Abstract: A piezoelectric device includes: a piezoelectric vibrating reed; and a package, wherein the piezoelectric vibrating reed has a vibrating part and first and second supporting arms extending from a base end part, the package has a base, a lid, a cavity defined by the base and the lid, a convex part projecting from the base or the lid into the cavity, a length of the first supporting arm is shorter than a length of the second supporting arm, and the convex part is provided in a range ahead of a leading end of the first vibrating arm in an extension direction of the first supporting arm and at least partially overlapping with the second supporting arm in a length direction of the piezoelectric vibrating reed so as not to overlap with the piezoelectric vibrating reed in a plan view.

Abstract: A piezoelectric oscillator includes: a package including a floor surface and a step portion thereinside; a conductive adhesive applied on the step portion; and a piezoelectric vibrator including one end placed on the step portion via the conductive adhesive. The floor surface is provided with a recess filled with a resin material having a thermal deformation property. The package includes a sidewall having transparency.

Abstract: In a method for manufacturing a piezoelectric device, a silicon oxide film is deposited by sputtering on a surface of a single-crystal piezoelectric substrate closer to an ion-implanted region, and a silicon nitride film is deposited by sputtering on a surface of the dielectric film opposite to a side thereof closer to the single-crystal piezoelectric substrate. The silicon oxide film has a composition that is deficient in oxygen relative to the stoichiometric composition. Accordingly, little oxygen is supplied from the silicon oxide film to the piezoelectric thin film during heat treatment of a piezoelectric device. This prevents oxidation of the piezoelectric thin film and therefore formation of an oxide layer with high resistivity in the piezoelectric thin film. As a result, a pyroelectric charge generated in the piezoelectric thin film can flow to the silicon oxide film.

Abstract: An exemplary piezoelectric device has a piezoelectric vibrating board including a portion that exhibits thickness-shear vibration, and a frame portion extending around and supporting the vibrating portion. A first cover board, bonded to the first main surface of the frame portion, has a first excitation electrode. A second cover board, bonded to the second main surface of the frame portion, has a second excitation electrode. Thus, the vibrating portion is sealed in a package formed by the frame portion and cover boards. A first convexity, defined either on the bonded main surface of the first cover board or on the first main surface of the frame portion, surrounds the excitation electrode and establishes a predetermined gap between the vibrating portion and excitation electrode. The first cover board and frame portion are bonded by adhesive applied, adjacent the first convexity but not on the first convexity, continuously around the vibrating portion.

Abstract: A resonator element which can achieve a reduction in size while maintaining vibration characteristics, and a piezoelectric device and an electronic device, are to be provided. A quartz crystal resonator element has a base portion, a pair of arm portions extending from the base portion as a root, and a cut-out portion formed by reducing the width of the base portion in the width direction from each side of the arm portions. The root has a first root portion positioned on a side where the arm portions are opposed to each other, and a second root portion positioned on a side where the arm portions are not opposed to each other, and a relationship between a length A from the first root portion to the second root portion and a length B from the first root portion to an inner end portion of the cut-out portion is A?B.

Abstract: In a piezoelectric resonator plate, a substrate having a main face formed in a rectangular shape is provided with a vibration portion and a joining portion that are integrated with each other, the vibration portion including a vibration region configured by forming a pair of excitation electrodes, and the joining portion having formed therein a pair of terminal electrodes that is joined to an external portion. The terminal electrodes in the pair each have a conductive bump formed therein and are electrically connected respectively to the excitation electrodes in the pair. Also, the substrate includes a post portion formed convexly at a position where the pair of terminal electrodes is formed.

Abstract: A laminated piezoelectric body (10) in which an internal positive electrode (15) and an internal negative electrode (16) are arranged at a predetermined distance from each other in the laminated direction of a plurality of piezoelectric element segments (12), while being arranged so as to be perpendicular to the lamination direction of the plurality of piezoelectric element segments (12). A piezoelectric element segment (12A) has an upper contact portion (29A) that comes into contact with a lower contact portion (28B) of an upper piezoelectric element segment (12B). The upper contact portion (29A) has a central projection (32), which protrudes toward the lower contact portion (28B), in the central portion.

Abstract: A vibrating body comprising a substrate a piezoelectric element comprising a piezoelectric layer and electrode layers and joined to the substrate and a ceramic layer between the substrate and the piezoelectric element, wherein the ceramic layer comprises a first region and a second region which is adjacent to the first region in a direction perpendicular to a thickness direction of the ceramic layer, wherein the first region has a quadrangular prism shape, each side of the first region having a length equal to a thickness of the ceramic layer, wherein the second region has a quadrangular prism shape, each side of the second region having the length equal to the thickness of the ceramic layer, and wherein a difference between a porosity of the first region and a porosity of the second region is not greater than 15%.

Abstract: A piezoelectric device employs solder on a roughened surface to improve bonding of electrical contacts with the device package. The device package includes a base, a crystal frame and a lid. The base includes connecting electrodes on a side of the base adjacent the crystal frame. The base has a through hole and a through hole electrode formed in the through hole in electrical contact with the connecting electrodes. The through hole is sealed with a sealing material and a first external electrode layer, which is electrically connected to the through hole electrode, is formed on an outside surface of the base opposite the piezoelectric plate. A second external electrode layer is formed to cover the first external electrode layer and the sealing material.

Abstract: A piezoelectric vibrating piece includes a rectangular vibrator, a framing portion, and a connecting portion. The rectangular vibrator is configured to vibrate at a predetermined vibration frequency and includes excitation electrodes on both principal surfaces. The framing portion surrounds a peripheral area of the vibrator and includes a first framing body and a second framing body. The first framing body extends in a long side direction. The second framing body extends in a short side direction. The connecting portion connects the vibrator and the framing portion. The first framing body includes a depressed portion or an extruding part on one principal surface that extends in a long side direction. The piezoelectric vibrating piece further includes an extraction electrode extending from the excitation electrode via the connecting portion. The extraction electrode extends from one end to another end of the one principal surface of the first framing body.

Abstract: A dielectric element substrate includes a board, a diffusion layer, a first isolation layer, and a lower electrode layer. The diffusion layer is provided on the board. The first isolation layer is provided on and unitarily with the diffusion layer. The lower electrode layer is provided on the first isolation layer at an opposite side with respect to the diffusion layer of, and is isolated from the diffusion layer by the first isolation layer. The diffusion layer is formed by allowing a first metal element and a second metal element to diffuse from the board to the same composition material as that of the first isolation layer. The first isolation layer is free from the first and second metal elements. A coefficient of thermal expansion of the diffusion layer decreases monotonously from the board to the first isolation layer.

Abstract: A piezoelectric vibrating piece includes a vibrator, a framing portion, and a connecting portion. The vibrator vibrates at a predetermined vibration frequency. The vibrator includes excitation electrodes on both principal surfaces. The vibrator is formed at a predetermined thickness. The framing portion surrounds a peripheral area of the vibrator. The connecting portion connects the vibrator and the framing portion. The vibrator has a side surface. At least a part of the side surface is formed into a taper shape such that a thickness of the vibrator becomes thin as close to an outer periphery of the vibrator. The piezoelectric vibrating piece further includes an extraction electrode extracted from each of the excitation electrodes to the framing portion via the connecting portions. One of the extraction electrodes is extracted from one principal surface to another principal surface via a taper-shaped side surface of the vibrator.

Abstract: A method of manufacturing a piezoelectric vibrator according to the invention is a method of manufacturing a piezoelectric vibrator in which a piezoelectric vibrating reed is sealed in a cavity formed between a base substrate and a lid substrate bonded to each other, the method including the steps of: inserting a core portion of a conductive rivet member, which includes a planar head portion and the core portion extending in a direction vertically to the surface of the head portion, into a penetration hole of the base substrate and bringing the head portion of the rivet member into contact with a first surface of the base substrate; attaching a laminate material having elastic properties to the first surface of the base substrate so as to cover the head portion; applying a paste-like glass frit on a second surface of the base substrate and filling the glass frit in the penetration hole; and baking and curing the glass frit.

Abstract: To provide a piezoelectric resonator that suppresses spread of a conductive adhesive and is low in cost and a method of manufacturing a piezoelectric resonator. At positions, of a base 3, corresponding to electrode terminals on a crystal resonating piece 10, projection portions 41, 42 are formed by etching the base 3, and a metal film is formed on front surfaces of the above projection portions 41, 42, and the above metal films and the electrode terminals on the above-described crystal resonating piece 10 are electrically connected with a conductive adhesive 34. The conductive adhesives 34 rise on side surfaces of the above-described projection portions 41, 42 due to surface tension to bring the conductive adhesives 34 into a state where they do not easily flow outward, so that it is possible to suppress spread of the conductive adhesives 34.

Abstract: The piezoelectric devices allow outside-in adjustment of their vibration frequency. An exemplary piezoelectric device includes a tuning-fork type piezoelectric vibrating piece mounted inside a package. The vibrating piece has a base fabricated of a piezoelectric material, a pair of vibrating arms extending parallel from the base in a predetermined direction, and a frequency-adjustment unit situated on the distal ends of the vibrating arms. The package includes first metal films on the inner main surface thereof where an external laser beam can be irradiated. The frequency-adjustment unit includes a transparent region extending in a predetermined direction, allowing the laser beam, passing through the lid of the package, to be incident on second metal films by passing through the transparent regions. The laser beam also can be incident on first metal films without also being incident on the second metal films, by passing through the lid but not through the transparent regions.

Abstract: An integrated resonator apparatus includes a piezoelectric resonator and an acoustic Bragg reflector formed adjacent the piezoelectric resonator. The integrated resonator apparatus also includes a mass bias formed over the Bragg reflector on a side of the piezoelectric resonator opposite the piezoelectric resonator.

Abstract: A piezoelectric vibrating piece includes a first extraction electrode and a second extraction electrode. The first extraction electrode is extracted from an excitation electrode formed on one principal surface to a framing portion via one principal surface of a connecting portion. The second extraction electrode is extracted from the extraction electrode formed on another principal surface to the framing portion via another principal surface of the connecting portion, a side surface of the connecting portion, and the one principal surface of the connecting portion. A distance between a first side and a second side at the framing portion is larger than a distance between the first side and the second side at the connecting portion. The first side is a side of the first extraction electrode at the second extraction electrode side. The second side is a side of the second extraction electrode at the first extraction electrode side.

Abstract: A piezoelectric vibrating piece includes a rectangular vibrator, a framing portion, a connecting portion, and a protrusion. The rectangular vibrator vibrates at a predetermined vibration frequency. The framing portion surrounds a peripheral area of the vibrator. The framing portion includes an inner side surface facing the vibrator. The connecting portion connects the vibrator and the framing portion. The protrusion protrudes to the vibrator side. The protrusion is formed on at least one of the inner side surface facing a side of the vibrator where the connecting portion is connected and the inner side surface adjacent to the connecting portion.

Abstract: A vibrating reed includes a vibrating body (a base portion, a vibrating arm, and a detection arm) and a support portion that supports the vibrating body via a plate-like coupling portion. In both principal surfaces of the coupling portion, grooves (a first groove and a second groove) are disposed. The first groove arranged in one of the principal surfaces of the coupling portion and the second groove arranged in the other principal surface are arranged at positions different from each other in plan view.

Abstract: Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

Abstract: A piezoelectric device includes: a base having a top surface, and first and second marginal ends; first and second supporting stands protruding from the top surface of the base; an adhesive applied to and filled between the first and second supporting stands; and a piezoelectric resonator including a mounting part having outer and inner sections respectively bonded to the first and second supporting stands, and a middle section bonded to the adhesive, and a resonant arm extending from the inner section toward the second marginal end in a cantilever fashion.

Abstract: Disclosed herein is a piezoelectric vibration module in which piezoelectric elements generating vibration force by repetitively extending and being shrinkingly deformed through application of flat external power are placed symmetrically around the center of a lower plate of a vibration plate.

Abstract: Disclosed herein is a piezoelectric vibration module that includes a side damper between a vibration plate with a piezoelectric element and an upper case so as to ensure reliability against external shock applied to the side and narrows a spaced distance between the vibration plate and the upper case.

Abstract: Methods are disclosed for manufacturing quartz-crystal devices. In an exemplary method three wafers are prepared. One is a quartz-crystal wafer defining multiple quartz-crystal pieces; a second is a wafer defining multiple package bases; and a third is a wafer defining multiple lids for the package bases. Each quartz-crystal piece has a respective excitation portion that vibrates when electrically energized and a respective frame portion surrounding the excitation portion. The quartz-crystal wafer has main surfaces that are lapped and polished to mirror-finish them. The base wafer defines multiple package bases each having a floor surface, a bonding surface surrounding the floor surface, and a lower main surface. The lid wafer defines multiple lids each having a ceiling surface, a bonding surface surrounding the ceiling surface, and a upper main surface. The quartz-crystal wafer is sandwiched between the base and lid wafers.

Abstract: A vibrator element includes a base section, vibration arms, and excitation electrodes provided to the respective vibration arms, the excitation electrodes each include a first electrode disposed on a principal surface side of the vibration arm, a second electrode disposed so as to be opposed to the first electrode, and a piezoelectric body extending between the first electrode and the second electrode, and ITO is used as at least one of the first electrode and the second electrode.

Abstract: A piezoelectric actuator includes an actuator base that supports a load beam and has an opening accommodating a piezoelectric element, a receiver member that is laid on and fixed to the actuator base and forms a receiver that faces the opening and receives the piezoelectric element, an adhesive part formed of a liquid adhesive that is filled in a space defined by the piezoelectric element, an inner circumference of the opening, and the receiver and adheres the piezoelectric element to the inner circumference of the opening and the receiver, and a suppressing zone that is formed along an overlapping area where the actuator base and receiver member overlap each other and suppresses penetration of the liquid adhesive due to a capillary phenomenon into the overlapping area.

Abstract: To achieve a piezoelectric power generating apparatus that is capable of both decreasing the natural vibration frequency and reducing the size and that has high power generation efficiency. A piezoelectric power generating apparatus including a power generating element having one end fixed to a supporting member and another end being a free end, and an excitation weight connected to the free end of the power generating element. The power generating element includes a vibration plate that is formed into a shape in which the vibration plate is folded back on the same plane between the one end and the other end and that includes multiple arm portions extending in parallel to each other. In addition, piezoelectric elements bonded to each arm portion of the vibration plate.

Abstract: A piezoelectric generator includes: a base body; and at least one piezoelectric transducer disposed on the base body, and including a first electrode, a piezoelectric body, and a second electrode, wherein the piezoelectric transducer includes a support section fixed to the base body, and a vibrating section disposed apart from the base body, having one end connected to the support section and the other end set as a free end, and vibrating due to a vibration applied externally, and a distance between the other end of the vibrating section and the base body is larger than a distance between the one end of the vibrating section and the base body.

Abstract: A piezoelectric element includes a metal substrate, an alumina layer, a lower electrode, a piezoelectric layer, and an upper electrode. The metal substrate includes iron as a main component and includes at least aluminum and chromium. The alumina layer is formed on the metal substrate, and the lower electrode is formed on the alumina layer. The piezoelectric layer is formed on the lower electrode, and the upper electrode is formed on the piezoelectric layer. The alumina layer is mainly formed of particles in a ?-alumina phase.

Abstract: An object of the invention is to provide a surface mount oscillator that can suppress a change with the lapse of time in frequency characteristics. A surface mount type crystal unit 1 includes: a framed crystal plate 2 in which an oscillating part 6 having a first excitation electrode 5a and a second excitation electrode 5b on opposite principal surfaces thereof is surrounded by a frame 7, and the oscillating part 6 and the frame 7 are connected by connecting parts 8a and 8b; a base 3; and a cover 4. The surface mount type crystal unit 1 has such a configuration that a first metal film 17 is formed in one area of two areas formed by dividing the principal surface of the frame 7 facing the base 3 at two positions around a circumferential direction of the frame 7, and a second metal film 18 is formed in the other area. The first metal film 17 is electrically connected to the first excitation electrode 5a, and the second metal film 18 is electrically connected to the second excitation electrode 5b.

Abstract: A piezo-resistive MEMS resonator comprising an anchor, a resonator mounted on the anchor, an actuator mounted to apply an electrostatic force on the resonator and a piezo-resistive read-out means comprising a nanowire coupled to the resonator.

Abstract: Provided is a surface mount crystal oscillator and a substrate sheet to prevent a decrease in a frequency variable amount by reducing electrostatic capacitance of the crystal oscillator. The surface mount crystal oscillator and the substrate sheet are each configured such that one end of a crystal holding terminal is connected to a corner terminal, and another end of the crystal holding terminal is formed from a center of a short side to be shorter than the one end so as to form an area in which no pattern is formed, and a pattern of a GND terminal is formed on that portion of a rear surface of a substrate which is opposed to the area in which no pattern is formed, so that the pattern (a crystal-mounted pattern) of the crystal holding terminal and the pattern of the GND terminal are not opposed to each other across the substrate.

Abstract: A surface mount piezoelectric device with a piezoelectric vibrating piece to be mounted on a surface of a printed circuit board includes a base substrate, a groove, and at least a pair of mounting terminals. The base substrate is formed of an insulating material. The base substrate includes a mounting surface to be mounted on the printed circuit board. The groove is formed on at least a part of a periphery of the mounting terminal. The groove has a bottom surface and a side surface. The side surface extends from the bottom surface to the mounting surface. The pair of mounting terminals are formed on the mounting surface and the side surface.

Abstract: Processes for making a membrane having a curved feature are disclosed. Recesses each in the shape of a reversed, truncated pyramid are formed in a planar substrate surface by KOH etching through a mask. An oxide layer is formed over the substrate surface. The oxide layer can be stripped leaving rounded corners between different facets of the recesses in the substrate surface, and the substrate surface can be used as a profile-transferring substrate surface for making a membrane having concave curved features. Alternatively, a handle layer is attached to the oxide layer and the substrate is removed until the backside of the oxide layer becomes exposed. The exposed backside of the oxide layer includes curved portions protruding away from the handle layer, and can provide a profile-transferring substrate surface for making a membrane having convex curved features.

Abstract: An acoustic wave device according to one embodiment of the present invention has a base with a vibrating body, a sealing member which is joined to the base in a frame-shaped region surrounding the vibrating body and faces the vibrating body with a space therebetween, and an intermediate layer between the frame-shaped region of the sealing member and the base. The frame-shaped region has a recess and at least a portion of the intermediate layer is located inside the recess.

Abstract: A piezoelectric vibrator includes a tuning fork type piezoelectric vibrating reed including a pair of vibration arm portions; a package that accommodates the piezoelectric vibrating reed; and a getter material that is formed along the longitudinal direction of the vibration arm portion in an inner portion of the package, wherein a cross-sectional area of a middle portion of the getter material adjacent to a center portion of the longitudinal direction of the vibration arm portion is greater than that of an end portion of the getter material.

Abstract: A package is configured to accommodate a piezoelectric element. The package includes a guide part having a plurality of spaces into which electrodes of the piezoelectric element is inserted, respectively. The plurality of spaces of the guide part are separated from each other.

Abstract: Piezoelectric devices and method for making them are disclosed. An exemplary piezoelectric device has a package base defining a cavity on a first surface thereof. An opposing second surface of the package base has at least one through-hole, a mounting electrode on which a piezoelectric vibrating piece is attached, and a respective sealing electrode sealing each through-hole. At least one external electrode is on the second surface, and a lid is bonded to the package base to enclose the piezoelectric vibrating piece. The mounting electrode, sealing electrodes, and external electrodes are formed integrally.

Abstract: There are provided a piezoelectric vibrator capable of suppressing vibration leakage while securing mounting strength of a piezoelectric vibrating reed and an oscillator, an electronic apparatus, and a radio-controlled timepiece each using the piezoelectric vibrator. The piezoelectric vibrator includes: a package that accommodates a piezoelectric vibrating reed; and a bump that mounts the base portion of the piezoelectric vibrating reed on a package. The bump includes a plurality of main bumps which is arranged in a line in the width direction of the base portion so as to be bonded to the base portion; and an auxiliary bump which is bonded to the base portion in an area between the main bumps disposed at both ends in the width direction of the base portion and an area between the main bumps and base ends of the vibrating arms in the longitudinal direction of the base portion.

Abstract: Quartz-crystal devices are disclosed, of which the CI value is reduced by adjusting the shortest distance between an edge of electrically conductive adhesive and an edge of the excitation electrode. The device has a quartz-crystal plate having long-edges and short-edges. Excitation electrodes are on first and second surfaces of the plate. Conductive pads are electrically connected to respective excitation electrodes and extend to the short-edge of the quartz-crystal plate. A package having a pair of external mounting terminals and respective connecting electrodes are situated on opposing sides of the mounting terminals for making electrical connections to the mounting terminals. An electrically conductive adhesive bonds the connecting terminals and respective conductive pads together, and the quartz-crystal plate onto the package. The shortest distance between an edge of the adhesive and an edge of the excitation electrode is 10%-15% the length of the quartz-crystal plate in the long-edge direction.

Abstract: When a length along a vibrating direction of the thickness shear vibration of a multi-stage type mesa substrate of A resonator element is x, a thickness of the vibration section is t, and a distance between the vibration section and the bonding region is y, y is in a range of ?0.0151×(x/t)+0.3471?y??0.0121×(x/t)+0.3471.

Abstract: A method for fabricating a quartz crystal device includes forming a corrosion-resistant film on a first surface and a second surface of the base wafer, forming and exposing a photoresist on the corrosion-resistant film, etching the corrosion-resistant film, and performing wet-etching on through holes. The through hole has, at a +X-axis side, a first inclined surface, a second inclined surface, and a first top formed at an intersection of the first and second inclined surface, and has, at a ?X-axis side, a third inclined surface, a fourth inclined surface, and a second top connecting the third and fourth inclined surfaces. The exposing exposes the first and second surfaces such that a distance from a center in the X-axis direction to the first top becomes equal to a distance from the center to the second top in the base plate.

Abstract: A resonator according to the present invention includes a supporting substrate, a piezoelectric layer, a pair of excitation electrodes, and a bonding layer. The piezoelectric layer is made of a piezoelectric material. The pair of excitation electrodes is formed on the upper surface of the piezoelectric layer so as to excite bulk acoustic waves. The bonding layer has a cavity formed therein so as to face the excitation electrode pair through the piezoelectric layer, and the bonding layer bonds the supporting substrate to the lower surface of the piezoelectric layer.

Abstract: A piezoelectric element holder allows a piezoelectric crystal to be mounted with a single exposed surface. This permits more accurate estimates of applied coating weights and thicknesses to be obtained. The piezoelectric element is mounted via a removable cap and malleable seal that permit the element to be removed and replaced easily.

Abstract: Piezoelectric devices are disclosed that are mountable on the surface of a printed circuit board or the like. An exemplary device comprises a piezoelectric vibrating piece enclosed and sealed within a package including at least a cover and a base-substrate formed of glass or piezoelectric material. The package includes frame-shaped metallic films formed in peripheral regions of inner main surfaces of the cover and/or the base substrate. The frame-shaped metallic films are used for sealing the package using a eutectic material (e.g., solder). At least one mounting terminal is provided on the outer (bottom) main surface of the base-substrate. At least one of the frame-shaped metallic films and mounting terminals includes a chromium foundation layer formed on the surface of the glass or piezoelectric material, a middle layer of NiW alloy formed on the surface of the chromium layer, and a gold layer formed on the surface of the middle layer.

Abstract: A crystal oscillator having a plurality of quartz crystals that are manufactured so that the directional orientation of the acceleration sensitivity vector is essentially the same for each crystal. This enables convenient mounting of the crystals to a circuit assembly with consistent alignment of the acceleration vectors. The crystals are aligned with the acceleration vectors in an essentially anti-parallel relationship and can be coupled to the oscillator circuit in either a series or parallel arrangement. Mounting the crystals in this manner substantially cancels the acceleration sensitivity of the composite resonator and oscillator, rendering it less sensitive to vibrational forces and shock events.

Abstract: A protective assembly that is adapted to provide temperature isolation for an electronic device is disclosed. The assembly includes a housing having a cavity with a top surface and at least one side surface. The housing is configured to accept an electronic device having a top and a bottom in the cavity with the top of the electronic device proximate to the top surface of the cavity. The housing is further configured to maintain a vacuum within the cavity. The assembly includes at least one support disposed within the cavity. The at least one support is configured to contact the housing only at a first point proximate to the top surface of the cavity and contact the electronic device only at a second point that is proximate to the bottom of the electronic device.

Abstract: A crystal device and an inspection method for inspecting the crystal device are provided. The crystal device includes: a crystal plate; excitation electrodes formed on the crystal plate; extraction electrodes extending from the excitation electrodes; electrode pads electrically connected with the extraction electrodes; a package including mounting terminals formed on a mounting surface and connection terminals formed on a bottom surface, which is on the other side of the mounting surface, and electrically connected with the mounting terminals; and an electrically-conductive adhesive agent bonding and fixing the connection terminals to the electrode pads. An bonding status inspection region, on which no metal film is formed, is formed in the crystal plate, and the bonding status inspection region is surrounded by or adjacent to the electrode pads. In addition, the bonding status inspection region occupies not more than 25% of the area of the electrode pads.

Abstract: A piezoelectric device includes a piezoelectric vibrating piece and a base portion in a square shape. The piezoelectric vibrating piece includes a piezoelectric piece, a pair of excitation electrodes, and a pair of extraction electrodes. The base portion includes a pair of connecting electrodes on a first surface at a side of the piezoelectric vibrating piece and a pair of mounting terminals on a second surface. The base portion has short sides facing one another. The short sides include two pairs of castellations depressed toward a center side of the base portion and two pairs of side surface electrodes on the two pairs of castellations. The two pairs of side surface electrodes connect the first surface and the second surface. One pair of the two pairs of side surface electrodes each connect to the pair of connecting electrodes and the pair of mounting terminals.

Abstract: The vibrating device of the invention includes a base member, a lid member joined the base member to constitute a cavity, and a vibrating strip housed in the cavity. The vibrating strip includes a thick center portion and a thin outer peripheral portion, the center portion includes an exciting electrode exciting vibration, and the outer peripheral portion includes terminal electrode electrically connected to exciting electrode and having a thickness larger than that of the exciting electrode. The base member is provided with a connecting portion on the surface thereof, and the connecting portion is connected to the terminal electrode and holds the vibrating strip in a cantilevered manner. Accordingly, the vibrating strip is supported by a very small bonding surface, and a compact vibrating device subjected to little deterioration in frequency characteristics with respect to the temperature change is realized.