The conductive leads and the electrodes transmit the signal representing the image to the cells in the retina. The signal representing the image stimulates cells in the retina.

Abstract: In a method of producing a honeycomb structure molding die composed of feed holes through which molding material is fed and slit grooves communicated with the feed holes for the use of molding a honeycomb structure body, the slit grooves are formed on one surface of a metal material in a lattice arrangement by repeatedly moving a thin circular grindstone blade which is rotating in a straight-line direction or a line direction approximating a straight line in order to cut the surface of the metal material. In particular, the method removes fine metal powder, generated by cutting the surface of the metal material, using polishing grooves formed in a dressing grindstone disposed in front of the metal material every cutting of the metal material during the slit groove formation.

Abstract: A machine for installing electrical box, wiring, and receptacles or switch simultaneously, A process that allows electricians to perform all 3 tasks at one time without the need to return to install receptacles or switch after wallboard is installed, Comprised of: Housing with built-in laser guide and attached magnetic spacers for metal studs or wooden studs that allow for correct alignment of receptacle or switch for applicable wallboard thickness used.

Abstract: The method is for using a foldable card as a USB contact. A foldable flat card has a folding line and a foldable front flap section and foldable rear flap section. The card has contact segments. The front flap section is upwardly folded until the front flap section bears against a top surface of the card. The rear flap section is also upwardly folded until the rear flap section bears against the top surface of the card. A front segment is downwardly folded along the folding line until an underside of a rear segment bears against an underside of the front segment and the contact segment comes into contact with the contact segment to form a USB contact. The USB contact is then inserted into a computer.

Abstract: A coupler is presented that has high-directivity and low coupling coefficient variation. The coupler includes a first trace associated with a first port and a second port. The first port is configured substantially as an input port and the second port is configured substantially as an output port. The coupler further includes a second trace associated with a third port and a fourth port. The third port is configured substantially as a coupled port and the fourth port is configured substantially as an isolated port. In addition, the coupler includes a first capacitor configured to introduce a discontinuity to induce a mismatch in the coupler.

Abstract: An electrosurgical forceps has at least the tip of one blade member formed of a composite material having aligned elongated particles of nickel interspersed in a matrix of silver particles. The tip can be provided as a tip member attached, such as by brazing, to the body of the blade member, or the entire blade member can be formed of the silver/nickel composite material. In another embodiment, the tip or blade member is formed of a dispersion strengthened silver or copper composite material.

Abstract: A method for remanufacturing an electronic assembly allows the assembly to be disassembled, tested and reassembled despite certain components being permanently affixed to a housing of the assembly. The electronic assembly includes a circuit assembly within the housing. During remanufacture, a first portion of the housing is removed to expose a first side of the circuit assembly and a second portion of the housing is removed to expose a second side of the circuit assembly. When removing the second portion of the housing, one of the components of the circuit assembly may also be removed. During remanufacture a connector assembly including a replacement component substantially similar to the removed component, and including one or more pins connected to the replacement component and situated to mate with one or more empty sockets of the circuit assembly is used to facilitate testing of the assembly.

Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration.

Abstract: Provided is a method of orienting a printer chip to enable interoperation between the printer chip and more than one type of printer. The printer chip has a plurality of sets of contacts, each set of contacts capable of interoperation with a different type of printer, cartridge, or photoconductor unit. The chip is installed on the cartridge with the chosen set of contacts oriented to mate with the electrical contacts in the printer cartridge receiving cavity of the printer. The result is a printer chip that can be installed on a printer cartridge or photoconductor unit in a plurality of orientations in order to allow the printer cartridge or photoconductor unit to interoperate with a plurality of types of printers, or allow a plurality of types of printer cartridges or photoconductor units to interoperate with a printer.

Abstract: A harness making device having at least two receiving sections, a pivoting gripping device, a cable preparation device, and a cable transfer. Each receiving section is utilized for receiving a connection mechanism. The connection mechanism, in each case, connects an end portion of a cable to a connector. The gripping device is located in a fixed position between the at least two receiving sections, and is constructed to guide the end portion of the cable to the connection mechanism. Additionally, a cable preparation device is positioned to prepare a cable loop with the cable. The cable transfer, which is constructed to receive the at least one cable from the cable preparation device, positions the cable to the pivoting gripping device.

Abstract: An electrical panelboard enclosure includes a primary service panel configured to receive power from a main power source and an alternate power source, an alternate power source connector array, and a distribution panel that delivers main or alternate power to subsidiary load circuits. A service transfer switch unit includes a main power breaker and an alternate power breaker having mutually interlocked toggle switches for respectively activating/deactivating the main and alternate power. The panelboard enclosure further includes an arrangement in which the primary service panel, the distribution panel, the alternate power source connector array and the service transfer switch are part of an installable panelboard assembly that is mountable as a unit within the panelboard enclosure.

Abstract: A band stop filter is provided for a lead wire of an active medical device (AMD). The band stop filter includes a capacitor in parallel with an inductor. The parallel capacitor and inductor are placed in series with the lead wire of the AMD, wherein values of capacitance and inductance are selected such that the band stop filter is resonant at a selected frequency. The Q of the inductor may be relatively maximized and the Q of the capacitor may be relatively minimized to reduce the overall Q of the band stop filter to attenuate current flow through the lead wire along a range of selected frequencies. In a preferred form, the band stop filter is integrated into a TIP and/or RING electrode for an active implantable medical device.

Abstract: An aesthetically pleasing small form factor desktop computer is described. The small form factor desktop computer can be formed of a single piece seamless housing that in the described embodiment is machined from a single billet of aluminum. The single piece seamless housing includes an aesthetically pleasing foot support having at least a portion formed of RF transparent material that provides easy user access to selected internal components as well as offers electromagnetic (EM) shielding. This simplicity of design can accrue many advantages to the small form factor desktop computer besides those related to aesthetic look and feel. Fewer components and less time and effort can be required for assembly of the small form factor desktop computer and the absence of seams in the single piece housing can provide good protection against environmental contamination of internal components as well as EM shielding.

Abstract: The invention includes methods of utilizing removable mechanical precising mechanisms and/or optical-based precising mechanisms to align chips within sockets. The sockets can be configured so that compression of the sockets opens a clamping mechanism. A chip can be placed within a socket with a manipulator and aligned during compression of the socket. Subsequently, the compression of the socket can be released while the manipulator remains in contact with the chip to hold the chip in place until the clamping mechanism is retaining the chip in the socket. The chip can then be released from the manipulator. The invention also includes systems for utilizing removable nests to align various chip geometries within generic socket designs.

Abstract: The invention concerns a process for the production of an electrically conductive structure on a carrier substrate comprising at least two conductor track portions spaced in a region of a width b over the entire width b at between 500 ?m and 1 ?m and a multi-layer film body. A conductive layer in the form of the conductor track portions is produced on the surface of the carrier substrate. A metallic coating forming the electrically conductive structure is deposited on the conductive layer by application of a flow of current in an electrolyte which contains a dissolved coating metal. In the production of the conductive layer the conductive layer is additionally produced in the form of conductor track extensions which are arranged on both sides of the conductor track portions and which are convexly curved away from the oppositely disposed conductor track portion.

Abstract: A manufacturing method for an ink jet recording head. The method includes the steps of preparing a recording element substrate, preparing an electric wiring member, preparing a sealing material discharging member, and applying a sealing material. The ink jet recording head is constructed to provide a first gap between a recording element substrate and an inner edge of a hole. The first gap is larger than a second gap between the recording element substrate and an opposite inner edge of the hole measured along the same line. The sealing material is applied while moving the sealing material discharging member, along the line, from a portion of an electric wiring member adjacent to the first gap, across the first gap, across the electrical connection portions, across the second gap, to a portion of the electric wiring member adjacent to the second gap.

Abstract: A stabilizing coupling body assembly for a coaxial connector is provided with a coupling body dimensioned to couple at a connector end of the coupling body with a cable end of the connector. A jacket grip of rigid material is retained between the coupling body and a stabilizing body coupled to a cable end of the coupling body. An outer diameter of the jacket grip abuts an annular wedge surface of the stabilizing body. The wedge surface is provided with a taper between a maximum diameter proximate a connector end of the jacket grip and a minimum diameter proximate a cable end of the annular wedge surface. The jacket grip is driven radially inward as the stabilizing body is advanced axially towards the coupling body. Methods of manufacture include forming elements of the coupling body assembly via injection molding.

Abstract: A method for manufacturing a substrate having built-in components prevents a short circuit caused by the spread of solder or conductive adhesive. Land regions to connect a circuit component and a wetting prevention region surrounding the land regions are formed on one primary surface of a metal foil. Terminal electrodes of the circuit component are electrically connected to the land regions using solder, and an uncured resin is disposed on and pressure bonded to the metal foil and the circuit component, so that a resin layer in which the circuit component is embedded is formed. Subsequently, a wiring pattern is formed by processing the metal foil. The wetting prevention region is a region obtained by roughening or oxidizing one primary surface of the metal foil so as to reduce solder wettability.

Abstract: The invention relates to an arrangement with a high voltage electrode (1) and a process vessel (2) assigned to the high voltage electrode (1), wherein the high voltage electrode (1) and the process vessel (2) can be positioned relative to each other in such a manner that the high voltage electrode (1) with its operational electrode end (5) in an operating position is immersed in the process vessel (2) and in a non-operating position is located outside the process vessel (2). Furthermore, the arrangement includes a grounding device (3), which is designed in such a manner that upon a positioning in the non-operating position it automatically is brought into contact with the operational electrode end (5) for grounding the high voltage electrode (1).

Abstract: A portable power source assembly including a plurality of battery cells that are directly attached to a housing used to enclose and support operational components of a portable computing device. A flexible interconnect component is used for electrically interconnecting the battery cells. Protective structures can be provided in discrete locations to protect the battery cells from compressive forces applied to the housing of the computing device. Removal handles or pull tabs may be provided on the battery cells so that individual battery cells may be easily removed for repair or replacement.

Abstract: An electrical connector electrically connects a first printed circuit board and a second printed circuit board, where the electrical connector includes: (a) an insulative housing; (b) a plurality of signal conductors, with at least a portion of each of the plurality of signal conductors disposed within the insulative housing; (c) each of the plurality of signal conductors having a first contact end, a second contact end and an intermediate portion therebetween; and (d) a passive circuit element electrically connected to the intermediate portion of each of the plurality of signal conductors, where the passive circuit element is housed in an insulative package and includes at least a capacitor or an inductor.

Abstract: A method for assembling an ultrasonic surgical assembly includes the steps of substantially simultaneously removably coupling an ultrasonic-driving-wave-signal generating circuit to an ultrasonic surgical handle body and removably inserting an ultrasonic-movement-producing distal end of a rotatably free ultrasonic transducer into the ultrasonic surgical handle body. An ultrasonic waveguide is inserted into the ultrasonic surgical handle body opposite the ultrasonic-movement-producing distal end. The ultrasonic waveguide is rotated with respect to the ultrasonic transducer to fixedly couple the ultrasonic waveguide to the ultrasonic-movement-producing distal end of the ultrasonic transducer.

Abstract: The present invention relates to flex cables, and more particularly to a temperature tolerant cover layer construction for a flex cable. In one embodiment, a flex cable designed to be bent to a particular curved shape includes one or more slits formed in the inner cover layer, to reduce the amount of material in the cover layer on the inside radius of the curve. By reducing the amount of cover layer material on the inside of the curve, the slits reduce the compressive stress in the cover layer. The slits are formed prior to laminating the flex cable so that upon lamination the flexible filler material below the cover layer fills the slits, providing a compliant, protective layer that bends into the desired curve and protects the active components inside the cable. The slits reduce the compressive stress along the inside cover layer and thereby prevent the cover layer from separating from the rest of the cable when the flex cable is subjected to high temperature conditions.

Abstract: An apparatus for routing data and power cables under raised floors and through other structures is disclosed herein. In one embodiment, such an apparatus includes an illuminated attachment comprising a connection mechanism to removably connect the illuminated attachment to an end of a cable. The illuminated attachment adds weight to the end of the cable to aid in tossing the end from one location to another. A corresponding method is also disclosed herein.

Abstract: A method of manufacturing an image drum includes fixing a control circuit board inside the drum body so that a plurality of terminals of the control circuit board are located in the slot formed longitudinally on the drum body, forming an insulation layer to the entire external surface of the drum body, forming connection parts by removing parts of the insulation layer where the terminals of the control circuit board are formed, forming electrode forming grooves including the insulation layer as a base on the external surface of the drum body comprising the connection parts thereon, and forming a plurality of ring electrodes to be connected to respective terminals among the plurality of the terminals, respectively, through the connection parts.

Abstract: A protruding electrodes is formed on a lead electrode of an electronic component, and the protruding electrodes comprises a first conductor formed on the lead electrode of the electronic component, and a second conductor overlaid on the first conductor by using a transfer mold having a concavity. By virtue of this structure, protruding electrodes of any configuration can be formed in fine pitches.